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KEMET ELECTRONICS CORPORATION
FSCM 31433
TEST REPORT FOR SOLDERABILITY PHYSICAL ANALYSIS
TEST REPORTS FOR SOLDERABILITY,ELECTRICAL SURVIVABILITY
Customer: Northrop Part Number: 1A151
Purchase Order: Date/Lot Code: 2334A1
Work Order or Factory Order: Line:
Sample Size: Number of Defectives Allowed:
Accept /Reject Lot: ACCEPT Approved: EDWIN BARRERA
Inspector: LUDIVINA CORTINA Title: SUPERVISOR QC
Date: 11/29/2023
7.1 PRE-TEST EXAMINATION:
Requirement ACCEPT REJECT
a ) Verification of part number
and Date/Lot code number. 14 0
b) Workmanship examination 14 0
c) Dimensional verification 14 0
7.2 SOLDERABILITY, ELECTRICAL SURVIVABILITY (5 SAMPLES) (GROUP A)
SAMPLE METALIZATION PASS /
INITIAL FINAL
INSPECTION
FAIL
DELTA
Parameter CAP DF DIP 1 DIP 2 DIP 3 CAP DF
CAP
I.R
Units PF % -- -- -- PF % Mohms
1,010.0000 2.00
Limits 990.0000
0.15 -- -- -- -- 0.15
-1.00
1.00E+05
993.9020 0.036 OK OK OK 993.8910 0.136 -0.0011 2.28E+06 PASS
1
1002.4900 0.102 OK OK OK 1002.5300 0.033 0.0040 8.00E+06 PASS
2
1007.1400 0.055 OK OK OK 1006.9600 0.045 -0.0179 8.57E+06 PASS
3
1007.2700 0.048 OK OK OK 1007.2100 0.048 -0.0060 9.57E+06 PASS
4
1006.9600 0.048 OK OK OK 1006.8200 0.079 -0.0139 6.16E+06 PASS
5
1001.0300 0.045 OK OK OK 1001.0400 0.087 0.0010 5.42E+06 PASS
6
994.2800 0.033 OK OK OK 994.0580 0.117 -0.0223 7.64E+06 PASS
994.2800 0.033 OK OK OK 994.0580 0.117 -0.0223 7.64E+06 PASS
7
F-QCM0245 Rev.0
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7.3 DESTRUCTIVE PHYSICAL ANALYSIS 14 SAMPLES
Requirement ACCEPT REJECT Serial No
(if Reject )
a) Delamination shall not exceed 10% of active electrode length or
010 inch,whichever is greater, shall not reduce
the dielectric thickness by more than 50% 14 0
b) No more than 3 delaminations of any
length in any sample. 14 0
c) No delamination from an electrode to opposite termination. 14 0
d) Uniform dielectric layer thickness,
variations no more than +50% of average thickness. 14 0
e) No cracks between electrodes or from
an electrode to outer surface. 14 0
f) Voids do not reduce remaining dielectric material to less than
50 % of electrode spacing or more than 10% longer than
active electrode length,or .010 inch, whichever is greater. 14 0
g) End and side margins .003" minimum. 14 0
h) Inactive electrodes terminated, discontinuities within active
electrodes shall not exceed 20% of active electrode length. 14 0
i) All 3 layers of metallization visible and bonded to element. 14 0
j) Discontinuities less than .001 inch, no more than 1 per
corner total discontinuities do not exceed .005" 14 0
k) Intermediate copper or nickel thickness 00005 to .0008 inch.
Minor variations do not exceed .0015 inch thickness
or more than 25% total length. 14 0
l) Cover plate at least equal to dielectric thickness, or
.001 inch per 50 volts of rated voltage, whichever is less. 14 0
n) Any void in the primary end termination metallization shall
not measure greater than .020” inches. 14 0
o) Any void in then primary end termination metallization shall
not exceed 35% of the electrode stack thickness. 14 0
p) Any series of (2) two or more voids in the primary end
termination metallization,where the metallization is obviously
well bonded to the chip element, total length shall not exceed
50% of the chip element thickness 14 0
q) All samples have the same electrode count 14 0
Comments:
F-QCM0245 Rev.0
