Top 5 Questions

about Aluminum PCBs

+ 2 Bonu
Alumin s
Resou m u
rces
 #1
What is the thickness of
the dielectric used in
Aluminum PCBs?

Amitron typically uses dielectric thicknesses of

around 0.003" for single layer products.

What is the
#2 thickness of
the Aluminum Base?

Material is typically stocked for 0.059" aluminum

but there is a wide variety of thicknesses available
if you have the budget for a custom pressed
product. Thicknesses of 0.030”, 0.040”, 0.050”,
0.080”, 0.090”, 0.100” and 0.125” are available.
 #3 Can Aluminum base PCBs have
break-aways and score lines?
Yes! Aluminum base PCBs can utilize break-aways and score
lines just like conventional rigid FR-4 products. The only
difference is that the tabs would use slightly large holes to make
it easier for our drilling process. Scored arrays work just fine but
will wear out the blades on those ‘pizza cutter’ type depanelers
much faster than FR-4 does. We recommend either breaking by
hand or keeping some back up blades in stock!

Do I have to change
#4 my SMT process for
Aluminum PCBs?
From the feedback we’ve received from our customers
the only modification necessary is on the reflow cycle.
Since the aluminum acts as a heat sink, a longer pre-
heat to increase the aluminum temperature is needed
before hitting peak reflow temp. Other than that, these
materials behave in much the same way as
conventional FR-4 products.
 #5 How much more do Aluminum
PCBs cost?
PCB costs are determined by a variety of factors.
With all other variables held constant, Single-
Sided Aluminum PCBs are roughly 3.3x the costs
of Single-Sided FR-4. For Double-Sided,
Aluminum PCBs can be roughly 4.8x
the costs of FR-4. The best way to know for sure is
to simply request a quote.

* BONUS
For those that are interested in dielectric constants,
dissipation, and impedance of Aluminum PCBs, we
have included the datasheets for the two most
common dielectrics used on our Aluminum based
PCBs. See below:
COBRITHERM
 A AISMALIBAR
DATA SHEET DS_140204

COBRITHERM HTC 2,2W (PROOF TEST 3000V)

DESCRIPTION
Insulated Metal Substrate (IMS), based aluminium clad with ED copper foil on the opposite side. It is designed for
the reliable thermal dissipation of circuitry. A proprietarily formulated reinforced-polymer-ceramic bonding layer
with high thermal conductivity and dielectric strength allows us to guarantee thermal endurance.

The material is supplied with a film on the aluminium side to protect it against wet PCB processes.
ROHS compliance directive 2002/95/EC and REACH Nº 1907/2006
STANDARD CONSTRUCTIONS
Aluminium thickness, µm (in) 1000 (0.039) – 1500 (0.059) – 2000 Aluminium Alloy / Treat 5052
(0.078) – 3000 (0.12)
Insulation thickness, µm 90-130 (3,5-5 mils) Dielectric thickness tolerance + 10 µm (0,4mils)
ED copper thickness, µm 35 (1oz) – 70 (2oz) – 105 (3oz)
Other constructions available upon request
UL Approved , QMTS2 File: E47820 IPC 4101-C

(1) Electrical proof test . 100% of our laminate production delivered, has been “on line” verified at
1500/3000 Vdc: 500 V/sec. ramp // 5sec. held at 1500/3000 Vdc. (90µ
µ/130µ
µ respectively)

PROPERTIES TEST TYPICAL Guaranteed

UNITS
1500 µm Al / 130 µm dielectric /70 µm Cu METHOD VALUES values
Time to blister at 288ºC, floating on solder (50 x 50 mm) IEC-61189 Sec >120 >60
Copper Peel strength, after heat shock 20 sec/288ºC IPC-TM 650-2.4.8 N/mm (Lb/in) 2,8 (16,0) >1,8 (>10,3)
µ)
Dielectric breakdown voltage, AC (2) (130µ IPC-TM 650-2.5.6.3 kV 8 7
Dielectric breakdown voltage, AC (2) (90µ
µ) IPC-TM 650-2.5.6.3 kV 5.5 5
Proof Test, DC (1) (130µ
µ) -- V 3000 3000
Proof Test, DC (1) (90µ
µ) -- V 1500 1500
Thermal conductivity (dielectric layer) ASTM-D 5470 W/mK (W/inK) 2,20 (0,056) 2,00 (0,051)
Thermal impedance (dielectric layer) HTC 90µ
µ 0,41 (0,063) 0,45 (0,070)
ASTM-D 5470 Kcm2/W (Kin2/K)
Thermal impedance (dielectric layer) HTC 130µ
µ 0,59 (0,092) 0,65 (0,100)
5
Surface resistance after damp heat and recovery IEC-61189 MΩ 10 105
4
Volume resistivity after damp heat and recovery IEC-61189 MΩm 10 104
Relative permittivity after damp heat and recovery, 10 kHz IEC-61189 - 4,5 4,5
Dissipation factor after damp heat and recovery 10 kHz IEC-61189 - 0,02 0,02
Comparative tracking index (CTI) IEC-61112 V 600 >550
Permittivity -- pF/m (pF/in) 6,7 (39,4) 6,7 (39,4)
Flammability, according UL-94, class UL-94 class V-0 V-0
Glass transition temperature of dielectric layer (by TMA) IPC-TM 650-2.4.24 ºC 120 120
Maximum operating temperature -- °C 150 150
(2) Dielectric Breakdown test is a material destructive laboratory test. It is performed according the IPC-TM-650 part 2.5.6.3., by using
AC voltage until electric failure on a relatively small surface area of the dielectric layer using metal electrodes. Values should be
taken as a material reference and not as guaranteed values.

AVAILABILITY
STANDARD SHEET SIZES mm 1220x930 (48x37), 610x460 (24x18)
(inch) 1060x1170 (42x46), 1210x1000(48x40), 1025x1225 (40,3x48,2) (Also available in cut panels)
Tolerance mm (inch) +5/-0 (+0.2/-0,0000)
Squareness mm (inch) 3 (0,1181) max., as differential between diagonal measurements.
Standard size tolerance in panels +- 0,3 (+/- 0.0118)
mm (inch)

The data is based on typical values of standard production and should be considered as general information. Our company reserves the right to future
changes. It is the responsibility of the user to ensure that the product complies with his requirements.

c/Bach, 2-B Pol. Ind Poinvasa 08110 Montcada i reixac (Barcelona) SPAIN Tel. +34 93 572 41 61 FAX +34 93 572 41 65
E. mail: e.benmayor@benmayor.com www.benmayor.com
 C S-AL-88/89 AD2 (2 W/m°C)
Specification of Aluminum Based Copper-clad Laminate

Item Unit Specification Test condition

Max 200
Insulation thickness µm Min 60 —
Solder resistance (288°C) Sec. Min 600 IPC-TM-650 3.10.1.12
Thermal shock Û& F\FOH Min 6 Times IPC-TM-650 2.4.13.1
Peel strength (Normal status) Ib/in Min 9 IPC-TM-650 2.4.8
Breakdown Voltage V/mil 750 IPC-TM-650 2.5.6
Volume resistivity (Normal status >E+14) ȍ‡FP 1.8x1015 IPC-TM-650 2.5.17.1
Surface resistivity (Normal status >E+12) Ÿ — 3.5x1014 IPC-TM-650 2.5.17.1
Dielectric constant IPC-TM-650
1 MHz Normal status — 5.6 2.5.5.3
2.5.5.5
1 GHz Normal status 5.3 2.5.5.6
Dissipation Factor IPC-TM-650
1 MHz Normal status 0.013 2.5.5.3
2.5.5.5
1 GHz Normal status 0.010 2.5.5.9
Water absorption % 0.2 IPC-TM-650 2.6.2.1
Thermal conductivity
:PÛ& 2.0 ASTM-E1461
(measured on insulation layer only)
Flammability 94V-0 Pass IPC-TM-650 2.3.9
Tg Û& 100 IPC-TM-650 2.4.24
Td Û& 410 TBD (5wt% loss)
MOT (RTI) Û& 130 UL 746B
CTI (Comparative Tracking Index) V >600 (PLC=0) UL746E DSR

The thickness and dimension of Aluminum Based Copper-clad Laminate

Product category CS-AL-88/89 AD2 (The thickness of glue is 2~8mil)

300~ 340× 500~ 520
405/ 400× 500~ 520
Dimension m/m 600~ 620× 500~ 520
1200~ 1240× 500~ 520
1200~ 1240× 1020~ 1060
The thickness of Single-Sided
2.0 1/0 1.5 1/0 1.5 2/0 1.0 1/0 0.8 1/0
PCB with Aluminum Substrate
The thickness of Double-Sided 2.0 1/1 1.5 H/H 1.5 1/1 1.0 1/1 0.8 1/1
PCB with Aluminum Substrate
» The above thicknesses exclude the thickness of glue, and the thicknesses of copper tinsel and Aluminum can be
combined arbitrarily.
The thickness of copper foilȈH oz~5.0 oz. The thickness of aluminum plateȈ0.2~5.0mm.
» This material is one kind of halogens-free green environmental kindly material.
» Compliance with the specification of RoHS,Compliance with the specification of REACH.

The scope of application

» Lighting LED outer-wall lighting, LED stage lighting, road LED lighting, domestic LED lighting, office LED lighting.
» Electronic devices in automobile igniting device, voltage regulator, auto safety control system, AC transformer.
» Power supply Switch regulator, switch, DC-DC transformer, DC-AC transformer, large power, base board of solar cell.
» Electronic control Relay, transistor base, switchboard, radiator, insulating heat conductive board in semiconductor,
motor control device.
» Computer devices Power supply device, soft disk driver, CPU.
» Communication electronic products automobile telephone, high frequency booster of mobile telephone, filter circuit,
transmitting circuit.

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