Intel® NUC Board

DN2820FY
Technical Product Specification

August 2014
Order Number: H30980-004

The Intel NUC Board DN2820FY may contain design defects or errors known as errata that may cause the product to deviate from published specifications.
Current characterized errata are documented in the Intel NUC Board DN2820FY Specification Update.
Revision History
Revision Revision History Date
®
001 First release of the Intel NUC Board DN2820FY Technical Product December 2013
Specification
002 Specification Clarification April 2014
003 Specification Clarification April 2014
004 Specification Clarification August 2014

Disclaimer
This product specification applies to only the standard Intel® NUC Board with BIOS identifier
FYBYT10H.86A
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE,
EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS
GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR
SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR
IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR
WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR
INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS
OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED
FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION
WHERE PERSONAL INJURY OR DEATH MAY OCCUR.

All Intel® NUC Boards are evaluated as Information Technology Equipment (I.T.E.) for use in personal
computers (PC) for installation in homes, offices, schools, computer rooms, and similar locations. The
suitability of this product for other PC or embedded non-PC applications or other environments, such as
medical, industrial, alarm systems, test equipment, etc. may not be supported without further evaluation by
Intel.

Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other
intellectual property rights that relate to the presented subject matter. The furnishing of documents and
other materials and information does not provide any license, express or implied, by estoppel or otherwise,
to any such patents, trademarks, copyrights, or other intellectual property rights.

Intel may make changes to specifications and product descriptions at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked “reserved”
or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for
conflicts or incompatibilities arising from future changes to them.

Intel processor numbers are not a measure of performance. Processor numbers differentiate features within
each processor family, not across different processor families: Go to:
Learn About Intel® Processor Numbers

Intel NUC Boards may contain design defects or errors known as errata, which may cause the product to
deviate from published specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your
product order.

Intel and Celeron are trademarks of Intel Corporation in the U.S. and/or other countries.

* Other names and brands may be claimed as the property of others.

Copyright  2013, 2014 Intel Corporation. All rights reserved.

Board Identification Information
Basic Intel® NUC Board DN2820FY Identification Information
AA Revision BIOS Revision Notes
H24582-201 FYBYT10H.86A.0012 1,2
H24582-203 FYBYT10H.86A.0032 1,2
Notes:
1. The AA number is found on a small label on the component side of the board.
2. Intel® Celeron® processor N2820 or Intel® Celeron® processor N2830, used on this AA revision,
consists of the following component:

Device Stepping S-Spec Numbers

Intel Celeron processor N2820 B3 SR1SG
Intel Celeron processor N2830 C0 SR1W4

Specification Changes or Clarifications

The table below indicates the Specification Changes or Specification Clarifications that
apply to the Intel NUC Board DN2820FY.

Specification Changes or Clarifications

Date Type of Change Description of Changes or Clarifications
January 2014 Spec Clarification Updated the Table of Contents because several headings were
missing.
February 2014 Spec Clarification • Updated the first Caution in Section 2.6 Thermal
Considerations.
• Added Figure 15 Board Height Dimensions.
April 2014 Spec Clarification • Added Section 1.9 Audio Subsystem
• Added Intel Celeron processor N2830 (AA Revision
H24582-203)
August 2014 Spec Clarification • Deleted DTS-HD from Section 1.5.1.3.1 Integrated Audio
Provided by the HDMI Interfaces

Errata
Current characterized errata, if any, are documented in a separate Specification
Update. See http://www.intel.com/content/www/us/en/nuc/overview.html for the
latest documentation.

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Intel NUC Board DN2820FY Technical Product Specification

iv
Preface

This Technical Product Specification (TPS) specifies the board layout, components,
connectors, power and environmental requirements, and the BIOS for Intel® NUC
Board DN2820FY.

Intended Audience
The TPS is intended to provide detailed, technical information about Intel NUC Board
DN2820FY and its components to the vendors, system integrators, and other engineers
and technicians who need this level of information. It is specifically not intended for
general audiences.

What This Document Contains

Chapter Description
1 A description of the hardware used on Intel NUC Board DN2820FY
2 A map of the resources of the Intel NUC Board
3 The features supported by the BIOS Setup program
4 A description of the BIOS error messages, beep codes, and POST codes
5 Regulatory compliance and battery disposal information

Typographical Conventions
This section contains information about the conventions used in this specification. Not
all of these symbols and abbreviations appear in all specifications of this type.

Notes, Cautions, and Warnings

NOTE
Notes call attention to important information.

CAUTION
Cautions are included to help you avoid damaging hardware or losing data.

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Intel NUC Board DN2820FY Technical Product Specification

Other Common Notation

# Used after a signal name to identify an active-low signal (such as USBP0#)
GB Gigabyte (1,073,741,824 bytes)
GB/s Gigabytes per second
Gb/s Gigabits per second
KB Kilobyte (1024 bytes)
Kb Kilobit (1024 bits)
kb/s 1000 bits per second
MB Megabyte (1,048,576 bytes)
MB/s Megabytes per second
Mb Megabit (1,048,576 bits)
Mb/s Megabits per second
TDP Thermal Design Power
xxh An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V Volts. Voltages are DC unless otherwise specified.
* This symbol is used to indicate third-party brands and names that are the property of their
respective owners.

vi
Contents

Revision History
Board Identification Information .................................................................. iii
Errata ......................................................................................................iii
Preface
Intended Audience..................................................................................... v
What This Document Contains..................................................................... v
Typographical Conventions ......................................................................... v
1 Product Description
1.1 Overview ......................................................................................... 11
1.1.1 Feature Summary ................................................................. 11
1.1.2 Board Layout (Top) ............................................................... 13
1.1.3 Board Layout (Bottom) .......................................................... 15
1.1.4 Block Diagram ...................................................................... 17
1.2 Online Support ................................................................................. 18
1.3 Processor ........................................................................................ 18
1.4 System Memory ............................................................................... 19
1.5 Processor Graphics Subsystem ........................................................... 20
1.5.1 Integrated Graphics ............................................................... 20
1.6 USB ................................................................................................ 21
1.7 SATA Interface ................................................................................. 22
1.7.1 AHCI Mode ........................................................................... 22
1.8 Real-Time Clock Subsystem ............................................................... 22
1.9 Audio Subsystem .............................................................................. 23
1.9.1 Audio Subsystem Software ..................................................... 23
1.10 LAN Subsystem ................................................................................ 24
1.10.1 Realtek* 8111GN-CG Gigabit Ethernet Controller ...................... 25
1.10.2 LAN Subsystem Software ....................................................... 25
1.10.3 RJ-45 LAN Connector with Integrated LEDs .............................. 26
1.11 Hardware Management Subsystem ..................................................... 27
1.11.1 Hardware Monitoring ............................................................. 27
1.11.2 Fan Monitoring ...................................................................... 27
1.11.3 Thermal Solution ................................................................... 28
1.12 Power Management .......................................................................... 29
1.12.1 ACPI .................................................................................... 29
1.12.2 Hardware Support ................................................................. 31

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Intel NUC Board DN2820FY Technical Product Specification

2 Technical Reference
2.1 Memory Resources ........................................................................... 35
2.1.1 Addressable Memory ............................................................. 35
2.2 Connectors and Headers .................................................................... 35
2.2.1 Front Panel Connector............................................................ 36
2.2.2 Back Panel Connectors ........................................................... 36
2.2.3 Connectors and Headers (Bottom) ........................................... 37
2.3 BIOS Security Jumper ....................................................................... 41
2.4 Mechanical Considerations ................................................................. 43
2.4.1 Form Factor .......................................................................... 43
2.5 Electrical Considerations .................................................................... 44
2.5.1 Power Supply Considerations .................................................. 44
2.5.2 Fan Header Current Capability ................................................ 44
2.6 Thermal Considerations ..................................................................... 44
2.7 Reliability......................................................................................... 47
2.8 Environmental .................................................................................. 47
3 Overview of BIOS Features
3.1 Introduction ..................................................................................... 49
3.2 BIOS Flash Memory Organization ........................................................ 49
3.3 System Management BIOS (SMBIOS) ................................................. 49
3.4 Legacy USB Support ......................................................................... 50
3.5 BIOS Updates .................................................................................. 50
3.5.1 Language Support ................................................................. 51
3.5.2 Custom Splash Screen ........................................................... 51
3.6 BIOS Recovery ................................................................................. 52
3.7 Boot Options .................................................................................... 53
3.7.1 Intel® Visual Boot Manager ..................................................... 53
3.7.2 Network Boot........................................................................ 53
3.7.3 Booting Without Attached Devices ........................................... 54
3.7.4 Changing the Default Boot Device During POST ......................... 54
3.7.5 Power Button Menu ............................................................... 55
3.8 Hard Disk Drive Password Security Feature .......................................... 56
3.9 BIOS Security Features ..................................................................... 57
4 Error Messages and Blink Codes
4.1 Front-panel Power LED Blink Codes ..................................................... 59
4.2 BIOS Error Messages ........................................................................ 59
5 Regulatory Compliance and Battery Disposal Information
5.1 Regulatory Compliance ...................................................................... 61
5.1.1 Safety Standards................................................................... 61
5.1.2 European Union Declaration of Conformity Statement ................ 62
5.1.3 Product Ecology Statements ................................................... 63
5.1.4 EMC Regulations ................................................................... 63

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 Contents

5.1.5 e-Standby and ErP Compliance ............................................... 66

5.1.6 Regulatory Compliance Marks (Board Level) ............................. 67
5.2 Battery Disposal Information .............................................................. 68

Figures
1. Major Board Components (Top) .......................................................... 13
2. Major Board Components (Bottom) ..................................................... 15
3. Block Diagram .................................................................................. 17
4. Memory Channel and SO-DIMM Configuration ...................................... 20
5. 4-Pin 3.5 mm (1/8 inch) Audio Jack Pin Out ......................................... 23
6. LAN Connector LED Locations ............................................................. 26
7. Thermal Solution and Fan Header ....................................................... 28
8. Location of the Standby Power LED ..................................................... 33
9. Front Panel Connector ....................................................................... 36
10. Back Panel Connectors ...................................................................... 36
11. Connectors and Headers (Bottom) ...................................................... 37
12. Location of the CIR Sensor ................................................................ 40
13. Location of the BIOS Security Jumper ................................................. 41
14. Board Dimensions ............................................................................. 43
15. Board Height Dimensions ................................................................... 44
16. Localized High Temperature Zones ..................................................... 45

Tables
1. Feature Summary ............................................................................. 11
2. Components Shown in Figure 1 .......................................................... 14
3. Components Shown in Figure 2 .......................................................... 16
4. Supported Memory Configurations ...................................................... 19
5. LAN Connector LED States ................................................................. 26
6. Effects of Pressing the Power Switch ................................................... 29
7. Power States and Targeted System Power ........................................... 30
8. Wake-up Devices and Events ............................................................. 31
9. Connectors and Headers Shown in Figure 11 ........................................ 38
10. PCI Express Half-Mini Card Connector ................................................. 39
11. BIOS Security Jumper Settings ........................................................... 42
12. Fan Header Current Capability ............................................................ 44
13. Thermal Considerations for Components .............................................. 46
14. Tcontrol Values for Components ......................................................... 46
15. Environmental Specifications .............................................................. 47
16. Acceptable Drives/Media Types for BIOS Recovery................................ 52
17. Boot Device Menu Options ................................................................. 54
18. Master Key and User Hard Drive Password Functions ............................ 56
19. Supervisor and User Password Functions ............................................. 57
20. Front-panel Power LED Blink Codes ..................................................... 59
21. BIOS Error Messages ........................................................................ 59

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Intel NUC Board DN2820FY Technical Product Specification

22. Safety Standards .............................................................................. 61

23. EMC Regulations ............................................................................... 63
24. Regulatory Compliance Marks ............................................................ 67

x
1 Product Description

1.1 Overview

1.1.1 Feature Summary

Table 1 summarizes the major features of the board.

Table 1. Feature Summary

Form Factor 4.0 inches by 4.0 inches (101.60 millimeters by 101.60 millimeters)

Processor • Soldered-down Intel® Celeron® processor N2820 or N2830 (Note)

with up to 7.5
W TDP
― Integrated graphics
― Integrated memory controller
― Integrated PCH
― Intel® Quick Sync Video is only available on the Intel Celeton processor
N2830
Memory • Support for DDR3L 1066 MHz SO-DIMM on the Intel Celeron processor N2820
• Support for DDR3L 1333 MHz SO-DIMM on the Intel Celeron processor N2830
• Support for 1 Gb, 2 Gb, and 4 Gb memory technology
• Support for up to 8 GB of system memory with one SO-DIMM using 4 Gb
memory technology
• Support for non-ECC memory
• Support for 1.35 V low voltage JEDEC memory
Graphics • Integrated graphics support with Intel® Graphics Technology
• One High Definition Multimedia Interface* (HDMI*) back panel connector
Audio • Intel® High Definition Audio via the HDMI v1.4a interfaces
• Realtek ALC283 audio codec providing:
― High Definition Audio via a stereo microphone/headphone jack on the back
panel
― Internal stereo speaker header
― Support for digital microphone (DMIC) via internal header
• Intel HD Audio via a stereo microphone/headphone jack on the back panel
• Back panel audio jack (3.5 mm jack)
Peripheral • USB ports:
Interfaces ― Two USB 2.0 back panel connectors
― One USB 3.0 front panel connector
― One port is reserved for the PCI Express* Half-Mini Card
• SATA ports:
― One SATA 3.0 Gb/s port
• Consumer Infrared (CIR)
Note:
• Intel Celeron processor N2820 is AA revision H24582-201
• Intel Celeron processor N2830 is AA revision H24582-203 and later
continued

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Intel NUC Board DN2820FY Technical Product Specification

Table 1. Feature Summary (continued)

Expansion One PCI Express Half-Mini Card connector
Capabilities
BIOS • Intel® BIOS resident in the Serial Peripheral Interface (SPI) Flash device
• Support for Advanced Configuration and Power Interface (ACPI), Plug and
Play, and System Management BIOS (SMBIOS)
LAN Support Gigabit (10/100/1000 Mb/s) LAN subsystem using the Realtek* 8111GN-CG
Gigabit Ethernet Controller
Hardware Monitor Hardware monitoring subsystem, based on an ITE IT8607E embedded controller,
Subsystem including:
• Voltage sense to detect out of range power supply voltages
• Thermal sense to detect out of range thermal values
• One processor fan header
• Fan sense input used to monitor fan activity
• Simple fan speed control

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 Product Description

1.1.2 Board Layout (Top)

Figure 1 shows the location of the major components on the top-side of Intel NUC
Board DN2820FY.

Figure 1. Major Board Components (Top)

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Intel NUC Board DN2820FY Technical Product Specification

Table 2 lists the components identified in Figure 1.

Table 2. Components Shown in Figure 1

Item from Figure 1 Description
A Battery header
B Processor fan header
C Onboard power button
D Power LED
E Standby power LED
F Hard Disk Drive LED
G Thermal solution

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 Product Description

1.1.3 Board Layout (Bottom)

Figure 2 shows the location of the major components on the bottom-side of Intel NUC
Board DN2820FY.

Figure 2. Major Board Components (Bottom)

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Intel NUC Board DN2820FY Technical Product Specification

Table 3. Components Shown in Figure 2

Item from
Figure 2 Description

A Back panel connectors

B PCI Express Half-Mini Card connector
C Front panel USB 3.0 connector
D SATA 3.0 Gb/s connector
E SATA power connector
F BIOS setup configuration jumper
G Front panel Consumer Infrared sensor (CIR)
H DDR3L SO-DIMM 1 socket

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 Product Description

1.1.4 Block Diagram

Figure 3 is a block diagram of the major functional areas of the board.

Note:
• Intel Celeron processor N2820 is AA revision H24582-201
• Intel Celeron processor N2830 is AA revision H24582-203 and later

Figure 3. Block Diagram

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Intel NUC Board DN2820FY Technical Product Specification

1.2 Online Support

To find information about… Visit this World Wide Web site:
Intel NUC Board DN2820FY http://www.intel.com/NUC
NUC Board Support http://www.intel.com/NUCSupport
Available configurations for Intel NUC http://ark.intel.com
Board DN2820FY
BIOS and driver updates http://downloadcenter.intel.com
Tested memory http://www.intel.com/NUCSupport
Integration information http://www.intel.com/NUCSupport

1.3 Processor
The board has a soldered-down System-on-a-Chip (SoC), which consists of an Intel
Celeron processor N2820 or N2830 (see Note on page 11) with up to 7.5 W TDP.
• Integrated graphics
• Integrated memory controller
• Integrated PCH
• Intel Quick Sync Video is only available on the Intel Celeron processor N2830

NOTE
This board has specific requirements for providing power to the processor. Refer to
Section 2.5.1 on page 44 for information on power supply requirements for this board.

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 Product Description

1.4 System Memory

The board has one 204-pin SO-DIMM socket and supports the following memory
features:
• 1.35 V DDR3L 1066 MHz SDRAM SO-DIMM with gold plated contacts on
Intel Celeron processor N2820 (see Note on page 11)
• 1.35 V DDR3L 1333 MHz SDRAM SO-DIMM with gold plated contacts on
Intel Celeron processor N2830 (see Note on page 11)
• One memory channel
• Unbuffered, single-sided or double-sided SO-DIMMs
• 8 GB maximum total system memory (with 4 Gb memory technology). Refer to
Section 2.1.1 on page 35 for information on the total amount of addressable
memory.
• Minimum recommended total system memory: 1024 MB
• Non-ECC SO-DIMMs
• Serial Presence Detect

NOTE
Higher-speed SO-DIMMs will be supported at the 1066 MHz memory timing for the
Intel Celeron processor N2820 (AA Revision H24582-203 and later).

NOTE
To be fully compliant with all applicable DDR SDRAM memory specifications, the board
should be populated with SO-DIMMs that support the Serial Presence Detect (SPD)
data structure. This allows the BIOS to read the SPD data and program the chipset to
accurately configure memory settings for optimum performance. If non-SPD memory
is installed, the BIOS will attempt to correctly configure the memory settings, but
performance and reliability may be impacted or the SO-DIMMs may not function under
the determined frequency.

Table 4 lists the supported SO-DIMM configurations.

Table 4. Supported Memory Configurations

SO-DIMM SDRAM SDRAM Organization Number of SDRAM
Capacity Configuration (Note) Density Front-side/Back-side Devices
1024 MB SS 1 Gbit 128 M x8/empty 8
2048 MB DS 1 Gbit 128 M x8/128 M x8 16
2048 MB SS 2 Gbit 256 M x8/empty 8
4096 MB DS 2 Gbit 256 M x8/256 M x8 16
4096 MB SS 4 Gbit 512 M x8/empty 8
8192 MB DS 4 Gbit 512 M x8/512 M x8 16
Note: “DS” refers to double-sided memory modules (containing two rows of SDRAM) and “SS” refers to
single-sided memory modules (containing one row of SDRAM).

For information about… Refer to:

Tested Memory http://www.intel.com/NUCSupport

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Intel NUC Board DN2820FY Technical Product Specification

Figure 4 illustrates the memory channel and SO-DIMM configuration.

Figure 4. Memory Channel and SO-DIMM Configuration

1.5 Processor Graphics Subsystem

The board supports graphics through Intel HD Graphics.

1.5.1 Integrated Graphics

The board supports integrated graphics via the processor.

1.5.1.1 Intel® High Definition (Intel® HD) Graphics

The Intel HD graphics controller features the following:
• HDMI 1.4
• 3D graphics hardware acceleration supporting DirectX*11, OCL 1.2, OGL ES
Halti/2.0/1.1, OGL 3.2
• Video decode hardware acceleration supporting H.264, MPEG2, MVC, VC-1, WMV9
and VP8 formats
• Video encode hardware acceleration supporting H.264, MPEG2 and MVC formats
• High-Bandwidth Digital Content Protection (HDCP) 1.4/2.1 support for content
protection

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 Product Description

1.5.1.2 Video Memory Allocation

®
Intel Dynamic Video Memory Technology (DVMT) is a method for dynamically
allocating system memory for use as graphics memory to balance 2D/3D graphics and
system performance. If your computer is configured to use DVMT, graphics memory is
allocated based on system requirements and application demands (up to the
configured maximum amount). When memory is no longer needed by an application,
the dynamically allocated portion of memory is returned to the operating system for
other uses.

1.5.1.3 High Definition Multimedia Interface* (HDMI*)

The HDMI port supports standard, enhanced, or high definition video, plus multi-
channel digital audio on a single cable. The port is compatible with all ATSC and DVB
HDTV standards and supports eight full range channels at 24-bit/96 kHz audio of
lossless audio formats. The maximum supported resolution is 1920 x 1200 @ 60 Hz,
24 bpp (WUXGA). The HDMI port is compliant with the HDMI 1.4 specification.

1.5.1.3.1 Integrated Audio Provided by the HDMI Interfaces

The following audio technologies are supported by the HDMI 1.4 interfaces directly
from the SoC:
• AC-3 - Dolby* Digital
• Dolby Digital Plus
• LPCM, 192 kHz/24-bit, 8 Channel

1.6 USB
The USB port arrangement is as follows:
• Two USB 2.0 back panel connectors
• One USB 3.0 front panel connector
• One port is reserved for the PCI Express Half-Mini Card
All the USB ports are high-speed, full-speed, and low-speed capable.

NOTE
Computer systems that have an unshielded cable attached to a USB port may not meet
FCC Class B requirements, even if no device is attached to the cable. Use a shielded
cable that meets the requirements for full-speed devices.

For information about Refer to

The location of the USB connectors on the back panel Figure 10, page 36
The location of the USB connector on the front panel Figure 2, page 15

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Intel NUC Board DN2820FY Technical Product Specification

1.7 SATA Interface

The SoC provides one SATA port with a theoretical maximum transfer rate of 3 Gb/s.
A point-to-point interface is used for host to device connections.

The underlying SATA functionality is transparent to the operating system. The SATA
controller can operate in both legacy and native modes. In legacy mode, standard IDE
I/O and IRQ resources are assigned (IRQ 14 and 15). In Native mode, standard PCI
Conventional bus resource steering is used. Native mode is the preferred mode for
configurations using Windows operating systems.

1.7.1 AHCI Mode

The board supports AHCI storage mode.

NOTE
In order to use AHCI mode, AHCI must be enabled in the BIOS. Microsoft* Windows 8
includes the necessary AHCI drivers without the need to install separate AHCI drivers
during the operating system installation process. However, it is always good practice to
update the AHCI drivers to the latest available by Intel.

1.8 Real-Time Clock Subsystem

A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the
computer is not plugged into a wall socket, the battery has an estimated life of three
years. When the computer is plugged in, the standby current from the power supply
extends the life of the battery. The clock is accurate to ± 13 minutes/year at 25 ºC
with 3.3 VSB applied via the power supply 5 V STBY rail.

NOTE
If the battery and AC power fail, date and time values will be reset and the user will be
notified during the POST.
When the voltage drops below a certain level, the BIOS Setup program settings stored
in CMOS RAM (for example, the date and time) might not be accurate. Replace the
battery with an equivalent one. Figure 1 on page 13 shows the location of the battery.

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 Product Description

1.9 Audio Subsystem

The board supports Intel HD Audio via the Realtek ALC283 audio codec. The audio
subsystem supports the following features:
• Analog line-out/Analog Headphone/Analog Microphone (back panel jack)
• High Definition Audio via a stereo microphone/headphone jack on the back panel
• Internal stereo speaker header
• DMIC interface (custom solutions header), with support for mono and stereo digital
microphones
• Support for 44.1 kHz/48 kHz/96 kHz/192 kHz sample rates on all analog outputs
• Support for 44.1 kHz/48 kHz/96 kHz sample rates on all analog inputs
• Back Panel Audio Jack Support (see Figure 5 for 3.5 mm audio jack pin out):
 Speakers only
 Headphones only
 Microphone only
 Combo Headphone/Microphone

Pin Number Pin Name Description

1 Tip Left Audio Out
2 Ring Right Audio Out
3 Ring Common/Ground
4 Sleeve Audio In

Figure 5. 4-Pin 3.5 mm (1/8 inch) Audio Jack Pin Out

NOTE
The analog circuit of the back panel audio connector is designed to power headphones
or amplified speakers only. Poor audio quality occurs if passive (nonamplified) speakers
are connected to this output.

1.9.1 Audio Subsystem Software

Audio software and drivers are available from Intel’s World Wide Web site.

For information about Refer to

Obtaining Audio software and drivers http://downloadcenter.intel.com

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Intel NUC Board DN2820FY Technical Product Specification

1.10 LAN Subsystem

The LAN subsystem consists of the following:
• Realtek 8111GN-CG Gigabit Ethernet Controller (10/100/1000 Mb/s)
• RJ-45 LAN connector with integrated status LEDs
Additional features of the LAN subsystem include:
• CSMA/CD protocol engine
• Jumbo frame support
• LAN connect interface between the SoC and the LAN controller
• Power management capabilities
 ACPI technology support
 LAN wake capabilities
• LAN subsystem software

For information about Refer to

LAN software and drivers http://downloadcenter.intel.com

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 Product Description

1.10.1 Realtek* 8111GN-CG Gigabit Ethernet Controller

The Realtek 8111GN-CG Gigabit Ethernet Controller supports the following features:
• 10/100/1000 BASE-T IEEE 802.3 compliant
• Energy Efficient Ethernet (EEE) IEEE802.3az support (Low Power Idle (LPI) mode)
• Dual interconnect between the Integrated LAN Controller and the Physical Layer
(PHY):
 PCI Express-based interface for active state operation (S0) state
 SMBUS for host and management traffic (Sx low power state)
• Compliant to IEEE 802.3x flow control support
• 802.1p and 802.1q
• TCP, IP, and UDP checksum offload (for IPv4 and IPv6)
• Full device driver compatibility

1.10.2 LAN Subsystem Software

LAN software and drivers are available from Intel’s World Wide Web site.

For information about Refer to

Obtaining LAN software and drivers http://downloadcenter.intel.com

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Intel NUC Board DN2820FY Technical Product Specification

1.10.3 RJ-45 LAN Connector with Integrated LEDs

Two LEDs are built into the RJ-45 LAN connector (shown in Figure 6).

Item Description
A Link LED (Green)
B Data Rate LED (Green/Yellow)

Figure 6. LAN Connector LED Locations

Table 5 describes the LED states when the board is powered up and the LAN
subsystem is operating.

Table 5. LAN Connector LED States

LED LED Color LED State Condition
Off LAN link is not established.
Link (A) Green On LAN link is established.
Blinking LAN activity is occurring.
Off 10 Mb/s data rate is selected.
Data Rate (B) Green/Yellow Green 100 Mb/s data rate is selected.
Yellow 1000 Mb/s data rate is selected.

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 Product Description

1.11 Hardware Management Subsystem

The hardware management features enable the board to be compatible with the Wired
for Management (WfM) specification. The board has several hardware management
features, including thermal and voltage monitoring.

For information about Refer to

Wired for Management (WfM) Specification www.intel.com/design/archives/wfm/

1.11.1 Hardware Monitoring

The hardware monitoring and fan control subsystem is based on an ITE IT8607E
embedded controller, which supports the following:
• Processor and system ambient temperature monitoring
• Chassis fan speed monitoring
• Voltage monitoring of +5 V, +3.3 V, Memory Vcc (SDRAM)
• SMBus interface

1.11.2 Fan Monitoring

Fan monitoring can be implemented using third-party software.

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Intel NUC Board DN2820FY Technical Product Specification

1.11.3 Thermal Solution

Figure 7 shows the location of the thermal solution and processor fan header.

Item Description
A Processor fan header
B Thermal solution

Figure 7. Thermal Solution and Fan Header

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 Product Description

1.12 Power Management

Power management is implemented at several levels, including:
• Software support through Advanced Configuration and Power Interface (ACPI)
• Hardware support:
 Power Input
 Instantly Available PC technology
 LAN wake capabilities
 Wake from USB
 WAKE# signal wake-up support
 Wake from S5
 Wake from CIR
 +5 V Standby Power Indicator LED

1.12.1 ACPI
ACPI gives the operating system direct control over the power management and Plug
and Play functions of a computer. The use of ACPI with this board requires an
operating system that provides full ACPI support. ACPI features include:
• Plug and Play (including bus and device enumeration)
• Power management control of individual devices, add-in boards (some add-in
boards may require an ACPI-aware driver), video displays, and disk drives
• Methods for achieving less than 15-watt system operation in the power-on/standby
sleeping state
• A Soft-off feature that enables the operating system to power-off the computer
• Support for multiple wake-up events (see Table 8 on page 31)
• Support for a front panel power and sleep mode switch

Table 6 lists the system states based on how long the power switch is pressed,
depending on how ACPI is configured with an ACPI-aware operating system.

Table 6. Effects of Pressing the Power Switch

If the system is in this …and the power switch is
state… pressed for …the system enters this state
Off Less than four seconds Power-on
(ACPI G2/G5 – Soft off) (ACPI G0 – working state)
On Less than four seconds Soft-off/Standby
Note
(ACPI G0 – working state) (ACPI G1 – sleeping state)
On More than six seconds Fail safe power-off
(ACPI G0 – working state) (ACPI G2/G5 – Soft off)
Sleep Less than four seconds Wake-up
(ACPI G1 – sleeping state) (ACPI G0 – working state)
Sleep More than six seconds Power-off
(ACPI G1 – sleeping state) (ACPI G2/G5 – Soft off)
Note: Depending on power management settings in the operating system.

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Intel NUC Board DN2820FY Technical Product Specification

1.12.1.1 System States and Power States

Under ACPI, the operating system directs all system and device power state
transitions. The operating system puts devices in and out of low-power states based
on user preferences and knowledge of how devices are being used by applications.
Devices that are not being used can be turned off. The operating system uses
information from applications and user settings to put the system as a whole into a
low-power state.
Table 7 lists the power states supported by the board along with the associated system
power targets. See the ACPI specification for a complete description of the various
system and power states.

Table 7. Power States and Targeted System Power

Processor Targeted System
Global States Sleeping States States Device States Power (Note 1)
G0 – working S0 – working C0 – working D0 – working Full power
state state.
(Note 2)
G1 – sleeping S3 – Suspend to No power D3 – no power Power < 5 W
state RAM. Context except for
saved to RAM. wake-up logic.
(Note 2)
G1 – sleeping S4 – Suspend to No power D3 – no power Power < 5 W
state disk. Context except for
saved to disk. wake-up logic.
(Note 2)
G2/S5 S5 – Soft off. No power D3 – no power Power < 5 W
Context not saved. except for
Cold boot is wake-up logic.
required.
G3 – No power to the No power D3 – no power for No power to the system.
mechanical off system. wake-up logic, Service can be performed
AC power is except when safely.
disconnected provided by
from the battery or
computer. external source.

Notes:
1. Total system power is dependent on the system configuration, including add-in boards and peripherals
powered by the system chassis’ power supply.
2. Dependent on the standby power consumption of wake-up devices used in the system.

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 Product Description

1.12.1.2 Wake-up Devices and Events

Table 8 lists the devices or specific events that can wake the computer from specific
states.

Table 8. Wake-up Devices and Events

Devices/events that wake up the system… …from this sleep state
Power switch S3, S4, S5
(Note 1)
RTC alarm S3, S4, S5
(Notes 1, 2)
LAN S3, S4, S5
(Note 3, 4)
USB S3, S4, S5
(Note 1)
PCIe via WAKE# S3, S4, S5
(Notes 3, 4)
Consumer IR S3, S4, S5
Notes:
1. Monitor will remain in “sleep” state
2. “S5 WoL after G3” supported w/Deep Sleep disabled
3. Wake from S4 and S5 only supported w/Deep Sleep disabled
4. Wake from device/event not supported immediately upon return from AC loss

NOTE
The use of these wake-up events from an ACPI state requires an operating system that
provides full ACPI support. In addition, software, drivers, and peripherals must fully
support ACPI wake events.

1.12.2 Hardware Support

The board provides several power management hardware features, including:
• Wake from Power Button signal
• Instantly Available PC technology
• LAN wake capabilities
• Wake from USB
• WAKE# signal wake-up support
• Wake from S5
• Wake from CIR
• +5 V Standby Power Indicator LED

NOTE
The use of Wake from USB from an ACPI state requires an operating system that
provides full ACPI support.

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Intel NUC Board DN2820FY Technical Product Specification

1.12.2.1 Power Input

When resuming from an AC power failure, the computer may return to the power state
it was in before power was interrupted (on or off). The computer’s response can be set
using the Last Power State feature in the BIOS Setup program’s Boot menu.

1.12.2.2 Instantly Available PC Technology

Instantly Available PC technology enables the board to enter the ACPI S3 (Suspend-to-
RAM) sleep-state. While in the S3 sleep-state, the computer will appear to be off (the
power supply is off, and the front panel LED is amber if dual colored, or off if single
colored.) When signaled by a wake-up device or event, the system quickly returns to
its last known wake state. Table 8 on page 31 lists the devices and events that can
wake the computer from the S3 state.
The use of Instantly Available PC technology requires operating system support and
drivers for any installed PCI Express add-in card.

1.12.2.3 LAN Wake Capabilities

LAN wake capabilities enable remote wake-up of the computer through a network. The
LAN subsystem monitors network traffic at the Media Independent Interface. Upon
detecting a Magic Packet* frame, the LAN subsystem asserts a wake-up signal that
powers up the computer.

1.12.2.4 Wake from USB

USB bus activity wakes the computer from an ACPI S3, S4, and S5 states.

NOTE
Wake from USB requires the use of a USB peripheral that supports Wake from USB.

1.12.2.5 WAKE# Signal Wake-up Support

When the WAKE# signal on the PCI Express bus is asserted, the computer wakes from
an ACPI S3, S4, or S5 state.

1.12.2.6 Wake from S5

When the RTC Date and Time is set in the BIOS, the computer will automatically wake
from an ACPI S5 state.

1.12.2.7 Wake from Consumer IR

CIR activity wakes the computer from an ACPI S3, S4, or S5 state.

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 Product Description

1.12.2.8 +5 V Standby Power Indicator LED

The standby power indicator LED shows that power is still present even when the
computer appears to be off. Figure 8 shows the location of the standby power LED.

CAUTION
If AC power has been switched off and the standby power indicator is still lit,
disconnect the power cord before installing or removing any devices connected to the
board. Failure to do so could damage the board and any attached devices.

Figure 8. Location of the Standby Power LED

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Intel NUC Board DN2820FY Technical Product Specification

34
2 Technical Reference

2.1 Memory Resources

2.1.1 Addressable Memory

The board utilizes up to 8 GB of addressable system memory. Typically the address
space that is allocated for PCI Conventional bus add-in cards, PCI Express
configuration space, BIOS (SPI Flash device), and chipset overhead resides above the
top of DRAM (total system memory). On a system that has 8 GB of system memory
installed, it is not possible to use all of the installed memory due to system address
space being allocated for other system critical functions. These functions include the
following:
• BIOS/SPI Flash device (64 Mbit)
• Local APIC (19 MB)
• Direct Media Interface (40 MB)
• PCI Express configuration space (256 MB)
• SoC base address registers PCI Express ports (up to 256 MB)
• Memory-mapped I/O (I/O fabric) that is dynamically allocated for PCI Express add-
in cards (256 MB)
The board provides the capability to reclaim the physical memory overlapped by the
memory mapped I/O logical address space. The board remaps physical memory from
the top of usable DRAM boundary to the 4 GB boundary to an equivalent sized logical
address range located just above the 4 GB boundary. All installed system memory can
be used when there is no overlap of system addresses.

2.2 Connectors and Headers

CAUTION
Only the following connectors and headers have overcurrent protection: back panel
and front panel USB.
This section describes the board’s connectors and headers. The connectors and
headers can be divided into these groups:
• Front panel I/O connector
• Back panel I/O connectors

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Intel NUC Board DN2820FY Technical Product Specification

2.2.1 Front Panel Connector

Figure 9 shows the location of the front panel connector for the board.

Item Description
A USB 3.0 port

Figure 9. Front Panel Connector

2.2.2 Back Panel Connectors

Figure 10 shows the location of the back panel connectors for the board.

Item Description
A Back panel stereo microphone/
headphone jack
B USB 2.0 ports
C LAN
D HDMI connector
E 12 V DC input jack

Figure 10. Back Panel Connectors

36
 Technical Reference

2.2.3 Connectors and Headers (Bottom)

Figure 11 shows the locations of the connectors and headers on the bottom-side of the
board.

Figure 11. Connectors and Headers (Bottom)

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Intel NUC Board DN2820FY Technical Product Specification

Table 9 lists the connectors and headers identified in Figure 11.

Table 9. Connectors and Headers Shown in Figure 11

Item from
Figure 11 Description

A PCI Express Half-Mini Card connector

B SATA 3.0 Gb/s connector

C SATA power connector

D BIOS security jumper

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 Technical Reference

2.2.3.1 Signal Tables for the Connectors and Headers

Table 10. PCI Express Half-Mini Card Connector

Pin Signal Name Pin Signal Name
1 WAKE# 2 3.3 V
3 Reserved 4 GND
5 Reserved 6 1.5 V
7 CLKREQ# 8 Reserved
9 GND 10 Reserved
11 REFCLK- 12 Reserved
13 REFCLK+ 14 Reserved
15 GND 16 Reserved
17 Reserved 18 GND
19 Reserved 20 Reserved
21 GND 22 PERST#
23 PERn0 24 +3.3 Vaux
25 PERp0 26 GND
27 GND 28 +1.5 V
29 GND 30 SMB_CLK
31 PETn0 32 SMB_DATA
33 PETp0 34 GND
35 GND 36 USB_D-
37 GND 38 USB_D+
39 +3.3 Vaux 40 GND
41 +3.3 Vaux 42 LED_WWAN#
43 Reserved 44 LED_WLAN#
45 Reserved 46 LED_WPAN#
47 Reserved 48 +1.5 V
49 Reserved 50 GND
51 Reserved 52 +3.3 V

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Intel NUC Board DN2820FY Technical Product Specification

2.2.3.2 Add-in Card Connector

The board has one PCI Express Half-Mini Card Connector.

2.2.3.3 Power Supply Connector

The board has the following power supply connector:
• External Power Supply – the board can be powered through a 12 V DC connector
on the back panel. The back panel DC connector is compatible with a 5.5 mm/OD
(outer diameter) and 2.5 mm/ID (inner diameter) plug, where the inner contact is
+12 (±10%) V DC and the shell is GND. The maximum current rating is 3 A.

For information about Refer to

Power supply considerations Section 2.5.1, page 44

2.2.3.4 Consumer Infrared (CIR) Sensor

The Consumer Infrared (CIR) sensor on the front panel provides features that are
designed to comply with Microsoft Consumer Infrared usage models.

The CIR feature is made up of the receiving sensor. The receiving sensor consists of a
filtered translated infrared input compliant with Microsoft CIR specifications.

Customers are required to provide their own media center compatible remote or smart
phone application for use with the Intel NUC. Figure 12 shows the location of the CIR
sensor.

Item Description
A CIR Sensor

Figure 12. Location of the CIR Sensor

40
 Technical Reference

2.3 BIOS Security Jumper

CAUTION
Do not move a jumper with the power on. Always turn off the power and unplug the
power cord from the computer before changing a jumper setting. Otherwise, the board
could be damaged.
Figure 13 shows the location of the BIOS security jumper. The 3-pin jumper
determines the BIOS Security program’s mode. Table 11 describes the BIOS security
jumper settings for the three modes: normal, lockdown, and configuration.

Figure 13. Location of the BIOS Security Jumper

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Intel NUC Board DN2820FY Technical Product Specification

Table 11 lists the settings for the jumper.

Table 11. BIOS Security Jumper Settings

Function/Mode Jumper Setting Configuration
Normal 1-2 The BIOS uses current configuration information and passwords
for booting.
Lockdown 2-3 The BIOS uses current configuration information and passwords
for booting, except:

• All POST Hotkeys are suppressed (prompts are not displayed

and keys are not accepted. For example, F2 for Setup, F10 for
the Boot Menu).

• Power Button Menu is not available (see Section 3.7.4 Power

Button Menu).

BIOS updates are not available except for automatic Recovery

due to flash corruption.

Configuration None BIOS Recovery Update process if a matching *.bio file is found.
Recovery Update can be cancelled by pressing the Esc key.

If the Recovery Update was cancelled or a matching *.bio file

was not found, a Config Menu will be displayed. The Config Menu
consists of the following (followed by the Power Button Menu
selections):

[1] Suppress this menu until the BIOS Security Jumper is

replaced.

[2] Clear BIOS User and Supervisor Passwords.

See Section 3.7.4 Power Button Menu.

42
 Technical Reference

2.4 Mechanical Considerations

2.4.1 Form Factor

The board is designed to fit into a custom chassis. Figure 14 illustrates the mechanical
form factor for the board. Dimensions are given in millimeters. The outer dimensions
are 101.60 millimeters by 101.60 millimeters [4.0 inches by 4.0 inches].

Figure 14. Board Dimensions

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Intel NUC Board DN2820FY Technical Product Specification

Figure 15 shows the height dimensions of the board.

Figure 15. Board Height Dimensions

2.5 Electrical Considerations

2.5.1 Power Supply Considerations

System power requirements will depend on actual system configurations chosen by the
integrator, as well as end user expansion preferences. It is the system integrator’s
responsibility to ensure an appropriate power budget for the system configuration is
properly assessed based on the system-level components chosen.

2.5.2 Fan Header Current Capability

Table 12 lists the current capability of the fan header.

Table 12. Fan Header Current Capability

Fan Header Maximum Available Current
Processor fan .25 A

2.6 Thermal Considerations

CAUTION
A chassis with a maximum internal ambient temperature of 58 oC at the processor fan
inlet is recommended. If the internal ambient temperature exceeds 58 oC, further
thermal testing is required to ensure components do not exceed their maximum case
temperature.

CAUTION
Failure to ensure appropriate airflow may result in reduced performance of both the
processor and/or voltage regulator or, in some instances, damage to the board.
All responsibility for determining the adequacy of any thermal or system design
remains solely with the system integrator. Intel makes no warranties or
representations that merely following the instructions presented in this document will
result in a system with adequate thermal performance.

44
 Technical Reference

CAUTION
Ensure that the ambient temperature does not exceed the board’s maximum operating
temperature. Failure to do so could cause components to exceed their maximum case
temperature and malfunction. For information about the maximum operating
temperature, see the environmental specifications in Section 2.8.

CAUTION
The processor voltage regulator area (shown in Figure 16) can reach a temperature of
up to 97.5 oC in an open chassis. Ensure that proper airflow is maintained in the
processor voltage regulator circuit. Failure to do so may result in shorter than
expected product lifetime.

Figure 16 shows the locations of the localized high temperature zones.

Item Description
A Processor voltage regulator area
B Thermal solution

Figure 16. Localized High Temperature Zones

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Intel NUC Board DN2820FY Technical Product Specification

Table 13 provides maximum case temperatures for the components that are sensitive
to thermal changes. The operating temperature, current load, or operating frequency
could affect case temperatures. Maximum case temperatures are important when
considering proper airflow to cool the board.

Table 13. Thermal Considerations for Components

Component Maximum Case Temperature
Processor For processor case temperature, see processor datasheets and
processor specification updates

To ensure functionality and reliability, the component is specified for proper operation
when Case Temperature is maintained at or below the maximum temperature listed in
Table 14. This is a requirement for sustained power dissipation equal to Thermal
Design Power (TDP is specified as the maximum sustainable power to be dissipated by
the components). When the component is dissipating less than TDP, the case
temperature should be below the Maximum Case Temperature. The surface
temperature at the geometric center of the component corresponds to Case
Temperature.

It is important to note that the temperature measurement in the system BIOS is a

value reported by embedded thermal sensors in the components and does not directly
correspond to the Maximum Case Temperature. The upper operating limit when
monitoring this thermal sensor is Tcontrol.

Table 14. Tcontrol Values for Components

Component Tcontrol
Processor For processor case temperature, see processor datasheets and
processor specification updates

For information about Refer to

Processor datasheets and specification updates Section 1.2, page 18

46
 Technical Reference

2.7 Reliability
The Mean Time Between Failures (MTBF) prediction is calculated using component and
subassembly random failure rates. The calculation is based on the Telcordia SR-332-2
Issue 2, Method I, Case 3, 55 ºC ambient. The MTBF prediction is used to estimate
repair rates and spare parts requirements. The MTBF for the board is 65,955 hours.

2.8 Environmental
Table 15 lists the environmental specifications for the board.

Table 15. Environmental Specifications

Parameter Specification
Temperature
Non-Operating -40 °C to +60 °C
Operating 0 °C to +50 °C
Shock
Unpackaged 50 g trapezoidal waveform
Velocity change of 170 inches/s²
Packaged Half sine 2 millisecond
Product Weight (pounds) Free Fall (inches) Velocity Change (inches/s²)
<20 36 167
21-40 30 152
41-80 24 136
81-100 18 118
Vibration
Unpackaged 5 Hz to 20 Hz: 0.01 g² Hz sloping up to 0.02 g² Hz
20 Hz to 500 Hz: 0.02 g² Hz (flat)
Packaged 5 Hz to 40 Hz: 0.015 g² Hz (flat)
40 Hz to 500 Hz: 0.015 g² Hz sloping down to 0.00015 g² Hz

NOTE
Before attempting to operate this board, the overall temperature of the board must be
above the minimum operating temperature specified. It is recommended that the
board temperature be at least room temperature before attempting to power on the
board. The operating and non-operating environment must avoid condensing humidity.

47
Intel NUC Board DN2820FY Technical Product Specification

48
3 Overview of BIOS Features

3.1 Introduction
The board uses a Intel Visual BIOS that is stored in the Serial Peripheral Interface
Flash Memory (SPI Flash) and can be updated using a disk-based program. The SPI
Flash contains the Visual BIOS Setup program, POST, the PCI auto-configuration
utility, LAN EEPROM information, and Plug and Play support. The initial production
BIOSs are identified as FYBYT10H.86A.

The Visual BIOS Setup program can be used to view and change the BIOS settings for
the computer, and to update the system BIOS. The BIOS Setup program is accessed
by pressing the <F2> key after the Power-On Self-Test (POST) memory test begins
and before the operating system boot begins.

NOTE
The maintenance menu is displayed only when the board is in configuration mode.
Section 2.3 on page 41 shows how to put the board in configuration mode.

3.2 BIOS Flash Memory Organization

The Serial Peripheral Interface Flash Memory (SPI Flash) includes a 64 Mb (8192 KB)
flash memory device.

3.3 System Management BIOS (SMBIOS)

SMBIOS is a Desktop Management Interface (DMI) compliant method for managing
computers in a managed network.
The main component of SMBIOS is the Management Information Format (MIF)
database, which contains information about the computing system and its
components. Using SMBIOS, a system administrator can obtain the system types,
capabilities, operational status, and installation dates for system components. The MIF
database defines the data and provides the method for accessing this information. The
BIOS enables applications such as third-party management software to use SMBIOS.
The BIOS stores and reports the following SMBIOS information:
• BIOS data, such as the BIOS revision level
• Fixed-system data, such as peripherals, serial numbers, and asset tags
• Resource data, such as memory size, cache size, and processor speed
• Dynamic data, such as event detection and error logging
Non-Plug and Play operating systems require an additional interface for obtaining the
SMBIOS information. The BIOS supports an SMBIOS table interface for such operating

49
Intel NUC Board DN2820FY Technical Product Specification

systems. Using this support, an SMBIOS service-level application running on a

non-Plug and Play operating system can obtain the SMBIOS information. Additional
board information can be found in the BIOS under the Additional Information header
under the Main BIOS page.

3.4 Legacy USB Support

Legacy USB support enables USB devices to be used even when the operating system’s
USB drivers are not yet available. Legacy USB support is used to access the BIOS
Setup program, and to install an operating system that supports USB. By default,
Legacy USB support is set to Enabled.

Legacy USB support operates as follows:

1. When you apply power to the computer, legacy support is disabled.
2. POST begins.
3. Legacy USB support is enabled by the BIOS allowing you to use a USB keyboard to
enter and configure the BIOS Setup program and the maintenance menu.
4. POST completes.
5. The operating system loads. While the operating system is loading, USB keyboards
and mice are recognized and may be used to configure the operating system.
(Keyboards and mice are not recognized during this period if Legacy USB support
was set to Disabled in the BIOS Setup program.)
6. After the operating system loads the USB drivers, all legacy and non-legacy USB
devices are recognized by the operating system, and Legacy USB support from the
BIOS is no longer used.
7. Additional USB legacy feature options can be access by using Intel ® Integrator
Toolkit.
To install an operating system that supports USB, verify that Legacy USB support in
the BIOS Setup program is set to Enabled and follow the operating system’s
installation instructions.

3.5 BIOS Updates

The BIOS can be updated using either of the following utilities, which are available on
the Intel World Wide Web site:
• Intel® Express BIOS Update utility, which enables automated updating while in the
Windows environment. Using this utility, the BIOS can be updated from a file on a
hard disk, a USB drive (a flash drive or a USB hard drive), or a CD-ROM, or from
the file location on the Web.
• Intel® Flash Memory Update Utility, which requires booting from DOS. Using this
utility, the BIOS can be updated from a file on a hard disk, a USB drive (a flash
drive or a USB hard drive), or a CD-ROM.

50
 Overview of BIOS Features

• Intel F7 switch during POST allows a user to select where the BIOS .bio file is
located and perform the update from that location/device. Similar to performing a
BIOS Recovery without removing the BIOS configuration jumper.
• Intel Visual BIOS allows the user to select the BIOS .bio file from the internet, USB
device, hard disk drive, or other media.
All utilities verify that the updated BIOS matches the target system to prevent
accidentally installing an incompatible BIOS.

NOTE
Review the instructions distributed with the upgrade utility before attempting a BIOS
update.

For information about Refer to

BIOS update utilities http://www.intel.com/support/motherboards/desktop/sb/C
S-034499.htm

3.5.1 Language Support

The BIOS Setup program and help messages are supported in US English. Check the
Intel web site for support.

3.5.2 Custom Splash Screen

During POST, an Intel® splash screen is displayed by default. This splash screen can
be augmented with a custom splash screen. The Intel Integrator’s Toolkit that is
available from Intel can be used to create a custom splash screen.

NOTE
If you add a custom splash screen, it will share space with the Intel branded logo.

For information about Refer to

Intel Integrator Toolkit http://developer.intel.com/design/motherbd/software/itk/

®
Additional Intel software tools http://developer.intel.com/design/motherbd/software.htm

51
Intel NUC Board DN2820FY Technical Product Specification

3.6 BIOS Recovery

It is unlikely that anything will interrupt a BIOS update; however, if an interruption
occurs, the BIOS could be damaged. Table 16 lists the drives and media types that
can and cannot be used for BIOS recovery. The BIOS recovery media does not need to
be made bootable.

Table 16. Acceptable Drives/Media Types for BIOS Recovery

Media Type (Note) Can be used for BIOS recovery?
Hard disk drive (connected to SATA or USB) Yes
CD/DVD drive (connected to SATA or USB) Yes
USB flash drive Yes
USB diskette drive (with a 1.4 MB diskette) No (BIOS update file is bigger than 1.4 MB size limit)

NOTE
Supported file systems for BIOS recovery:
• NTFS (sparse, compressed, or encrypted files are not supported)
• FAT32
• FAT16
• FAT12
• ISO 9660

For information about Refer to

BIOS recovery http://www.intel.com/support/motherboards/desktop/sb/CS-
034524.htm

52
 Overview of BIOS Features

3.7 Boot Options

In the BIOS Setup program, the user can choose to boot from a hard drive, optical
drive, removable drive, or the network. The default setting is for the optical drive to
be the first boot device, the hard drive second, removable drive third, and the network
fourth.

3.7.1 Intel® Visual Boot Manager

Intel® Visual Boot Manager is a new module that has been added to Intel® Visual
BIOS. It provides the capability of selecting from a list of installed OS’s on any
attached HDD and booting to the selected OS during the POST process. It utilizes
flexible UEFI core BIOS to implement this feature. Intel Visual Boot Manager can be
toggled on and off via a configuration option in Intel Visual BIOS under the boot tab.
Once Intel Visual Boot Manager has been enabled, the system will always bring up
Intel Visual Boot Manager which will provide you with a selection of OS’s to boot to. An
additional feature is the countdown timer. The timer range is configurable in Intel
Visual BIOS and controls the behavior upon entering Intel Visual Boot Manager. If the
countdown timer is enabled, the timer will countdown by 1 second intervals from the
range specified by the option in Intel Visual BIOS. Once it reaches 0, and as long as
there is no mouse, touch, or keyboard activity, the first boot device will be
automatically selected and booted to. In a future BIOS update release, Intel Visual
Boot Manager will allow the ability to select an OS from the Intel Visual Boot Manager
menu that has not previously been installed on a HDD. It will enable the capability to
download an OS from the web and install it on a HDD if the Intel NUC is connected to
the internet. This will then allow you to boot to multiple OS’s from a HDD, ensuring a
more flexible platform capability. The ability to change the default first boot device will
also be added at a later time.

3.7.2 Network Boot

The network can be selected as a boot device. This selection allows booting from the
onboard LAN or a network add-in card with a remote boot ROM installed.
Pressing the <F12> key during POST automatically forces booting from the LAN. To
use this key during POST, the User Access Level in the BIOS Setup program's Security
menu must be set to Full.

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Intel NUC Board DN2820FY Technical Product Specification

3.7.3 Booting Without Attached Devices

For use in embedded applications, the BIOS has been designed so that after passing
the POST, the operating system loader is invoked even if the following devices are not
present:
• Video adapter
• Keyboard
• Mouse

3.7.4 Changing the Default Boot Device During POST

Pressing the <F10> key during POST causes a boot device menu to be displayed. This
menu displays the list of available boot devices. Table 17 lists the boot device menu
options.

Table 17. Boot Device Menu Options

Boot Device Menu Function Keys Description
<↑> or <↓> Selects a default boot device
<Enter> Exits the menu, and boots from the selected device
<Esc> Exits the menu and boots according to the boot priority
defined through BIOS setup

54
 Overview of BIOS Features

3.7.5 Power Button Menu

The Power Button Menu is accessible via the following sequence:
1. System is in S4/S5 (not G3)
2. User pushes the power button and holds it down
3. The system will emit three short beeps from the PC speaker, then stop to signal the
user to release the power button (approximately 3 seconds)
4. User releases the power button before the 4-second shutdown override
If this boot path is taken, the BIOS will use default settings, ignoring settings in VPD
where possible.
At the point where Setup Entry/Boot would be in the normal boot path, the BIOS will
display the following prompt and wait for a keystroke:
[ESC] Normal Boot
[F2] Intel Visual BIOS
[F3] Disable Fast Boot
[F4] BIOS Recovery
[F7] Update BIOS
[F10] Enter Boot Menu
[F12] Network Boot

[F3] Disable Fast Boot is only displayed if at least one Fast Boot optimization is
enabled.

If an unrecognized key is hit, then the BIOS will beep and wait for another keystroke.
If one of the listed hotkeys is hit, the BIOS will follow the indicated boot path.
Password requirements must still be honored.

If Disable Fast Boot is selected, the BIOS will disable all Fast Boot optimizations and
reset the system.

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Intel NUC Board DN2820FY Technical Product Specification

3.8 Hard Disk Drive Password Security Feature

The Hard Disk Drive Password Security feature blocks read and write accesses to the
hard disk drive until the correct password is given. Hard Disk Drive Passwords are set
in BIOS SETUP and are prompted for during BIOS POST. For convenient support of S3
resume, the system BIOS will automatically unlock drives on resume from S3. Valid
password characters are A-Z, a-z, and 0-9. Passwords may be up to 19 characters in
length.
The User hard disk drive password, when installed, will be required upon each power-
cycle until the Master Key or User hard disk drive password is submitted.
The Master Key hard disk drive password, when installed, will not lock the drive. The
Master Key hard disk drive password exists as an unlock override in the event that the
User hard disk drive password is forgotten. Only the installation of the User hard disk
drive password will cause a hard disk to be locked upon a system power-cycle.

Table 18 shows the effects of setting the Hard Disk Drive Passwords.

Table 18. Master Key and User Hard Drive Password Functions
Password Set Password During Boot
Neither None
Master only None
User only User only
Master and User Set Master or User

During every POST, if a User hard disk drive password is set, POST execution will
pause with the following prompt to force the user to enter the Master Key or User hard
disk drive password:
Enter Hard Disk Drive Password:

Upon successful entry of the Master Key or User hard disk drive password, the system
will continue with normal POST.

If the hard disk drive password is not correctly entered, the system will go back to the
above prompt. The user will have three attempts to correctly enter the hard disk drive
password. After the third unsuccessful hard disk drive password attempt, the system
will halt with the message:
Hard Disk Drive Password Entry Error

A manual power cycle will be required to resume system operation.

NOTE
The passwords are stored on the hard disk drive so if the drive is relocated to another
computer that does not support Hard Disk Drive Password Security feature, the drive
will not be accessible.

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 Overview of BIOS Features

3.9 BIOS Security Features

The BIOS includes security features that restrict access to the BIOS Setup program
and who can boot the computer. A supervisor password and a user password can be
set for the BIOS Setup program and for booting the computer, with the following
restrictions:
• The supervisor password gives unrestricted access to view and change all the Setup
options in the BIOS Setup program. This is the supervisor mode.
• The user password gives restricted access to view and change Setup options in the
BIOS Setup program. This is the user mode.
• If only the supervisor password is set, pressing the <Enter> key at the password
prompt of the BIOS Setup program allows the user restricted access to Setup.
• If both the supervisor and user passwords are set, users can enter either the
supervisor password or the user password to access Setup. Users have access to
Setup respective to which password is entered.
• Setting the user password restricts who can boot the computer. The password
prompt will be displayed before the computer is booted. If only the supervisor
password is set, the computer boots without asking for a password. If both
passwords are set, the user can enter either password to boot the computer.
• For enhanced security, use different passwords for the supervisor and user
passwords.
• Valid password characters are A-Z, a-z, and 0-9. Passwords may be up to
16 characters in length.
• To clear a set password, enter a blank password after entering the existing
password.
Table 19 shows the effects of setting the supervisor password and user password. This
table is for reference only and is not displayed on the screen.

Table 19. Supervisor and User Password Functions

Password Password
Password Supervisor to Enter During
Set Mode User Mode Setup Options Setup Boot
Neither Can change all Can change all None None None
options (Note) options (Note)
Supervisor Can change all Can change a Supervisor Password Supervisor None
only options limited
number of
options
User only N/A Can change all Enter Password User User
options Clear User Password
Supervisor Can change all Can change a Supervisor Password Supervisor or Supervisor or
and user set options limited Enter Password user user
number of
options
Note: If no password is set, any user can change all Setup options.

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Intel NUC Board DN2820FY Technical Product Specification

58
4 Error Messages and Blink Codes

4.1 Front-panel Power LED Blink Codes

Whenever a recoverable error occurs during POST, the BIOS causes the board’s front
panel power LED to blink an error message describing the problem (see Table 20).

Table 20. Front-panel Power LED Blink Codes

Type Pattern Note
BIOS update in progress Off when the update begins, then on for
0.5 seconds, then off for 0.5 seconds. The
pattern repeats until the BIOS update is
complete.
(Note)
Video error On-off (1.0 second each) two times, then When no VGA option ROM is
2.5-second pause (off), entire pattern repeats found.
(blink and pause) until the system is powered
off.
Memory error On-off (1.0 second each) three times, then
2.5-second pause (off), entire pattern repeats
(blinks and pause) until the system is powered
off.
Thermal trip warning Each beep will be accompanied by the following
blink pattern: .25 seconds on, .25 seconds off,
.25 seconds on, .25 seconds off. This will result
in a total of 16 blinks.
Note: Disabled per default BIOS setup option.

4.2 BIOS Error Messages

Table 21 lists the error messages and provides a brief description of each.

Table 21. BIOS Error Messages

Error Message Explanation
CMOS Battery Low The battery may be losing power. Replace the battery soon.
CMOS Checksum Bad The CMOS checksum is incorrect. CMOS memory may have
been corrupted. Run Setup to reset values.
Memory Size Decreased Memory size has decreased since the last boot. If no memory
was removed, then memory may be bad.
No Boot Device Available System did not find a device to boot.

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Intel NUC Board DN2820FY Technical Product Specification

60
5 Regulatory Compliance and Battery
Disposal Information

5.1 Regulatory Compliance

This section contains the following regulatory compliance information for Intel NUC
Board DN2820FY:
• Safety standards
• European Union Declaration of Conformity statement
• Product Ecology statements
• Electromagnetic Compatibility (EMC) standards
• Product certification markings

5.1.1 Safety Standards

Intel NUC Board DN2820FY complies with the safety standards stated in Table 22 when
correctly installed in a compatible host system.

Table 22. Safety Standards

Standard Title
CSA/UL 60950-1 Information Technology Equipment – Safety - Part 1: General
Requirements (USA and Canada)
EN 60950-1 Information Technology Equipment – Safety - Part 1: General
Requirements (European Union)
IEC 60950-1 Information Technology Equipment – Safety - Part 1: General
Requirements (International)

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Intel NUC Board DN2820FY Technical Product Specification

5.1.2 European Union Declaration of Conformity

Statement
We, Intel Corporation, declare under our sole responsibility that the products Intel®
NUC Board DN2820FY is in conformity with all applicable essential requirements
necessary for CE marking, following the provisions of the European Council Directive
2004/108/EC (EMC Directive), 2006/95/EC (Low Voltage Directive), and 2002/95/EC
(ROHS Directive).
The product is properly CE marked demonstrating this conformity and is for
distribution within all member states of the EU with no restrictions.

This product follows the provisions of the European Directives 2004/108/EC,

2006/95/EC, and 2002/95/EC.
Čeština Tento výrobek odpovídá požadavkům evropských směrnic 2004/108/EC,
2006/95/EC a 2002/95/EC.
Dansk Dette produkt er i overensstemmelse med det europæiske direktiv
2004/108/EC, 2006/95/EC & 2002/95/EC.
Dutch Dit product is in navolging van de bepalingen van Europees Directief
2004/108/EC, 2006/95/EC & 2002/95/EC.
Eesti Antud toode vastab Euroopa direktiivides 2004/108/EC, ja 2006/95/EC ja
2002/95/EC kehtestatud nõuetele.
Suomi Tämä tuote noudattaa EU-direktiivin 2004/108/EC, 2006/95/EC & 2002/95/EC
määräyksiä.
Français Ce produit est conforme aux exigences de la Directive Européenne
2004/108/EC, 2006/95/EC & 2002/95/EC.
Deutsch Dieses Produkt entspricht den Bestimmungen der Europäischen Richtlinie
2004/108/EC, 2006/95/EC & 2002/95/EC.
Ελληνικά Το παρόν προϊόν ακολουθεί τις διατάξεις των Ευρωπαϊκών Οδηγιών
2004/108/EC, 2006/95/EC και 2002/95/EC.
Magyar E termék megfelel a 2004/108/EC, 2006/95/EC és 2002/95/EC Európai
Irányelv előírásainak.
Icelandic Þessi vara stenst reglugerð Evrópska Efnahags Bandalagsins númer
2004/108/EC, 2006/95/EC, & 2002/95/EC.
Italiano Questo prodotto è conforme alla Direttiva Europea 2004/108/EC,
2006/95/EC & 2002/95/EC.
Latviešu Šis produkts atbilst Eiropas Direktīvu 2004/108/EC, 2006/95/EC un
2002/95/EC noteikumiem.
Lietuvių Šis produktas atitinka Europos direktyvų 2004/108/EC, 2006/95/EC, ir
2002/95/EC nuostatas.
Malti Dan il-prodott hu konformi mal-provvedimenti tad-Direttivi Ewropej
2004/108/EC, 2006/95/EC u 2002/95/EC.
Norsk Dette produktet er i henhold til bestemmelsene i det europeiske direktivet
2004/108/EC, 2006/95/EC & 2002/95/EC.
Polski Niniejszy produkt jest zgodny z postanowieniami Dyrektyw Unii Europejskiej
2004/108/EC, 206/95/EC i 2002/95/EC.

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 Regulatory Compliance and Battery Disposal Information

Portuguese Este produto cumpre com as normas da Diretiva Européia 2004/108/EC,

2006/95/EC & 2002/95/EC.
Español Este producto cumple con las normas del Directivo Europeo 2004/108/EC,
2006/95/EC & 2002/95/EC.
Slovensky Tento produkt je v súlade s ustanoveniami európskych direktív
2004/108/EC, 2006/95/EC a 2002/95/EC.
Slovenščina Izdelek je skladen z določbami evropskih direktiv 2004/108/EC,
2006/95/EC in 2002/95/EC.
Svenska Denna produkt har tillverkats i enlighet med EG-direktiv 2004/108/EC,
2006/95/EC & 2002/95/EC.
Türkçe Bu ürün, Avrupa Birliği’nin 2004/108/EC, 2006/95/EC ve 2002/95/EC
yönergelerine uyar.

5.1.3 Product Ecology Statements

The following information is provided to address worldwide product ecology concerns
and regulations.

5.1.3.1 Disposal Considerations

This product contains the following materials that may be regulated upon disposal:
lead solder on the printed wiring board assembly.

5.1.4 EMC Regulations

Intel NUC Board DN2820FY complies with the EMC regulations stated in Table 23 when
correctly installed in a compatible host system.

Table 23. EMC Regulations

Regulation Title
FCC 47 CFR Part 15, Title 47 of the Code of Federal Regulations, Part 15, Subpart B, Radio
Subpart B Frequency Devices. (USA)
ICES-003 Interference-Causing Equipment Standard, Digital Apparatus. (Canada)
EN55022 Limits and methods of measurement of Radio Interference Characteristics
of Information Technology Equipment. (European Union)
EN55024 Information Technology Equipment – Immunity Characteristics Limits and
methods of measurement. (European Union)
EN55022 Australian Communications Authority, Standard for Electromagnetic
Compatibility. (Australia and New Zealand)
CISPR 22 Limits and methods of measurement of Radio Disturbance Characteristics
of Information Technology Equipment. (International)
CISPR 24 Information Technology Equipment – Immunity Characteristics – Limits
and Methods of Measurement. (International)
VCCI V-3, V-4 Voluntary Control for Interference by Information Technology Equipment.
(Japan)
KN-22, KN-24 Korean Communications Commission – Framework Act on
Telecommunications and Radio Waves Act (South Korea)
CNS 13438 Bureau of Standards, Metrology, and Inspection (Taiwan)

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Intel NUC Board DN2820FY Technical Product Specification

FCC Declaration of Conformity

This device complies with Part 15 of the FCC Rules. Operation is subject to the
following two conditions: (1) this device may not cause harmful interference, and (2)
this device must accept any interference received, including interference that may
cause undesired operation.
For questions related to the EMC performance of this product, contact:

Intel Corporation, 5200 N.E. Elam Young Parkway, Hillsboro, OR 97124

1-800-628-8686

This equipment has been tested and found to comply with the limits for a Class B
digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to
provide reasonable protection against harmful interference in a residential installation.
This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instructions, may cause harmful interference
to radio communications. However, there is no guarantee that interference will not
occur in a particular installation. If this equipment does cause harmful interference to
radio or television reception, which can be determined by turning the equipment off
and on, the user is encouraged to try to correct the interference by one or more of the
following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and the receiver.
• Connect the equipment to an outlet on a circuit other than the one to which the
receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.
Any changes or modifications to the equipment not expressly approved by Intel
Corporation could void the user’s authority to operate the equipment.

Tested to comply with FCC standards for home or office use.

Canadian Department of Communications Compliance Statement

This digital apparatus does not exceed the Class B limits for radio noise emissions from
digital apparatus set out in the Radio Interference Regulations of the Canadian
Department of Communications.
Le présent appareil numerique német pas de bruits radioélectriques dépassant les
limites applicables aux appareils numériques de la classe B prescrites dans le
Réglement sur le broullage radioélectrique édicté par le ministére des Communications
du Canada.

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 Regulatory Compliance and Battery Disposal Information

Japan VCCI Statement

Japan VCCI Statement translation: This is a Class B product based on the standard of
the Voluntary Control Council for Interference from Information Technology Equipment
(VCCI). If this is used near a radio or television receiver in a domestic environment, it
may cause radio interference. Install and use the equipment according to the
instruction manual.

Korea Class B Statement

Korea Class B Statement translation: This equipment is for home use, and has
acquired electromagnetic conformity registration, so it can be used not only in
residential areas, but also other areas.

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Intel NUC Board DN2820FY Technical Product Specification

5.1.5 e-Standby and ErP Compliance

Intel NUC Board DN2820FY meets the following program requirements in an adequate
system configuration, including appropriate selection of an efficient power supply:
• EPEAT*
• Korea e-Standby
• European Union Energy-related Products Directive 2013 (ErP) Lot 6

For information about Refer to

Electronic Product Environmental Assessment Tool (EPEAT) http://www.epeat.net/
Korea e-Standby Program http://www.kemco.or.kr/new_eng/pg02
/pg02100300.asp
European Union Energy-related Products Directive 2009 (ErP) http://ec.europa.eu/enterprise/policies/s
ustainable-business/sustainable-
product-policy/ecodesign/index_en.htm

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 Regulatory Compliance and Battery Disposal Information

5.1.6 Regulatory Compliance Marks (Board Level)

Intel NUC Board DN2820FY has the regulatory compliance marks shown in Table 24.

Table 24. Regulatory Compliance Marks

Description Mark
UL joint US/Canada Recognized Component mark. Includes adjacent UL file
number for Intel NUC Boards: E210882.

FCC Declaration of Conformity logo mark for Class B equipment.

CE mark. Declaring compliance to the European Union (EU) EMC directive,

Low Voltage directive, and RoHS directive.

Australian Communications Authority (ACA) and New Zealand Radio

Spectrum Management (NZ RSM) C-tick mark. Includes adjacent Intel
supplier code number, N-232.

Japan VCCI (Voluntary Control Council for Interference) mark.

Korea Certification mark. Includes an adjacent KCC (Korean

Communications Commission) certification number:
KCC-REM-CPU-DN2820FY.

Taiwan BSMI (Bureau of Standards, Metrology and Inspections) mark.

Includes adjacent Intel company number, D33025.

Printed wiring board manufacturer’s recognition mark. Consists of a unique V-0

UL recognized manufacturer’s logo, along with a flammability rating (solder
side).
China RoHS/Environmentally Friendly Use Period Logo: This is an example of
the symbol used on Intel NUC Boards and associated collateral. The color of
the mark may vary depending upon the application. The Environmental
Friendly Usage Period (EFUP) for Intel NUC Boards has been determined to
be 10 years.

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Intel NUC Board DN2820FY Technical Product Specification

5.2 Battery Disposal Information

CAUTION
Risk of explosion if the battery is replaced with an incorrect type. Batteries should be
recycled where possible. Disposal of used batteries must be in accordance with local
environmental regulations.

PRÉCAUTION
Risque d'explosion si la pile usagée est remplacée par une pile de type incorrect. Les
piles usagées doivent être recyclées dans la mesure du possible. La mise au rebut des
piles usagées doit respecter les réglementations locales en vigueur en matière de
protection de l'environnement.

FORHOLDSREGEL
Eksplosionsfare, hvis batteriet erstattes med et batteri af en forkert type. Batterier bør
om muligt genbruges. Bortskaffelse af brugte batterier bør foregå i overensstemmelse
med gældende miljølovgivning.

OBS!
Det kan oppstå eksplosjonsfare hvis batteriet skiftes ut med feil type. Brukte batterier
bør kastes i henhold til gjeldende miljølovgivning.

VIKTIGT!
Risk för explosion om batteriet ersätts med felaktig batterityp. Batterier ska kasseras
enligt de lokala miljövårdsbestämmelserna.

VARO
Räjähdysvaara, jos pariston tyyppi on väärä. Paristot on kierrätettävä, jos se on
mahdollista. Käytetyt paristot on hävitettävä paikallisten ympäristömääräysten
mukaisesti.

VORSICHT
Bei falschem Einsetzen einer neuen Batterie besteht Explosionsgefahr. Die Batterie
darf nur durch denselben oder einen entsprechenden, vom Hersteller empfohlenen
Batterietyp ersetzt werden. Entsorgen Sie verbrauchte Batterien den Anweisungen des
Herstellers entsprechend.

AVVERTIMENTO
Esiste il pericolo di un esplosione se la pila non viene sostituita in modo corretto.
Utilizzare solo pile uguali o di tipo equivalente a quelle consigliate dal produttore. Per
disfarsi delle pile usate, seguire le istruzioni del produttore.

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 Regulatory Compliance and Battery Disposal Information

PRECAUCIÓN
Existe peligro de explosión si la pila no se cambia de forma adecuada. Utilice
solamente pilas iguales o del mismo tipo que las recomendadas por el fabricante del
equipo. Para deshacerse de las pilas usadas, siga igualmente las instrucciones del
fabricante.

WAARSCHUWING
Er bestaat ontploffingsgevaar als de batterij wordt vervangen door een onjuist type
batterij. Batterijen moeten zoveel mogelijk worden gerecycled. Houd u bij het
weggooien van gebruikte batterijen aan de plaatselijke milieuwetgeving.

ATENÇÃO
Haverá risco de explosão se a bateria for substituída por um tipo de bateria incorreto.
As baterias devem ser recicladas nos locais apropriados. A eliminação de baterias
usadas deve ser feita de acordo com as regulamentações ambientais da região.

AŚCIAROŽZNAŚĆ
Існуе рызыка выбуху, калі заменены акумулятар неправільнага тыпу.
Акумулятары павінны, па магчымасці, перепрацоўвацца. Пазбаўляцца ад старых
акумулятараў патрэбна згодна з мясцовым заканадаўствам па экалогіі.

UPOZORNÌNÍ
V případě výměny baterie za nesprávný druh může dojít k výbuchu. Je-li to možné,
baterie by měly být recyklovány. Baterie je třeba zlikvidovat v souladu s místními
předpisy o životním prostředí.

Προσοχή
Υπάρχει κίνδυνος για έκρηξη σε περίπτωση που η μπαταρία αντικατασταθεί από μία
λανθασμένου τύπου. Οι μπαταρίες θα πρέπει να ανακυκλώνονται όταν κάτι τέτοιο είναι
δυνατό. Η απόρριψη των χρησιμοποιημένων μπαταριών πρέπει να γίνεται σύμφωνα με
τους κατά τόπο περιβαλλοντικούς κανονισμούς.

VIGYÁZAT
Ha a telepet nem a megfelelő típusú telepre cseréli, az felrobbanhat. A telepeket
lehetőség szerint újra kell hasznosítani. A használt telepeket a helyi környezetvédelmi
előírásoknak megfelelően kell kiselejtezni.

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Intel NUC Board DN2820FY Technical Product Specification

AWAS
Risiko letupan wujud jika bateri digantikan dengan jenis yang tidak betul. Bateri
sepatutnya dikitar semula jika boleh. Pelupusan bateri terpakai mestilah mematuhi
peraturan alam sekitar tempatan.

OSTRZEŻENIE
Istnieje niebezpieczeństwo wybuchu w przypadku zastosowania niewłaściwego typu
baterii. Zużyte baterie należy w miarę możliwości utylizować zgodnie z odpowiednimi
przepisami ochrony środowiska.

PRECAUŢIE
Risc de explozie, dacă bateria este înlocuită cu un tip de baterie necorespunzător.
Bateriile trebuie reciclate, dacă este posibil. Depozitarea bateriilor uzate trebuie să
respecte reglementările locale privind protecţia mediului.

ВНИМАНИЕ
При использовании батареи несоответствующего типа существует риск ее взрыва.
Батареи должны быть утилизированы по возможности. Утилизация батарей должна
проводится по правилам, соответствующим местным требованиям.

UPOZORNENIE
Ak batériu vymeníte za nesprávny typ, hrozí nebezpečenstvo jej výbuchu.
Batérie by sa mali podľa možnosti vždy recyklovať. Likvidácia použitých batérií sa musí
vykonávať v súlade s miestnymi predpismi na ochranu životného prostredia.

POZOR
Zamenjava baterije z baterijo drugačnega tipa lahko povzroči eksplozijo.
Če je mogoče, baterije reciklirajte. Rabljene baterije zavrzite v skladu z lokalnimi
okoljevarstvenimi predpisi.

UYARI
Yanlış türde pil takıldığında patlama riski vardır. Piller mümkün olduğunda geri
dönüştürülmelidir. Kullanılmış piller, yerel çevre yasalarına uygun olarak atılmalıdır.

OСТОРОГА
Використовуйте батареї правильного типу, інакше існуватиме ризик вибуху.
Якщо можливо, використані батареї слід утилізувати. Утилізація використаних
батарей має бути виконана згідно місцевих норм, що регулюють охорону довкілля.

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Intel NUC Board DN2820FY Technical Product Specification

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