Data sheet acquired from Harris Semiconductor

SCHS057C – Revised September 2003

The CD4073B, CD4081B, and CD4082B types

are supplied in 14-lead hermetic dual-in-line
ceramic packages (F3A suffix), 14-lead
dual-in-line plastic packages (E suffix), 14-lead
small-outline packages (M, MT, M96, and NSR
suffixes), and 14-lead thin shrink small-outline
packages (PW and PWR suffixes).

Copyright  2003, Texas Instruments Incorporated

 PACKAGE OPTION ADDENDUM

www.ti.com 15-Oct-2009

PACKAGING INFORMATION

Orderable Device Status (1) Package Package Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Type Drawing Qty
7702402CA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
7705102CA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
7705902CA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
CD4073BE ACTIVE PDIP N 14 25 Pb-Free CU NIPDAU N / A for Pkg Type
(RoHS)
CD4073BEE4 ACTIVE PDIP N 14 25 Pb-Free CU NIPDAU N / A for Pkg Type
(RoHS)
CD4073BF ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
CD4073BF3A ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
CD4073BM ACTIVE SOIC D 14 50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4073BM96 ACTIVE SOIC D 14 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4073BM96E4 ACTIVE SOIC D 14 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4073BM96G4 ACTIVE SOIC D 14 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4073BME4 ACTIVE SOIC D 14 50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4073BMG4 ACTIVE SOIC D 14 50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4073BMT ACTIVE SOIC D 14 250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4073BMTE4 ACTIVE SOIC D 14 250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4073BMTG4 ACTIVE SOIC D 14 250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4073BNSR ACTIVE SO NS 14 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4073BNSRE4 ACTIVE SO NS 14 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4073BNSRG4 ACTIVE SO NS 14 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4073BPW ACTIVE TSSOP PW 14 90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4073BPWE4 ACTIVE TSSOP PW 14 90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4073BPWG4 ACTIVE TSSOP PW 14 90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4073BPWR ACTIVE TSSOP PW 14 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4073BPWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4073BPWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4081BE ACTIVE PDIP N 14 25 Pb-Free CU NIPDAU N / A for Pkg Type
(RoHS)
CD4081BEE4 ACTIVE PDIP N 14 25 Pb-Free CU NIPDAU N / A for Pkg Type
(RoHS)

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Orderable Device Status (1) Package Package Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Type Drawing Qty
CD4081BF ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
CD4081BF3A ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
CD4081BF3AS2534 OBSOLETE CDIP J 14 TBD Call TI Call TI
CD4081BM ACTIVE SOIC D 14 50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4081BM96 ACTIVE SOIC D 14 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4081BM96E4 ACTIVE SOIC D 14 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4081BM96G4 ACTIVE SOIC D 14 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4081BME4 ACTIVE SOIC D 14 50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4081BMG4 ACTIVE SOIC D 14 50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4081BMT ACTIVE SOIC D 14 250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4081BMTE4 ACTIVE SOIC D 14 250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4081BMTG4 ACTIVE SOIC D 14 250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4081BNSR ACTIVE SO NS 14 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4081BNSRE4 ACTIVE SO NS 14 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4081BNSRG4 ACTIVE SO NS 14 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4081BPW ACTIVE TSSOP PW 14 90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4081BPWE4 ACTIVE TSSOP PW 14 90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4081BPWG4 ACTIVE TSSOP PW 14 90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4081BPWR ACTIVE TSSOP PW 14 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4081BPWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4081BPWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4082BE ACTIVE PDIP N 14 25 Pb-Free CU NIPDAU N / A for Pkg Type
(RoHS)
CD4082BEE4 ACTIVE PDIP N 14 25 Pb-Free CU NIPDAU N / A for Pkg Type
(RoHS)
CD4082BF ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
CD4082BF3A ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
CD4082BM ACTIVE SOIC D 14 50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4082BM96 ACTIVE SOIC D 14 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4082BM96E4 ACTIVE SOIC D 14 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)

Addendum-Page 2
 PACKAGE OPTION ADDENDUM

www.ti.com 15-Oct-2009

Orderable Device Status (1) Package Package Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Type Drawing Qty
CD4082BM96G4 ACTIVE SOIC D 14 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4082BME4 ACTIVE SOIC D 14 50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4082BMG4 ACTIVE SOIC D 14 50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4082BMT ACTIVE SOIC D 14 250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4082BMTE4 ACTIVE SOIC D 14 250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4082BMTG4 ACTIVE SOIC D 14 250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4082BNSR ACTIVE SO NS 14 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4082BNSRE4 ACTIVE SO NS 14 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4082BNSRG4 ACTIVE SO NS 14 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4082BPW ACTIVE TSSOP PW 14 90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4082BPWE4 ACTIVE TSSOP PW 14 90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4082BPWG4 ACTIVE TSSOP PW 14 90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4082BPWR ACTIVE TSSOP PW 14 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4082BPWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4082BPWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
JM38510/17001BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
JM38510/17002BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
JM38510/17003BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

Addendum-Page 3
 PACKAGE OPTION ADDENDUM

www.ti.com 15-Oct-2009

(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.

Addendum-Page 4
 PACKAGE MATERIALS INFORMATION
www.ti.com 11-Mar-2008

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package Package Pins SPQ Reel Reel A0 (mm) B0 (mm) K0 (mm) P1 W Pin1
Type Drawing Diameter Width (mm) (mm) Quadrant
(mm) W1 (mm)
CD4073BM96 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
CD4073BNSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
CD4073BPWR TSSOP PW 14 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1
CD4081BM96 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
CD4081BNSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
CD4081BPWR TSSOP PW 14 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1
CD4082BM96 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
CD4082BNSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
CD4082BPWR TSSOP PW 14 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1

Pack Materials-Page 1
 PACKAGE MATERIALS INFORMATION
www.ti.com 11-Mar-2008

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
CD4073BM96 SOIC D 14 2500 346.0 346.0 33.0
CD4073BNSR SO NS 14 2000 346.0 346.0 33.0
CD4073BPWR TSSOP PW 14 2000 346.0 346.0 29.0
CD4081BM96 SOIC D 14 2500 346.0 346.0 33.0
CD4081BNSR SO NS 14 2000 346.0 346.0 33.0
CD4081BPWR TSSOP PW 14 2000 346.0 346.0 29.0
CD4082BM96 SOIC D 14 2500 346.0 346.0 33.0
CD4082BNSR SO NS 14 2000 346.0 346.0 33.0
CD4082BPWR TSSOP PW 14 2000 346.0 346.0 29.0

Pack Materials-Page 2
 MECHANICAL DATA

MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999

PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE

14 PINS SHOWN

0,30
0,65 0,10 M
0,19
14 8

0,15 NOM
4,50 6,60
4,30 6,20

Gage Plane

0,25
1 7
0°– 8°
A 0,75
0,50

Seating Plane

1,20 MAX 0,15 0,10

0,05

PINS **
8 14 16 20 24 28
DIM

A MAX 3,10 5,10 5,10 6,60 7,90 9,80

A MIN 2,90 4,90 4,90 6,40 7,70 9,60

4040064/F 01/97

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

 PACKAGE OPTION ADDENDUM

www.ti.com 1-May-2025

PACKAGING INFORMATION

Orderable Status Material type Package | Pins Package qty | Carrier RoHS Lead finish/ MSL rating/ Op temp (°C) Part marking
part number (1) (2) (3) Ball material Peak reflow (6)
(4) (5)

7702402CA Active Production CDIP (J) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 7702402CA
CD4081BF3A
7705102CA Active Production CDIP (J) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 7705102CA
CD4073BF3A
7705902CA Active Production CDIP (J) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 7705902CA
CD4082BF3A
CD4073BE Active Production PDIP (N) | 14 25 | TUBE Yes NIPDAU N/A for Pkg Type -55 to 125 CD4073BE
CD4073BF Active Production CDIP (J) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 CD4073BF
CD4073BF3A Active Production CDIP (J) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 7705102CA
CD4073BF3A
CD4073BM Obsolete Production SOIC (D) | 14 - - Call TI Call TI -55 to 125 CD4073BM
CD4073BM96 Active Production SOIC (D) | 14 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -55 to 125 CD4073BM
CD4073BMT Obsolete Production SOIC (D) | 14 - - Call TI Call TI -55 to 125 CD4073BM
CD4073BNSR Active Production SOP (NS) | 14 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -55 to 125 CD4073B
CD4073BPW Obsolete Production TSSOP (PW) | 14 - - Call TI Call TI -55 to 125 CM073B
CD4073BPWR Active Production TSSOP (PW) | 14 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -55 to 125 CM073B
CD4081BE Active Production PDIP (N) | 14 25 | TUBE Yes NIPDAU N/A for Pkg Type -55 to 125 CD4081BE
CD4081BF Active Production CDIP (J) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 CD4081BF
CD4081BF3A Active Production CDIP (J) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 7702402CA
CD4081BF3A
CD4081BM Active Production SOIC (D) | 14 50 | TUBE Yes NIPDAU Level-1-260C-UNLIM -55 to 125 CD4081BM
CD4081BM96 Active Production SOIC (D) | 14 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -55 to 125 CD4081BM
CD4081BMT Obsolete Production SOIC (D) | 14 - - Call TI Call TI -55 to 125 CD4081BM
CD4081BNSR Active Production SOP (NS) | 14 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -55 to 125 CD4081B
CD4081BPW Obsolete Production TSSOP (PW) | 14 - - Call TI Call TI -55 to 125 CM081B
CD4081BPWR Active Production TSSOP (PW) | 14 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -55 to 125 CM081B
CD4082BE Active Production PDIP (N) | 14 25 | TUBE Yes NIPDAU N/A for Pkg Type -55 to 125 CD4082BE
CD4082BF Active Production CDIP (J) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 CD4082BF
CD4082BF3A Active Production CDIP (J) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 7705902CA
CD4082BF3A
CD4082BM Obsolete Production SOIC (D) | 14 - - Call TI Call TI -55 to 125 CD4082BM

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 PACKAGE OPTION ADDENDUM

www.ti.com 1-May-2025

Orderable Status Material type Package | Pins Package qty | Carrier RoHS Lead finish/ MSL rating/ Op temp (°C) Part marking
part number (1) (2) (3) Ball material Peak reflow (6)
(4) (5)

CD4082BM96 Active Production SOIC (D) | 14 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -55 to 125 CD4082BM
CD4082BMT Obsolete Production SOIC (D) | 14 - - Call TI Call TI -55 to 125 CD4082BM
CD4082BNSR Active Production SOP (NS) | 14 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -55 to 125 CD4082B
CD4082BPW Obsolete Production TSSOP (PW) | 14 - - Call TI Call TI -55 to 125 CM082B
CD4082BPWR Active Production TSSOP (PW) | 14 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -55 to 125 CM082B
JM38510/17001BCA Active Production CDIP (J) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 JM38510/
17001BCA
JM38510/17002BCA Active Production CDIP (J) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 JM38510/
17002BCA
JM38510/17003BCA Active Production CDIP (J) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 JM38510/
17003BCA

(1)
Status: For more details on status, see our product life cycle.

(2)
Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without
limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available
for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind.

(3)
RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition.

(4)
Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the
finish value exceeds the maximum column width.

(5)
MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per
JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board.

(6)
Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part.

Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the
previous line and the two combined represent the entire part marking for that device.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

Addendum-Page 2
 PACKAGE OPTION ADDENDUM

www.ti.com 1-May-2025

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF CD4073B, CD4073B-MIL, CD4081B, CD4081B-MIL, CD4082B, CD4082B-MIL :

• Catalog : CD4073B, CD4081B, CD4082B

• Military : CD4073B-MIL, CD4081B-MIL, CD4082B-MIL

NOTE: Qualified Version Definitions:

• Catalog - TI's standard catalog product

• Military - QML certified for Military and Defense Applications

Addendum-Page 3
 PACKAGE MATERIALS INFORMATION

www.ti.com 13-May-2025

TAPE AND REEL INFORMATION

REEL DIMENSIONS TAPE DIMENSIONS

K0 P1

B0 W
Reel
Diameter
Cavity A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
W Overall width of the carrier tape
P1 Pitch between successive cavity centers

Reel Width (W1)

QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE

Sprocket Holes

Q1 Q2 Q1 Q2

Q3 Q4 Q3 Q4 User Direction of Feed

Pocket Quadrants

*All dimensions are nominal

Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
CD4073BM96 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
CD4073BNSR SOP NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
CD4073BPWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
CD4081BM96 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
CD4081BNSR SOP NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
CD4081BPWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
CD4082BM96 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
CD4082BNSR SOP NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
CD4082BPWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1

Pack Materials-Page 1
 PACKAGE MATERIALS INFORMATION

www.ti.com 13-May-2025

TAPE AND REEL BOX DIMENSIONS

Width (mm)
H
W

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
CD4073BM96 SOIC D 14 2500 356.0 356.0 35.0
CD4073BNSR SOP NS 14 2000 356.0 356.0 35.0
CD4073BPWR TSSOP PW 14 2000 356.0 356.0 35.0
CD4081BM96 SOIC D 14 2500 356.0 356.0 35.0
CD4081BNSR SOP NS 14 2000 356.0 356.0 35.0
CD4081BPWR TSSOP PW 14 2000 356.0 356.0 35.0
CD4082BM96 SOIC D 14 2500 356.0 356.0 35.0
CD4082BNSR SOP NS 14 2000 356.0 356.0 35.0
CD4082BPWR TSSOP PW 14 2000 356.0 356.0 35.0

Pack Materials-Page 2
 PACKAGE MATERIALS INFORMATION

www.ti.com 13-May-2025

TUBE

T - Tube
height L - Tube length

W - Tube
width

B - Alignment groove width

*All dimensions are nominal

Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm)
CD4073BE N PDIP 14 25 506 13.97 11230 4.32
CD4073BE N PDIP 14 25 506 13.97 11230 4.32
CD4081BE N PDIP 14 25 506 13.97 11230 4.32
CD4081BEE4 N PDIP 14 25 506 13.97 11230 4.32
CD4081BM D SOIC 14 50 506.6 8 3940 4.32
CD4081BME4 D SOIC 14 50 506.6 8 3940 4.32
CD4081BMG4 D SOIC 14 50 506.6 8 3940 4.32
CD4082BE N PDIP 14 25 506 13.97 11230 4.32
CD4082BE N PDIP 14 25 506 13.97 11230 4.32
CD4082BEE4 N PDIP 14 25 506 13.97 11230 4.32
CD4082BEE4 N PDIP 14 25 506 13.97 11230 4.32

Pack Materials-Page 3
 PACKAGE OUTLINE
D0014A SCALE 1.800
SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT

C
6.2
TYP SEATING PLANE
5.8

A PIN 1 ID 0.1 C
AREA
12X 1.27
14
1

8.75 2X
8.55 7.62
NOTE 3

7
8
0.51
14X
4.0 0.31
B 1.75 MAX
3.8 0.25 C A B
NOTE 4

0.25
TYP
0.13
SEE DETAIL A
0.25
GAGE PLANE

0.25
0 -8 1.27 0.10
0.40

DETAIL A
TYPICAL

4220718/A 09/2016

NOTES:

1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm, per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.43 mm, per side.
5. Reference JEDEC registration MS-012, variation AB.

www.ti.com
 EXAMPLE BOARD LAYOUT
D0014A SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT

14X (1.55) SYMM

1
14

14X (0.6)

12X (1.27)
SYMM

7 8

(R0.05)
TYP
(5.4)

LAND PATTERN EXAMPLE

SCALE:8X

SOLDER MASK METAL UNDER SOLDER MASK

METAL OPENING
OPENING SOLDER MASK

0.07 MAX 0.07 MIN

ALL AROUND ALL AROUND

NON SOLDER MASK SOLDER MASK

DEFINED DEFINED

SOLDER MASK DETAILS

4220718/A 09/2016
NOTES: (continued)

6. Publication IPC-7351 may have alternate designs.

7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

www.ti.com
 EXAMPLE STENCIL DESIGN
D0014A SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT

14X (1.55) SYMM

1
14

14X (0.6)

12X (1.27)
SYMM

7 8

(5.4)

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL
SCALE:8X

4220718/A 09/2016
NOTES: (continued)

8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.

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 PACKAGE OUTLINE
J0014A SCALE 0.900
CDIP - 5.08 mm max height
CERAMIC DUAL IN LINE PACKAGE

PIN 1 ID A 4X .005 MIN

(OPTIONAL) [0.13] .015-.060 TYP
[0.38-1.52]

1
14
12X .100
[2.54] 14X .014-.026
14X .045-.065 [0.36-0.66]
[1.15-1.65]
.010 [0.25] C A B

.754-.785
[19.15-19.94]

7 8

B .245-.283 .2 MAX TYP .13 MIN TYP

[6.22-7.19] [5.08] [3.3]

C SEATING PLANE

.308-.314
[7.83-7.97]
AT GAGE PLANE

.015 GAGE PLANE

[0.38]

0 -15 14X .008-.014

TYP [0.2-0.36]

4214771/A 05/2017

NOTES:

1. All controlling linear dimensions are in inches. Dimensions in brackets are in millimeters. Any dimension in brackets or parenthesis are for
reference only. Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This package is hermitically sealed with a ceramic lid using glass frit.
4. Index point is provided on cap for terminal identification only and on press ceramic glass frit seal only.
5. Falls within MIL-STD-1835 and GDIP1-T14.

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 EXAMPLE BOARD LAYOUT
J0014A CDIP - 5.08 mm max height
CERAMIC DUAL IN LINE PACKAGE

(.300 ) TYP
[7.62] SEE DETAIL B
SEE DETAIL A

1 14

12X (.100 )
[2.54]

SYMM

14X ( .039)
[1]

7 8

SYMM

LAND PATTERN EXAMPLE

NON-SOLDER MASK DEFINED
SCALE: 5X

.002 MAX (.063)

[0.05] [1.6]
ALL AROUND METAL
( .063)
SOLDER MASK [1.6]
OPENING

METAL

SOLDER MASK .002 MAX

(R.002 ) TYP [0.05]
OPENING
[0.05] ALL AROUND
DETAIL A DETAIL B
SCALE: 15X 13X, SCALE: 15X

4214771/A 05/2017

www.ti.com
 PACKAGE OUTLINE
PW0014A SCALE 2.500
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE

SEATING
PLANE
6.6 C
TYP
A 6.2
0.1 C
PIN 1 INDEX AREA
12X 0.65
14
1

2X
5.1 3.9
4.9
NOTE 3

4X (0 -12 )
7
8
0.30
14X
0.17
4.5 1.2 MAX
B 0.1 C A B
4.3
NOTE 4

(0.15) TYP
SEE DETAIL A

0.25
GAGE PLANE
0.15
0.05

0.75
0.50
0 -8
DETAIL A
A 20

TYPICAL

4220202/B 12/2023

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-153.

www.ti.com
 EXAMPLE BOARD LAYOUT
PW0014A TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE

14X (1.5) SYMM

(R0.05) TYP
1
14X (0.45) 14

SYMM

12X (0.65)

7 8

(5.8)

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN
SCALE: 10X

SOLDER MASK METAL UNDER SOLDER MASK

METAL SOLDER MASK OPENING
OPENING

EXPOSED METAL EXPOSED METAL

0.05 MAX 0.05 MIN

ALL AROUND ALL AROUND

NON-SOLDER MASK SOLDER MASK

DEFINED DEFINED
(PREFERRED) SOLDER MASK DETAILS
15.000

4220202/B 12/2023
NOTES: (continued)

6. Publication IPC-7351 may have alternate designs.

7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

www.ti.com
 EXAMPLE STENCIL DESIGN
PW0014A TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE

14X (1.5) SYMM

(R0.05) TYP
1
14X (0.45) 14

SYMM

12X (0.65)

7 8

(5.8)

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL
SCALE: 10X

4220202/B 12/2023
NOTES: (continued)

8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.

www.ti.com
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