PLCC Package – An Insight into
Modern Electronics
ELECTRONIC MANUFACTURING INDUSTRY
Kerstin September 9, 2023 4:16 pm No Comments
The realm of electronics is a dynamic landscape, constantly adapting to the demands of modern
technology and innovation.
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As we become more reliant on electronic devices in our daily lives, the components that power these
devices gain paramount importance.
One such component, the Plastic Leaded Chip Carrier (PLCC), stands out as a game-changer. It has not
only transformed the design and functionality of integrated circuits but has also set new standards in
electronic packaging.
This article explores the PLCC package, highlighting its importance, applications, and advantages.
Table of Contents
What is a PLCC package?
PLCC Package
A PLCC, standing for Plastic Leaded Chip Carrier, is a specialized type of surface-mount integrated circuits
(IC) package. Characterized by its rectangular plastic housing, the PLCC is a modern and cost-effective
evolution from its predecessor, the ceramic leadless chip carrier (CLCC). This transition from ceramic to
plastic not only made the package more affordable but also enhanced its adaptability in various electronic
applications.
Design and construction of a PLCC
package
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Designing and constructing a PLCC (Plastic Leaded Chip Carrier) package involves several key steps and
considerations to ensure it meets performance, reliability, and manufacturing requirements.
1. Package Design
The design of a PLCC package begins with defining the layout and dimensions. The PLCC is characterized
by its square or rectangular plastic body with leads extending from all four sides. This design facilitates
ease of mounting on circuit boards. Key considerations include the size of the package, the pitch (distance
between leads), and the number of leads, which should align with the needs of the integrated circuit it will
house. The design must also account for thermal management and mechanical stability.
2. Material Selection
Choosing the right materials is crucial for the PLCC package’s performance. The body is typically made of a
plastic material such as epoxy resin or phenolic resin, which provides insulation and structural support. The
leads are usually made of a metal alloy like copper with a layer of solder or gold plating for improved
solderability and corrosion resistance. The choice of materials affects the package’s durability, thermal
performance, and electrical properties.
3. Lead Frame Construction
The lead frame is an integral part of the PLCC package, providing the necessary electrical connections
between the integrated circuit and the PCB. The lead frame is typically made from a thin metal sheet that
is stamped or etched to create the required lead configuration. It is then formed into shape and integrated
into the package mold. Accurate lead alignment and spacing are critical to ensure proper soldering and
electrical connectivity.
4. Die Attachment
The semiconductor die, which contains the actual integrated circuit, is attached to the lead frame within the
PLCC package. This is usually done using an adhesive or a solder bump. The attachment process must
ensure a reliable mechanical bond and effective heat dissipation. Die attachment can be performed using
techniques such as epoxy die attach or solder die attach, depending on the thermal and electrical
requirements.
5. Molding and Encapsulation
Once the die is attached, the entire assembly is enclosed in a plastic mold. The molding process involves
injecting molten plastic into a mold cavity to form the package body, encapsulating the die and lead frame.
This encapsulation protects the semiconductor die from environmental damage, such as moisture and
mechanical stress, and helps with thermal management by dissipating heat generated during operation.
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6. Lead Plating and Soldering
After molding, the leads of the PLCC package are plated to enhance solderability and prevent corrosion.
Common plating materials include tin-lead or lead-free solder, and sometimes a layer of gold for high-
reliability applications. The plating process ensures that the leads can be easily soldered onto the PCB
during assembly.
7. Testing and Quality Control
Before the PLCC packages are shipped, they undergo rigorous testing to ensure they meet performance
and reliability standards. This includes electrical testing to verify connectivity and functionality, thermal
cycling tests to check for durability under temperature variations, and mechanical stress tests to ensure the
package withstands handling and mounting stresses.
8. Final Assembly and Packaging
Once tested, the PLCC packages are assembled into bulk or reel packaging for delivery. Proper packaging
is essential to prevent damage during transport and handling. The packages are then ready for integration
into electronic devices or further assembly into PCB boards.
The design and construction of a PLCC package involve detailed planning and execution across various
stages, from initial design and material selection to molding, testing, and final assembly. Each step must be
carefully controlled to ensure the final package performs reliably in its intended applications, providing
robust and efficient connections between semiconductor devices and printed circuit boards.
What does a PLCC do?
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At its core, the PLCC serves as a protective housing for integrated circuits. It ensures that the IC is securely
mounted on the circuit board, facilitating seamless communication between the chip and other electronic
components. By providing a stable environment, the PLCC ensures the longevity and efficiency of the IC,
making it an indispensable component in modern electronics.
Types and sizes of PLCC packages
PLCC (Plastic Leaded Chip Carrier) packages come in various types and sizes, each suited to different
applications based on the specific needs of the electronic device.
1. Types of PLCC Packages
Standard PLCC: This is the most common type, featuring a square or rectangular plastic body with leads
extending from all four sides. It is widely used in applications requiring moderate to high-density
interconnections, such as microcontrollers and memory chips.
J-Lead PLCC: Characterized by its J-shaped leads, this variant offers enhanced mechanical stability and
is often used in applications where strong physical connections are needed. The J-lead design helps
improve the package’s performance during soldering and mechanical stress.
Fine-Pitch PLCC: This type has a finer lead pitch compared to standard PLCCs, which allows for higher
pin counts in a compact footprint. Fine-pitch PLCCs are used in applications where space is at a premium
and high-density connections are necessary.
Dual Flat Package (DFP): Though not a PLCC in the strictest sense, DFP packages share similarities
with PLCCs in their leaded design and are sometimes grouped in discussions about leaded chip carriers.
They are used in similar applications but may have different lead configurations.
2. Sizes of PLCC Packages
20-Pin PLCC: This smaller size is suitable for devices with a relatively low number of connections, such
as basic logic circuits or simple microcontrollers. It provides a compact solution for applications where
space and pin count are limited.
32-Pin PLCC: Offering a moderate increase in pin count, the 32-pin PLCC is commonly used for more
complex devices that need additional connections, like intermediate memory chips or controllers with
additional functions.
44-Pin PLCC: This size is used for higher-density applications where more connections are required. It is
often found in advanced memory modules or microcontrollers with increased functionality and
peripheral support.
68-Pin PLCC: Larger PLCC packages like the 68-pin variant are used for high-performance devices
requiring numerous connections. These are typically employed in advanced microprocessors or complex
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ASICs (Application-Specific Integrated Circuits).
84-Pin PLCC: This size is suitable for applications needing an even higher pin count, such as
sophisticated processors or high-capacity memory devices. It offers ample connections while still fitting
within a manageable footprint.
3. Considerations for Selection
When selecting a PLCC package, several factors must be considered:
Pin Count and Pitch: The number of pins and the pitch (distance between pins) determine how well the
package fits the design requirements and the density of connections. Higher pin counts and finer pitches
allow for more complex devices but may require more precise assembly techniques.
Thermal Management: Different sizes and types of PLCC packages have varying thermal characteristics.
It’s important to select a package that can effectively dissipate heat generated by the device, especially
for high-power applications.
Mechanical Reliability: The design of the leads and the package body affects how well the package can
withstand mechanical stress during handling and soldering. Variants like J-lead PLCCs offer improved
mechanical stability.
Application Requirements: The choice of PLCC package size and type should align with the specific
needs of the electronic device, considering factors such as space constraints, electrical performance, and
environmental conditions.
PLCC packages come in a range of types and sizes, each tailored to different needs in electronic design.
Understanding the various options and their characteristics helps in selecting the most appropriate
package for a given application, balancing factors like pin count, size, thermal performance, and mechanical
reliability.
What is the difference between the
LCC and PLCC package?
Electronics have many parts that might look similar but are different in some ways. While both LCC
(Leaded Chip Carrier) and PLCC are chip carriers, they differ in material and design.
The LCC, which stands for Leaded Chip Carrier, is versatile. It can be made from two materials: ceramic or
plastic. Its design is straightforward, making it a common choice for various electronic tasks.
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LCC vs PLCC Package
On the other side, we have the PLCC or Plastic Leaded Chip Carrier. As the name suggests, it’s always
made of plastic. But what really sets it apart are its unique J-shaped metal parts. These aren’t just for
show; they have a specific purpose. They help the PLCC connect better to other components, ensuring that
devices work smoothly and efficiently.
So, while both LCC and PLCC might seem like just small parts in a device, they’re crucial in making sure our
gadgets run properly. Each has its own strengths, making them suitable for different electronic needs.
Advantages of using PLCC component
packages
Using PLCC (Plastic Leaded Chip Carrier) component packages offers several advantages, each
contributing to the overall efficiency and performance of electronic devices.
1. High Pin Density
PLCC packages provide a high density of pins within a compact area. This allows for a significant number
of connections in a relatively small footprint, making it ideal for complex integrated circuits that require
numerous I/O connections. This high pin density is beneficial for designs where space on the PCB (Printed
Circuit Board) is limited.
2. Ease of Assembly
PLCC packages are designed for ease of mounting on PCBs. The leads extend from all four sides of the
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package, which simplifies the process of soldering to the board. This lead configuration helps in achieving
consistent and reliable solder joints, reducing the risk of assembly errors and improving the overall quality
of the finished product.
3. Improved Mechanical Stability
The design of PLCC packages contributes to their mechanical robustness. The leads are embedded in a
plastic body that provides physical protection to the semiconductor die inside. This sturdy construction
helps the package withstand mechanical stress during handling, shipping, and installation, ensuring long-
term reliability in various applications.
4. Enhanced Thermal Performance
PLCC packages are effective at managing heat dissipation, especially in larger sizes. The plastic body and
lead frame are designed to conduct heat away from the semiconductor die, which helps maintain optimal
operating temperatures. This thermal management capability is crucial for high-power or high-
performance applications where excess heat could impact device reliability.
5. Versatile Application Range
PLCC packages are versatile and can be used in a wide range of electronic devices, from simple logic
circuits to complex microprocessors. Their adaptability makes them suitable for diverse applications,
including consumer electronics, automotive systems, and industrial controls. This versatility allows
manufacturers to standardize on PLCC packages across multiple product lines.
6. Cost-Effective Solution
Compared to some other packaging options, PLCC packages offer a cost-effective solution for many
applications. Their established manufacturing processes and widespread use contribute to lower
production costs, making them an economical choice for both low and high-volume production runs.
7. Reflow Soldering Compatibility
PLCC packages are well-suited for reflow soldering, a common technique used in modern PCB assembly.
This method involves melting solder paste to create solder joints, which is compatible with the PLCC’s lead
configuration. The compatibility with reflow soldering simplifies the assembly process and improves the
consistency of solder joints.
8. Reliable Electrical Performance
The design of PLCC packages ensures reliable electrical performance. The lead frame’s layout and the
package’s overall construction minimize electrical interference and signal degradation. This reliability is
essential for maintaining the integrity of high-speed or sensitive signals within the electronic device.
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9. Design Flexibility
PLCC packages come in various sizes and lead counts, allowing designers to select the package that best
fits their specific needs. This design flexibility enables engineers to optimize the package for their particular
application, balancing factors like pin count, physical size, and thermal performance.
10. Long-Term Availability
Due to their widespread use and established manufacturing processes, PLCC packages often enjoy long-
term availability. This reliability ensures that designers and manufacturers can source these components
over extended periods, supporting consistent product development and supply chain stability.
PLCC component packages offer a range of advantages, including high pin density, ease of assembly,
mechanical stability, and effective thermal management. Their versatility, cost-effectiveness, and
compatibility with modern assembly techniques make them a popular choice for various electronic
applications, ensuring reliable performance and design flexibility.
Do PLCC packages have leads on them?
Indeed, one of the defining features of the PLCC package is its “J”-shaped metal leads. These leads, which
wrap around and beneath the package’s edge, are reminiscent of the letter “J” when observed in cross-
section.
But these leads aren’t just for design; they serve a vital purpose. They are instrumental in forming a bridge
between the integrated circuit (IC) housed within the PLCC and the external circuit board.
By doing so, they ensure that data flows smoothly and power is supplied efficiently, making sure our
electronic devices function optimally.
Applications of PLCC package
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Applications of PLCC Package
The versatility of the PLCC package is evident in its wide range of applications across various industries.
From everyday gadgets to specialized aerospace equipment, the PLCC has cemented its place as an
indispensable component. Let’s explore some of its primary applications.
Memory Storage
PLCCs are particularly prevalent in read-only memories. Their design allows for an easily swappable
socketed chip, making them ideal for devices that require frequent memory updates or replacements.
Consumer Electronics
From televisions to gaming consoles, PLCCs are integral to many consumer electronic devices. Their
compact design and efficient performance make them a preferred choice for manufacturers aiming for
sleeker and more powerful gadgets.
Automotive Industry
Modern vehicles are equipped with a plethora of electronic systems, from entertainment units to advanced
driver-assistance systems (ADAS). PLCCs play a pivotal role in ensuring these systems function
seamlessly, enhancing vehicle performance and safety.
Aerospace Sector
In the aerospace sector, reliability is paramount. PLCCs are often employed in aircraft electronics, ensuring
that systems function optimally even in challenging conditions.
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Advantages of PLCC package
The adoption of the PLCC package in modern electronics is not just due to its functional design but also the
myriad of advantages it offers. These benefits not only enhance the performance of the devices they’re
integrated into but also provide cost and space efficiencies. Here are some of the standout advantages of
the PLCC package.
Efficient Board Utilization
One of the standout benefits of the PLCC design is its efficient use of board surface area. Especially when
the lead counts exceed 40 pins, the PLCC’s compact design ensures minimal board space usage.
Versatile Mounting Options
PLCCs offer flexibility in assembly. They can be either socketed or surface-mounted, allowing
manufacturers to choose the best approach based on the device’s requirements.
Enhanced Heat Dissipation
Heat management is crucial for electronic components. The PLCC design, especially versions with heat
spreaders, ensures efficient heat dissipation, prolonging the life of the IC.
Cost-Effective
Transitioning from ceramic to plastic made PLCCs more affordable without compromising on performance.
This cost-effectiveness has made them a popular choice among manufacturers.
How to troubleshoot and repair PLCC
packages
Troubleshooting and repairing PLCC (Plastic Leaded Chip Carrier) packages involves a series of methodical
steps to identify and address issues that can arise during their use or in circuit boards.
1. Visual Inspection
Begin with a thorough visual inspection of the PLCC package and the surrounding PCB area. Look for
obvious signs of damage such as cracked or bent leads, burnt components, or soldering defects. Using a
magnifying glass or microscope can help detect subtle issues like micro-cracks in the solder joints or
fractures in the package body.
2. Check Solder Joints
Inspect the solder joints on the PCB to ensure they are intact and properly formed. Common issues include
cold solder joints, solder bridges, or insufficient solder. Reflowing the solder or adding a small amount of
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fresh solder can often resolve these problems. Be cautious not to overheat the area, as excessive heat can
damage the PLCC package or the PCB.
3. Test Electrical Connectivity
Use a multimeter to test the electrical connectivity of the PLCC package. Check for continuity between the
leads of the package and the corresponding PCB traces. This can help identify issues like broken
connections or short circuits. If continuity tests reveal problems, you may need to repair or replace the
affected traces or leads.
4. Verify Signal Integrity
For more complex issues, such as signal integrity problems, use an oscilloscope to monitor the signals
passing through the PLCC package. Check for irregularities such as signal dropouts, noise, or unexpected
waveform distortions. Comparing the observed signals with expected waveforms can help diagnose issues
with the package’s functionality.
5. Reflow or Rework the Package
If you suspect that the PLCC package has been improperly seated or soldered, you might need to reflow or
rework the package. Reflowing involves heating the solder to melt it, allowing the package to settle into
place and form reliable connections. Use a hot air rework station or an oven designed for PCB reflow.
Ensure the process is controlled to avoid overheating the package.
6. Check for Physical Damage
If the PLCC package appears physically damaged (e.g., cracked or chipped), it may need to be replaced.
Physical damage can affect the package’s performance and lead to intermittent or complete failure.
Carefully desolder the damaged package and replace it with a new one, ensuring correct alignment and
soldering.
7. Evaluate Power Supply and Grounding
Ensure that the power supply and grounding connections associated with the PLCC package are stable and
within specified ranges. Irregularities in power supply or grounding can lead to operational issues or
damage the package. Measure the supply voltages and check grounding connections for any anomalies.
8. Consult Technical Documentation
Refer to the technical documentation or datasheet of the PLCC package for specific details about pin
functions, electrical characteristics, and recommended operating conditions. This information can provide
valuable insights for diagnosing problems and performing accurate repairs.
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9. Perform Functional Testing
After addressing any visible or electrical issues, perform functional testing to verify that the PLCC package
operates as intended. Check the overall functionality of the circuit or system to ensure that the package is
correctly integrated and performing its designated tasks.
10. Consider Environmental Factors
Environmental factors such as excessive heat, humidity, or exposure to corrosive substances can affect the
performance of PLCC packages. Ensure that the PCB is used within the recommended environmental
conditions and take appropriate measures to protect it from adverse environmental influences.
Troubleshooting and repairing PLCC packages involves a systematic approach, starting with visual
inspection and solder joint checks, and progressing to electrical testing, signal verification, and rework if
necessary. Addressing physical damage, ensuring proper power and grounding, and consulting technical
documentation are also crucial steps. By carefully following these procedures, you can effectively diagnose
and resolve issues with PLCC packages, ensuring reliable performance and longevity in your electronic
systems.
Conclusion
The PLCC package, with its myriad of applications and advantages, stands as a testament to the
advancements in electronic component design. As technology continues to evolve, the PLCC’s role in
shaping the future of electronics remains undeniable. Its versatility, efficiency, and adaptability make it a
linchpin in the realm of modern electronics, driving innovation and enhancing device performance.
FAQ
What is a PLCC package?
What does a PLCC do?
What is the difference between the LCC and PLCC package?
What is the full form of PLCC package?
What does PLCC stand for?
What is an LCC package?
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Last updated on September 11th, 2024 at 08:45 am
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