AG604-89

InGaP HBT Gain Block

Product Features Product Description Functional Diagram

• DC – 2700 MHz The AG604-89 is a general-purpose buffer amplifier that GND
offers high dynamic range in a low-cost surface-mount
• +19.5 dBm P1dB at 900 MHz package. At 900 MHz, the AG604-89 typically provides
4

• +33.5 dBm OIP3 at 900 MHz 21 dB of gain, +33.5 dBm OIP3, and +19.5 dBm P1dB.
• 21 dB Gain at 900 MHz The device combines dependable performance with
consistent quality to maintain MTTF values exceeding
• Single Voltage Supply 1000 years at mounting temperatures of +85 °C and is
• Lead-free / RoHS-compliant / housed in a lead-free/green/RoHS-compliant SOT-89 1 2 3

Green SOT-89 package industry-standard SMT package. RF IN GND RF OUT

• Internally matched to 50 Ω
The AG604-89 consists of Darlington pair amplifiers using Function Pin No.
the high reliability InGaP/GaAs HBT process technology Input 1
and only requires DC-blocking capacitors, a bias resistor, Output/Bias 3
Applications and an inductive RF choke for operation. Ground 2, 4
• Mobile Infrastructure The broadband MMIC amplifier can be directly applied to
• CATV / FTTX various current and next generation wireless technologies
such as GPRS, GSM, CDMA, and W-CDMA. In addition,
• W-LAN / ISM
the AG604-89 will work for other various applications
• RFID within the DC to 2.7 GHz frequency range such as CATV
• WiMAX / WiBro and WiMAX.

Specifications (1) Typical Performance (1)

Parameter Units Min Typ Max Parameter Units Typical
Operational Bandwidth MHz DC 2700 Frequency MHz 500 900 1900 2140
Test Frequency MHz 900 S21 dB 22.5 21.4 18.2 17.6
Gain dB 21.4 S11 dB -18 -20 -35 -25
Input Return Loss dB 20 S22 dB -16 -12 -10 -10
Output Return Loss dB 12 Output P1dB dBm +19.4 +19.4 +19.0 +19.0
Output P1dB dBm +19.4 Output IP3 (2) dBm +33.5 +33.4 +33.2 +32.9
Output IP3 (2) dBm +33.4 Noise Figure dB 3.5 3.5 3.8 3.8
Output IP2 dBm +45
Noise Figure dB 3.5
Test Frequency MHz 1900
Gain dB 17.2 18.2 19.2
Output P1dB dBm +19
Output IP3 (2) dBm +33.2
Device Voltage V 5.16
Device Current mA 75
1. Test conditions: 25 ºC, Supply Voltage = +6 V, Rbias = 11.2 Ω, 50 Ω System.
2. 3OIP measured with two tones at an output power of +2 dBm/tone separated by 10 MHz. The
suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.

Absolute Maximum Rating

Parameter Rating
Storage Temperature -55 to +150 °C Ordering Information
DC Voltage +7 V
RF Input Power (continuous) +10 dBm Part No. Description
Junction Temperature +177 °C AG604-89G InGaP HBT Gain Block
(lead-free/green/RoHS-compliant SOT-89 Package)
Thermal Resistance, Rth 154 °C / W AG604-89PCB 700 – 2400 MHz Fully Assembled Eval. Board
Operation of this device above any of these parameters may cause permanent damage. Standard T/R size = 3000 pieces on a 13” reel.
Specifications and information are subject to change without notice

WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com, www.TriQuint.com Page 1 of 5 June 2008
 AG604-89
InGaP HBT Gain Block

Typical Device RF Performance

Supply Bias = +6 V, Rbias = 11.2 Ω, Icc = 75 mA

Frequency MHz 100 500 900 1900 2140 2400 3500 5800
S21 dB 23.2 22.5 21.4 18.2 17.6 16.9 14.4 10.1
S11 dB -20 -18 -20 -35 -25 -25 -19 -15
S22 dB -29 -16 -12 -10 -10 -10 -8 -6
Output P1dB dBm +19.4 +19.4 +19.4 +19.0 +19.0 +18.8 +16.2
Output IP3 dBm +33.6 +33.5 +33.4 +33.2 +32.9 +32.4
Noise Figure dB 3.4 3.5 3.5 3.8 3.8 3.9
1. Test conditions: T = 25 ºC, Supply Voltage = +6 V, Device Voltage = 5.16 V, Rbias = 11.2 Ω, Icc = 75 mA typical, 50 Ω System.
2. 3OIP measured with two tones at an output power of +2 dBm/tone separated by 10 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
3. Data is shown as device performance only. Actual implementation for the desired frequency band will be determined by external components shown in the application circuit.
Gain vs. Frequency Return Loss I-V Curve
24 0 120

Device Current (mA)

22 100
-10 Optimal operating point
S11, S22 (dB)

20 80
G a in (d B )

18 -20 60

16 40
-30
14 20
S11 S22
-40 C +25 C +85 C
-40 0
12
0 1 2 3 4 5 6 3.4 3.8 4.2 4.6 5.0 5.4 5.8
0 1 2 3 4
Frequency (GHz) Frequency (GHz) Device Voltage (V)

Output IP3 vs. Frequency Output IP2 vs. Frequency Noise Figure vs. Frequency
40 50 5

4
35 45
OIP2 (dBm)
OIP3 (dBm)

NF (dB)

3
30 40
2
25 35
1
-40 C +25 C +85 C -40 C +25 C +85 C -40 C +25 C +85 C
20 30 0
0 0.5 1 1.5 2 2.5 3 0 200 400 600 800 1000 0 0.5 1 1.5 2 2.5 3
Frequency (GHz) Frequency (MHz) Frequency (GHz)

P1dB vs. Frequency Output Power / Gain vs. Input Power Output Power / Gain vs. Input Power
20 frequency = 900 MHz frequency = 2000 MHz
22 24 18 24

15 20 20 16 20
O u tp u t P ow e r (d B m )

O u tp u t P ow e r (d B m )

Gain Gain
P1dB (dBm)

G a in (d B )

G a in (d B )

18 16 14 16
10
16 12 12 12
5
-40 C +25 C +85 C 14 Output Power 8 10 8
Output Power
0 12 4 8 4
0 0.5 1 1.5 2 2.5 3 3.5 4 -12 -8 -4 0 4 8 -12 -8 -4 0 4 8
Frequency (GHz) Input Power (dBm) Input Power (dBm)

Specifications and information are subject to change without notice

WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com, www.TriQuint.com Page 2 of 5 June 2008
 AG604-89
InGaP HBT Gain Block

Typical Device RF Performance (cont’d)

Supply Bias = +8 V, Rbias = 38 Ω, Icc = 75 mA
Gain vs. Frequency Output IP3 vs. Frequency Output IP2 vs. Frequency
24 40 50

22
35 45

OIP2 (dBm)
OIP3 (dBm)
20
G a in (d B )

18 30 40

16
25 35
14 -40 C +25 C +85 C -40 C +25 C +85 C
-40 C +25 C +85 C
12 20 30
0 1 2 3 4 0 0.5 1 1.5 2 2.5 3 0 200 400 600 800 1000
Frequency (GHz) Frequency (GHz) Frequency (MHz)
P1dB vs. Frequency Noise Figure vs. Frequency
20 5

4
15
P1dB (dBm)

NF (dB) 3
10
2
5
1
-40 C +25 C +85 C -40 C +25 C +85 C
0 0
0 0.5 1 1.5 2 2.5 3 3.5 4 0 0.5 1 1.5 2 2.5 3
Frequency (GHz) Frequency (GHz)

Specifications and information are subject to change without notice

WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com, www.TriQuint.com Page 3 of 5 June 2008
 AG604-89
InGaP HBT Gain Block

Vcc
Icc = 75 mA
Application Circuit

R1
Bias
Resistor

C4
Bypass
Capacitor
C3
0.018 µF

L1
RF Choke
RF IN RF OUT
AG604-89

C1 C2
Blocking Blocking
Capacitor Capacitor

Recommended Component Values Recommended Bias Resistor Values

Reference Frequency (MHz) S upply
R1 value S ize
Designator 50 500 900 1900 2200 2500 3500 Voltage
L1 820 nH 220 nH 68 nH 27 nH 22 nH 18 nH 15 nH 6V 11.2 ohms 0805
C1, C2, C4 .018 µF 1000 pF 100 pF 68 pF 68 pF 56 pF 39 pF 7V 24.5 ohms 1210
1. The proper values for the components are dependent upon the intended frequency of operation.
2. The following values are contained on the evaluation board to achieve optimal broadband performance:
8V 38 ohms 1210
Ref. Desig. Value / Type Size 9V 51 ohms 2010
L1 39 nH wirewound inductor 0603 10 V 65 ohms 2010
C1, C2 56 pF chip capacitor 0603 12 V 91 ohms 2512
C3 0.018 μF chip capacitor 0603 The proper value for R1 is dependent upon the supply
C4 Do Not Place voltage and allows for bias stability over temperature.
WJ recommends a minimum supply bias of +6 V. A
R1 10.0 Ω 1% tolerance 0805 1% tolerance resistor is recommended.

Typical Device Data

S-Parameters (Vdevice = +5.16 V, ICC = 75 mA, T = 25 °C, calibrated to device leads)
Freq (MHz) S11 (dB) S11 (ang) S21 (dB) S21 (ang) S12 (dB) S12 (ang) S22 (dB) S22 (ang)
50 -21.02 176.97 22.84 176.30 -25.02 0.11 -35.04 -72.79
250 -20.93 167.34 22.70 163.03 -25.01 0.10 -22.53 -107.76
500 -21.67 156.28 22.19 146.43 -24.96 -0.54 -16.95 -122.03
750 -21.48 144.30 21.63 131.68 -24.81 -1.02 -13.83 -138.27
1000 -21.14 138.44 20.90 117.72 -24.60 -1.19 -11.97 -151.92
1250 -21.11 130.15 20.08 105.21 -24.37 -2.45 -10.82 -165.62
1500 -21.02 123.48 19.35 93.63 -24.14 -3.48 -9.83 -176.24
1750 -20.63 121.82 18.55 82.34 -23.92 -4.63 -9.23 172.06
2000 -20.16 115.19 17.86 72.75 -23.50 -6.73 -8.61 162.19
2250 -18.96 110.58 17.11 63.40 -23.14 -8.83 -8.06 152.28
2500 -18.42 109.32 16.47 54.31 -22.93 -11.10 -7.62 143.58
2750 -17.62 106.38 15.75 45.65 -22.58 -14.33 -7.15 134.36
3000 -16.99 102.88 15.12 36.89 -22.23 -17.30 -6.90 126.68
3250 -16.24 100.26 14.54 28.84 -21.85 -20.87 -6.63 118.09
3500 -15.25 92.23 13.92 20.86 -21.64 -25.34 -6.29 110.51
3750 -14.75 89.12 13.42 12.78 -21.40 -28.81 -5.99 103.27
4000 -14.09 84.37 12.93 4.39 -21.06 -32.91 -5.69 96.26
4250 -13.32 81.46 12.35 -2.84 -20.80 -37.16 -5.52 89.72
4500 -12.78 76.94 11.87 -11.16 -20.62 -41.54 -5.17 82.40
4750 -12.01 71.30 11.34 -18.78 -20.41 -46.34 -4.97 75.56
5000 -11.42 66.87 10.79 -26.03 -20.12 -50.54 -4.67 69.05
5250 -10.91 60.24 10.24 -33.13 -20.03 -56.69 -4.58 62.28
5500 -10.07 55.04 9.71 -40.94 -19.99 -61.21 -4.24 55.62
5750 -9.48 51.03 9.26 -46.90 -19.72 -65.66 -4.01 51.15
6000 -9.24 46.08 8.80 -55.27 -19.45 -71.22 -3.93 44.84
Device S-parameters are available for download off of the website at: http://www.wj.com
Specifications and information are subject to change without notice

WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com, www.TriQuint.com Page 4 of 5 June 2008
 AG604-89
InGaP HBT Gain Block

AG604-89G (Green / Lead-free SOT-89 Package) Mechanical Information

This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260 °C reflow temperature) and leaded
(maximum 245 °C reflow temperature) soldering processes. The plating material on the leads is NiPdAu.

Outline Drawing Product Marking

The AG604-89G will be marked with an
“A604G” designator with an alphanumeric lot
A604G code marked below the part designator. The
obsolete tin-lead package is marked with an
XXXX-X
“AG604” designator followed by an
alphanumeric lot code.

Tape and reel specifications for this part are

located on the website in the “Application
Notes” section.

MSL / ESD Rating

Land Pattern
ESD Rating: Class 1C
Value: Passes ≥ 1000V min.
Test: Human Body Model (HBM)
Standard: JEDEC Standard JESD22-A114

ESD Rating: Class IV

Value: Passes ≥ 1000V min.
Test: Charged Device Model (CDM)
Standard: JEDEC Standard JESD22-C101

MSL Rating: Level 3 at +260 °C convection reflow

Standard: JEDEC Standard J-STD-020

Mounting Config. Notes

1. Ground / thermal vias are critical for the proper
performance of this device. Vias should use a .35mm
(#80 / .0135”) diameter drill and have a final plated thru
diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer layers
near the part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the
board to a heatsink. Ensure that the ground / thermal via
region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board in
the region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material and
construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in
degrees.

Specifications and information are subject to change without notice

WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com, www.TriQuint.com Page 5 of 5 June 2008