TiWi-R2 TRANSCEIVER MODULE

DATASHEET

Integrated Transceiver Modules for WLAN 802.11 b/g/n, Bluetooth,

and ANT

FEATURES DESCRIPTION

IEEE 802.11 b,g,n,d,e,i, compliant The TiWi-R2 module is a high performance 2.4
 Typical WLAN Transmit Power: GHz IEEE 802.11 b/g/n and Bluetooth 2.1+EDR
o 20.0 dBm, 11 Mbps, CCK (b) radio in a cost effective, pre-certified footprint.
o 14.5 dBm, 54 Mbps, OFDM (g)
o 12.5 dBm, 65 Mbps, OFDM (n)
 Typical WLAN Sensitivity:
o -89 dBm, 8% PER, 11 Mbps
o -76 dBm, 10% PER, 54 Mbps
o -73 dBm, 10% PER, 65 Mbps
 Bluetooth 2.1+EDR, Power Class 1.5 The module realizes the necessary PHY/MAC
 Full support for ANT layers to support WLAN applications in
conjunction with a host processor over a SDIO
 Miniature footprint: 18 mm x 13 mm
interface.
 Low height profile: 1.9 mm
 U.FL connector for external antenna The module also provides a Bluetooth platform
 Terminal for PCB/Chip antenna feeds through the HCI transport layer. Both WLAN
and Bluetooth share the same antenna port.
 Integrated band-pass filter
 Worldwide acceptance: FCC (USA), IC Need to get to market quickly? Not an expert in
(Canada), and CE (Europe) 802.11 or Bluetooth? Need a custom antenna?
 Modular certification allows reuse of LSR Would you like to own the design? Would you
FCC ID and ETSI certification without like a custom design? Not quite sure what you
repeating the expensive testing on your end need? Do you need help with your host board?
product LS Research Design Services will be happy to
 Compact design based on Texas develop custom hardware or software, integrate
Instruments WL1271 Transceiver the design, or license the design so you can
 Seamless integration with TI OMAP™ manufacture yourself. Contact us at
application processors sales@lsr.com or call us at 262-375-4400.
 SDIO Host data path interfaces
 Bluetooth Advanced Audio Interfaces
 Low power operation mode
 RoHS compliant

APPLICATIONS

 Security
 HVAC Control, Smart Energy
 Sensor Networks
 Medical

The information in this document is subject to change without notice.

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ORDERING INFORMATION

Order Number Description

TiWi-R2 Module with U.FL connector for external antenna

450-0037
(Tray, SPQ = 100)
TiWi-R2 Module with U.FL connector for external antenna
450-0037R
(Tape and Reel, SPQ = 1000)
Table 1 Orderable TiWi-R2 Part Numbers

MODULE ACCESSORIES

Order Number Description

2.4 GHz Dipole Antenna with Reverse

001-0001 Polarity SMA Connector

U.FL to Reverse Polarity SMA Bulkhead

080-0001 Cable 105mm

Table 2 Module Accessories

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BLOCK DIAGRAM

TPS73028

TPS62611
VBAT

VIO FAST_CLK
FEM_CONTROL

SLOW_CLK PA_DETECTOR

PA_BIAS

WLAN
WL_TX
2.4
PA GHZ
WL_RX
RF
HOST_SIGNALLING
BT_TX_RX BPF
HOST_INTERFACE
FEM

HOST_DEBUG
BT

MATCHING

FM
MATCHING

WL1271

Figure 1 TiWi-R2 Module Block Diagram – Top-Level

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TABLE OF CONTENTS

FEATURES .......................................................................................................................... 1

APPLICATIONS ................................................................................................................... 1

DESCRIPTION ..................................................................................................................... 1

ORDERING INFORMATION ................................................................................................ 2

MODULE ACCESSORIES ................................................................................................... 2

BLOCK DIAGRAM ............................................................................................................... 3

PIN DESCRIPTIONS ............................................................................................................ 7

INI FILE RADIO PARAMETERS .......................................................................................... 9

ELECTRICAL SPECIFICATIONS ...................................................................................... 10

Absolute Maximum Ratings ..................................................................................................................... 10
Recommended Operating Conditions .................................................................................................... 10
General Characteristics ............................................................................................................................ 11
WLAN RF Characteristics......................................................................................................................... 13
Bluetooth RF Characteristics .................................................................................................................. 15

WLAN POWER-UP SEQUENCE ....................................................................................... 16

WLAN POWER-DOWN SEQUENCE ................................................................................. 17

BLUETOOTH POWER-UP SEQUENCE............................................................................ 18

BLUETOOTH POWER-DOWN SEQUENCE ..................................................................... 19

ENABLE SCHEME ............................................................................................................ 20

IRQ OPERATION ............................................................................................................... 20

SLOW (32 KHZ) CLOCK SOURCE REQUIREMENTS ..................................................... 21

BLUETOOTH HCI UART ................................................................................................... 22

SDIO INTERFACE TIMING ................................................................................................ 24

SDIO CLOCK TIMING........................................................................................................ 25

SOLDERING RECOMMENDATIONS ................................................................................ 26

Recommended Reflow Profile for Lead Free Solder ............................................................................. 26

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CLEANING ......................................................................................................................... 27

OPTICAL INSPECTION ..................................................................................................... 27

REWORK ........................................................................................................................... 27

SHIPPING, HANDLING, AND STORAGE ......................................................................... 27

Shipping ..................................................................................................................................................... 27
Handling ..................................................................................................................................................... 27
Moisture Sensitivity Level (MSL) ............................................................................................................. 27
Storage ....................................................................................................................................................... 27
Repeating Reflow Soldering .................................................................................................................... 28

AGENCY CERTIFICATIONS ............................................................................................. 29

AGENCY STATEMENTS ................................................................................................... 29

Federal Communication Commission Interference Statement ............................................................ 29
Industry Canada Statements.................................................................................................................... 30

OEM RESPONSIBILITIES TO COMPLY WITH FCC AND INDUSTRY CANADA

REGULATIONS ....................................................................................................... 31

OEM LABELING REQUIREMENTS FOR END-PRODUCT .............................................. 32

OEM END PRODUCT USER MANUAL STATEMENTS.................................................... 33

EUROPE ............................................................................................................................ 34
CE Notice ................................................................................................................................................... 34
Declaration of Conformity (DOC) ............................................................................................................ 34

MECHANICAL DATA......................................................................................................... 35

TAPE AND REEL SPECIFICATION .................................................................................. 37

DEVICE MARKINGS .......................................................................................................... 38

Rev 0 Devices ............................................................................................................................................ 38
Rev 1 Devices ............................................................................................................................................ 38
Rev 2 Devices ............................................................................................................................................ 39
Rev 3 Devices ............................................................................................................................................ 39
Rev 4 Devices ............................................................................................................................................ 40

CONTACTING LS RESEARCH ......................................................................................... 41

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TIWI-R2 MODULE FOOTPRINT AND PIN DEFINITIONS

To apply the TiWi-R2 module, it is important to use the module pins in your application as they are
designated in below and in the corresponding pin definition table found on pages 7 and 8. Not all the
pins on the TiWi-R2 module may be used, as some are reserved for future functionality.

Figure 2 TiWi-R2 Pinout (Top View)

The information in this document is subject to change without notice.

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PIN DESCRIPTIONS

Module I/O Buffer Logic

Name Description
Pin Type Type Level

1 VBAT PI - - Battery Voltage 3.6 VDC Nominal (3.0-4.8 VDC)

2 BT_FUNC5 DO 4 mA 1.8 VDC HOST_WU (*)
3 WL_UART_DBG DIO 4 mA 1.8 VDC WL_UART_DBG
4 WLAN_IRQ DO 4 mA 1.8 VDC WLAN Interrupt Request
5 BT_EN DI - 1.8 VDC Bluetooth Enable
6 FM_EN DI - 1.8 VDC NOT SUPPORTED, CONNECT TO GND
7 WL_RS232_RX DI - 1.8 VDC WLAN TEST UART RX (*)
8 WL_RS232_TX DO 4 mA 1.8 VDC WLAN TEST UART TX (*)
9 FM_I2S_FSYNC DO 4 mA 1.8 VDC NOT SUPPORTED, NO CONNECT
10 WL_EN DI - 1.8 VDC WLAN Enable
POWER SUPPLY FOR 1.8 VDC DIGITAL
11 VIO PI - -
DOMAIN
12 GND GND - - Ground
13 SDIO_D3 DIO 8 mA 1.8 VDC SDIO INTERFACE, HOST PULL UP
14 SDIO_D2 DIO 8 mA 1.8 VDC SDIO INTERFACE, HOST PULL UP
15 SDIO_D1 DIO 8 mA 1.8 VDC SDIO INTERFACE, HOST PULL UP
16 SDIO_D0 DIO 8 mA 1.8 VDC SDIO INTERFACE, HOST PULL UP
17 SDIO_CMD DIO 8 mA 1.8 VDC HOST PULL UP
18 SDIO_CLK DI - 1.8 VDC HOST PULL UP
19 SLOW_CLK DI - 1.8 VDC SLEEP CLOCK (32 kHz)
20 FM_IRQ DO 4 mA 1.8 VDC NOT SUPPORTED, NO CONNECT
21 FM_SDA DO 4 mA 1.8 VDC NOT SUPPORTED, NO CONNECT
22 FM_SCL DO 4 mA 1.8 VDC NOT SUPPORTED, NO CONNECT
23 FM_I2S_CLK DO 4 mA 1.8 VDC NOT SUPPORTED, NO CONNECT
24 FM_I2S_DI DI 4 mA 1.8 VDC NOT SUPPORTED, CONNECT TO GND
25 FM_I2S_DO DO 4 mA 1.8 VDC NOT SUPPORTED, NO CONNECT
26 FM_AUD_RIN AI - - NOT SUPPORTED, CONNECT TO GND
27 FM_AUD_LIN AI - - NOT SUPPORTED, CONNECT TO GND
28 FMRFOUT AO - - NOT SUPPORTED, NO CONNECT
29 FMRFIN AI - - NOT SUPPORTED, CONNECT TO GND
30 GND GND - - Ground
31 FM_AUD_ROUT AO - - NOT SUPPORTED, NO CONNECT

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Module I/O Buffer Logic

Name Description
Pin Type Type Level

32 FM_AUD_LOUT AO - - NOT SUPPORTED, NO CONNECT

33 AUD_FSYNC DIO 4 mA 1.8 VDC PCM I/F
34 HCI_RX DI 8 mA 1.8 VDC Bluetooth HCI UART RX (*)
35 HCI_RTS DO 4 mA 1.8 VDC Bluetooth HCI UART RTS (*)
36 HCI_TX DIO 8 mA 1.8 VDC Bluetooth HCI UART TX
37 AUD_CLK DO 4 mA 1.8 VDC PCM I/F (*)
38 AUD_OUT DO 4 mA 1.8 VDC PCM I/F (*)
39 HCI_CTS DI 4 mA 1.8 VDC Bluetooth HCI UART CTS (*)
40 AUD_IN DI 4 mA 1.8 VDC PCM I/F (*)
41 BT_FUNC2 DO 4 mA 1.8 VDC Bluetooth Wakeup / DC2DC Mode (*)
42 BT_FUNC4 DO 4 mA 1.8 VDC BT_UARTD (DEBUG) (*)
43 VDD_LDO_CLASS_1P5 NC - - VBAT VOLTAGE PRESENT, NO CONNECT
44 GND GND - - Ground
45 GND GND - - Ground
46 GND GND - - Ground
47 GND GND - - Ground
Antenna terminal for WLAN and Bluetooth (Note
48 ANT RF -
[1])
49 GND GND - - Ground
50 GND GND - - Ground
51 GND GND - - Ground
52 GND GND - - Ground
PI = Power Input PO = Power Output DI = Digital Input (1.8 VDC Logic Level) DO=Digital Output (1.8 VDC Logic Level)
AI = Analog Input AO = Analog Output AIO = Analog Input/Output RF = RF Port GND = Ground

Note[1]: Antenna terminal presents d.c. short circuit to ground.

(*) indicates that pin is capable of bidirectional operation, but is used as the type shown.

Table 3 TiWi-R2 Module Pin Descriptions

All digital I/O signals use 1.8V logic. If the host microcontroller does not support 1.8V
logic, then level shifters MUST be used.

The information in this document is subject to change without notice.

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INI FILE RADIO PARAMETERS

There is an ini file that contains WLAN radio parameters which are critical to both the RF performance
and EMC compliance of the module.

The ini file available on the LSR website is only intended to be used with the LSR WLAN Eval Tool.
Note that this ini file will not work when using the TiWi-R2 module in normal operation which typically
involves an operating system. To use the TiWi-R2 module in normal operation, refer to specifics
contained in the TiWi Family INI File Radio Parameter User Guide which is also available for download
on the LSR website.

The settings specified in the appropriate ini file must be used to operate the module in compliance with
the modular certification for FCC or ETSI. There is a unique ini file for operating the module in
compliance with FCC regulations, and a different ini file for operating the module in compliance with the
ETSI regulations.

The information in this document is subject to change without notice.

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ELECTRICAL SPECIFICATIONS

The majority of these characteristics are based on controlling and conditioning the tests using the TiWi-
R2 control software application. Other control conditions may require these values to be re-
characterized by the customer.

Absolute Maximum Ratings

Parameter Min Max Unit

(4)(5)
Power supply voltage (VBAT) -0.5 +5.5 V
Digital supply voltage (VIO) -0.5 2.1 V
Voltage on any GPIO -0.5 VIO + 0.5 V
(3)
Voltage on any Analog Pins -0.5 2.1 V
RF input power, antenna port +10 dBm
(6)
Operating temperature -40 +85 ºC
Storage temperature -55 +125 ºC

1. Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device and are not
covered by the warranty. These are stress ratings only and functional operation of the device at these or any other
conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-
maximum-rated conditions for extended periods may affect device reliability.
2. All parameters are measured as follows unless stated otherwise: VDD_IN=1.8V, VDDIO_1.8V=1.8V,
VDD_LDO_CLASS1P5=3.6V
3. Analog pins: XTALP, XTALM, RFIOBT, DRPWRXBM, DRPWRXBP, DRPWTXB, and also FMRFINP, FMRFINM,
FMRFINM, FMAUDLIN, FMAUDRIN, FMAUDLOUT, FMAUDROUT
4. The following signals are from the VBAT group, PMS_VBAT and VDD_LDO_CLASS1P5 (if BT class 1.5 direct VBAT is
used).
5. Maximum allowed depends on accumulated time at that voltage; 4.8V for 7 years lifetime, 5.5V for 6 hours cumulative.
6. The device can be reliably operated for 5,000 active-WLAN cumulative hours at TA of 85oC.
Table 4 Absolute Maximum Ratings

Recommended Operating Conditions

Parameter Min Typ Max Unit

VBAT 3.0 3.6 4.8 V

VIO 1.62 1.8 1.92 V
VIH 0.65 x VIO - VIO V
VIL 0 - 0.35 x VIO V
VOH @ 4, 8 mA VIO - 0.45 - VIO V
VOL @ 4, 8 mA 0 - 0.45 V
Ambient temperature range -40 25 85 ºC
Table 5 Recommended Operating Conditions

The information in this document is subject to change without notice.

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General Characteristics

Parameter Min Typ Max Unit

WLAN RF frequency range 2412 2472 MHz

802.11 b/g/n
WLAN RF data rate 1 rates 65 Mbps
supported
BT RF frequency Range 2402 2480 MHz
Table 6 General Characteristics

Power Consumption - WLAN

Parameter Test Conditions Min Typ Max Unit

2437 MHz, VBAT =3.6V, Tamb=+25°C

CCK (802.11b)
Po=20 dBm, 11 Mbps CCK - 280 - mA
TX Current
L=1200 bytes, tdelay (idle)=4 S
2437 MHz, VBAT =3.6V, Tamb=+25°C
OFDM (802.11g)
Po=14.5 dBm, 54 Mbps OFDM - 194 - mA
TX Current
L=1200 bytes, tdelay (idle)=4 S
2437 MHz, VBAT =3.6V, Tamb=+25°C
OFDM (802.11n)
Po=12.5 dBm, 65 Mbps OFDM - 187 - mA
TX Current
L=1200 bytes, tdelay (idle)=4 S
CCK (802.11b)
- 100 - mA
RX Current
OFDM (802.11g)
- 100 - mA
RX Current
OFDM (802.11n)
- 100 - mA
RX Current
Dynamic Mode [1] - <1.2 - mA

[1] Total Current from VBAT for reception of Beacons with DTIM=1 TBTT=100 mS, Beacon duration 1.6ms, 1 Mbps beacon
reception in Listen Mode.

Table 7 WLAN Power Consumption

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Power Consumption - Bluetooth

Parameter Test Conditions Min Typ Max Unit

GFSK TX Current Constant Transmit, DH5, PRBS9 - 45 - mA

Constant Transmit, 2DH5,3DH5,
EDR TX Current - 43 - mA
PRBS9
GFSK RX Current Constant Receive, DH1 - 35 - mA
EDR RX Current Constant Receive, 2DH5, 3DH5 - 41 - mA
Deep Sleep Current Deep Sleep Mode - 70 - µA
Table 8 Bluetooth Power Consumption

DC Characteristics – General Purpose I/O

Parameter Test Conditions Min Typ Max Unit

VIO Current - 16 mA
Logic input low, VIL 0 - 0.35 x VIO V
Logic input high, VIH 0.65 x VIO - VIO V

Logic output low, VOL Iout = 8 mA 0 - 0.45 V

(Full Drive) Iout = 4 mA 0 - 0.45 V

Logic output low, VOL Iout = 1 mA 0 - 0.112 V

(Reduced Drive) Iout = 0.09 mA 0 - 0.01 V

Logic output high, VOH Iout = -8 mA VIO - 0.45 - VIO V

(Full Drive) Iout = -4 mA VIO - 0.45 - VIO V

Logic output high, VOH Iout = -1 mA VIO - 0.112 - VIO V

(Reduced Drive) Iout = -0.3 mA VIO - 0.033 - VIO V
Table 9 DC Characteristics General Purpose I/O

The information in this document is subject to change without notice.

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WLAN RF Characteristics

WLAN Transmitter Characteristics

(TA=25°C, VBAT=3.6 V)

Parameter Test Conditions Min Typ Max Unit

11 Mbps CCK , 802.11(b) Mask

11 Mbps CCK (802.11b)
Compliance, 35% EVM - 20 - dBm
TX Output Power
RMS power over TX packet
9 Mbps OFDM , 802.11(g) Mask
9 Mbps OFDM (802.11g)
Compliance, -8 dB EVM - 19 - dBm
TX Output Power
RMS power over TX packet
54 Mbps OFDM, 802.11(g) Mask
54 Mbps OFDM (802.11g)
Compliance, -25 dB EVM - 14.5 - dBm
TX Output Power
RMS power over TX packet
6.5 Mbps OFDM, 802.11(n) Mask
6.5 Mbps OFDM (802.11n)
Compliance, -5 dB EVM - 19 - dBm
TX Output Power
RMS power over TX packet
65 Mbps OFDM, 802.11(n) Mask
65 Mbps OFDM (802.11n)
Compliance, -28 dB EVM - 12.5 - dBm
TX Output Power
RMS power over TX packet
Table 10 WLAN Transmitter RF Characteristics

The information in this document is subject to change without notice.

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WLAN Receiver Characteristics

(TA=25°C, VBAT=3.6 V) [1]

Parameter Test Conditions Min Typ Max Unit

1 Mbps CCK (802.11b)

8% PER - -97 - dBm
RX Sensitivity
11 Mbps CCK (802.11b)
8% PER - -89 - dBm
RX Sensitivity
9 Mbps OFDM (802.11g)
10% PER - -90 - dBm
RX Sensitivity
54 Mbps OFDM (802.11g)
10% PER - -76 - dBm
RX Sensitivity
6.5 Mbps OFDM (802.11n)
10% PER - -91 - dBm
RX Sensitivity
65 Mbps OFDM (802.11n)
10% PER - -73 -- dBm
RX Sensitivity
11 Mbps CCK (802.11b)
8% PER - - -10 dBm
RX Overload Level
6 Mbps OFDM (802.11g)
10% PER - - -20 dBm
RX Overload Level
54 Mbps OFDM (802.11g)
10% PER - - -20 dBm
RX Overload Level
65 Mbps OFDM (802.11n)
10% PER - - -20 dBm
RX Overload Level
[1] Up to 2 dB degradation at Channel 13 for 11g/n modes and up to 2 dB degradation at Channel 14 for 11b/g/n modes.

Table 11 WLAN Receiver RF Characteristics

The information in this document is subject to change without notice.

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Bluetooth RF Characteristics

Bluetooth Transmitter GFSK and EDR Characteristics, Class 1.5

(TA=25°C, VBAT=3.6 V)

Test
Parameter Min Typ Max Bluetooth Spec Unit
Conditions

GFSK RF Output Power - 9.5 - - dBm

EDR RF Output Power - 7 - dBm
Power Control Step Size 2 4 8 2-8 dB
EDR Relative Power -2 1 -4/+1 dB
Table 12 Bluetooth Transmitter RF Characteristics

Bluetooth Receiver Characteristics

(TA=25°C, VBAT=3.6 V)

Test
Parameter Min Typ Max Bluetooth Spec Unit
Conditions

GFSK Sensitivity BER=0.1% - -92 - -70 dBm

EDR 2 Mbps Sensitivity BER=0.01% - -91 - -70 dBm
EDR 3 Mbps Sensitivity BER=0.01% - -82 - -70 dBm
GFSK Maximum Input Level BER=0.1% - -5 - -20 dBm
EDR 2 Maximum Input Level BER=0.1% - -10 - - dBm
EDR 3 Maximum Input Level BER=0.1% - -10 - - -
Table 13 Bluetooth Receiver RF Characteristics

The information in this document is subject to change without notice.

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WLAN POWER-UP SEQUENCE

The following sequence describes device power-up from shutdown. Only the WLAN Core is enabled; the
Bluetooth and FM cores are disabled.

Figure 3 TiWi-R2 Power-up Sequence Requirements

1. No signals are allowed on the IO pins if no IO power is supplied, because the IOs are not 'fail safe’.
Exceptions are CLK_REQ_OUT, SLOWCLK, XTALP, and AUD_xxx, which are failsafe and can
tolerate external voltages with no VDDS and DC2DC".

2. VBAT, VIO, and SLOWCLK must be available before WL_EN.

3. Twakeup = T1 + T2

The duration of T1 is defined as the time from WL_EN=high until F REF is valid for the SoC. T1=~55ms

The duration of T2 depends on:

– Operating system
– Host enumeration for the SDIO/WSPI
– PLL configuration
– Firmware download
– Releasing the core from reset
– Firmware initialization

The information in this document is subject to change without notice.

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WLAN POWER-DOWN SEQUENCE

Notes:
1. The DC2DC(1.8V) signal can be monitored on BT_FUNC2 Module Pin (#41)
2. DC_REQ and CLK_REQ are internal signals shown for reference only
Figure 4 TiWi-R2 Module Power-down Sequence Requirements

1. DC_REQ will go low only if WLAN is the only core working. Otherwise if another core is working (e.g
BT) it will stay high.

2. CLK_REQ will go low only if WLAN is the only core working. Otherwise if another core is working and
using the FREF (e.g BT) it will stay high.

3. If WLAN is the only core that is operating, WL_EN must remain de-asserted for at least 64sec
before it is re-asserted.

The information in this document is subject to change without notice.

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BLUETOOTH POWER-UP SEQUENCE

The following sequence describes device power up from shutdown. Only the Bluetooth core is enabled;
the WLAN core is disabled.

Notes:
1. (A) After this sequence is completed, the device is in the low VIO-leakage state while in shutdown
2. The DC2DC(1.8V) signal can be monitored on BT_FUNC2 Module Pin (#41)
3. DC_REQ, CLK_REQ, and FREF are internal signals shown for reference only
Figure 5 Bluetooth Power-up Sequence

Power up requirements:

1. No signals are allowed on the IO pins if no IO power supplied, because the IOs are not 'failsafe'.
Exceptions are CLK_REQ_OUT, SLOWCLK, XTALP, and AUD_xxx, which are failsafe and can
tolerate external voltages with no VDDS and DC2DC.

2. VDDS and SLOWCLK must be stable before releasing BT_EN.

3. Fast clock must be stable maximum 55 ms after BT_EN goes HIGH.

The information in this document is subject to change without notice.

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BLUETOOTH POWER-DOWN SEQUENCE

Notes:
1. The DC2DC(1.8V) signal can be monitored on BT_FUNC2 Module Pin (#41)
2. DC_REQ and CLK_REQ are internal signals shown for reference only
Figure 6 Bluetooth Power-down Sequence

The TiWi-R2 module indicates completion of Bluetooth power up sequence by asserting HCI_RTS low.
This occurs up to 100 ms after BT_EN goes high.

The information in this document is subject to change without notice.

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ENABLE SCHEME

The module has 3 enable pins, one for each core: WL_EN, and BT_EN and FM_EN. Presently, there are 2
modes of active operation now supported: WLAN and Bluetooth. It is recommended that the FM_EN pin be
grounded to disable the FM section. It is also recommended that the FM section be disabled by Bluetooth HCI
commands.

1. Each core is operated independently by asserting each signal EN to Logic '1’. In this mode it is possible to
control each core asynchronously and independently.

2. Bluetooth mode operation. WLAN will be operated through WL_EN asynchronously and independently of
Bluetooth.

IRQ OPERATION

1. The default state of the WLAN_IRQ prior to firmware initialization is 0.

2. During firmware initialization, the WLAN_IRQ is configured by the SDIO module; a WLAN_IRQ changes
its state to 1.

3. A WLAN firmware interrupt is handled as follows:

a. The WLAN firmware creates an Interrupt-to-Host, indicated by a 1-to-0 transition on the

WLAN_IRQ line (host must be configured as active-low or falling-edge detect).

b. After the host is available, depending on the interrupt priority and other host tasks, it masks the
firmware interrupt. The WLAN_IRQ line returns to 1 (0-to-1 transition on the WLAN_IRQ line).

c. The host reads the internal register status to determine the interrupt sources - the register is
cleared after the read.

d. The host processes in sequence all the interrupts read from this register

e. The host unmasks the firmware interrupts.

4. The host is ready to receive another interrupt from the WLAN device.

The information in this document is subject to change without notice.

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SLOW (32 KHZ) CLOCK SOURCE REQUIREMENTS

The slow clock is always supplied from an external source. It is input on the SLOW_CLK pin, and can be a digital
signal in the range of VIO only. For slow clock frequency and accuracy refer to Table 14. The external slow clock
must be stable before the system exits from shut down mode.

Parameter [1] Condition Symbol Min Typ Max Unit

Input slow clock frequency 32768 Hz

Input slow clock accuracy WLAN, BT +/-250 ppm
Input transition time Tr/Tf – 10% to 90% Tr/Tf 100 ns
Frequency input duty cycle 30 50 70 %
Square wave, VIH
Input voltage limits 0.65 x VDDS VDDS Vpeak
DC coupled
VIL 0 0.35 x VDDS
Input impedance 1 MW
Input capacitance 5 pF
Rise and fall time 100 ns
Phase noise 1 kHz -125 dBc/Hz

[1] Slow clock is a fail safe input

Table 14 Slow Clock Source Requirements

The information in this document is subject to change without notice.

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BLUETOOTH HCI UART

Figure 7 Bluetooth UART Timing

Table 15 Bluetooth UART Timing

The information in this document is subject to change without notice.

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Figure 8 Bluetooth UART Data Frame

Table 16 Bluetooth UART Data Frame

The information in this document is subject to change without notice.

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SDIO INTERFACE TIMING

Table 17 SDIO Interface Read (see Figure 9)

Figure 9 SDIO Single Block Read

Table 18 SDIO Interface Write (see Figure 10)

Figure 10 SDIO Single Block Write

The information in this document is subject to change without notice.

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SDIO CLOCK TIMING

Table 19 SDIO Clock Timing

Figure 11 SDIO Clock Timing

The information in this document is subject to change without notice.

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SOLDERING RECOMMENDATIONS

Recommended Reflow Profile for Lead Free Solder

Note: The quality of solder joints on the castellations (‘half vias’) where they contact the
host board should meet the appropriate IPC Specification. See IPC-A-610-D Acceptability
of Electronic Assemblies, section 8.2.4 Castellated Terminations.”

Figure 12 Reflow Profile

The information in this document is subject to change without notice.

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CLEANING SHIPPING, HANDLING, AND STORAGE

In general, cleaning populated modules is Shipping

strongly discouraged. Residuals under the
module cannot be easily removed with any TiWi-R2 modules are delivered in trays of 100
cleaning process. or reels of 1,000.
 Cleaning with water can lead to capillary Handling
effects where water is absorbed into the gap
between the host board and the module.
The TiWi-R2 modules contain a highly sensitive
The combination of soldering flux residuals
and encapsulated water could lead to short electronic circuitry. Handling without proper
circuits between neighboring pads. Water ESD protection may damage the module
could also damage any stickers or labels. permanently.
 Cleaning with alcohol or a similar organic
solvent will likely flood soldering flux Moisture Sensitivity Level (MSL)
residuals into the RF shield, which is not
accessible for post-washing inspection. The Per J-STD-020, devices rated as MSL 4 and
solvent could also damage any stickers or not stored in a sealed bag with desiccant pack
labels. should be baked prior to use.
 Ultrasonic cleaning could damage the
module permanently. After opening packaging, devices that will be
subjected to reflow must be mounted within 72
OPTICAL INSPECTION hours of factory conditions (<30°C and 60%
RH) or stored at <10% RH.
After soldering the Module to the host board,
Bake devices for 48 hours at 125°C.
consider optical inspection to check the
following:
Storage
 Proper alignment and centering of the
module over the pads. Please use this product within 6 months after
receipt. Any product used after 6 months of
 Proper solder joints on all pads.
receipt needs to have solderability confirmed
 Excessive solder or contacts to neighboring before use.
pads or vias.
The product shall be stored without opening the
REWORK packing under the ambient temperature from 5 to
35deg.C and humidity from 20 to 70%RH.
The module can be unsoldered from the host (Packing materials, in particular, may be
board if the Moisture Sensitivity Level (MSL) deformed at the temperatures above this range.)
requirements are met as described in this
datasheet. Do not store in salty air or in an environment
with a high concentration of corrosive gas, such
as Cl2, H2S, NH3, SO2, or NOX.
Never attempt rework on the module Do not store in direct sunlight.
itself, e.g., replacing individual
components. Such actions will The product should not be subject to excessive
terminate warranty coverage. mechanical shock.

The information in this document is subject to change without notice.

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Repeating Reflow Soldering

Only a single reflow soldering process is recommended for host boards.

The information in this document is subject to change without notice.

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AGENCY CERTIFICATIONS

FCC ID: TFB-TIWI1-01, 15.247

IC ID: 5969A-TIWI101, RSS 210

CE: Compliant to standards EN 60950-1, EN 300 328, and EN 301 489

SAR: This wireless mobile and/or portable device has been shown to be compliant for localized specific
absorption rate (SAR) for uncontrolled environment/general exposure limits specified in ANSI/IEEE Std.
C95.1-1999 and had been tested in accordance with the measurement procedures specified in IEEE
1528-2003, OET Bulletin 65 Supp. C, RSS-102 and Safety Code 6.

AGENCY STATEMENTS

Federal Communication Commission Interference Statement

This equipment has been tested and found to comply with the limits for a Class B digital device,
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection
against harmful interference in a residential installation. This equipment generates uses and can radiate
radio frequency energy and, if not installed and used in accordance with the instructions, may cause
harmful interference to radio communications. However, there is no guarantee that interference will not
occur in a particular installation. If this equipment does cause harmful interference to radio or television
reception, which can be determined by turning the equipment off and on, the user is encouraged to try
to correct the interference by one of the following measures:

 Reorient or relocate the receiving antenna.

 Increase the separation between the equipment and receiver.
 Connect the equipment into an outlet on a circuit different from that to which the receiver is
connected.
 Consult the dealer or an experienced radio/TV technician for help.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions: (1) This device may not cause harmful interference, and (2) this device must accept any
interference received, including interference that may cause undesired operation.

FCC CAUTION: Any changes or modifications not expressly approved by the party
responsible for compliance could void the user's authority to operate this equipment.

The information in this document is subject to change without notice.

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Industry Canada Statements

Operation is subject to the following two conditions: (1) this device may not cause interference, and (2)
this device must accept any interference, including interference that may cause undesired operation of
the device.

To reduce potential radio interference to other users, the antenna type and its gain should be so
chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that permitted for
successful communication.

This device has been designed to operate with the antenna(s) listed below, and having a maximum
gain of 4.3 dBi (LSR Dipole) and -0.6dBi (Ethertronics Presetta). Antennas not included in this list or
having a gain greater than 4.3 dBi and -0.6dBi are strictly prohibited for use with this device. The
required antenna impedance is 50 ohms.

List of all Antennas Acceptable for use with the Transmitter

1) LS Research 001-0001 center-fed dipole antenna and LS Research 080-0001 U.FL to Reverse
Polarity SMA connector cable.
2) Ethertronics Presetta 1000423 and Johnson Emerson U.FL. to U.FL coaxial cable 415-0088-150.

L'opération est soumise aux deux conditions suivantes: (1) cet appareil ne peut pas provoquer
d'interférences et (2) cet appareil doit accepter toute interférence, y compris les interférences qui
peuvent causer un mauvais fonctionnement de l'appareil.

Pour réduire le risque d'interférence aux autres utilisateurs, le type d'antenne et son gain doiventêtre
choisis de manière que la puissance isotrope rayonnée équivalente (PIRE) ne dépasse pascelle
permise pour une communication réussie.

Cet appareil a été conçu pour fonctionner avec l'antenne (s) ci-dessous, et ayant un gain maximum de
4,3 dBi (LSR dipôle) et -0.6dBi (Ethertronics Presetta). Antennes pas inclus danscette liste ou
d'avoir un gain supérieur à 4,3 dBi et -0.6dBi sont strictement interdites pour l'utilisation avec cet
appareil. L'impédance d'antenne requise est de 50 ohms.

Liste de toutes les antennes acceptables pour une utilisation avec l'émetteur

1) LS Research 001-0001 alimenté par le centre antenne dipôle et LS Research 080-0001

U.FL d'inversion de polarité du câble connecteur SMA.
2) Ethertronics Presetta 1000423 et Johnson Emerson U.FL d'un câble coaxial U.FL 415-0088-150.

The information in this document is subject to change without notice.

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OEM RESPONSIBILITIES TO COMPLY WITH FCC AND INDUSTRY CANADA

REGULATIONS

The TiWi-R2 Module has been certified for integration into products only by OEM integrators under the
following conditions:

This device is granted for use in Mobile only configurations in which the antennas used for this
transmitter must be installed to provide a separation distance of at least 20cm from all person and not
be co-located with any other transmitters except in accordance with FCC and Industry Canada multi-
transmitter product procedures.

As long as the two conditions above are met, further transmitter testing will not be required.
However, the OEM integrator is still responsible for testing their end-product for any additional
compliance requirements required with this module installed (for example, digital device emissions, PC
peripheral requirements, etc.).

IMPORTANT NOTE: In the event that these conditions cannot be met (for certain
configurations or co-location with another transmitter), then the FCC and Industry
Canada authorizations are no longer considered valid and the FCC ID and IC Certification
Number cannot be used on the final product. In these circumstances, the OEM integrator
will be responsible for re-evaluating the end product (including the transmitter) and
obtaining a separate FCC and Industry Canada authorization.

Le module de TiWi-R2 a été certifié pour l'intégration dans des produits uniquement par des
intégrateurs OEM dans les conditions suivantes:

Ce dispositif est accordé pour une utilisation dans des configurations mobiles seul dans lequel les
antennes utilisées pour cet émetteur doit être installé pour fournir une distance de séparation d'au
moins 20cm de toute personne et ne pas être colocalisés avec les autres émetteurs, sauf en conformité
avec la FCC et de l'Industrie Canada, multi-émetteur procédures produit.

Tant que les deux conditions précitées sont réunies, les tests de transmetteurs supplémentaires ne
seront pas tenus. Toutefois, l'intégrateur OEM est toujours responsable de tester leur produit final pour
toutes les exigences de conformité supplémentaires requis avec ce module installé (par exemple, les
émissions appareil numérique, les exigences de périphériques PC, etc.)

NOTE IMPORTANTE: Dans le cas où ces conditions ne peuvent être satisfaites (pour
certaines configurations ou de co-implantation avec un autre émetteur), puis la FCC et
Industrie autorisations Canada ne sont plus considérés comme valides et l'ID de la FCC
et IC numéro de certification ne peut pas être utilisé sur la produit final. Dans ces
circonstances, l'intégrateur OEM sera chargé de réévaluer le produit final (y compris
l'émetteur) et l'obtention d'un distincte de la FCC et Industrie Canada l'autorisation.

The information in this document is subject to change without notice.

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OEM LABELING REQUIREMENTS FOR END-PRODUCT

The TiWi-R2 module is labeled with its own FCC ID and IC Certification Number. The FCC ID and IC
certification numbers are not visible when the module is installed inside another device, as such the
end device into which the module is installed must display a label referring to the enclosed module.
The final end product must be labeled in a visible area with the following:

“Contains Transmitter Module FCC ID: TFB-TIWI1-01”

“Contains Transmitter Module IC: 5969A-TIWI101”

or

“Contains FCC ID: TFB-TIWI1-01”

“Contains IC: 5969A-TIWI101”

The OEM of the TiWi-R2 Module must only use the approved antenna(s) listed above, which have been
certified with this module.

Le module de TiWi-R2 est étiqueté avec son propre ID de la FCC et IC numéro de certification. L'ID de
la FCC et IC numéros de certification ne sont pas visibles lorsque le module est installé à
l'intérieur d'un autre appareil, comme par exemple le terminal dans lequel le module est installé
doit afficher une etiquette faisant référence au module ci-joint. Le produit final doit être étiqueté dans un
endroit visible par le suivant:

“Contient Module émetteur FCC ID: TFB-TIWI1-01"

“Contient Module émetteur IC: 5969A-TIWI101"

ou

“Contient FCC ID: TFB-TIWI1-01"

“Contient IC: 5969A-TIWI101"

L’OEM du module TiWi-R2 ne doit utiliser l'antenne approuvée (s) ci-dessus, qui ont été certifiés avec
ce module.

The information in this document is subject to change without notice.

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OEM END PRODUCT USER MANUAL STATEMENTS

The OEM integrator should not provide information to the end user regarding how to install or remove
this RF module or change RF related parameters in the user manual of the end product.

The user manual for the end product must include the following information in a prominent
location:

This device is granted for use in Mobile only configurations in which the antennas used for this
transmitter must be installed to provide a separation distance of at least 20cm from all person and not
be co-located with any other transmitters except in accordance with FCC and Industry Canada multi-
transmitter product procedures.

Other user manual statements may apply.

L'intégrateur OEM ne devrait pas fournir des informations à l'utilisateur final en ce qui concerne la façon
d'installer ou de retirer ce module RF ou modifier les paramètres RF connexes dans le manuel
utilisateur du produit final.

Le manuel d'utilisation pour le produit final doit comporter les informations suivantes dans
unendroit bien en vue:

Ce dispositif est accordé pour une utilisation dans des configurations mobiles seule dans laquelle les
antennes utilisées pour cet émetteur doit être installé pour fournir une distance de séparation d'au
moins 20cm de toute personne et ne pas être co-localisés avec les autres émetteurs, sauf en
conformité avec FCC et Industrie Canada, multi-émetteur procédures produit.

Autres déclarations manuel de l'utilisateur peuvent s'appliquer.

The information in this document is subject to change without notice.

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EUROPE

CE Notice

This device has been tested and certified for use in the European Union. See the Declaration of
Conformity (DOC) for specifics.

If this device is used in a product, the OEM has responsibility to verify compliance of the final product to
the EU standards. A Declaration of Conformity must be issued and kept on file as described in the
Radio and Telecommunications Terminal Equipment (R&TTE) Directive.

The ‘CE’ mark must be placed on the OEM product per the labeling requirements of the Directive.

Declaration of Conformity (DOC)

This DOC can be downloaded from the LSR Wiki.

The information in this document is subject to change without notice.

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MECHANICAL DATA

Figure 13 Module Mechanical Dimensions (Maximum Module Height = 1.9 mm)

The information in this document is subject to change without notice.

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Figure 14 TiWi-R2 Recommended PCB Footprint (Top View)

The information in this document is subject to change without notice.

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TAPE AND REEL SPECIFICATION

Figure 15 TiWi-R2 Tape and Reel Specification

The information in this document is subject to change without notice.

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DEVICE MARKINGS

Rev 0 Devices

WL1271: WL1271A1YFVR PG2.1

Front End: TQM679002A

LS Research
TiWi01-R2
2D Bar
Code

00-XXXXXX
Where 00 = revision
XXXXXX = incremental serial number
2D Barcode Format is Data Matrix Standard

Rev 1 Devices

WL1271: WL1271BYFVR PG3.1

Front End: TQM679002A

 Changed the WL1271 IC to WL1271BYFVR PG3.1.

LS Research
TiWi01-R2
2D Bar
Code

01-XXXXXX
Where 01 = revision
XXXXXX = incremental serial number
2D Barcode Format is Data Matrix Standard

The information in this document is subject to change without notice.

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Rev 2 Devices

WL1271: WL1271BYFVR PG3.1

Front End: TQM679002A

 Changed PCB supplier.

LS Research
TiWi-R2
2D Bar
Code

2-XXXXXX
Where 2 = revision
XXXXXX = incremental serial number
2D Barcode Format is Data Matrix Standard

Rev 3 Devices

WL1271: WL1271BYFVR PG3.1

Front End: TQM679002A

 Incorporated PCB DFM improvements.

LS Research
TiWi-R2
2D Bar
Code

3-XXXXXX
Where 3 = revision
XXXXXX = incremental serial number
2D Barcode Format is Data Matrix Standard

The information in this document is subject to change without notice.

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Rev 4 Devices

WL1271: WL1271BYFVR PG3.1

Front End: TQM679002A

 LSR logo changed from red to black.

 Improvements to prevent solder from wicking to bottom pad on module pin 48.
 Switched the locations of the serial number and model name on the label.

LS RESEARCH
4-XXXXXX

2D Bar
Code

Model: TiWi-R2
Where 4 = Revision
XXXXXX = incremental serial number
2D Barcode Format is Data Matrix Standard

The information in this document is subject to change without notice.

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CONTACTING LS RESEARCH

Headquarters LS Research, LLC

W66 N220 Commerce Court
Cedarburg, WI 53012-2636
USA
Tel: (262) 375-4400
Fax: (262) 375-4248

Website www.lsr.com

Wiki wiki.lsr.com

Technical Support forum.lsr.com

Sales Contact sales@lsr.com

The information in this document is provided in connection with LS Research (hereafter referred to as “LSR”)
products. No license, express or implied, by estoppel or otherwise, to any intellectual property right is granted by
this document or in connection with the sale of LSR products. EXCEPT AS SET FORTH IN LSR’S TERMS AND
CONDITIONS OF SALE LOCATED ON LSR’S WEB SITE, LSR ASSUMES NO LIABILITY WHATSOEVER AND
DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY WARRANTY RELATING TO ITS PRODUCTS
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A
PARTICULAR PURPOSE, OR NON-INFRINGEMENT. IN NO EVENT SHALL LSR BE LIABLE FOR ANY
DIRECT, INDIRECT, CONSEQUENTIAL, PUNITIVE, SPECIAL OR INCIDENTAL DAMAGES (INCLUDING,
WITHOUT LIMITATION, DAMAGES FOR LOSS OF PROFITS, BUSINESS INTERRUPTION, OR LOSS OF
INFORMATION) ARISING OUT OF THE USE OR INABILITY TO USE THIS DOCUMENT, EVEN IF LSR HAS
BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. LSR makes no representations or warranties with
respect to the accuracy or completeness of the contents of this document and reserves the right to make changes
to specifications and product descriptions at any time without notice. LSR does not make any commitment to
update the information contained herein. Unless specifically provided otherwise, LSR products are not suitable
for, and shall not be used in, automotive applications. LSR’s products are not intended, authorized, or warranted
for use as components in applications intended to support or sustain life.

The information in this document is subject to change without notice.

330-0045-R4.0 Copyright © 2010-2012 LS Research, LLC Page 41 of 41

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