Unit I
Mechanical Behaviour of metals
  Arrangement of Atoms
                              Arrangement of atoms in
                              (a) face-centred cubic structure,
                              (b) close-packed hexagonal structure, and
                              (c) body-centred cubic structure
When Does it take place?
• Deformation in metals or alloys takes place when stress
  is applied.
• Deformation is the change in the dimension or the form of
  the material under the action of applied force
Elastic Deformation:
• Deformation in metals can occur either by elastic
  movement or by plastic flow. In elastic deformation a
  limited distortion of the crystal lattice is produced, but the
  atoms do not move permanently from their ordered
  positions, and as soon as the stress is removed the
  distortion disappears.
Elastic Deformation:
• Characteristics of Elastic Deformation:
    (1) it is reversible,
    (2) stress and strain are linearly proportional to
        each other according to Hooke’s Law and
    (3) strain is usually small (i.e. <1% elastic strain).
Plastic Deformation
• When a metal is stressed beyond the elastic limit plastic deformation
  takes place
• Movement of the atoms into new positions, since considerable
  permanent distortion is produced. Plastic deformation is permanent
                             A: Before straining             B: After straining
Plastic Deformation
• Permanent or plastic deformation may be carried out intentionally
  many times as in working or shaping processes like bending,
  stamping, drawing, spinning, rolling, forging extruding etc.
• Plastic deformation may also be carried out in order to improve some
  mechanical properties of metals and alloys.
Mechanism of Plastic Deformation                                              Structure
                                                      Structure Insensitive   sensitive
Lattice Defects:                                                              Electrical
                                                      Elastic constants       conductivity
•   Lattice defects help explain mechanical                                   Semiconductor
    properties of materials such as:                  Melting point           properties
•   Yield strength                                    Density                 Yield stress
                                                                              Fracture
•   Fracture strength
                                                      Specific Heat           strength
•   Creep strength                                    Coefficient of
                                                      thermal expansion Creep Strength
                                Point Defects
                                              Schematic representation of different point
                                              defects in a crystal.
                                              (1) vacancy;
                                              (2) self interstitial;
                                              (3) interstitial impurity;
                                              (4), (5) substitutional impurities.
                                              The arrows show the local stresses
                                              introduced by the point
What are dislocations?
• Dislocations are line defects that exist in metals
• There are two types of dislocations: edge and screw
• The symbol for a dislocation is
• The dislocation density in annealed metals is normally r = 106/cm2
How does a dislocation move?
                             Deformation by slip
Types of dislocations
                                                            Screw
                     Edge
Dislocation motion Û plastic deformation
   Note: Dislocations normally move under a shear stress
Stress field of
a dislocation
Analog to
an electric
charge
  Dislocation –TEM picture of dislocation network in
    cold worked aluminium
TEM is Transmission Electron Microscopy .
In this technique a thin foil of 100nm is
prepared from the sample.
This thin foil becomes transparent to
electrons in electron microscope and
therefore it becomes possible to view the
dislocation network, stacking faults etc.
Dislocation interaction
                 Positive                Positive
                     ^                         ^                    Repulsion
                  Positive              Negative
                                                                Attraction
                      ^
                                                                    &
                                                               Annihilation
             Note: More positive-positive interactions in reality
    Positive-positive dislocation interaction
• Results in more stress to move dislocations (or cause plastic
  deformation)
• Due to the process of work hardening
• This type of interaction also leads to dislocation multiplication
  which leads to more interactions and more work hardening
    Modes of deformation
    • Slip
    • Twinning
     Slip
• Dislocations move on a certain crystallographic plane: slip plane
• Dislocations move in a certain crystallographic direction: slip direction
•    The combination of slip direction and slip plane is called a slip system
•    Slip planes are normally close-packed planes
•    Atoms move easily on a packed planes
•    Slip directions are normally close-packed
        Recall for fcc close-packed planes are {111}
        Close-packed directions are <110>
Slip systems
  Crystal    Slip plane Slip        Total     Active
  system                direction   number of slip
                                    slip      systems
                                    systems
  fcc        {111}      <110>       4X3       12
  hcp        {0001}     <1120>      1X3       3
  bcc        {110}      <111>       6X2       12
             {211}      <111>       12X1      12
             {321}      <111>       24X1      24
 Classical slip
            Under the action of Shear Load
Twinning
• Common in hcp and fcc structures
• Limited deformation but helps in plastic deformation in hcp and
  bcc crystals
• Occurs on specific twinning planes and twinning directions
   Typical Slip planes and directions for Twinning
   Metal                Structure              Slip System
                                         Slip       Slip
                                         Plane      Direction
   Zn, Mg, Cd           HCP              {1012} <1011>
   Cu, Ag, Au           FCC              {111}      <112>
   Fe, Cr, V, Mo,
   W                    BCC              {112}      <111>
      Mechanical Twins and Annealing twins
(a)    Neumann’s       bands     in Fe,
(b)    Mechanical twins produced in Zn on polishing and
(c)    Annealing twins generated after annealing in gold-silver alloy
      Difference between slip and Twinning
         Difference between slip and twinning:
       Slip                           Twinning
       1. All the atoms in one        1. Atoms in successive plane
           block move the same           within a block move
           distance                      different distance
       2. Under microscope the        2. Twins appears as broad
           slip appears as a thin        lines or bands
           line                       3. There is a markedly
       3. There is very little           different lattice orientation
           change in the lattice         in the twinned region
           orientation                4. Whenever the possible slip
       4. Twining usually requires       systems are considerably
           higher shear stress than      limited, as in the case of
           slip initially                HCP metals, twinning
                                         becomes the mode of
                                         deformation
Deformation by Slip:
Earlier it was thought that slip occurs by simultaneous gliding of
complete block of atoms over another. But this requires that the
shearing force must have the same value over all points of the slip
plane. The vibration of atoms and the difficulty in applying a
uniformly distributed force makes this condition unattainable.
Wrinkled sheet of paper example
Dislocations are imperfections or distorted region in the otherwise
prefect crystal and the step by step movement of dislocations
explains why the force required to produce slip is of the order of
1000 times less than the theoretical assuming simultaneous slip
over a whole system.
 Deformation by Slip:
The Burgers vector b is the vector which defines the magnitude and
direction of slip.
It has already been shown that for a pure edge dislocation the
Burger’s vector is perpendicular to the dislocation line, while for a pure
screw dislocation the Burger’s vector is parallel to the dislocation line.
Actually, dislocations in real crystals are rarely straight lines and rarely lie
in a single plane.
A dislocation will be partly edge and partly screw in character
Slip occurs at a definite point where dislocation exists and proceeds by
movement of the dislocation in a given plane of the crystal due to shear
stresses.
A dislocation results in the slip band
Deformation by Stacking Faults
                                                Faulted structures,
                                                (a) Face-centered cubic packing;
                                                (b) deformation fault in fcc
                                                (c) twin fault in fcc
                                                (d) hcp packing.
 Deformation by Stacking Faults
                   FCC                               HCP
     slip                                                            or C
                                                                     or C
  • All defects cost energy (J/m2 or erg/cm2).
  • Stress, dislocation motion can create Stacking Faults.
Deformation by Kinking:
Consideration of the equation for critical resolved shear stress
shows that it will be difficult to deform a hexagonal crystal when the
basal plane is nearly parallel to the crystal axis.
Orowan found that if a cadmium crystal of this orientation were
loaded in compression it would deform by a localized region of the
crystal suddenly snapping into a tilted position with a sudden
shortening of the crystal.
Deformation in polycrystalline Materials
Until now we considered the deformation in single crystals in terms of
the movement of dislocations and the basic deformation mechanisms
of slip and twinning.
Commercially available materials are made of polycrystalline aggregates
made of a large number of small grains.
                                                     Grains are not free to move
                                                     as they are-
                                                     Surrounded by other grains,
                                                     grain boundaries and have
                                                     different crystallographic
                                                     orientation
           Microstructure of Fe-C alloy
    Deformation in polycrystalline Materials
                                                      • Each of the light areas is called a
                                                        grain, or crystal, which is the
                                                        region of space occupied by a
                                                        continuous crystal lattice
                                                      • The dark lines surrounding the
                                                        grains are grain boundaries.
                                                      • (B) represents four grains of
                                                        different orientation and the grain
    (A) Microscopic             (B) Atomic              boundaries that arise at the
                                                        interfaces between the grains.
                                                      • (A) Random grain Orientation –
                                                        isotropic properties
                                                      • (B) Directional properties
   (A) Random      Cold       (B) Preferred grain-
   Rolled Non Oriented       oriented structure
   https://engineeringlibrary.org/reference/structure-of-metals-doe-handbook
         Yield Point and grain diameter correlation
Deformation in polycrystalline Materials
Restricted movement :
A large amount of stress is required to move the dislocations across the
grains due to difference in the orientation of the grains.
Grain boundaries restrict the movement of the dislocations resulting in
the pile up of dislocations at the grain boundary
Grain Size also plays an important role in the movement of dislocations
in the early stages of deformation
Stages in the deformation process of
polycrystalline materials
1.   Elastic Deformation
2.   Plastic deformation sets in- Elastic after effect where stresses develop and the
     elastically deformed crystals force the plastically deformed crystals into their
     original positions.
3.   Majority of crystals deform plastically
4.   Yielding of the polycrystalline material
   Yield point phenomenon                                 Luders Bands
                                                          Tensile test specimen the
Two distinct yield points called as upper yield point     fillet act as stress raisers
and lower yield point                                     and at these points the
Stress value rises higher with strain and fluctuates at   luders bands are formed.
a lower value before the load is again increased          They are generally at
The elongation that takes place at constant stress is     approximately at an angle
called as Yield point         elongation and the          0f 45 to 50 degree to
phenomenon is called as Yield Point phenomenon.           tensile axis.
    Strain Hardening of Single Crystals:
  shear stress required to produce slip continuously increases with
  increasing shear strain. The increase in the stress required to cause slip
  because of previous plastic deformation is known as strain hardening, or
  work hardening.
  An increase in flow stress of over 100 per cent from strain
  hardening is not unusual in single crystals of ductile metals.
  Strain hardening is caused by dislocations interacting with each
  other and with barriers which impede their motion through the
  crystal lattice.
  Strain Hardening of Single Crystals:
  •As deformation proceeds the metal becomes progressively
  harder and stronger and, whether by slip or by twinning, a point is
  reached when no more deformation can be produced. Any further
  increase in the applied force will lead only to fracture.
  •In this condition, when tensile strength and hardness have
  reached a maximum and ductility a minimum, the material is said
  to be work hardened. As deformation proceeds the capacity for
  further deformation decreases and the force necessary to produce it
  increases.
  •This increase in the stress required to cause slip because of the
  previous plastic deformation or the increase in strength of material
  due to mechanical working is known as strain hardening or
  work hardening
  Strain Hardening of Single Crystals:
   •Strain hardening is very commonly applied to pure
   metals or alloys as a means to improve the
   mechanical properties such as hardness and
   strength.
                                                          Cold working
                                                  Strain hardening is expressed in
                                                  terms of % cold work
                                                  %CW = ((Ao-Ad)/Ao)*100
                                                  Ao = Original Area
                                                  Ad = Deformed area
Bauschinger effect of complete reversal of slip
     Effect- direction on stress- strain curve.
 Data of cold work with TS and Ductility
     Example
Compute the tensile strength and ductility (%EL) of a cylindrical copper rod if
the diameter is reduced from 15.2 mm to 12.2 mm
Data is available to compute strength and ductility from the value of % CW
                   Hot Working and cold working
• Hot working – metal working processes carried out above the
  recrystallization temperature are called as hot working
  processes.
• Cold working processes: metal working processes carried out
  below the recrystallization temperature are called as hot
  working processes.
• Under the action of heat and force the atoms reach a certain
  higher energy level and new crystals start to form.
• Recrystallization destroys the older grain structure deformed by
  mechanical working and new crystals that are strain free are
  formed.
                                                                                  53
                 Hot Working and cold working
             A                  B                   C                    D
           A      B : Recrystallization
           B, C & D : Grain Growth
•   Grain begin start to nucleate at the sites of severest deformation due to a
    very high stored energy.
•   Recrystallization Temperature: is defined as “approximate minimum
    temperature at which complete recrystallization of a cold worked metal
    occurs within a specified time”
                                                 American Society of Materials
                                                                                  54
                  Hot Working and cold working
                                 •     Three EBSD (Electron Back Scatter
                                       Diffraction) maps of the stored energy
                                       in an Al-Mg-Mn alloy after exposure
                                       to increasing recrystallization
                                       temperature. The volume fraction of
                                       recrystallized grains (light) increases
                                       with temperature for a given time
                                 • The recrystallization
                                   temperature generally varies
                                   between 1/3rd of to half the
                                   melting point of most metals.
                                                                                                       39
            Hot Working and cold working
    Typical values of Recrystallization Temperatures
                                     Ref: Manufacturing technology by P.N. Rao Volume –I 3rd edition
Melting points:
Lead : 327 oC           Zinc: 419 oC                            Copper: 1083 oC
Tin: 232 oC             Magnesium: 670 oC                       Iron:1539 oC
Cadmium: 321 oC         Aliminium: 660 oC                       Tungsten: 3000 oC
Nickel: 1452 oC         Titanium: 1795 oC                         Beryllium: 1287 oC
                                                                                                       40
                    Hot Working and cold working
Effect of amount of plastic deformation on the
recrystallization temperature
Recrystallization temperature
also depends upon the amount
of cold work the materials has
already received.
Higher the cold work lower is
the recrystallization
temperature
                                 Ref: Manufacturing technology by P.N. Rao Volume –I 3rd edition       57
                    Hot Working and cold working
  Effect of other parameters on the recrystallization
     temperature
                                     Ref: Manufacturing technology by P.N. Rao Volume –I 3rd edition
                                                                                                       42
                Hot Working and cold working
• Recrystallization kinetics are
  commonly observed to follow
  the profile shown. There is an
  initial 'nucleation
  period' t0 where the nuclei
  form, and then begin to grow
  at a constant rate consuming
  the deformed matrix.
                                     Variation of recrystallized volume fraction
                                     with time
                                                                             43
              Hot Working and cold working
  Schematic showing the variation of grain size in hot rolling
  process (Grain Reformation)
                                                                             44
             Hot Working and cold working
• This process is generally performed on a metal held at such a
  temperature that the metal does not work-harden. A few metals
  e.g., Pb and Sn (since they possess low crystallization
  temperature) can be hot worked at room temperature.
• Raising the metal temperature lowers the stresses required to
  produce deformations and increases the possible amount of
  deformation before excessive work hardening takes place.
• Hot working is preferred where large deformations have to be
  performed that do not have the primary purpose of causing work
  hardening.
• Hot working produces the same net results on a metal as cold
  working and annealing. It does not strain harden the metal.
                                                                 45
             Hot Working and cold working
• In hot working processes, compositional irregularities are ironed
  out and nonmetallic impurities are broken up into small,
  relatively harmless fragments, which are uniformly dispersed
  throughout the metal instead of being concentrated in large
  stress-raising metal working masses.
• Hot working such as rolling process refines grain structure.
• The coarse columnar dendrites of cast metal are refined to
  smaller equi-axed grains with corresponding improvement in
  mechanical properties of the component.
• Surface finish of hot worked metal is not nearly as good as with
  cold working, because of oxidation and scaling.
                                                                 46
           Hot Working and cold working
• One has to be very careful with the temperatures at which to
  start hot work and at which to stop because this affects the
  properties to be introduced in the hot worked metal.
• Too high a temperature may cause phase change and overheat
  the steel whereas too low temperature may result in excessive
  work hardening.
• Defects in the metal such as blowholes, internal porosity and
  cracks get removed or welded up during hot working.
• During hot working, self-annealing occurs and recrystallization
  takes place immediately following plastic deformation. This
  self-annealing action prevents hardening and loss of ductility.
                                                               47
               Advantages of hot rolling
• As the material is above the recrystallization temperature, any
  amount of working can be imparted since there is no strain
  hardening taking place.
• At a high temperature, the material would have higher amount
  of ductility and therefore there is no limit on the amount of
  hot working that can be done on a material.
• Even brittle materials can be hot worked.
• In hot working process, the grain structure of the metal is
  refined and thus mechanical properties improved.
• Porosity of the metal is considerably minimized.
• If process is properly carried out, hot work does not affect
  tensile strength, hardness, corrosion resistance, etc.
• No residual stresses are present in hot worked metals
                                                               48
              Disadvantages of Hot Working
 • Due to high temperature in hot working, rapid oxidation or
   scale formation and surface de-carburization take place on
   the metal surface leading to poor surface finish and loss of
   metal.
 • On account of the loss of carbon from the surface of the steel
   piece being worked the surface layer loses its strength. This is
   a major disadvantage when the part is put to service.
 • The weakening of the surface layer may give rise to a fatigue
   crack which may ultimately result in fatigue failure of the
   component.
                                                                  49
                         cold working
• Cold working of a metal is carried out below its recrystallization
  temperature. Although normal room temperatures are ordinarily
  used for cold working of various types of steel, temperatures up
  to the recrystallization range are sometimes used.
PURPOSE OF COLD WORKING
• The common purposes of cold working are given as under
• Cold working is employed to obtain better surface finish on parts.
• It is commonly applied to obtain increased mechanical properties.
• It is widely applied as a forming process of making steel products
  using pressing and spinning.
• It is used to reduce thickness of materials like from slabs to
  sheets.
                                                                  66
     CHARACTERISTICS OF COLD WORKING
• Cold working involves plastic deformation of a metal, which
  results in strain hardening.
• It usually involves working at ordinary (room) temperatures but
  for high melting point metals, e.g., tungsten, the cold working
  may be carried out at a red heat.
• The stress required for deformation increases rapidly with the
  amount of deformation.
• The amount of deformation, which can be performed without
  introducing other treatment, is limited.
• Cold rolling process generally distorts grain structure.
                                                                   51
 CHARACTERISTICS OF COLD WORKING
 • Good surface finish is obtained in cold rolling.
 • The upper temperature limit for cold working is the maximum
   temperature at which strain hardening is retained. Since cold
   working takes place below the recrystallization temperature, it
   produces strain hardening.
 • Excessive cold working gives rise to the formation and
   propagation of cracks in the metal.
 • The loss of ductility during cold working has a useful side effect
   in machining.
 • With less ductility, the chips break more readily and facilitate
   the cutting operation.
 • Directional properties can be easily imparted.
                                                                   52
           CHARACTERISTICS OF COLD WORKING
  • For relatively ductile metals, cold working is often
    more economical than hot working.
  • Cold working process increases:
     –   Ultimate tensile strength & Yield strength
     –   Hardness
     –   Fatigue strength
     –   Residual stresses
  • Cold working processes decreases:
     –   Percentage elongation
     –   Reduction of area
     –   Impact strength
     –   Resistance to corrosion
     –   Ductility
                                                           53
                   ADVANTAGES OF COLD WORKING
• In cold working processes, smooth surface finish can be
  easily produced.
• Accurate dimensions of parts can be maintained.
• Since the working is done in cold state, no oxide would
  form on the surface and consequently good surface
  finish is obtained.
• Cold working increases the strength and hardness of
  the material due to the strain hardening which would
  be beneficial in some situations.
• There is no possibility of decarburization of the surface
• It is far easier to handle cold parts and it is also
  economical for smaller sizes.
                                                           54
                         DISADVANTAGES OF COLD WORKING
  • Brittle materials cannot be cold worked easily.
  • Since the material has higher yield strength at lower
    temperatures, the amount of deformation that can be given to is
    limited by the capability of the presses or hammers used.
  • A distortion of the grain structure is created.
  • Since the material gets strain hardened, the maximum amount of
    deformation that can be given is limited. Any further deformation
    can be given after annealing.
  • Internal stresses are set up which remain in the metal unless they
    are removed by proper heat-treatment.
                                                                                                               55
                 COMPARISIN OF HOT WORKING & COLD WORKING
Sr. No.                Hot working                                   Cold Working
       HW is carried out above the recrystallization CW is carried out below the recrystallization
     1 temperature                                   temperature
     2Strain hardening does not take place                    Strain hardening of metals takes place
       No internal or residual stresses are generated in the In this process internal stresses are generated in the
     3 metal due to HW                                       metal
       It helps in reducing segregation of alloying elements in It results in loss of uniformity of composition and
     4 the metals by breaking down the structure                affects the metal properties
     5Close dimensional tolerances cannot be maintained       Better dimensional tolerances are obtained
     6Inferior surface finish                                  Smooth surface finish is obtained
       It results in improvements in the mechanical properties
       like impact strength and elongation (ductility)         It results in improvement of properties like impact
     7                                                         strength and hardness
       Hot working refines the grain structure resulting in   Most of the common CW processes result in
     8 better mechanical properties                           distortion of grains
       The defects like blow holes and cracks are removed     In CW processes the existing cracks are propagated
     9 during HW process                                      and new cracks are formed.
      If properly performed HW does not affect UTS, YS,It improves UTS, YS, harness but reduces the corrosion
      hardness, corrosion resistance and fatigue strength ofresistance and impact strength of the metals 72
    10the metals
       Strain Hardening of Single Crystals:
 One of the earliest dislocation concepts to explain
 strain hardening was the idea that dislocations pile
 up on slip planes at barriers in the crystal.
 The pile-ups produce a back stress which opposes
 the applied stress on the slip plane.
 The existence of a back stress was demonstrated
 experimentally by shear tests on zinc single crystals.
 Zinc crystals are ideal for Shear strain crystal-
 plasticity experiments because they slip only on the
 basal plane, and hence complications due to duplex
 slip are easily avoided.
 The crystal is strained to point 0, unloaded, and then
 reloaded in the direction opposite to the original slip
 direction. Note that on reloading the crystal the stress
 is reduced
        Strain Hardening of Single Crystals:
Furthermore, when the slip direction is reversed,
dislocations of opposite sign could be created at the
same sources that produced the dislocations
responsible for strain in the first slip direction.
opposite sign attract and annihilate since dislocations
of each other, the net effect would be a further softening
of the lattice.
This explains the fact that the flow curve in the reverse
direction lies below the curve for continued flow in the
original direction.
The lowering of the yield stress when deformation in one
direction is followed by deformation in the opposite
direction is called the Bauschinger effect.
            Stages of work Hardening:
                           Stage I: This is known as the
                           region of easy glide.
                           This immediately follows the
                           yield point and is characterized
                           by little strain hardening
                           undergone by the crystal.
                           During easy glide the dislocations
                           are able to move over relatively
                           large distances without
                           encountering barriers.
                           During easy glide the slip occurs
Stages of work hardening   only on one slip system.
in FCC crystal
            Stages of work Hardening:
                           Stage II: This region is
                           marked by a rapid increase
                           in work hardening the slope
                           of which is approximately
                           independent of applied
                           stress, temperature or alloy
                           content.
                           In this region slip occurs on
                           more than one set of planes
                           i.e. both the primary and
Stages of work             secondary slip systems.
hardening in FCC crystal
               Stages of work Hardening:
                                  Stage II: . As a result of this a
                                  lot of irregularities are likely to
                                  be formed that include
                                      • Forest dislocations
                                      • Lomer Cottrell barriers
                                      • Jogs produced either by
                                      moving dislocations cutting
                                      through forest dislocations
                                      or forest dislocations cutting
                                      through       the      primary
                                      dislocations.
   Stages of work
   hardening in FCC crystal
             Stages of work Hardening:
      The pile up theory:
      According to this theory some of the dislocations given out
      by the Frank Read sources are eventually stopped at barriers
      like grain boundaries resulting in increase of stress on the
      leading dislocations
                                         The breakdown of a barrier occur
                                         by
                                         1) Slip on a new plane.
                                         2)Climb of dislocation around the
                                         barrier.
                                         3)Generation of high enough
                                         tensile stress to produce a crack
As the deformation proceeds the number of barriers increases until
each source becomes completely surrounded by barriers.
                  Stages of work Hardening:
                             Stage III:
                             It is a region of decreasing strain
                             hardening.
                             • At sufficiently high stress value or
                             temperature in region III, the
                             dislocations held up in stage II are
                             able to move by a process that had
                             been suppressed at lower stress
                             and temperature.
       Stages of work        •In stage III cross slip takes place
       hardening in FCC
       crystal
                             and the slip lines are broad, deep
                             and consist of segments joined by
                             cross slip traces.
        •The screw dislocations held in stage II, cross slip and return
        to the primary slip plane by double cross slip.
        Effect of Heating After %CW (Annealing)
The influence of
annealing
temperature
(1 hour) on the
tensile strength
and ductility of a
brass alloy.
Grain size is shown
as a function of
annealing
temperature.
                              Anisotropy - Polycrystals
                                                                                           rolling
                                                                                          direction
                                                                                              -
                                                                                         Grains are
                                                                                         elongated
                    before rolling                            after rolling
       Isotropic                                      Anisotropic (directional)
       grains are approx. spherical,                  since rolling affects grain
       equiaxed & randomly oriented.                  orientation and shape.
                                                                                           82
      Annealing                   • Annealing includes three stages:
                                     – Recovery
                                        – Recrystallization
                                        – Grain Growth
    Recovery
•    During recovery, some of the stored internal strain energy is relieved through
     dislocation motion due to enhanced atomic diffusion at the elevated temperatures.
•    There is some reduction in the number of dislocations.
•    Physical properties (electrical and thermal conductivity) are recovered to their
•    pre-cold worked states.
    Annihilation reduces dislocation density.
                                                      Mechanical
                                                      properties are
                                                      largely unchaged
                                                                                    84
                           Recrystallization
 • Even after recovery is complete, the grains are still in a
   relatively high strain energy state.
 • Recrystallization is the formation of a new set of
   strain-free and equiaxed grains that have low
   dislocation densities (pre-cold work state).
 • The driving force to produce the new grain structure is
   the internal energy difference between strained and
   unstrained material.
 • The new grains form as very small nuclei and grow
   until they consume the parent material.
 • Recrystallization temperature is 1/3 <Tm <1/2.
                                                                                  85
                          Recrystallization
    • Brass: shows several stages of recrystallization and grain
      growth.
33% CW grains    Initial recrystallization;   Partial replacement   Complete recryst.
                 After 3 seconds, 580˚C       of CW grains;         after 8 seconds
                                              After 4 seconds
                                                                                 86
Recrystallization with temperature vs %CW for iron. For
deformations less than 5% CW, recrystallization will not occur.
                                                                    69
                      GRAIN GROWTH
                                      • After recrystallization is
                                        complete, the strain-free
                                        grains will continue to grow
                                        if the metal specimen is left
                                        at elevated temperatures.
                                      • As grains increase in size, the
                                        total boundary area
                                        decreases, as does the total
                                        energy.
                                      • Large grains grow at the
                                        expense of smaller grains.
                                                                    70
• Grain diameter versus time for grain growth at specific
  temperatures (log scale). Brass Alloy example                                    89
                                 Assignment I
     1. Draw a neat labelled diagram of stress strain curve for mild steel
        and explain the following.
         a. Young’s modulus
         b. Ductility
         c. Yield point
         d. ultimate tensile strength
         e. Fracture point
     2. Explain the motion of the edge type dislocation with a neat
        diagram.
     3. What is the difference between engineering and true stress strain curve?
     4. What is yield point Phenomenon?
     5. Differentiate between cold working and hot working.