COMPONENT

MAINTENANCE MANUAL
WITH
ILLUSTRATED PARTS LIST
POWER MODULE
PART NUMBER
EAMBC8816-431

Fokker Aircraft B.v

Amsterdam
Holland
27-36-13
OCT 01/93
 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

TRANSMITTAL LETTER FOR CMM 27-36-13

UNIT TITLE : Power Module
PART NUMBERS: EAMBC8816-431 REVISION NUMBER 001
REVISION DATE MAY 01/96
PREVIOUS DATE OCT 01/93

This is a revision of CMM 27-36-13. Revise this manual in accordance with the
revised List of Effective Pages. The revised List of Effective Pages is the only
document to be used for checking your manual for correct contents. Please enter the
new revision date and number in the appropriate columns on the Record of Revisions.
For details of the revision and a list of the affected pages refer to the
highlights page(s).
Problems, comments and requests for change or improvement to this manual must be
sent to the following address:
Fokker Aircraft B.V.
Technical Support Turboprop Aircraft
P.O. Box 12222
1100 AE AMSTERDAM ZUID-OOST
The Netherlands
Telephone : +31 20 6057301
Fax : +31 20 6057555
Telex : 11526 fmhs nl
Sita : amsfk7x

"END"

TRANSMITTAL LETTER 27-36-13

 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

HIGHLIGHTS FOR CMM 27-36-13

.UNIT TITLE : Power Module
PART NUMBERS: EAMBC8816-431 REVISION NUMBER : 001
REVISION DATE : MAY 01/96

This revision updates technical information.

The following list details the subjects affected by this revisions and the reason
for change:

SUBJECT PAGE REASON FOR CHANGE

List of Effective Pages 1 and 2 Shows the revised, deleted and new pages.
Introduction 3 Vendor code updated.
Testing and Fault Isolation 121/122 Figure 106: pin number on connector J14
changed.
127/128 Figure 108: value for resistor R507 changed
from 100R to 10R.
Disassembly, 301, The material number for Solder has been
Repair, 602, changed from Fk05-040 into Fk05-085.
Assembly and Storage 701 thru 708
Special Tools, Fixtures, 901 Part number for the grounded work station
Equipment and Materials changed to 8010-3M. Vendor codes updated.
902 No changes.
903 Material number for solder changed to
Fk05-085. Vendor codes updated.
Illustrated Parts List 1001 Vendor addresses relocated and updated.
thru 1003 Blank page introduced.

'END11

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HIGHLIGHTS 27-36-13 MAY 01/96
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R E C O R D OF REVISIONS

After insertion of a Revision in this manual fill in the table below by noting
down: Revision Number, Date of issue, Initials of person who inserted the
Revision and the Date of this Action.

Revision Date of Inserted By Date Revision Date of Inserted By Date

Number Issue Number Issue
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oc* O * /
/
IW.

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R E C O R D OF T E M P O R A R Y REVISIONS

After insertion of a Temporary Revision in this manual f i l l in the table below by

noting down: Temp. Revision Number, Date of Issue, Initials of the person who
Inserted the Revision and the Date of this Action. After removal of a Temporary
Revision from the manual complete table below by noting down the Initials of the
person who removed the Revision and the Date of this Action.

Temp. Date of Inserted By Date Removed By Date

Revision Issue
Number

RTR Page 1/2

27-36-13 OCT 01/93
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P/N EAMBC8816

S E R V I C E BULLETIN LIST

SERVICE BULLETIN REV. DATE SERVICE BULLETIN REV. DATE

NUMBER NO. INSERTED NUMBER NO. INSERTED

SBL Page 1/2

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M O D I F I C A T I O N HISTORY R E C O R D

UNIT TITLE: Power Module

BASIC PART NUMBER: EAMBC8816

ASSEMBLY MODIFICATION DESCRIPTION SERVICE

BULLETIN
431 Basic assembly.

"END"

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LIST OF EFFECTIVE PAGES

REVISION NUMBER : 001 N = NEW PAGE
R = REVISED PAGE
D = DELETED PAGE
PAGE DATE PAGE DATE
Title Page OCT 01/93 110 OCT 01/93
111 OCT 01/93
RR 1/2 OCT 01/93 112 OCT 01/93
113 OCT 01/93
RTR 1/2 OCT 01/93 114 OCT 01/93
115 OCT 01/93
SBL 1/2 OCT 01/93 116 OCT 01/93
117/118 OCT 01/93
MHR 1 OCT 01/93 119/120 OCT 01/93
121/122 MAY 01/96 R
LEP 1 MAY 01/96 R 123 OCT 01/93
LEP 2 MAY 01/96 R 124 OCT 01/93
LEP 3 D 125/126 OCT 01/93
127/128 MAY 01/96 R
TOC 1 OCT 01/93 129 OCT 01/93
TOC OCT 01/93 130 OCT 01/93
TOC OCT 01/93 131/132 OCT 01/93
133/134 OCT 01/93
LOF OCT 01/93 135/136 OCT 01/93
LOF OCT 01/93 137/138 OCT 01/93
139/140 OCT 01/93
LOT 1 OCT 01/93 141 OCT 01/93
142 OCT 01/93
INTRO 1 OCT 01/93 143 OCT 01/93
INTRO 2 OCT 01/93 144 OCT 01/93
INTRO 3 MAY 01/96 R 145 OCT 01/93
146 OCT 01/93
1 OCT 01/93 147 OCT 01/93
2 OCT 01/93 148 OCT 01/93
3/4 OCT 01/93 149 OCT 01/93
5 OCT 01/93 150 OCT 01/93
6 OCT 01/93 151 OCT 01/93
7/8 OCT 01/93 152 OCT 01/93
9 OCT 01/93 153 OCT 01/93
10 OCT 01/93
11 OCT 01/93 301 MAY 01/96 R
12 OCT 01/93 302 OCT 01/93
13 OCT 01/93 303 OCT 01/93
304 OCT 01/93
101 OCT 01/93 305 OCT 01/93
102 OCT 01/93 306 OCT 01/93
103/104 OCT 01/93
105 OCT 01/93 401 OCT 01/93
106 OCT 01/93
107 OCT 01/93 501 OCT 01/93
108 OCT 01/93 502 OCT 01/93
109 OCT 01/93

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PAGE DATE PAGE DATE

601 OCT 01/93

602 MAY 01/96 R
701 MAY 01/96 R
702 MAY 01/96 R
703 MAY 01/96 R
704 MAY 01/96 R
705 MAY 01/96 R
706 MAY 01/96 R
707 MAY 01/96 R
708 MAY 01/96 R
709 OCT 01/93
801 OCT 01/93
901 MAY 01/96 R
902 MAY 01/96 R
903 MAY 01/96 R
1001 MAY 01/96 R
1002 MAY 01/96 R
1003 MAY 01/96 R
1004 OCT 01/93
1005 OCT 01/93
1006 OCT 01/93
1007 OCT 01/93
1008 OCT 01/93
1009/1010 OCT 01/93
1011/1012 OCT 01/93
1013 OCT 01/93
1014 OCT 01/93
1015/1016 OCT 01/93
1017 OCT 01/93
1018 OCT 01/93
1019 OCT 01/93
1020 OCT 01/93
1021/1022 OCT 01/93
1023/1024 OCT 01/93
1025 OCT 01/93
1026 OCT 01/93
1027/1028 OCT 01/93
1029/1030 OCT 01/93
1031 OCT 01/93
1032 OCT 01/93

"END"

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TABLE OF CONTENTS

SUBJECT PAGE
DESCRIPTION AND OPERATION

1. General 1
2. Physical Description 1
3. Function 1
A. Normal Mode 1
B. Dispatch Mode 2
4. Operation 5
A. Operational Description Normal Mode 5
B. Operational Description D i s p a t c h Mode 6
C. C i r c u i t Description 9
5. Assembly Variants 13
TESTING AND FAULT ISOLATION

1. Introduction 101
2. Preliminary Checks 102
3. Special Tools and M a t e r i a l s 102
4. Test Procedures 102
A. Test Set-up Data 102
B. Test Procedure 106
C. Completion 115
5. Assembly Variant Test Procedures 115
6. Component Layouts, Interconnection Diagram, Schematic Diagrams 115
and Component Data
AUTOMATIC TEST R E Q U I R E M E N T S Not Applicable
DISASSEMBLY

1. Techniques and Precautions 301

2. Special Tools and M a t e r i a l s 301
3. Procedures 301
A. Removal of Component from M a i n Assembly 301
B. Removal of Components from PCB Assembly E 303
C. Removal of Components from PCB Assembly D 304
D. Removal of Components from PCB Assembly F 305
E. Removal of Components from Case Assembly 305
CLEANING

1. Precautions 401
2. Special Tools and M a t e r i a l s 401
3. Procedures 401
A. External Cleaning 401
B. Internal Cleaning 401

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SUBJECT PAGE
CHECK

1. Precautions 501
2. Special Tools, Fixtures and Equipment 501
3. Procedures 501
A. External Inspection 501
B. Internal Inspection 501
REPAIR
1. Techniques and Precautions 601
2. Special Tools and Materials 601
3. Procedures 601
A. Paintwork 601
B. Wired Contact Replacement 601
C. Soldered Connections 602
D. Printed C i r c u i t Boards 602
E. Inductors L1 thru L3 602
ASSEMBLY AND STORAGE

1. Techniques and Precautions 701

2. Special Tools and Materials 701
3. Procedures 701
A. Fitting of Components to Case Assembly 701
B. Fitting of Components to PCB Assembly F 703
C. Fitting of Components to PCB Assembly D 703
D. Fitting of Components to PCB Assembly E 704
E. Fitting of Components to M a i n Assembly 706
4. Storage 709
A. General 709
B. Preservation 709
C. Packing 709
D. Identification Labels 709
FITS AND C L E A R A N C E S

1. General 801
2. Torque Values 801
SPECIAL TOOLS, FIXTURES, EQUIPMENT AND MATERIALS

1. Introduction 901
2. Special Tools, Fixtures and Equipment 901
3. Materials 903

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x^^x
SUBJECT PAGE

ILLUSTRATED PARTS LIST

f. Introduction 100
A. Purpose 100
B. How to Use the IPL 100
2. Vendor Names and Addresses 100
3. Equipment Designator Index 100
4. Numerical Index 100
5. Detailed Parts Lists 101

"END"

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LIST OF FIGURES

FIGURE SUBJECT PAGE

1 Modulated Bungee Control Unit Block Diagram 3/4

2 Power Module Block Diagram 7/8

101 Testbox Front Panel - Type EGMBT9001 103/104

102 Test Set-up 105

103 Pulse W i d t h Modulator SYNC Waveform (TP-E5) 116
104 PCMDR-0 Waveform (TP-E7) 116
105 MOSFET Driver Waveform (TP-D1 and TP-D2) 117/118
106 Interconnection Diagram 121/122
107 Printed C i r c u i t Board Assembly D - Component Layout
(Sheet 1) 123
(Sheet 2) 124
108 Printed C i r c u i t Board Assembly D - Schematic Diagram
(Sheet 1) 127/128
109 Printed C i r c u i t Board Assembly E - Component Layout
(Sheet 1) 129
(Sheet 2) 130
110 Printed C i r c u i t Board Assembly E - Schematic Diagram
(Sheet 1) 133/134
(Sheet 2) 135/136
111 Printed C i r c u i t Board Assembly F - Component Layout 137/138
112 Printed C i r c u i t Board Assembly F - S c h e m a t i c Diagram 141

113 CR610 - 2,5 Vdc Reference Diode 142

114 K1 - Relay 142
115 K2 - Relay 143
116 K3 - Relay 143
117 Q501, Q503 thru Q507 and Q701 - N Channel Enhancement 144
Mode MOSFET
118 Q502 and Q601 - NPN Transistor 144

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 v^umruiMciM i IVIAAIIM i CIM/AIMV^C IVIMIMUML
(CTftkfelS') P/N EAMBC8816

FIGURE SUBJECT PAGE

119 Q602 - PNP Transistor 145
120 Q603 - N Channel Enhancement Mode MOSFET 145
121 Q604 - P Channel JFET 146
122 Q605 - N Channel JFET 146
123 U501 - Dual MOSFET D r i v e r 147
124 U502 and U503 - MOSFET D r i v e r A m p l i f i e r 147
125 U601, U603, U605 and U609 - Opto Isolator 148
126 U602 - Pulse W i d t h Modulator 149
127 U604 - Dual JK F l i p Flop 150
128 U606 - Opto Isolator 151
129 U607 - Quad 2-input AND Gate 151
130 U608 - Quad 2-input NAND S c h m i t t Trigger Gate 152
131 U610 - Dual Op-Amp 152
132 U611 - Comparator 153
133 VR601 - Adjustable Voltage Regulator 153
601 Details of Inductor L1 602
701 Mounting D e t a i l s for Resistors R501, R502, R509, 706
R514, R601 and R702

702 Details of Inductors 707

IPL 1 Power Module 1011/1012
IPL 2 Printed C i r c u i t Board Assembly E 1015/1016
IPL 3 Printed C i r c u i t Board Assembly D 1021/1022
IPL 4 Printed C i r c u i t Board assembly F 1026
IPL 5 Case Assembly 1029/1030

"END"

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 COMPONENT MAINTENANCE MANUAL
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LIST OF TABLES

TABLE SUBJECT PAGE

'101 Initial Testbox Settings 105

501 Inspection Procedures 501
801 Torque Values 801
901 Special Tools, F i x t u r e s and Equipment 901
902 Materials 903

"END"

LOTPa9e1
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 COMPONENT MAINTENANCE MANUAL
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INTRODUCTION
%

/ 1. General
This manual contains maintenance information and an illustrated parts list for
the Power Module prepared in accordance with ATA specification 100, revision
21. The information is presented in the following page-blocks:
Description and operation
Testing and fault isolation
Disassembly
Cleaning
Check
Repair
Assembly and storage
Fits and Clearances
Special tools, fixtures, equipment and materials
Illustrated parts list.
Disassembly, assembly, testing and fault isolation procedures have been
verified by the engineering department, Fokker BV. An automatic test
equipment (ATE) test procedure in the ATLAS specification is available on
request.
2. Associated Publications
CMM 27-36-01 for the Modulated Bungee Control Unit
) GEM 0092 for the Modulated Bungee Control Unit Test Box
Standard Manual
Consumable Material List
Commercial Process Manual
3. Approved Maintenance Policy
The information contained in this manual is designed to enable the user to
restore, to proper operating condition, equipment that has been removed from
service.
4- Glossary of Terms and Abbreviations
The non-standard abbreviations used in this manual are:
Abbreviation Term
ACT Actuator
ATLAS Abbreviated Test Language for All Systems
BRSD Bridge Shutdown
BR1DR Bridge One Driver
BR2DR Bridge Two Driver
BCO Bungee Control On
BFI " Box F a i l u r e Indication
CLK Clock
\ CMCI Current Measurement C i r c u i t Current

INTRO Page 1
OCT 01/93
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Abbreviation
CMCP Current Measurement Control Pulse
CMCT Current Measurement Control Trigger
CPM Commercial Process Manual
DISASSY Disassembly
DISP Dispatch
DP Dispatch Position
DPDR Dispatch Position Dr ive
DPER Dispatch Position Error
DPID Dispatch Position Current Drive
DPIS Dispatch Position Current Sensing
DPS Dispatch Position Supply
EFF. Effectivity
EN Enable
EXT Extend
FIT Fault
GFS Ground F l i g h t Supply
GLE Gustlock Engaged
H High
INOP Inoperative
IPL Illustrated Parts List
L Low
MBCU Modulated Bungee Control Unit
MD Maintenance Data
HMD Enter (on display menu)
Module Power Module
MON Monitor
NATO North Atlantic Treaty Organization
Op-Amp Operational Amp I ifier
PA Power A m p l i f i e r
PCTL Power Control
P/N Part Number
P-P Peak-to-Peak
PS Power Supply
PCMDR Power Current Measurement Drive
PSCS Power Stage Current Sensing
PSDR Power Stage Drive
PSODR Power Supply Output Drive
PWM Pulse W i d t h Modulator
RET Retract
RF Reference
SO Shut-off
Temp. Temporary
TI Select (on display menu)
TH Technical Handbook
UM Motor Voltage
UPA Power A m p l i f i e r Voltage
V Valid

INTRO Page 2
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5. List of Vendors
' The following vendor codes, names and addresses are applicable to the special
tools, fixtures and equipment detailed in page-block 901.
CODE VENDOR'S NAME AND ADDRESS
H0643 Fokker Aircraft BV, Bedrijf Schiphol
Postbus 7600, 1117 ZJ SCHIPHOL-OOST. The Netherlands
H1248 3M Nederland BV
Postbus 193, 2300 AD LEIDEN. The Netherlands
71468 ITT Corporation, ITT Cannon Division
666 East Dyer Road, SANTA ANA, CA 92702, USA

"END"

INTRO Pa
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 COMPONENT MAINTENANCE MANUAL
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5. List of Vendors
The following vendor codes, names and addresses are applicable to the special
tools, fixtures and equipment detailed in page-block 901.
VENDOR'S NAME AND ADDRESS

ITT Cannon Electric

Santa Ana Division
P.O. Box 666
SANTA ANA. CA 92702
U.S.A.

H0643 Fokker Aircraft BV

Bedrijf Schiphol
Postbus 7600
1117 ZJ SCHIPHOL-OOST
Nederland
H1248 3M Nederland BV
Postbus 193
2300 AD LEIDEN
Nederland

"END"

INTRO Page 3
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DESCRIPTION AND OPERATION

1. General
The Power Module is a module in the Modulated Bungee Control Unit (MBCU). The
Power Module contains the power converter and motor driver stages for
positioning the bungee actuator.
The standard assembly is described in paragraphs 1 thru 4. Any assembly
variants w i l l be described in paragraph 5.
2. Physical Description (Refer to IPL Figure 1)
The standard assembly consists of a case assembly, with sideplates, containing
three rigid multilayer PCB assemblies D, E and F. PCB assembly F is secured
to PCB assembly D using screws and spacers. Relays K1 thru K3 are secured to
the top plate of the case assembly. Filters FL1, FL2 and inductor L1 are
secured to a bracket mounted on the bottom plate of the case assembly.
Filters FL3 and FL4 are secured to the filter plate mounted on the front plate
of the case assembly. Inductors 12 and L3 are wired into the wiring loom.
The module connects to the rest of the MBCU via connectors J13, J14 and J15.
The module power requirement is 28 Vdc
The module dimensions are:
- Length 123,0 mm (4,84 inches)
- Width 52 mm (2,04 inches)
- Depth 109,4 mm (4,30 inches)
3. Function (Refer to Figure 1)
The module operates in the following modes.
A. Normal Mode
The module receives a PWM signal from the main controller w h i c h is used to
control the motor driver stage. The output voltage of the motor driver
stage is determined by the duty cycle of the PWM signal. The output
voltage (UM) of the motor driver stage is fed back to the main controller
to provide closed loop regulation of the EXT/RET outputs. When the PCTL
input to the power module is de-activated (loss of main controller +5V),
the PWM signal is inhibited.

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The power converter stage and the motor driver stage are enabled by the
main controller via the PS-EN and PA-EN inputs. The power converter stage
boosts the +28 VDC1 supply to +45 Vdc for use by the motor driver stage.
The +28 VDC1 supply is also fed to the main controller. The state of the
'power converter stage (PS-INOP) and the +45 Vdc (UPA) is monitored by the
main controller.
When there is full agreement between the main and monitor controllers the
ACT-EN-MON signal w i l l energize the shut-off relay in the motor drive
output circuit. The shut-off relay connects the motor driver stage to the
EXT/RET outputs. When the shut-off relay is de-energized the EXT/RET
outputs are connected for dispatch operation or to disable normal actuator
drive operation. The state of the shut-off relay (SO-MON) is monitored by
the main controller.
The output current of the motor drive stage, converted to a voltage CMCI,
is measured by the current measurement circuit. When the main controller
triggers this c i r c u i t with the CMCT signal, it samples the current level
and generates a pulse (CMCP) of a length proportional of the current in the
motor drive output.
B. Dispatch Mode
The dispatch mode can only be activated under the following conditions:
A primary fault is present (the shut-off relay is de-energized by the
ACT-EN-MON input)
The BCO-I2 input is active and the +28VGFS supply is present from the
main controller. These inputs disconnect the motor driver stage
output (UM) and connect the dispatch position output to the actuator
motor.
When the dispatch mode is activated by the DISP POS pushbutton switch (S1)
on the front of the MBCU +28VGFS supply is used to enable dispatch position
operation. The +28VGFS supply is derived from the +28 VDC1 via S1
(+28VDPS) and the main controller.
The dispatch position controller and display, via the main controller,
generates drive pulses (DPDR) and a direction signal (DPER) which are used,
in conjunction with the +28VDPS signal, by the power module to position the
actuator.
The dispatch position driver current signal DPIS is monitored, via the main
controller, by the dispatch position controller and display. In case of
over-current (more than 10 A), the DPDR output from the dispatch position
controller and display is disabled. During dispatch positioning the DPID
output signal is sent via the main controller to the dispatch position
controller and display and causes the DISP POS LED (DS201) to flash. (This
indicates that the dispatch facility is in use).
The +28VDPS output is fed back to the main controller to confirm that the
DISP POS pushbutton switch (S1) has been pressed.

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AFBL
AFBH
DEB
FTT

PWM
UM
MD
UPA
EXT-ACT-EN PA-EN
TF PS-EN
PCTL
RHI
CMCT
28VDC2 CMCP
+EXT/-RET
PS-INOP
PLA1/NPT1 COMMON
SO-MON POWER
MODULE -EXT/4RET
DPDR
PLA2/NPT2 DPER
DPIS
AP DPID
GLE 28VDC1
MAIN 28VDPS
lOGT CONTROLLER 28VGFS

BCD
DISPLAY DATA DO-06 28VDPS
DISPLAY ADDRESS/CONTROL
DFH AFBH-DP
AFBS-DP DISPATCH POSITION
DFL CONTROLLER AND I
AFBL-DP DISPLAY \
DPS DPID
DPIS
IASH DPDR
IASL DPER 28VDC1
S201
TJ
IASR BFI
S202
IASV HMD
28VDC2
AFBS +28VGFS

SERIAL DATALINK OUT

SERIAL DATALINK IN

MONITOR
CONTROLLER EXT-BFI

ACT-EN-MON

Modulated Bungee Control Unit Block Diagram

Figure 1

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4. Operation
A. Operational Description - Normal Mode (Refer to Figure 2)
The power module receives its +28 Vdc supply from the +28 VDC1 input. An
auxiliary 15 Vdc supply voltage, for powering the major part of the power
module control c i r c u i t r y , is derived from the power supply conditioner,
using the +28 VDC1 supply. A +28 VDC1 supply is also available for the
main controller.
To compensate for the voltage losses w h i c h occur over the interconnecting
cables between the MBCU and the actuator motor, the +28 V D C 1 input voltage
is boosted to a constant +45 Vdc voltage. The voltage conversion is
accomplished by the power converter stage. This stage is controlled by the
PWM controller, via the PSDR control signal. The PSCS signal is fed back
to the PWM controller to provide overcurrent protection. The PWM
controller generates a +5 Vdc supply for internal use only.
To l i m i t the inrush current and to provide an additional overall disable
of the power converter stage, the disable/softstart c i r c u i t is
incorporated. In conjunction w i t h the power converter stage, this circuit
also establishes a protection against excessive input current due to short
circuits and failures of the power section. The PS-INOP output from the
enable logic is used to inform the main controller of the power converter
state. S i m i l a r l y , the UPA output from the PWM controller, represents the
output voltage state of the power converter. Two enable control signals
(PS-EN and PA-EN) are applied to the enable logic via opto-isolators. The
enable logic monitors these enable control signals and the state of the PWM
controller (CLK). The enable logic produces a PSODR signal to enable power
converter operation, only if the correct start-up conditions are presented.
During normal operation the actuator motor is driven by the motor driver
stage via the motor d r i v e output c i r c u i t . The output voltage (UM) of the
motor driver stage is determined by the duty cycle of the incoming PWM
signal, in conjunction w i t h the PCTL control signal. (The PWM signal is
opto-isolated from the PWM pulse conditioner). The PWM pulse conditioner
converts the PWM signal into two complementary d r i v e r signals BR1DR and
BR2DR for the motor driver stage.
The motor d r i v e r stage is powered by the +45 Vdc voltage from the power
converter stage and is enabled by BRSD signal from the enable logic. The
final output voltage (UM) of the motor driver stage is fed back to the main
controller. This ensures a closed loop regulation of the actuator motor
drive output.
The enable logic provides a square wave clock signal (PCMDR) w h i c h is
buffered on the motor driver stage and used by the current measurement
power supply c i r c u i t . This c i r c u i t provides the +10 Vdc and -10 Vdc power
supplies for the current measurement c i r c u i t .

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The output current of the motor drive stage is measured across a small
series resistor in one of the output lines. The voltage is conditioned in
the current measurement c i r c u i t and is passed to the voltage to pulse
length converter. When the main controller triggers this c i r c u i t with the
CMCT signal, it samples the current measurement c i r c u i t output and
generates a pulse (CMCP) whose length is a measurement of the output
current.
The output (UM) of the motor driver stage is separated from the actuator
motor by means of a shut-off relay in the motor drive output circuit. The
shut-off relay is energized using the +28 VDC1 supply and the ACT-EN-MON
signal w h i c h is present when the system is on and not in the dispatch mode.
The motor driver stage in the module is then connected, via the shut-off
relay, to the actuator motor drive outputs (EXT/RET).
B. Operational Description - Dispatch Mode
When in dispatch mode, the dispatch position driver, under the control of
f18 DPD R signal, provides the output, via the de-energized shut-off relay
(the ACT-EN-MON input is high), to drive the actuator motor to the dispatch
position. The BCO-I2 input energizes the dispatch position enable relay
using the +28 VGFS supply. The motor drive stage output (UN) is
disconnected and the dispatch position driver output is connected to the
EXT/RET outputs.

The DPER signal activates the direction control relay using the +28VGFS
supply to d r i v e the actuator in the correct direction for the dispatch
position. The dispatch position driver c i r c u i t monitors the current drawn
by the actuator motor and outputs a current sensing signal (DPIS). The
DPID is used to indicate that the dispatch f a c i l i t y is in use.
The SO-MON output, derived from the relaxed contact of the shut-off relay
in the motor drive output c i r c u i t , indicates when the module is in dispatch
mode.
The +28 VDPS input supply is used to power the actuator motor during
dispatch mode, via the relays in the motor drive output c i r c u i t as
described earlier. A +28 VDPS output is also fed back to the main
controller to confirm that the dispatch position pushbutton switch S1 on
the front of the MBCU has been pressed.

27-36-13 OCT 01/93

 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816
28VDC1

*-28VDC1

UPA

PS-INOP

CURRENT
MEASUREMENT
POWER SUPPLY
CIRCUIT

MOTOR DRIVE
OUTPUT CIRCUIT EXT/-RET TO
ACTUATOR
^ -EXT/4RET MOTOR

ACT-EN-MON
BCO-I2
+28VGFS
+28VDPS *28VDPS

CMM-27-5305A

Power Module Block Diagram

Figure 2

Page 7/8
27-36-13 OCT 01/93
 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

C. C i r c u i t Description (Refer to Schematic and Interconnection Diagrams in

Page-block 101)
(1) Power Supply C i r c u i t (Refer to Figure 110, Sheet 1)
+28 VDC1 is fed to the linear voltage regulator VR601. It provides
the +15 Vdc auxiliary supply voltage for the control c i r c u i t s and the
MOSFET drivers located on PCB assembly D. Zener diode CR602 and
resistor R601 provide overvoltage protection. Capacitors C601 and
C629 are provided for smoothing of input and output voltages.
Resistors R602 and R603 set the voltage level of VR601 and capacitor
C602 eliminates h i g h frequency transients.
(2) Power Converter Stage and Disable/Softstart C i r c u i t (Refer to
Figure 108)
The +28 Vdc (+28 VDC1) to +45 Vdc (+45 V D C ) power converter stage is
formed by transformer T501, rectifying diodes CR503, CR504 and CR505,
output LC filter L502 with capacitor C506 and switching MOSFET Q503.
The switching frequency of the power converter stage is 100 kHz.
The gate of MOSFET Q503 is controlled by MOSFET driver U501-1 and
resistor R507, w i t h the 100 kHz PWM control signal (PSDR) derived from
the PWM controller circuit, located on PCB assembly E (refer to figure
110, sheet 1).
The source lead of Q503 is provided with a current sensing resistor
R509. The signal across resistor R509 (PSCS), w h i c h is an image of
the switching current through MOSFET Q503, is fed back to the PWM
controller c i r c u i t to provide overcurrent protection for MOSFET Q503.
Inductor L501 with capacitors C502 and C503, form an LC section for
smoothing out the input current pulses. The disable/softstart
circuit, based on MOSFET Q501, is connected in series with this LC
section. This c i r c u i t functions as an additional overall disable, an
inrush current l i m i t e r and provides a softstart capability for the
power converter stage, in conjunction with the control c i r c u i t s on PCB
assembly E.
Assume that prior to start-up and during the disable state, switching
MOSFET Q503 is off and the PSODR signal is floating (or open). This
means that MOSFET Q501 is off, allowing capacitors C502, C503 and C506
to become gradually charged up to the input voltage level via L501 and
bypass resistor R501.
At the moment the power converter is enabled, the PSODR is connected
to the converter output via a 1 mA current l i m i t i n g diode CR603 (refer
to figure 110, sheet 1). The output voltage increases further due to
the converter operation, switching MOSFET Q501 on. Transistor Q502
with resistor R502 is a current l i m i t i n g c i r c u i t for MOSFET Q501
during voltage surges at the input voltage. The series connection of
zener diode CR501 and diode CR502 provides further protection for
MOSFET Q501.

27-36-13 OCT 01/93

 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

(3) Motor Driver Stage (Refer to Figure 108)

The motor driver stage is composed of two similar output sections.
Each section consists of a MOSFET driver (U502/U503), two MOSFETs
(0504,8505/0506,0507) arranged in a half-bridge configuration,
followed by an LC output filter network (L503,C510/L504,C513) to
establish a net DC output voltage.
The MOSFET drivers U502 and U503, arranged in a complementary
configuration, are driven by pulse width modulated signals (BR1DR and
BR2DR) from the PWM pulse conditioner circuit on PCB assembly E (refer
to figure 110, sheet 2). The third control signal (BRSD) enables the
shutdown of the MOSFET drivers by the main controller. The frequency
of the pulse width modulated signal is 100 kHz.
To drive the high side output MOSFETs (0504, 0506), the drivers
utilize a charge pump principle. A 47 nF capacitor (C508,C511) is
charged up to approximately +15 Vdc during the time the low side
MOSFET (0505, 0507) conducts. The energy stored in this capacitor is
sufficient to turn on the other output MOSFET during the next
switching state. The gates of the output MOSFETs are provided with
diodes and resistors (CR507, CR508, R512, R513/CR514, CR515, R516,
R517) to ensure suitable switching speeds.
Diodes CR509 thru CR512 and CR516 thru CR519 prevent the intrinsic
source drain diodes of the output MOSFETs being subjected to back EMF
caused by the output inductors.
(4) PWM Controller (Refer to Figure 110, Sheet 1)
The power converter is based on PWM controller U602. Resistor R606
and capacitor C605 set the internal oscillator frequency at 200 kHz.
Because this oscillator frequency is used to alternately control the
two outputs of the device, the pulse frequency of the OUT B output is
100 kHz. (The other output is not used).
An internal error a m p l i f i e r ensures that the output remains at
+45 Vdc.
The feedback network (R608 thru R611 and C606 thru C608) ensures
stable regulation of the converter output voltage. The +5 Vdc
reference section of PWM controller U602, w h i c h is buffered by
transistor 0602 and resistor R612, is used for powering PCB assembly
E logic circuits.
The UPA signal, w h i c h is generated via resistor R629 and capacitor
C631 is monitored by the main controller to ensure that the power
converter stage has reached its full output voltage.

27-36-13 10
OCT 01/93
 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

(5) Enable Logic (Refer to Figure 110, Sheet 1)

The power converter and motor driver stage operation is enabled by the
main controller section via opto-isolator U601 (PS-EN) and U603
(PA-EN). The main controller is able to monitor the power converter
state by means of opto-isolator U605 (PS-INOP). CR603 is a 1 mA
current l i m i t i n g diode, already mentioned in the explanation of the
power converter stage. The effect of CR603 on the PSODR output, can
be disabled by MOSFET Q603 and diode CR604. The PSODR output controls
the MOSFET Q501 on PCB assembly D (refer to figure 108).
MOSFET Q603 is controlled by dual JK flip-flop U604. U604-1 divides
the 200 kHz oscillator frequency from the PWM controller U602 by two,
to establish a 100 kHz clock signal for U604-2. Flip-flop U604-2 is
only set (thereby enabling the converter stage start-up action) when
the power converter becomes enabled (PS-EN becomes active high) while
the motor driver stage is still disabled (PA-EN is inactive low). Any
other start-up sequence is ignored, leaving Q603 on, to disable any
further start-up action.
(6) PWM Pulse Conditioner (Refer to Figure 110, Sheet 2)
The interfacing and conditioning of the incoming motor drive signals
(PCTL and PWM), is via high-speed opto-isolator U606. The signal is
applied to the PWM pulse conditioner based on NAND gates U607 and
U608.
The outputs BR1DR and BR2DR are used to alternately switch on the high
and low side MOSFETs (Q504 thru Q507) of the motor driver stage. The
c i r c u i t formed by resistor R616 and capacitor C617 establishes a
defined dead time between both output pulse signals.
(7) Current Measurement C i r c u i t (Refer to Figure 110, Sheet 2)
The current measurement c i r c u i t is fed directly from resistor R514 in
one of the outputs of the motor driver stage.
The operation of the current measurement c i r c u i t is as follows. The
voltage drop across the current sensing resistor R514, situated on PCB
assembly D (refer to figure 108), is filtered by inductors L601, L602,
capacitor C618 and amplified by operational amplifier U610-1. A 2,5
Vdc voltage reference, provided by zener diode CR610 together with
resistor R617, is also applied to the amplifier circuit. The net
result at the output of the operational amplifier U610-1 is the
current signal, superimposed on a -2,5 Vdc offset level. The
effective range of this output signal is between —5 Vdc and 0 Vdc.
For the transfer of this CMCP signal to the main controller, the
c i r c u i t r y around comparator U611 is used.

27-36-13 OCT 01/93

 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

Assuming that the output of comparator U611 (pin 1 in this

configuration) is switched off, this means that JUGFET Q604 is
switched on and JUGFET Q605 is switched off. Capacitor C620 follows
the output signal of operational amplifier U610-1 via resistor R622.
At the moment the main controller wants a current sample, it w i l l
trigger the circuitry by activating opto-isolator U609. This switches
off Q604 and switches on Q605.
Consequently the threshold level at pin 3 of comparator U611 changes
from —10Vdc to the 2,5 Vdc reference level, so that the comparator
output switches on or becomes active, taking over the control of
JUGFETs Q604, Q605.
The current, via current l i m i t i n g diode CR619 (1 mA), charges up
capacitor C620 via diode CR618. When the voltage at the point just
above capacitor C620 crosses the 2,5 Vdc reference level, the output
of comparator U611 switches off again. From the elapsed time, the
main controller is able to calculate the actuator load current.
(8) Current Measurement Power Supply C i r c u i t (Refer to Figure 110,
Sheet 2)
The current measurement c i r c u i t is powered by floating + 10 Vdc and -
10 Vdc supplies, obtained from the current measurement power supply
circuit. This floating power source is accomplished by transformer
T601, w h i c h is AC coupled to a 100 kHz square wave signal. The 100
kHz square wave is available from flip-flop U604-1 (refer to figure
110, sheet 1) via MOSFET driver U501-2 on PCB assembly D (refer to
figure 108).
The signal from transformer T601 is rectified by diodes CR606 thru
CR609 and smoothed by resistors R614, R615 and capacitors C615, C616
to produce +10 Vdc and -10 Vdc.
(9) Dispatch Position Driver (Refer to Figure 112)
When the dispatch position facility is enabled, the DPDR signal is
applied to the gate of power MOSFET Q701, via resistor R703, switching
it on when a pulse is present. Every time MOSFET Q701 is on, a
current path is then established for the +28 VDPS supply through the
actuator motor, Q701, R702 to +28 V RET.
Diode CR701 and zener diode CR702 protect MOSFET Q701 against voltage
spikes, induced by the inductive motor load. The source of MOSFET
Q701 is provided w i t h current sensing resistor R702 to establish
overcurrent protection via the DPIS output. This output is fed to the
dispatch position controller and display module, to disable the DPDR
signal.
Diodes CR703 thru CR705 are used for spike suppression of the relay
coils.

12
27-36-13 OCT 01/93
 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

(10) Motor Drive Output C i r c u i t (Refer to Figures 106 and 112)

In the normal mode, shut-off relay K1 is energized, connecting the
motor driver stage via the EXT/RET outputs to the actuator motor. The
relay coil of K1 is energized by the +28 VDC1 supply when the
ACT-EN-MON signal is activated (at F6 on PCB assembly F). Relay K1,
contact sets A and B, now complete the current path from the motor
driver stage on PCB assembly D (D3 and D4), through to the EXT/RET
outputs to drive the actuator. The return path is through either
diode CR11 or diode CR12 to ground depending on the driver output
signal polarity (extend or retract). At the same time the relay K1,
contact set C, provides a ground signal to the main controller, via
the SO-MON output (F10 and F11 on PCB assembly F). Filters FL3 and
FL4 are incorporated on the two motor driver stage outputs.
In dispatch mode the shut-off relay is de-energized when the
ACT-EN-MON signal goes high. The dispatch position enable relay K2 is
now energized by the +28 VGFS supply when the BCO-I2 signal is
activated (at F8 on PCB assembly F). Relay K2, contact set A, now
completes a current path for the +28 VDPS supply, through the K3 relay
contacts and the relaxed K1 contacts, to drive the actuator. The
dispatch position direction control relay K3, contact sets A and B,
control the direction of drive of the actuator motor, depending on the
DPER signal present at F9 on PCB assembly F. This drive direction
signal is used together with the +28 VGFS supply (present at F7) to
energize or de-energize K3. In this may the required drive direction
of the actuator motor is achieved.
The +28 VDC1 supply and +28 VRET1 outputs incorporate filters FL1 and
FL2 respectively and an additional inductor L1 is included on both
outputs. A +28 VDPS supply is also available for the main controller.
5. Assembly Variants
Not applicable.

"END"

27-36-13 Page 13
OCT 01/93
 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816
X_X
TESTING AND FAULT ISOLATION

Introduction
The test procedures enable a fault to be traced to component level. Before
the module is returned to service or storage, after repair or disassembly it
must be subjected to the applicable overall test procedure detailed in
CMM 27-36-01.
The test procedure given in paragraph 4 is for the standard assembly. The
test procedures for any assembly variants w i l l be given in paragraph 5.
Before proceeding w i t h any c i r c u i t test, check the assembly number of the
module to be tested and then refer to the relevant assembly variant test
procedure.
Each procedure tests a particular function of the module. If the normal
result of a test is not obtained refer to the probable fault column w h i c h is
provided as an aid to fault isolation. Once the fault has been isolated, the
suspect component can be repaired or replaced, for details refer to page-block
601.
CAUTION: THIS UNIT CONTAINS ELECTROSTATIC DISCHARGE SENSITIVE (ESDS)
COMPONENTS WHICH ARE HIGHLY SUSCEPTIBLE TO DAMAGE FROM ELECTRIC
FIELDS EMANATING FROM C H A R G E D OBJECTS AND FROM DIRECT STATIC
DISCHARGE. ELECTROSTATIC CHARGES ARE GENERATED BY THE MOVEMENT OF
DISSIMILAR MATERIALS AGAINST OR NEAR ONE ANOTHER. THE MAIN SOURCE
OF ELECTROSTATIC CHARGES WHICH MUST BE CONTROLLED IS THE HUMAN
BODY. IN ORDER TO PROTECT ESDS COMPONENTS THE FOLLOWING
PRECAUTIONS MUST BE OBSERVED:

- ESDS COMPONENTS AND ASSEMBLIES MUST BE R E M O V E D FROM THEIR

PROTECTIVE PACKAGING ONLY AT AN APPROVED ELECTROSTATIC
CONTROLLED OR GROUNDED WORK STATION BY TRAINED PERSONNEL (REFER
TO CPM-TH 6.4602).
- C A R E MUST BE TAKEN WHEN HANDLING ESDS COMPONENTS. DO NOT TOUCH
CONNECTOR CONTACTS.

- ELECTROSTATIC GENERATING MATERIALS SUCH AS POLYTHENE AND MASKING

TAPE MUST NOT BE PLACED ON THE GROUNDED WORK SURFACE.

- ESDS COMPONENTS AND ASSEMBLIES MUST NOT BE R E M O V E D FROM THEIR

PROTECTIVE PACKAGING UNLESS REQUIRED FOR TEST OR REPAIR
PURPOSES.

- WHEN REMOVING OR PACKAGING ESDS COMPONENTS AND ASSEMBLIES, THE

PROTECTIVE PACKAGING MUST BE IN CONTACT WITH THE GROUNDED WORK
SURFACE.

- ALL ELECTRONIC AND E L E C T R I C A L TEST EQUIPMENT MUST BE

E L E C T R I C A L L Y ISOLATED FROM THE GROUNDED WORK SURFACE. ONLY USE
SOLDERING EQUIPMENT AND TOOLS WHICH ARE APPROVED FOR USE AT A
G R O U N D E D WORK STATION.

P39e101
27-36-13 OCT 01/93
 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

- B E F O R E CONNECTING OR DISCONNECTING POWER SUPPLIES THE SUPPLY

VOLTAGE MUST BE SWITCHED O F F . SIGNAL VOLTAGES SHOULD ALWAYS BE
D I S C O N N E C T E D B E F O R E THE POWER SUPPLY IS SWITCHED O F F .

- ESDS COMPONENTS AND ASSEMBLIES MUST BE REPLACED IN THEIR

PROTECTIVE PACKAGING WHEN NOT REQUIRED FOR USE.

- ANTI-STATIC DUST CAPS SHOULD BE FITTED TO ALL EXTERNAL

CONNECTORS AND R E M O V E D ONLY FOR TEST AND REPAIR PURPOSES.

NOTE: If possible, the area used to handle ESDS components should be in a

relative h u m i d i t y range of 40% thru 60%.
2. P r e l i m i n a r y Checks
Before starting the test procedure, clean and examine the module for physical
damage, for details refer to page-blocks 401 and 501.
3. Special Tools and Materials
The special tools and materials are listed in page-block 901. Ensure that all
test equipment is switched off and disconnected after use.
4. Test Procedures
NOTE: Unless otherwise specified all indicators, potentiometers, switches,
terminals and connectors are located on the testbox (refer to figure
101). All test points are located on the module PCS assemblies D and
E (refer to figures 107 thru 112). Remove conformal coating from the
test points to make good e l e c t r i c a l contact.
NOTE: Tests 1 thru 24 are only v a l i d for a power module w i t h the side plates
removed and PCB assembly E loosened and bent backwards. The
subsequent steps must be performed w i t h PCB assembly E fitted.
NOTE: During all tests Logic 0 = 0 Vdc thru 0,4 Vdc
Logic 1 = 3,5 Vdc thru 5 Vdc
A. Test Set-Up Data (Refer to Figure 102)
(1) Remove the sideplates from the module and loosen PCB assembly E (refer
to page-block 301 for relevant disassembly instructions). Bend PCB
assembly E back to gain access to components and test points.
(2) Connect a +28 Vdc (10 A) power supply to J3(+), and J4(-) and J5(-).
(3) Connect an ammeter (DC, range 0 thru 5 A) between J3( + ) and J2(-).
Set the testbox switches to the positions shown in table 101. Connect
the module under test to the testbox using cable assembly
27.1-4794-40.

27-36-13 102
OCT 01/93
COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

S44 DS10 POSITION DS5 S21 DS4 S20 DS3 S19

nOPEN S34 DS8 ACTUATOR NO aT
ON
ft OPCN
GND 2.5"- SHORTED
OFF
PS-INOP ACT-EN OFF
S42 S43 - FAULT . -DEB- BCO
2.0"- - 20-
L— BFl DPER -1
J37 J38 S26 S15 S17 J25 J26
J44 J45 - 30' 1^1 *M
1.5"-
GND 6NO ©
SO-MON EXT-FLT
©
S40 S41 1.0-
INP-H1 INP-LO
MON SELECT INTER UUT
————— RUNAWAY 1
Hl L "— SPARE • "AHRU—
R5 °
- 50'
J34 J35 J36 S18 J23 J24 J13 J6
GND GND OPEN/ AM
SELECT ENTER f^l J^l l^H
© © © ©
GND ^rf
S39 DS9 •I-EXT COMMON -EXT IN OUT
RLOAD S33 ————— EXT ACT ————— >- SPARE -1 GlpTLOCK MAINT DATA • ADC CASE
OPEN J31 J32 J33 S13 f!4 S9 J2 J3
J21 J22
,vA^
1^1 ^M ARINC AM AM
•I-28V 429
+28VGFS GND © © © © ©
DP1S
L- BCO-12 • >oH w>r GND GND ANALOG W>< VV>T
HI WIPER LO 4- DC1 •f DC2
J49 J50 S32 DS7 J43 EXT SENSOR EEC AIU
AM AM
S23 S24 S25 J18 U19 J20 J11 J12 J4 J5
© © J10
HH IHH AM A^ AM AM AM AM
loH vw
HI LO DPER
GND
SO-MON 28VDPS © I© © © © © © ©

S37 S38 S29 S30 S31 INT INT INT KH lv>r vw Vv- vw VV^T
nENBL HI WIPER LO HI IPER
3
LO REF SIGN LO - RET - RET
FLl EXT IAS ANALOG EXT — 28VDC
J28 J29 J30 S10 SI 2 S6 S7 S8 S4 S3
GND GND DPDR
OFF DSBL
ACT-EN
OPEN
28VDPS
^A-v J^ /-M 0.2

——— UM ——— © © © A 4 ^^

J48 S27 S28 DS6

VW INT I INT INT INT INT INT 1
"lENBL HI WIPER LO HI §PER LO REF SIGN LO TRIGGER
AM ———— SENSOR POWER INT ——
© J8 J9
J27 S22 J15 |I16 J17 J7 DS1 DS2
Vv^ DSBL DSBL j~j SNSR R3 A A^ ^M AM
GND PS-EN PA-EN PS-INOP
© ^ ^M EXT ACT © © © ©
INT ACT V^
J46 J47 J41 J4-2
REF SIGN
iPERR2 LO D. LO H-28VDC1 +28VDC2
^© ^
©
AM
©
HH
© R4
GND
R3 Ki
SI S2

Hi LO HI LO
—— UPA ———
J14 S5 .ON
l
OFF
4" OFF

S35 S36 J39 J40 POWER

^AA ^H
10PCT 90PCT
GND IAS-VAUD
MODULATED BUNGiE CONTROL
© © UNIT TESTBOX
loH W^ TYPE E0MBT0001
GND GND HI LO t> o
UP A CMCP PWM INT IAS ANALOG INT
PART NO 27.1-4794

CMM-27-5320A
Testbox Front Panel - Type E6MBT9001
Figure 101

Page 103/104
27-36-13 OCT 01/93
 COMPONENT MAINTENANCE MANUAL
P/N EAHBC8816

SWITCH POSITION SWITCH POSITION

R4 (PWM) CENTRAL S30 (ACT-EN) DSBL (down)
S1 (28 V D C 1 ) OFF (down) S31 (28VDPS) OPEN (down)
S22 EXT ACTdnid S32 (DPER) OPEN (up)
position)
S27 (PS-EN) DSBL (down) S33 (BCO-I2) OPEN (up)
S28 (PA-EN) DSBL (down)
S29 (DPDR) OFF (down)

I n i t i a l Testbox Settings
Table 101

-O J3
DMM DC SUPPLY TEST BOX
J4
J5

J51
OSCILLOSCOPE
P1

CABLE
ASSEMBLY

PULSE-LENGTH
METER
I P3 I [

, ,
AMMETER | J14 | | J13 |

POWER MODULE
I

Test Set-up
Figure 102

Page 105
27-36-13 OCT 01/93
 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

B. Test Procedure

Test Procedure Normal Result Probable Fault

No. ' If Abnormal Result

1 Select S1 to ON (up), Current flow Wiring/short

Less than 300 mA, c i r c u i t on PCB D or
DS1 and DS6 E. Utilize test
come on 2 to isolate
the affected supply
voltage.
NOTE; Test 2 to be performed only if test 1 fails.
2 Use the DMM to measure
the voltage between
the following pairs of
testpoints:
TP-E2C+) and TP60K-) Greater than 28 VDC1 input supply
+17 Vdc
TP-E3(+) and TP60K-) +15 Vdc +15 Vdc supply
TP-E4C+) and TP60K-) + 5 Vdc +5 Vdc supply
Use the DMM to measure +1,3 + 0,4 Vdc Considerably less
the voltage between than 0,9 Vdc -
TP-EK + ) and TP-E2C-). CR601, R601
Less than 0,9 Vdc,
do test 4.
Greater than
+2,7 Vdc, do tests
4 and 5
NOTE: Test 4 to be performed only if test 3 fails.
4 Use the DMM to measure +15 + 0,5 Vdc VR601, R602, R603
the voltage between
TP-E3( + ) and TP60K-).
NOTE: Test 5 to be performed only if test 3 fails.
5 Use the DMM to measure +5 ± 0,1 Vdc U602, Q602, R612
the voltage between
TP-E4C + ) and TP60K-K

Use the DMM to measure

the voltage between
the following pairs of
testpoints:
TP-E3( + ) and TP60K-) +15 + 0,5 Vdc VR601, R602, R603
TP-E4C + ) and TP60K-) +5 + 0,1 Vdc U602, Q602, R612

Page 106
27-36-13 OCT 01/93
 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

Test Procedure Normal Result Probable Fault

No. If Abnormal Result

Connect the oscilloscope

between the following
pairs of testpoints.
Check the oscilloscope
display.
TP-E5C+) and TP60K-) Waveform as shown U602, R605, R606,
in figure 103 C605, U604
TP-E6C+) and TP60K-) Symmetrical U604, U501
square wave -
periodic time
10 ± 1,5 jus
TP-E7C+) and TP60K-) 13 ± 1 Vp-p U501, C614, T601,
amplitude CR606 thru CR609,
waveform as shown C615, C616
in figure 104 or current
measurement
c i r c u i t around
U610/U611
Use the DMM to measure
the voltage between the
following pairs of
testpoints:
TP-E8C+) and TP602(-) +11 ± 1 Vdc T601, CR607, CR609,
R614, C615
TP-E9(+) and TP602(-) -11 + 1 Vdc T601, CR606, CR608,
R615, C616
Connect the oscilloscope 15 V pulses of Pulse signal
between J40C-) and J39C+), pulse w i d t h incorrect - do tests
5 ± 1,2 ms. 10 thru 13
Repetition rate Pulse signal correct
approx. 20 ms but pulse width
incorrect - CR618,
CR619, R622, C620
NOTE; Do tests 10 thru 13 only if test 9 fails.
10 Connect the oscilloscope Approx. -2,5 Vdc CR610, R617, U610,
between pin 1 of U610C+) and R618, R620, CR611,
TP602C-). Check the voltage CR612
level displayed on the
oscilloscope.

Page 107
27-36-13 OCT 01/93
 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

Test Procedure Normal Result Probable Fault

No. If Abnormal Result

11 Connect the oscilloscope 20 ms pulses - U609, CR613, Q604

between CR613 cathode ( + ) approx. 10 V peak
and TP602C-). Check the level
oscilloscope display.
12 Connect the oscilloscope Pulse signal Q605, U610, U611,
between U611 pin 3( + ) and altering CR615, CR617
TP602(-). Check the between -10 V and
oscilloscope display. + 2,5 V
13 Connect the oscilloscope Pulse signal U611, Q604, CR614,
between CR614 anode (+) and altering CR618, CR619, C620,
TP602 (-). Check the between -10 V and R626, R627
oscilloscope display. + 10 V
14 Connect the oscilloscope Complementary 5 \ U606 thru U608,
Trace A between TP-E10(+) pulse signals. R616, C617
and TP60K-), Trace B Gaps (i.e where
between TP-E1K + ) and both signals are
TP60K-). Check the low) between
oscilloscope display. pulses on both
traces are
between 300 and
600 ns
15 Use the DMM to measure 27 ± 1,5 Vdc Less than
the voltage between J4K + ) 25,2 Vdc -
and J42C-). Note the result, wiring, short
but leave the DMM s t i l l c i r c u i t to GND in
connected. +45 Vdc converter
stage, CR503 thru
CR505, CR509 thru
CR512, CR516 thru
CR519
More than 28,5 Vdc
- U601, R604, Q601.

Page 108
27-36-13 OCT 01/93
 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

Test Procedure Normal Result Probable Fault

No. If Abnormal Result

NOTE; To trace a short c i r c u i t in the +45 Vdc path, it is recommended to

temporarily remove one or more of the following diodes, to determine in
w h i c h section the short c i r c u i t exists:
CR503 thru CR505, CR509 thru CR512, CR516 thru CR519

16 Select S27 to ENBL (up) DS6 (PS-INOP) When the DMM reading
(DMM s t i l l connected goes off DMM reading is not w i t h i n
between J41 and J42). +45 Vdc + 2 Vdc tolerance and
lamp DS6 if off:
R607, R611, C606
thru C608, U602
When the DMM reading
is considerably more
than the value noted
in test 15 but DS6
is on:
Q603, CR603 thru
CR605, U605
When the DMM reading
is less than or
equal to the value
noted in test 15,
do tests
17 thru 19
NOTE; Tests 17 thru 19 to be performed only if the DMM reading noted in test 16
is less than or equal to the value noted in test 15.
17 Connect the oscilloscope 100 kHz 15 V U602, U601, Q601
between U602 pin 16(+) and pulse
TP602C-). Check the
oscilloscope display.
18 Connect the oscilloscope 100 kHz 15 V U501, Q503
between Q503 pin 3( + ) and pulse
TP602C-). Check the
oscilloscope display.
19 Connect the oscilloscope 100 kHz pulse Q503, T501, CR503
between Q503 pin 2(+) and
TP602(-). Check the
oscilloscope display.

Page 109
27-36-13 OCT 01/93
 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

Test Procedure Normal Result Probable Fault

No. If Abnormal Result

20 Select S27 to DSBL (down) DS6 (PS-INOP) U601, Q601, U604,

comes on. DMM U605, Q603
voltage as noted
in test 15
21 Select S28 to ENBL (up) DS6 remains on U603, U604
then select S27 to ENBL (up),
22 Select S27 and S28 to DSBL. DS6 goes off -
(down). Select S27 to DMM indicates
ENBL (up). Note DMM reading, +45 + 2 Vdc
23 Select S28 to ENBL (up). DS6 remains off. CR506 thru CR519,
DMM indicates U502, U503, H-bridge
reading noted in sections Q504/Q505
test 22 or Q506/Q507
NOTE: To isolate faulty sections, diodes CR509 and CR510 can be removed
(isolates Q504/Q505) or CR516/CR517 (isolates Q506 and Q507).
24 Disconnect the DMM from
the testbox and
the oscilloscope from the
module.
25 Select S1 to OFF (down).
26 Disconnect the module from
the cable assembly
27.1-4794-40.
Assemble PCS assembly E
in position w i t h i n the
module (refer to
page-block 701 for
relevant assembly
instructions).
27 Reconnect the module to the
cable assembly 27.1-4794-40.
28 Select S1 to ON (up), S27 DS6, DS7 both ON W i r i n g , K1
and S28 to DSBL (down).
29 Select S27 to ENBL (up). DS6 goes OFF Wiring, K1
30 Select S28 to ENBL (up). DS6 stays OFF W i r i n g , K1

Page 110
27-36-13 OCT 01/93
 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

Test Procedure Normal Result Probable Fault

No. If Abnormal Result

31 Select S30 to ENBL (up). DS7 goes off W i r i n g , K1

32 Use the DMM to measure Between +34 Vdc No output voltage
the voltage between J34C+) and +40 Vdc at - W i r i n g , K1.
and J36C-). Rotate R4 10 PCT to between Output voltage not
(PWM) clockwise from -34 Vdc and -40 Vdc w i t h i n specified
10 PCT to 90 PCT. at 90 PCT. Both range - perform
voltage ranges tests 33 and 34
inclusive
NOTE: Tests 33 and 34 to be performed only if test 32 fails.
33 Use the DMM to measure Voltage ranges Wiring, Q504,
the voltage between J36C+) from approx. 40 Vdc Q505, CR506 thru
and J4(-). Rotate R4 to 5 Vdc CR512, R511 thru
counter-clockwise from R513, U502, L503,
90 to 10 PCT. C510
34 Use the DMM to measure Voltage ranging W i r i n g Q506, Q507
the voltage between J34(+) from approx. 5 Vdc CR513 thru CR519,
and J4(-). Rotate R4 to 40 Vdc R515 thru R517,
clockwise from 10 to 90 PCT, U503, L504, C513

35 Use the DMM to measure

the voltage between
J34(+) and J36C-).
Rotate R4 until the DMM
reads 0 + 0,5 Vdc.
Leave the DMM connected.
Connect the oscilloscope
between the following
pairs of testpoints:
TP-DK + ) and TP50K-) As shown in Q506, Q507, CR513
figure 105 thru CR519, R515
thru R517, U503,
L504, C513
TP-D2C + ) and TP50K-) As shown in Q504, Q505, CR506
figure 105 thru CR512, R511
thru R513, U502,
L503, C510

Page 111
27-36-13 OCT 01/93
 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

Test Procedure Normal Result Probable Fault

No. If Abnormal Result

36 Select S30 (ACT-EN) to

DSBL (down). Connect a
10 Ohm resistive load
(PD =100 W) in series
w i t h an ammeter
(0 thru 5 Adc range) to
J34(+) J36(-)
(The DMM remains connected).
37 Connect a pulse-length Pulse-length is
meter between J39(+) 5,000 ± 1,200 ms
and J40(-) and adjust it
in such a way that a
reliable measurement is
obtained of the 15 V/5 ms
current pulses (see also
test 9). Check the
oscilloscope display.
38 Select switch S30 (ACT-EN)
to ENBL (up) and rotate R4
clockwise until the current
indicated by the ammeter is
-2,5 ± 0,05 Adc. Record
the pulse-length meter
indication at this time (TmD.
39 Select s w i t c h S30 (ACT-EN) to
DSBL (down) and record the
measured pulse-length (TcalD
indicated on the pulse-length
meter.
Calculate the value of:
111 1/124 ± 0,008. W i r i n g , R514,
TcaU L601, L602, R619,
C618

112
OCT 01/93
 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

Test Procedure Normal Result Probable Fault

No. If Abnormal Result

40 Rotate R4 approx. to its

center position and select
switch S30 (ACT-EN) to
ENBL (up).

41 Rotate R4 counterwise until

the current indicated by the
ammeter is + 2,5 ± 0,05 Adc
and record the pulse-length
meter indication at this
time (Tm2).
42 Select switch S30 (ACT-EN) to
DSBL (down) again and record
the measured pulse-length
(Tcal2) indicated on the
pulse-length meter.
Calculate the value of:
111 0,876 ± 0,008 L601, L602, C618
Tcal2
43 Select switch S30 (ACT-EN) to
ENBL (up) and rotate R4 to
obtain an ammeter reading
of approx. 1 Adc.
44 Lower the 28 Vdc power supply 1 8 + 2 Vdc T501, CR503
voltage gradually and check
the current on the ammeter
in series w i t h the supply
voltage. Determine the
supply voltage where the
current shows a m a x i m u m
of approx. 1 ± 0,2 Adc.

Page 113
27-36-13 OCT 01/93
 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

Test Procedure Normal Result Probable Fault

No. If Abnormal Result

45 Readjust the power supply

voltage to 28 ± 0,5 Vdc
and select switch S30 (ACT-EN)
to DSBL (down). Remove the
load resistor from terminals
J34 and J36 (the DMM stays
connected).
46 Select switch S30 to ENBL (up)
and rotate R4 until approx.
0 Vdc is obtained on the DMM.
47 Select S22 to INT ACT (down). Pointer moves up CR11
Rotate R4 counter-clockwise to the fully
to 10 PCT. Monitor the extended
actuator position indicator. position
48 Rotate R4 clockwise to 90 PCT. Pointer moves CR12
Monitor the actuator down to the fully
position indicator. retracted position
49 Rotate R4 counter-clockwise Pointer in Pointer does not
and position the pointer in m i d d l e of the come out of the
the m i d d l e of the scale scale fully retracted
(between V'and 1.5"). position: CR11
Select S27, S28 and S30
to DSBL (down).
50 Select S31 to +28 V (up). Pointer does not Wi r ing
move
51 Select S33 to GND (down), Pointer does not Wiring, Q701,
move CR702
52 Select S29 (DPDR) ON (up), Actuator pointer W i r i n g , Q701,
moving down - DMM R702 thru R704,
reading K2, CR704
+28 V ± 1 Vdc
53 Select S29 to OFF (down), Actuator pointer Wir ing,
S32 to GND (down) S29 to moving up - DMM K3, CR705
On (up) again. reading
+28 + 1 Vdc

27-36-13 Page 114

OCT 01/93
 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

Test Procedure Normal Result Probable Fault

No. If Abnormal Result

54 Select S1 to OFF (down). Less than 0,1 Ohm W i r i n g , K1,

Disconnect the module under K2, K3
test from the test cable
assembly. Use the DMM to
measure the resistance
between J14 pins 1(+)
and 3(-).
55 Use the DMM to measure the 4,7 kOhm ± 2% W i r i n g , R701
resistance between J14 pins
1(+) and 4(-).
56 Do the completion procedure
detailed in paragraph 4C.

C. Completion
(1) Switch off the +28 Vdc supply.
(2) Disconnect any test equipment from the testbox and UUT.
(3) Disconnect the UUT from the testbox.
(4) Loosen PCB assembly E (refer to page-block 301 for relevant
disassembly instructions). Bend PCB assembly E back to gain access to
components and test points.
(5) Replace the conformal coating around testpoints and other components
w h i c h have had conformal coating removed. Use masking tape
(CML-Fk01-115) to protect areas of the module w h i c h do not require
conformal coating.
(6) Assemble PCB assembly E in position w i t h i n the module then fit the
side plates (refer to page-block 701 for relevant assembly
instructions).
Assembly Variant Test Procedures
Not applicable.
Component Layouts, Interconnection D i a g r a m , Schematic Diagrams and Component
Data
The component layout gives the location of all electrical and electronic
components and test points on the module. The interconnection diagram gives
the PCB interconnections and other wired connections of the module.
The schematic diagrams give the connections for all the electrical and
electronic components contained in the PCB assemblies of the module and are
provided for trouble-shooting purposes. Pin layout views for connection
locations and internal functional diagrams for some electrical and electronic
components are given to support the s c h e m a t i c diagrams, where necessary.

Page 115
27-36-13 OCT 01/93
COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

r
]

X
a ^
e O-J
> O
-4- •fl
O

— — — ."
0.5us±0.1us
5us± 0.75us

CMM-27-5291

Pulse W i d t h Modulator SYNC Waveform (TP-E5)

Figure 103

>
ZERO LEVEL ^
O
rn

10us± 1.5us

CMM-27-5292

PCMDR-0 Waveform (TP-E7)

F i g u r e 104

Page 116
27-36-13 OCT 01/93
COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

ZERO LEVEL

10us± 1.5us

CMM-27-5293

MOSFET D r i v e r Waveform (TP-D1 and TP-D2)

F igure 105

Page 117/118
27-36-13 OCT 01/93
 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

REVISION REVISION DESCRIPTION SERIAL NO.

CODE EFFECTIVITY

Revision Reference Sheet for Figure 106

Page 119/120
27-36-13 OCT 01/93
 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

.ll/.

»?8VDCI S 2 x-^x-N^-v 1
-O D1

J12 P11 J13

LI
+28VRET1 -O D2

MOTOR DRIVE OUTPUT CIRCUIT PCB ASSEMBLY E

PCB ASSEMBLY D

2 —
-O D3

2 —
-O D4

A3
B3 A2 -O F3 P10 J10
K3
4EXT/-RET
CR12 A1
B1 -O F2
COMMON 2 B3
CR11 A3 B2
A2 K3
-EXT/.RET 3 K1
B1 A3
IA1
A1 PCB ASSEMBLY F
J15
+28VDPS -O F1
-O F10

K1 -O F11

-O F8

K2
-O F7
*X1 P9 J9
K3
-X2
-O F9
-O F5

K1
-X2
-O F6

Interconnection Diagram
Figure 106

Page 121/122
27-36-13 MAY 01/96
COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

TP D2

TP D1
STATIC SENSITIVE COMPONENTS (ESDS)
HANDLE ONLY AT STATIC SAFE
WORKSTATION

CMM-27-5266A

Printed C i r c u i t Board Assembly D - Component Layout

Figure 107 (Sheet 1)

Page 123
27-36-13 OCT 01/93
 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

CR509

CR505

CR516

CR503

I II CR514

R508

CMM-27-5267A

Printed C i r c u i t Board Assembly D - Component Layout

F i g u r e 107 (Sheet 2)

Page 124
27-36-13 OCT 01/93
t .——V V^UIVirVJIML-IM 1 WIMIIM 1 l_IM/-MM^I_ IVIMIMUML

\?V$^y P/N EAHBC8816

REVISION REVISION DESCRIPTION S E R I A L NO.

CODE EFFECTIVITY

Revision Reference Sheet for Figure 108

Page 125/126
27-36-13 OCT 01/93
 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816
^.^

POWER CONVERTER STAGE

«28VPC1 PSODR

*28VDC1 CR501
IN/,979
75V A CR503
15k ^ 330n 1N5811

CR502
1N5552-J-

28VRET1
28VRET1 + DISABLE/SOFTSTART
CIRCUIT

CR509 .. CR510

U501-1
6 TSC427 WM250
R507

R508
/
\AA/ CR511
100R 1- 1N5811 -iT CR512
1N5811

CR516 .. CR517

1N5806
R516
"\AA,
22R UM-H

ATTENTION
; 1N5806
STATIC SENSITIVE COMPONENTS (ESDS)
HANDLE ONLY AT STATIC SAFE
1^ WORKSTATION
MOTOR DRIVER STAGE

Printed Circuit Board Assembly D - Schematic Diagram

Figure 108

Page 127/128
27-36-13 MAY 01/96
 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

TP E4 TP E7 TP E8 TP E2 TP E3

TP 602

R620 || R619

JJL wm

o
0
in
Csl
LJ
CNI

1 _1
CS ^_

C£L o:
00
vO
o: ce
LJ
vO

i v
J10 II • J9 I
J

TP E9 TP E5 TP E6 TP E1 TP E11 TP E10

ATTENTION
STATIC SENSITIVE COMPONENTS (ESDS)
HANDLE ONLY AT STATIC SAFE
WORKSTATION

CMM-27-5269A

Printed C i r c u i t Board Assembly E - Component Layout

Figure 109 (Sheet 1)

Page 129
27-36-13 OCT 01/93
COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

so
0:1

R630 C632
I
C631 R629
II I
i cm

CMM-27-5270A
Printed C i r c u i t Board Assembly E - Component Layout
Figure 109 (Sheet 2)

Page 130
27-36-13 OCT 01/93
 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816
^^/

REVISION REVISION DESCRIPTION SERIAL NO.

CODE EFFECTIVITY

Revision Reference Sheet for Figure 110

Page 131/132
27-36-13 OCT 01/93
 COMPONENT MAINTENANCE MANUAL
P/N EAHBC8816

VR601
61 3
LT117AK P11

f28VDCI ° +15VDC
C629
J- C602 12 +15VDC
OOn 50V
+28VDCI TP E3

415V
ATTENTION
428VDCI STATIC SENSITIVE COMPONENTS (ESDS)
HANDLE ONLY AT STATIC SAFE
+28VDCI
WORKSTATION
PSCS-H

PSC5-L
I-28VRTN
*>28VRTN -CS +CS *ER -£R COMP TP E4
ERR
SifTDN
+5VDC
C611
PS-EN-H J-C610 t tO/A
OOn 20V
10 +45VDC
--C604 \ 6k8 J-C605 11
R629
PCTL-L 1k J13

UPA-H
.C631
'10n
29 UPA-L
nA-
P11
x—
17 PSDR
PA-EN-H BRSD
15 PCMDR-I
R630 1k
——————' V V V————— J UM-H
J13
t 26 UM-H

3 1 PS-INOP-H

I 1
)
- C632
N

L
10n
m
P11

20 PSODR

ENABLE LOGIC
CMM-27-5271A

Printed C i r c u i t Board Assembly E - Schematic Diagram

Figure 110 (Sheet 1)

Page 133/134
27-36-13 OCT 01/93
 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816
J9 J13
+28VGFS
5 4
+10V DPID
27

^
3
DPIS
CR607 < R614 •O TP E8 1 8
10R SO-MON-H
C615 2 6
TP 602 ATTENTION BCO-I2
4 12
20V
STATIC SENSITIVE COMPONENTS (ESDS) 6
HANDLE ONLY AT STATIC SAFE
C616 WORKSTATION
10/4
..NOT!^ UNLESS OTHERWISE STATED ALL J10
20V
DIODES ARE 1N4148 TYPE +28VRET1
-O TP E9 6 22
+28VDPS
-+ -10V 2 7
DPER
1 28
CURRENT MEASUREMENT POWER SUPPLY CIRCUIT ACT-EN-MON
C621 -L 3 2
100n £ DPDR
J13 5 5
U608-4 TP £10 _A_ -JU-
PCTL-H 25 U606
HCPL5400 U607-4 A 0
P11

>
54HCT08 12

> TV-
12

Q 1
VA2 13 BR1DR
13 •AAAr
VEYGN, R616 *5V
C617
3 7 5 750R 111!
PWM-L
420p
A C623
TP E11
Q
+10V
» , x «• jiii U~ C622

>
II 100n
3 2 u ^
U608-3 4 lillBllllI BR2DR
U609
TIL103 L U608-1

>
TP 601 54HC132
,8 1:1
: 111
CMCT-L 20
1 10

PWM PULSE CONDITIONER

§iiiiil
-10V +10V
1

TE2-Q4-TA1mH2
L601 R619 R620
•2 604k 10,0k
CMCI-H
+10V 4-10V
SHT. 2 4r C624

C618-J-
R617
4K7 R618
10KO
-WV
•^ T
C625 _L C626
2M2 T 100n
100n

V 20V V
UM-L CR611 - - X CR612

4 U610-1
CR610 LT1013 CMCP-L
^1009.1. C619
TE2-Q4-TA1mH2 ^2Y5 100n
L602
I ^' _ ^. ^_ L
CMCI-L 100nT 2/^2^. -10V CMCP-H
20V
CURRENT MEASUREMENT CIRCUIT ^ ^ VOLTAGE TO PULSE LENGTH CONVERTER

Printed C i r c u i t Board Assembly E - S c h e m a t i c Diagram

Figure 110 (Sheet 2)

Page 135/136
27-36-13 OCT 01/93
COMPONENT MAINTENANCE MANUAL
P/N EAHBC8816

CR702 1 CR701 1
c)
y
R701
1CR704 ||CR705
El i
R702 u_

(—
r-

©
u_
Q701
———>
m oo in
u_ u_ u_
A HID
——> m
rr\
0 0 o
C£ xO
CfL L_J LL_ LL_ u_

P9 •)! P10 •
O

ATTENTION
STATIC SENSITIVE COMPONENTS (ESDS)
HANDLE ONLY AT STATIC SAFE
WORKSTATION

CMM-27-5275A

Printed C i r c u i t Board Assembly F - Component Layout

F i g u r e 111

137/138
"" 1I OCT 01/93
 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

REVISION REVISION DESCRIPTION SERIAL NO.

CODE EFFECTIVITY

Revision Reference Sheet for Figure 112

Page 139/140
27-36-13 OCT 01/93
r WWI VlrWIMCIM 1 IVI/-\IIM 1 OMMSMV^C IV5MSMUML
rr«,y^
(^y P/N
EAMBC8816

P10

F1
O———————— 2 +28VDPS

F2 R701 A L ATTENTION
- STATIC SENSITIVE COMPONENTS (ESDS)
I 4K7 -L Ifo^L HANDLE ONLY AT STATIC SAFE
P9
X CR701 mMU K& WORKSTATION

0———————1-H ———————————————————*——————— DPID

1 _L> P10

£
Q701
IRFM250 ———VSA/———————r————————— DPDR
2
220R
V, rv CR702 P9
J ^ 1N497C)
75V i 1 DPIS
6 +28VRET1
<>> R702 <> R704
<> 25m <> 10K
P10

.
1- i
LVR3
F4

• 6 + 28VRET1

F5
0———————— 4 + 28VDC1

] I CR703
F6
o—————— 3 ACT-EN-MON

P9
F7
O———————— 5 + 28VGFS

] [ CR704 ] [ CR705
F8
O———————— 4 BCO-I2

P10
F9
o————— 1 DPER

P9

F10
o—————— 2 SO-MON-HI

F11
O——————|
DISPATCH POSITION DRIVER

CMM-27-5273A

Pr inted C i rcuit B o a r d A s s e m b l y F - Sch e m a t i c D i a g r a m

F i g u r e 112

27-;36-1: 5
3
Page 141
OCT 01/93
COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

ADJ

f
PIN CONFIGURATION FUNCTIONAL DIAGRAM

CMM-21-5028A
C R 6 1 0 - 2,5 Vdc R e f e r e n c e Diode
F i g u r e 113

C3 C2 C1

B3 ^ B2 B1
XI A1
A3 ^ A2 A1 (+)————ok
(-)———oJ>

PIN CONFIGURATION FUNCTIONAL DIAGRAM

CMM-27-5300A

K1 - Relay
F i g u r e 114

Page 142
27-36-13 OCT 01/93
COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

A3

X1 X2
o A2
©
A1

PIN CONFIGURATION FUNCTIONAL DIAGRAM

CMM-27-53Q1A
K2 - Relay
F i g u r e 115

A1 B1
X1 X2
A2 B2
A3 B3

PIN CONFIGURATION SCHEMATIC DIAGRAM

CMM-24-X053A
K3 - Relay
F i g u r e 116

Page 143
27-36-13 OCT 01/93
 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

DRAIN
o

GATE SOURCE
GATE o-

1
SOURCE

DRAIN

PIN CONFIGURATION FUNCTIONAL DIAGRAM

CMM-73-5029A
Q501, Q503 thru Q507 and Q701 - N Channel Enhancement Mode MOSFET
F i g u r e 117

BASE
COLLECTOR

BASE
EMITTER COLLECTOR

EMITTER

PIN CONFIGURATION FUNCTIONAL DIAGRAM

CMM-30-5040A
Q502 and Q601 - NPN Transistor
F i g u r e 118

Page 144
27-36-13 OCT 01/93
 COMPONENT MAINTENANCE MANUAL
P/N E A M B C 8 8 1 6

BASE
COLLECTOR

BASE
EMITTER COLLECTOR

EMITTER

PIN CONFIGURATION FUNCTIONAL DIAGRAM

CMM-73-5170A
Q602 - PNP T r a n s i s t o r
F i g u r e 119

GATE DRAIN
o

SOURCE DRAIN GATE O-

o
SOURCE

PIN CONFIGURATION FUNCTIONAL DIAGRAM

CMM-27-5298A
Q603 - N Channel Enhancement Mode MOSFET
Figure 120

Page 145
27-36-13 OCT 01/93
 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

DRAIN

DRAIN

SOURCE GATE
GATE

SOURCE

PIN CONFIGURATION FUNCTIONAL DIAGRAM

CMM-27-5330A
Q604 - P Channel J F E T
F i g u r e 121

DRAIN

DRAIN

SOURCE GATE GATE

SOURCE

PIN CONFIGURATION FUNCTIONAL DIAGRAM

CMM-27-5297A
Q605 - N Channel JFET
Figure 122

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27-36-13 OCT 01/93
 COMPONENT MAINTENANCE MANUAL
P/N EAHBC8816

OUTA

N/C N/C

INA OUTA

GND

INB OUTB

INB OUTB
PIN CONFIGURATION

GND

FUNCTIONAL DIAGRAM

CMM 27-5187A
U501 - Dual MOSFET D r i v e r
F i g u r e 123

•
-\j
LO [^ 1 14 ^j N/C

COM Q 2 13 U v-
v. H 3 12 [] LIN

N/C Q 4 A „ USD
vs Q 5 10 ^] HIN

VB Q 6 9 ^] VDD

HO Q 7 8 ^] N/C

PIN CONFIGURATION

CMM 27-5186A

U502 and U503 - MOSFET D r i v e r A m p l i f i e r

Figure 124

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27-36-13 OCT 01/93
 COMPONENT MAINTENANCE MANUAL
P/N E A M B C 8 8 1 6

BASE
ANODE COLLECTOR
BASE ( 2

CATHODE EMITTER

EMITTER CATHODE

(BOTTOM VIEW)
PIN CONFIGURATION FUNCTIONAL DIAGRAM

CMM 27-5020A

U601, U603, U605 and U609 - Opto-isolator

Figure 125

27-36-13 Page 148

OCT 01/93
 COMPONENT MAINTENANCE MANUAL
P/N E A M B C 8 8 1 6
\L^
^ERROR Q 1 18 ^\ VREF

-ERROR [^ 2 17 ^ WIN

COMPENSATION Q 3 16 ^] OUTPUT B

C SOFTSTART Q 4 15 ^] GROUND

RESET Q 5 ^t 14

-CURRENT SENSE Q 6 13 ~^j OUTPUT A

-^CURRENT SENSE Q 7 12 ^ SYNC

SHUTDOWN Q B 11 ~^\ RD

R TIMING Q 9 10 DCT
P IN CONFIGURATION
VREF

REFERENCE UNDER
+ VIN * REGULATOR f VOLTAGE ———
LOCKOUT
Tn INTFRNAI
nun* 1
^ CIRCUITRY

RD
* SYIC
OUTPUT
R TIMING *——— ———'——— 1
OSCILLATOR ——1————————— ^-4 A

CT »——f- pZ_^^
|
MEMORY TOGGLE
F/F F/F
kbbbi'i—— ——*—— \ \——— O S Q ---«
SOFT
C.SOFT START "
START*———'———————l - - r-D QJ Q---I
rnMPFN,,
SATION

+ERROR*——— "^^L
+yjN
,,

AMP "^>—i —— y'

X.

U >>~
r-
———^

———S
o
SQ

Q"
jy OUTPUT
B

-ERROR •——— -^ METERING

F/F
+CURRENT.___ >x^
SENSE ^^

-CURRENT S^
SENSE*——— -^

FUNCTIONAL DIAGRAM CMM-27-5191A

U602 - Pulse W i d t h Modulator
F i g u r e 126

27-36-13 Page 149

OCT 01/93
COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

F_ ^ J1 —————— J Q Q1
J ———
CLK 1 Q 1 14 H Ji CLK 1 ———C >CLK
r~l
LLr\D *il 11 2 13 ^| 01
M_ K
OR Q QT
K1C 3 12 H 01
ri n 1

vcc [2 4 A^ 11^] GND

CLK 2 Q 5 10 ^] K2 J2 ———— J Q Q2
2
CLFT [2 6 9 ^] 02 CLK 2 ———C »CLK

J2 £ 7 8 UQ2 I/O K 02
OR 0"

D IM rnNF iniiDATin M n r? 9

FUNCTIONAL DIAGRAM

INPUTS OUTPUTS
OR CLK J K Q Q
L X X X L H
H ^_ L L 00 00
H -x. H L H L
H "V L H L H
H H H TOGGLE
H H X X 00 00

X DONT CARE

TRUTH TABLE

CMM-27-X061A
U604 - Dual JK F l i p - F l o p
F i g u r e 127

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27-36-13 OCT 01/93
r—ri—i uuiviruiMCiM i IVIMIIM i ci
(TIuk&)
^^y P/N EAMBC8816

NC Q 1 8 H v^ INPUT +

INPUT + Q 2 7 ^ ENABLE
A OUTPUT
INPUT - Q 3 6 ^] OUTPUT
INPUT -
NC Q 4 5 ^ GND
GND
ENABLE

PIN CONFIGURATION FUNCTIONAL DIAGRAM

INPUT ENABLE OUTPUT

H H Z
H L H
L L L

TRUTH TABLE CMM-27-5195A

U606 - Opto-Isolator
F i g u r e 128

A1
__ ^ Y1
^———— B1
v+
A1 Q 1 14 Zl
Bid 2 13 ^] B4 A2
Y2
Y1C 3 12 ~^\ A4 B2

A2 Q 4 ^k 11
H Y4
A3
Y3
B2 Q 5 10 UBS B3
Y2 Q 6 9 H A3

GND Q 7 8 A4
U Y3
Y4
B4

Y = A.B
PIN CONFIGURATION FUNCTIONAL DIAGRAM

CMM 27-X065A
U607 - Quad 2-input AND Gate
Figure 129

27-36-13 Page 151

OCT 01/93
 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

• —v^
1A £ 1 14 m y+
1B £ 2 13 ^ 4B

1Y Q 3 12 ^] 4A

2AC 4 A * H4Y

2BC 5 10 U 3B

2Y Q 6 9 H 3A

GND Q 7 8 D3Y

Y = A.B

PIN CONFIGURATION FUNCTIONAL DIAGRAM

CMM 27-5192A
U608 - Quad 2-input NAND S c h m i t t T r i g g e r Gate
F i g u r e 130

-OUTPUT A
>M^
OUTPUT A Q 1 8

-IN A [^ 2 ^] OUTPUT B

4-IN A Q 3
A 6' U -IN B -|N B

•OUTPUT B
v- C 4 5 ^] 4-IN B 4-IN B ————

PIN CONFIGURATION
FUNCTIONAL DIAGRAM

CMM-27-5021A

U610 - Dual Op-Amp

Figure 131

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27-36-13 OCT 01/93
 COMPONENT MAINTENANCE MANUAL
P/N E A M B C 8 8 1 6

BALANCE
GND OUTPUT
V+-
BALANCE/
STROBE
BALANCE/ IN-*
STROBE OUTPUT

IN- GND

BALANCE V-

V-
PIN CONFIGURATION FUNCTIONAL DIAGRAM

CMM 24-5032A
U611 - C o m p a r a t o r
F i g u r e 132

ADJUSTMENT INPUT

OUTPUT(CASE)

PIN CONFIGURATION

CMM 29-5036A

VR 601 - A d j u s t a b l e V o l t a g e R e g u l a t o r
F i g u r e 133
"END 1 1

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 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

DISASSEMBLY
1. 'Techniques and Precautions
Standard techniques for the disassembly of electronic units apply. Before
making any electrical disconnections install identification tags on the wires
to aid correct reconnection. Before removal of electronic components, relays
and tantalum capacitors, note the polarity and position of the components for
correct assembly, for details refer to the IPL. Solder (CML-Fk05-085) may be
used for de-soldering components in the following procedures.
CAUTION: THIS MODULE CONTAINS DEVICES SENSITIVE TO STATIC ELECTRICITY.
OBSERVE THE ESDS CAUTION IN PAGE-BLOCK 101.
CAUTION: THE PRINTED CIRCUIT BOARD ASSEMBLIES ARE CONFORMAL COATED. REMOVE
THE CONFORMAL COATING (CML-Fk09-039) FROM AROUND THE WIRES, PINS OR
CONTACTS OF THE COMPONENT TO BE REMOVED BEFORE DE-SOLDERING.
CAUTION: WHEN UNSOLDERING TRANSISTORS, DIODES AND INTEGRATED CIRCUITS USE A
LOW WATTAGE, GROUNDED SOLDERING IRON.
2. Special Tools and Materials
The special tools and materials are listed in page-block 901.
3. Procedures
A. Removal of Components from Main Assembly
Unless otherwise stated, the item numbering used in the following
procedures refers to the numbered annotations in IPL figure 1.
(1) Removal of Sideplates (10 and 20)
(a) Remove the four screws (30) securing each sideplate to the case
assembly (280).
(b) Remove the sideplates from the case assembly (280).
(2) Removal of PCB Assembly E (50)
(a) Remove the two screws (60) and two screws (70) securing the PCB
assembly (50) to the case assembly (280).
(b) Disconnect connector Pll (IPL figure 2, item 650) from the PCB
assembly (50).
(c) Remove the PCB assembly (50) from the case assembly (280).
(3) Removal of Filter Plate (80) and Filters (100)
(a) Remove the two screws (90) securing the filter plate (80) to the
case assembly (280).

1 O0 Page 301
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 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

(b) Desolder the wires from the two filters (100) attached to the
filter plate (80).
(c) Remove the filter plate (80) with the two filters (100) from the
case assembly (280).
(d) Desolder the wires from the two remaining filters (100) attached
to the case assembly (280).
(e) Remove the nuts securing the filters (100) to the filter plate
(80) and case assembly (280).
(f) Remove the filters (100).
(4) Removal of PCB Assemblies D and F (110 and 180)
(a) Remove the four screws (120), six screws (130), four washers
(140), four nuts (150) and two spacers (160) securing the PCB
assembly D (110) to the case assembly (280).
(b) Remove PCB assembly D (110) from the case assembly (280) with PCB
assembly F and the flat cable assembly (IPL figure 3, item 350)
still attached.
(c) Remove the two screws (190) securing PCB assembly F (180) to PCB
assembly D (110).
(d) Remove PCB assembly F (180) from PCB assembly D (110).
(e) Disconnect connector J12 (IPL figure 3, item 370) from PCB
assembly D (110) and remove the flat cable assembly (IPL figure 3,
item 350).
(5) Removal of Connector J14 (220) and Diodes CR11 and CR12 (240)
(a) Remove the two jack posts (230) securing the connector (220) to
the case assembly (280).
(b) Desolder the wires and the diodes CR11 and CR12 (240) from the
connector (220).
(c) Remove the connector (220) and the diodes (240) from the case
assembly (280).
(6) Removal of Inductors (250)
(a) Desolder the inductor (250) from the w i r i n g loom.
(b) Cut the lacing tape, if applicable, and remove the inductors (250)
from the case assembly (280).
(7) Removal of Connector J15 (260)
(a) Extract the wired contacts from the connector (260), for details
refer to paragraph 3A(8).
(b) Remove the connector (260).
(8) Wired Contact Extraction
NOTE: This is a general procedure, for more specific details refer to
vendor documentation.
(a) Place the wire of the contact to be extracted into the large
opening at the w h i t e end of the insertion/extraction tool.

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 COMPONENT MAINTENANCE MANUAL
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(b) Slide the tool back on the wire, holding the thumb against the
wire at the opening, until the wire slips into the tool.
(c) Push the tool into the cavity until it bottoms. At this point the
tool releases the tines on the retaining clip, and the contact can
be extracted.
(d) Maintaining a slight pressure on the tool, firmly hold the wire
against the serrated shoulder at the center of the tool, and
extract the wired contact and the tool from the connector.
(e) Repeat this operation for the remaining wired contacts.
B. Removal of Components from PCB Assembly E
Unless otherwise stated, the item numbering used in the following
procedures refers to the numbered annotations in IPL figure 2.
(1) Removal of Voltage Regulator VR601 (540) and Heatsink (590)
(a) Remove the mounting kit (600) securing the heatsink (590) to the
PCB (720).
(b) Desolder the pins and remove the voltage regulator (540) and the
heatsink (590) from the PCB (720).
(2) Removal of Transistor Q602 (420) and Heatsink (550)
(a) Remove the screw (560), two washers (570) and nut (580) securing
the heatsink (550) to the PCB (720).
(b) Desolder the pins and remove the transistor (420) and heatsink
(550) from the PCB (720).
(3) Removal of Connector J13 (620)
(a) Remove the two screws (630) and two nuts (640) securing the
connector (620) to the PCB (720).
(b) Desolder the contacts of the connector (620) from the PCB (720)
and remove the connector (620).
(4) Removal of Integrated C i r c u i t s (460 thru 530)
(a) Select the correct size extraction tool for the integrated c i r c u i t
to be removed.
(b) Open the extraction tool jaws by pressing the plunger, and
position the tool over the integrated circuit. Release the
plunger, ensuring that the integrated c i r c u i t is firmly gripped by
the jaws.
(c) Reflow the solder by applying a de-solder block to the integrated
c i r c u i t terminal joints.
(d) Withdraw the integrated c i r c u i t .
(e) Remove the mounting pad, if applicable.
(5) Removal of Other Components
(a) Desolder the component connections from the PCB, observing the
standard techniques.

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 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

(b) Withdraw the component from the PCB.

(d) Remove the mounting pad, if applicable.
C. Removal of Components from PCB Assembly D
Unless otherwise stated, the item numbering used in procedure 3C(1) refers
to the numbered annotations in IPL figure 1. For procedures 3C(2) thru
3C(5) refer to IPL figure 3.
(1) Removal of Transistors Q501 and Q503 thru Q507 (170)
(a) Desolder the pins of the transistor (170) from the PCB assembly
(110).
(b) Remove the transistor (170) from the PCB assembly (110).
(2) Removal of Integrated Circuits (240 and 250)
(a) Select the correct size extraction tool for the integrated circuit
to be removed.
(b) Open the extraction tool jaws by pressing the plunger, and
position the tool over the integrated circuit. Release the
plunger, ensuring that the integrated c i r c u i t is firmly gripped by
the jaws.
(c) Reflow the solder by applying a de-solder block to the integrated
circuit terminal joints.
(d) Withdraw the integrated circuit.
(3) Removal of Inductors L501, L503 and L504 (270)
(a) Remove the screw (280) and nut (290) securing the inductor (270)
to the PCB (390).
(b) Desolder the pins and remove the inductor (270) from the
PCB (390).
(4) Removal of Inductor L502 (300)
(a) Remove the screw (310) and nut (320) securing the inductor (300)
to the PCB (390).
(b) Desolder the pins and remove the inductor (300) from the
PCB (390).
(5) Removal of Other Components
(a) Desolder the component connections from the PCB, observing
standard techniques.
(b) Withdraw the component from the PCB.
(c) Remove the mounting pads, if applicable.

97-3A Page 304

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 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

D. Removal of Components from PCB Assembly F

Unless otherwise stated, the item numbering used in the following
procedures refers to the numbered annotations in IPL figure 4.
(1) Removal of Transistor Q701 (70)
(a) Remove the screw (80) and nut (90) securing the transistor (70)
the PCB (120).
(b) Desolder the pins and remove the transistor (70) from the
PCB (120).
(2) Removal of Other Components
(a) Desolder the component connections from the PCB, observing
standard techniques.
(b) Withdraw the component from the PCB.
E. Removal of Components from Case Assembly
Unless otherwise stated, the item numbering used in the following
procedures refers to the numbered annotations in IPL figure 5.
(1) Removal of Top Plate (10)
(a) Remove the two screws (20) securing the top plate (10) to the top
mounting blocks (250).
(b) Remove the top plate (10) to the extent of the wiring.
(2) Removal of Relay K3 (30)
(a) Desolder the relay (30) terminals and remove the wire from each
terminal.
(b) Remove the screw (40) and screw (50) securing the relay (30) to
the threaded spacers (110 and 120).
(c) Remove the relay (30) and spacer (60).
(d) Remove the screw (130) securing the threaded spacer (110) to the
top plate (10).
(e) Remove the threaded spacer (110).
(3) Removal of Relay K2 (70)
(a) Desolder the relay (70) terminals and remove the wire from each
terminal.
(b) Remove the screw (80) securing the relay (70) to the threaded
spacer (120).
(c) Remove the relay (70).
(d) Remove the two screws (130) securing the two threaded spacers
(120) to the top plate (10).
(e) Remove the two threaded spacers (120).

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 COMPONENT MAINTENANCE MANUAL
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(4) Removal of Relay K1 (90)

(a) Desolder the relay (90) terminals and remove the wire from each
terminal.
(b) Remove the three screws (100) securing the relay (90) to the
threaded spacers (120).
(c) Remove the relay (90)
(d) Remove the three screws (130) securing the threaded spacers (120)
to the top plate (10).
(e) Remove the threaded spacers (120).
(5) Removal of Front Plate (140)
(a) Remove the four screws (150) securing the front plate (140) to the
two mounting blocks (250).
(b) Remove the front plate (140).
(6) Removal of Rear Plate (160)
(a) Remove the four screws (170) securing the rear plate (160) to the
two mounting blocks (250).
(b) Remove the rear plate (160).
(c) Remove the four screws (270) securing the two mounting blocks
(260) and remove the mounting blocks from the rear plate (160).
(7) Removal of Bottom Plate Assembly (180)
(a) Remove the four screws (190) securing bottom plate assembly (240)
to the mounting blocks (250).
(b) Remove the bottom plate assembly (180).

"END"

Pa9e306
27-36-13 OCT 01/93
 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

CLEANING

1. Precautions
• WARNING; WEAR GOGGLES WHEN USING AN AIR-JET. WARN OTHER PERSONS TO STAY
—————— AWAY FROM THE AREA. THE AIR-JET SHALL HAVE A MAXIMUM PRESSURE OF
193 kPa (28 PSD.
CAUTION: THIS MODULE CONTAINS DEVICES SENSITIVE TO STATIC ELECTRICITY.
————— OBSERVE THE ESDS CAUTION IN PAGE-BLOCK 101.

2. Special Tools and Materials

The special tools and materials are listed in page-block 901.
3. Procedures
A. External Cleaning
WARNING; WEAR GOGGLES WHEN USING AN AIR-JET (Refer to WARNING in
paragraph 1).
Using a lint-free cloth (CML-Fk05-044) and a camel hair brush clean all
metal parts. Use an air-jet fitted with an ionization nozzle to clean
places inaccessible to a cloth. Pay particular attention to dirt which may
be trapped between the contacts of the connectors.
B. Internal Cleaning
WARNING; WEAR GOGGLES WHEN USING AN AIR-JET (Refer to WARNING above).
Remove the RH and LH sideplates and PCB assemblies D thru F, for details
refer to page-block 301. Using a lint-free cloth (CML-Fk05-044) and a
camel hair brush clean all metal parts. Pay particular attention to dirt
which may be trapped inside the case assembly.
Using a small camel hair brush and an air-jet fitted with an ionization
nozzle, clean away all dust and dirt from around the components on the PCB
assemblies. Pay particular attention to dirt that may be trapped between
connector contacts, around the voltage regulator and heatsinks. Clean away
any flux and solder particles which may be trapped on the track side of the
board or between connector contacts.

"END"

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 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

CHECK

1. Precautions
CAUTION: THE MODULE CONTAINS DEVICES SENSITIVE TO STATIC ELECTRICITY.
OBSERVE THE ESDS CAUTION IN PAGE-BLOCK 101.

2. Special Tools, Fixtures and Equipment

The special tools, fixtures and equipment are listed in page-block 901.
3. Procedures
A. External Inspection
Inspect the case assembly and sideplates for cracks, dents, defective
securing devices and scratched paintwork. Inspect all connectors for
broken, bent, loose or corroded contacts, cracked insulation and defective
securing devices.
B. Internal Inspection
CAUTION: THE PRINTED CIRCUIT BOARD ASSEMBLIES CONTAIN DEVICES SENSITIVE
TO STATIC ELECTRICITY. OBSERVE THE ESDS CAUTION IN PAGE-BLOCK
101.

(1) Remove the RH and LH sideplates and PCB assemblies D thru F, for
details refer to page-block 301.
(2) Do the procedures in table 501.

ITEM INSPECT FOR

Case Assembly and Sideplates Broken, deformed, cracked or corroded metal
work. Scratched paintwork. Defective
securing devices.
Connectors Broken, bent, loose or corroded contacts.
Damaged insert, cracked insulation. Loose
pieces of solder around the base of the
connector. Defective securing devices, if
applicable.
Resistors Broken, cracked, charred or blistered
bodies. Loose or broken wires. Missing
color codes, or type numbers.
Capacitors Broken, cracked or leaking bodies. Loose
or broken wires. Correct polarity of
tantalum capacitors. Missing or unreadable
part numbers.
Transistors, Integrated Damage to housings, signs of overheating.
Circuits, Voltage Regulators Missing or unreadable part numbers.
and Relays Orientation.

Page 501
27-36-13 OCT 01/93
 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

ITEM INSPECT FOR

Transformers Damage to core or windings, signs of
excessive heat. Missing or unreadable part
numbers.
Diodes Broken or cracked bodies, damaged leads,
missing or unreadable part numbers.
Missing polarity bands. Correct polarity.
Inductors Broken or cracked case, loose or broken
wires, missing or unreadable part numbers.
Soldered and Wired Connections Dry joints, overstripping, excessive
solder, wire strain.
Printed C i r c u i t Boards Broken, cracked or deformed board, loose
components. Damage to conformal coating.
Signs of overheating.
Test Pins and Wiring General damage and security.___________
Inspection Procedures
Table 501

"END"

Page 502
27-36-13 OCT 01/93
 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816
VL-X

1. Techniques and Precautions

Standard techniques for the repair of electronic units apply. Before waking
any electrical disconnections install identification tags on the wires to aid
correct reconnect ion. Before removal of electronic components, relays and
tantalum capacitors, note the polarity and position of the components for
correct assembly. Component locations are shown in the IPL.
CAUTION: THE MODULE CONTAINS DEVICES SENSITIVE TO STATIC ELECTRICITY.
OBSERVE THE ESDS CAUTION IN PAGE-BLOCK 101.

CAUTION: THE PRINTED CIRCUIT BOARD ASSEMBLIES ARE CONFORMAL COATED. REMOVE
THE C O N F O R M A L COATING (CML-Fk09-039) FROM THE AREA TO BE REPAIRED
B E F O R E DE-SOLDERING.

CAUTION: A R E P L A C E M E N T COMPONENT MUST BE FITTED IN THE EXACT POSITION FROM

W H I C H THE FAULTY COMPONENT WAS REMOVED. FOR COMPONENT LOCATIONS
R E F E R TO THE IPL.

CAUTION: THE HEATSINKS, TEST PINS, CONNECTORS J9, J10, P9, P10, P11 AND THE
CONTACTS OF CONNECTORS J12 AND J13 MUST NOT BE COATED WITH
C O N F O R M A L COATING (CML-Fk09-039). USE MASKING TAPE (CML-Fk05-
115) TO PROTECT A R E A S OF THE MODULE WHICH DO NOT R E Q U I R E C O N F O R M A L
COATING.

CAUTION: W H E N S O L D E R I N G AND UNSOLDERING TRANSISTORS, DIODES AND INTEGRATED

CIRCUITS, USE A LOW WATTAGE, GROUNDED SOLDERING IRON.

2. Special Tools and M a t e r i a l s

The special tools and m a t e r i a l s are listed in page-block 901.
3. Procedures
W i t h the exception of the components detailed in the following procedures, all
components are non-repairable. If any part of a component is damaged, the
whole component must be replaced. If a component has been replaced, the
module must be refitted to the MBCU (refer to page-block 701 of CMM 27-36-01)
and subjected to the applicable overall test detailed in page-block 101 of
CMM 27-36-01.
NOTE: Ensure all components are securely mounted.
A. Paintwork
Re-paint any scratched paintwork.
B. Wired Contact Replacement
No attempt should be made to straighten bent contacts at the rear of the
connector. For d e t a i l s of contact insertion/extraction, refer to page-
blocks 301 and 701.

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 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

C. Soldered Connections
•Resolder (CML-Fk05-085) broken or bad connections, such as dry or corroded
joints. Remove excess solder.
D. Printed Circuit Boards
If broken, replace the printed circuit board using standard de-soldering
and identification techniques described in page-block 301. Clean off
damaged conformal coating and replace (CML-Fk09-039). Clean off damaged
adhesive joints between the two spacers (IPL figure 4, item 100) and PCB
assembly F and replace (CML-Fk08-001).
E. Inductors LI thru L3
(1) Remove any conformal coating from the area around the soldered wires.
(2) Desolder the inductor from the wiring loom or filters, as applicable,
observing standard techniques.
(3) Remove the lacing tape, if applicable, securing the inductor to the
bracket. Remove the inductor.
(4) Unwind and remove the damaged wiring from the shield bead of the
inductor.
(5) Rewind the inductor using one and a half turns of 24 AWG wire, refer
to figure 601.
(6) If applicable, secure the shield bead to the bracket using lacing tape
(CML-Fk05-090) and insert the wires through the bracket.
(7) Solder (CML-Fk05-085) the wires into the wiring loom, or on to the
filters, as applicable.
(8) Re-apply the conformal coating (CML-Fk09-039) to the repaired area.

INDUCTOR

100
(FL1)

250 CRIMP SLEEVE

(L1)
MOUNT WITH LACING TAPE

CMM-27-5224A

Details of Inductor LI
Figure 601
"END11

Page 602
27-36-13 MAY 01/96
 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

ASSEMBLY AND STORAGE

1.' Techniques and Precautions
Standard techniques for the assembly of electronic units apply. Before
completion of the assembly procedures the module must be refitted to the MBCU
(refer to page-block 701 of CMM 27-36-01) and subjected to the applicable
overall test procedure detailed in page-block 101 of CMM 27-36-01. For special
mounting details applicable to components on the printed circuit board
assemblies, refer to the IPL.
CAUTION; A REPLACEMENT COMPONENT MUST BE FITTED IN THE EXACT POSITION FROM
WHICH THE FAULTY COMPONENT WAS REMOVED. CHECK THE POLARITY OF
DIODES AND TANTALUM CAPACITORS BEFORE FITTING. COMPONENT LOCATIONS
ARE SHOWN IN THE IPL.
CAUTION: THE MODULE CONTAINS DEVICES SENSITIVE TO STATIC ELECTRICITY. OBSERVE
THE ESDS CAUTION IN PAGE-BLOCK 101.
CAUTION: THE PRINTED CIRCUIT BOARDS ARE CONFORMAL COATED (CML-Fk09-039).
AFTER COMPLETION OF ASSEMBLY REPLACE THE CONFORMAL COATING. THE
HEATSINKS, ALL TEST PINS, CONNECTORS J9, J10, P9, P10, Pll AND THE
CONTACTS OF CONNECTORS J12 AND J13 MUST NOT BE CONFORMAL COATED.
USE MASKING TAPE (CML-Fk05-115) TO PROTECT AREAS OF THE MODULE WHICH
DO NOT REQUIRE CONFORMAL COATING.
CAUTION: WHEN SOLDERING TRANSISTORS, DIODES AND INTEGRATED CIRCUITS USE A LOW
WATTAGE, GROUNDED SOLDERING IRON.
2. Special Tools and Materials
The special tools and materials are listed in page-block 901.

3. Procedures
A. Fitting of Components to Case Assembly
Unless otherwise stated, the item numbering in the following procedures
refers to the numbered annotations in IPL figure 5.
(1) Fitting of Bottom Plate Assembly (180)
(a) Secure the bottom plate assembly (180) to the mounting blocks
(250) using the four screws (190). Apply anaerobic resin (CML-
Fk08-051) to the screws.
(2) Fitting of Rear Plate (160)
(a) Fit the mounting blocks (260) to the rear plate (160) and secure
using the four screws (270).
(b) Fit the rear plate (160) to the mounting blocks (250) and secure
using the four screws (170).

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(3) Fitting of Front Plate (140)

(a) Fit the front plate (140) to the mounting blocks (250) and secure
using the four screws (150).
(4) Fitting of Relay Kl (90)
(a) Fit the three threaded spacers (120) to the top plate (10) and
secure using the three screws (130).
(b) Fit the relay (90) to the threaded spacers (120) and secure using
the three screws (100).
(c) Solder (CML-Fk05-085) the wires to the relay (90) terminals.
(5) Fitting of Relay K2 (70)
(a) Fit the two threaded spacers (120) to the top plate (10) and
secure using the two screws (130).
(b) Fit the relay (70) to the threaded spacers (120) and secure using
the screw (80).
(c) Solder (CML-Fk05-085) the wires to the relay (70) terminals.
(6) Fitting of Relay K3 (30)
(a) Fit the threaded spacer (110) to the top plate (10) and secure
using the screw (130).
(b) Fit the relay (30) and spacer (60) to the threaded spacer (110)
and the base of relay K2 (70) and secure using the screw (40) and
screw (50).
(c) Solder (CML~Fk05-085) the wires to the relay (30) terminals.
(7) Fitting of Top Plate (10)
(a) Fit the top plate (10) to the mounting blocks (250) attached to
the front and rear plates (140 and 160) and secure using the two
screws (20). Apply anaerobic resin (CML-Fk08-051) to the screws.

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B. Fitting of Components to PCB Assembly F

Unless otherwise stated, the item numbering in the following procedures
refers to the numbered annotations in IPL figure 4.
(1) Fitting of Transistor Q701 (70)
(a) Fit the transistor (70) to the PCB (120) and solder (CML~Fk05-085)
the pins.
(b) Secure the transistor (70) using the screw (80) and nut (90).
(2) Fitting of Other Components
NOTE: When installing resistor R702 (40), leave a 1 mm gap between
the component body and the surface of the PCB (120), for
details refer to figure 701.
NOTE: The two spacers (100) are secured to the component side of the
PCB using adhesive (CML-Fk08-001).
(a) Position the component on the PCB (120) and solder (CML-Fk05-085)
the pins, contacts or wires of the component to the PCB, observing
standard techniques.
(b) Clean the PCB (120) to remove all traces of flux.
C. Fitting of Components to PCB Assembly D
Unless otherwise stated, the item numbering used in the following
procedures refers to the numbered annotations in IPL figure 3.
NOTE: For details of the fitting of transistors Q501 and Q503 thru Q507,
refer to paragraph 3E(4).
(1) Fitting of Inductor L502 (300)
(a) Insert the pins of the inductor (300) through the terminals holes
in the PCB (390) and secure using the screw (310) and nut (320).
(b) Solder (CML-Fk05-085) the pins of the inductor to the PCB (390).
(2) Fitting of Inductors L501, L503 and L504 (270)
(a) Insert the pins of the inductor (270) through the terminals holes
in the PCB (390) and secure using the screw (280) and nut (290).
(b) Solder (CML-Fk05-085) the pins of the inductor (270) to the PCB
(390).
(3) Fitting of Integrated Circuits (240 and 250)
(a) Select the correct size insertion tool for the integrated circuit
to be fitted.
(b) Open the jaws of the insertion tool by pressing the plunger, then
position the integrated circuit in the jaws. Release the plunger
ensuring that the jaws grip the integrated circuit firmly.

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(c) Insert the pins of the integrated circuit through the terminal
holes in the PCB (390).
(d) Solder (CML-Fk05-085) the integrated circuit to the PCB (390).
(e) Clean the PCB (390) to remove all traces of flux.
(4) Fitting of Other Components
NOTE: When installing resistors R501 (60), R502 (80), R509 (90) and
R514 (70), leave a 1 mm gap between the component body and the
surface of the PCB (390), for details refer to figure 701.
(a) Position the component on the PCB (390) and solder (CML- Fk05-085)
the pins, contacts or wires of the component to the PCB observing
standard techniques.
D. Fitting of Components to PCB Assembly E
Unless otherwise stated, the item numbering in the following procedures
refers to the numbered annotations in IPL figure 2.
(1) Fitting of Connector J13 (620)
(a) Fit the connector (620) to the PCB (720) and secure using the two
screws (630) and two nuts (640).
(b) Solder (CML-Fk05-085) the connector (620) to the PCB (720).
(2) Fitting of Transistor Q602 (420) and Heatsink (550)
NOTE: Avoid excessive application of heat conducting paste. Apply
thinly and evenly using a spatula.
(a) Apply heat conducting paste (CML-Fk08-002) to the mating surface
of heatsink (550).
(b) Fit the transistor (420) and the heatsink (550) to the PCB (720)
and secure using the screw (560), two washers (570) and nut
(580).
(c) Solder (CML-Fk05-085) the pins of the transistor (420) to the PCB
(720), observing standard techniques.
(3) Fitting of Voltage Regulator VR601 (540) and Heatsink (590)
NOTE: Avoid excessive application of heat conducting paste. Apply
thinly and evenly using a spatula.
(a) Apply heat conducting paste (CML-Fk08-002) to the mating surface
of the heatsink (590).
(b) Fit the voltage regulator (540) and heatsink (590) to the PCB
(720) and secure using the mounting kit (600).
(c) Solder (CML-Fk05-085) the pins of the voltage regulator (540) to
the PCB (720), observing standard techniques.

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(4) Fitting of Integrated Circuits

(a) Select the correct size insertion tool for the integrated circuit
to be fitted.
(b) Open the jaws of the insertion tool by pressing the plunger, then
position the integrated circuit in the jaws. Release the plunger
ensuring that the jaws grip the integrated circuit firmly.
(c) Insert the pins of the integrated circuit through the terminal
holes in the PCB (720).
(d) Solder (CML-Fk05-085) the integrated circuit to the PCB (720).
(e) Clean the PCB (720) to remove all traces of flux.
(5) Fitting of Other Components
NOTE: The following components are fitted with a mounting pad:

EQUIPMENT DESIGNATOR IPL FIGURE-ITEM

CR603 and CR619 2-380
CR610 2-400
Q601 2-410
Q603 2-430
Q604 2-440
Q605 2-450
U601, U603, U605 and U609 2-530
U611 2-490

NOTE; When installing resistor R601 (210), leave a 1 mm gap between

the component body and the surface of the PCB (720), for
details refer to figure 701.
(a) Position the component and, if applicable, mounting pad on the PCB
(720) and solder (CML- Fk05-085) the pins, contacts or wires of
the component to the PCB, observing standard techniques.

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COMPONENT BODY

1rnm SPACING
PCB

CMM-61-5036A

Mounting Details for Resistors R501, R502, R509, R514, R601 and R702
Figure 701
Fitting of Components to Main Assembly
Unless otherwise stated, the item numbering in the following procedures
refer to the numbered annotations in IPL figure 1.
(1) Fitting of Connector J15 (260)
(a) Position the connector (260) in the wiring loom.
(b) Insert the wired contacts into the connector (260), for details
refer to paragraph 3E(8).
(2) Fitting of Inductors (250)
(a) Wind 1.5 turns of AWG 24 copper wire, on to the shield bead (250),
for details refer to figure 702.
(b) For inductor LI (250), repeat step (a) for the second coil.
(c) If applicable, secure the inductor (250) to the PCB assembly using
lacing tape (CML-Fk05-090).
(d) Solder (CML-Fk05-085) the wires of the inductor (250) into the
wiring loom.

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SHIELD
BEAD

A W G 24
COPPER WIRE

CMM-61-5037A

Details of Inductors
Figure 702
(3) Fitting of Connector J14 (220) and Diodes CR11 and CR12 (240)
(a) Solder (CML-Fk05-085) the didoes CR11 and CR12 (240) to the
connector (220), observing standard techniques.
(b) Fit the connector (220) to the case assembly and secure using the
two jacks posts (230).
(c) Solder (CML-Fk05-085) the wiring loom connections to the connector
(220), observing standard techniques.
(4) Fitting of PCB Assemblies F thru D (180 and 110)
NOTE: Avoid excessive application of heat conducting paste, Apply
thinly and evenly using a spatula.
(a) Reconnect connector J12 (IPL figure 3, item 370) to PCB assembly
D (110) and insert the flat cable assembly (IPL figure 2t item
350) through the case assembly ready for mating with PCB assembly
E (50).
(b) Fit PCB assembly F (180) to the four threaded spacers (200) and
secure using the two screws (190).
(c) Apply heat conducting paste (CML-Fk08-002) to the mating surface
of the heatsinks of transistors Q501 and Q503 thru Q507 (170).
(d) Fit the transistors (170) to PCB assembly D (110) ensuring that
the transistor heatsink holes align with their respective holes
in the case assembly (280) when PCB assembly D is in its normal
mounted position.

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(e) Solder (CML-Fk05-085) the pins of the transistors (170) to the PCB
assembly D (110).
(f) Fit PCB assembly D (110) to the case assembly (280) and secure
using the four screws (120), six screws (130), four washers (140),
four nuts (150) and two spacers (160).
(5) Fitting of Filters (100) and Filter Plate (80)
NOTE: Maximum torque of the filters is 34 ± 5 Ncm.
(a) Fit the four filters (100) to their mounting bracket in the case
assembly (280) or the filter plate (80) and secure using the
filter securing nuts.
(b) Solder (CML-Fk05-085) the wires to the filters (100).
(c) Fit the filter plate (80) with the two filters (100) attached to
the case assembly (280) and secure using the two screws (90).
(6) Fitting of PCB Assembly E (50)
(a) Reconnect connector P12 (IPL figure 2, item 650) to the PCB
assembly E (50).
(b) Fit the PCB assembly E (50) to the case assembly (280) and secure
using the two screws (60) and two screws (70).
(7) Fitting of Sideplates (10 and 20)
(a) Fit the sideplates (10 and 20) to the case assembly (280) and
secure each sideplate using the four screws (30).
(8) Wired Contact Insertion
NOTE: This is a general procedure, for specific details refer to
vendor documentation.
(a) Place the wire to be inserted in the large opening at the colored
end of the insertion/extraction tool.
(b) Hold the tool so that the thumb is over the wire in the opening.
Slide the tool backwards until the wire has slipped into the tool.
Slide the tool forwards until it reaches the shoulder of the
contact.
(c) Push the wired contact into the correctly identified cavity with
a firm and even, but not excessive pressure. When the contact is
fully inserted, the tines of the retaining clip will close over
the shoulder of the contact. This will be denoted by a slight
click.
(d) Withdraw the tool from the rear of the connector. Check that the
contact is locked in position by gently pulling back on the wire.
Remove the tool from the wire.

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4. Storage
A. General
(1) Store the module in its original packing or in a suitable container,
in accordance with ATA specification 300.
(2) Store in a clean, well-ventilated room at a temperature w i t h i n the
range -20° thru +70°C (-4°F thru +158°F) and a humidity of 65%
maximum.
(3) Do not store in the v i c i n i t y of corrosive fluids,electromagnetic,
electrostatic, magnetic and radioactive fields, or near heat or ozone
generating sources.
(4) Position the package so that the identification label can be checked
easily.
B. Preservation
(1) Before packing for storage, the module must be preserved in accordance
w i t h specification MIL-P-116.
C. Packing
(1) Attach an identification label and an ESDS sticker to the module.
(2) Place the module in a clean anti-static bag (for details refer to the
commercial process manual), together with a quantity of approved
desiccant (CML-Fk15-010). The desiccant must be separately contained
in a muslin or cotton bag.
(3) Expel as mush air as possible from the anti-static bag and heat-seal
the opening of the bag.
(4) Place the module into the packing and attach an identification label
and an ESDS sticker to the outside of the package.
D. Identification Labels
(1) Prepare two identification labels showing the module type, part
number, serial number and dates of test,, receipt into storage and
condition checks during storage.
(2) If the identification label is missing, the module cannot be approved
for storage or installation.

"END"

Pa9e709
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FITS AND C L E A R A N C E S

1. General
Torque values for relevant items in the module are given in tabular format,
2. Torque Values
Torque values for relevant items in the module are given in table 801.

IPL FIG TORQUE

AND ITEM
ITEH NO.

1-100 Filter 34 ± 5 Ncm (3,01 ± 0,44 Ibf in)

Torque Values
Table 801

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SPECIAL TOOLS, FIXTURES, EQUIPMENT AND MATERIALS

1. -Introduction
This page-block details the special tools, fixtures, equipment and materials
needed to perform all the procedures detailed in this manual.
2. Special Tools, Fixtures and Equipment
The following table lists the special tools, fixtures and equipment.
Equivalent substitutes can be used for listed items. For details of vendor
codes given in table 901, refer to the CMM introduction.

ITEM NAME SPECIFICATION/ QTY. VENDOR UTILIZATION

NO. PART NUMBER CODE
T D C C R A
E I L H E S
S S E E P S
T A A C A Y
I S N K I /
N S I R S
G Y N T
G 0
R
E

1 DC Power Supply 0-30 V, 3 A 1 Local X

2 Testbox type 27.1-4794-01 1 H0643 X
EGMBT9001
3 Accessories Case 27.1-4794-05 1 H0643 X
4 Grounded Work 8010-3M 1 H1248 X X X X X X
Station
5 Oscilloscope Digital storage 1 .oca! X
(dual channel)
6 Integrated Circuit General purpose AR Local X X
Insertion/
Extraction Tool
7 Contact Insertion/ M81969/14-02 1 71468 X X X
Extraction Tool (20 contact size)

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ITEM NAME SPECIFICATION/ QTY. VENDOR UTILIZATION

NO. PART NUMBER CODE
T D C C R A
E I L H E S
S S E E P S
T A A C A Y
I S N K I /
N S I R S
G Y N T
G 0
R
E

8 Digital Multimeter DC voltage range 0 1 Local X

thru 30 Vdc with
accuracy of:
0,01% + 10 uV (0
thru 200 mV)
0,01% + 30 uV (200
thru 2000 mV)
0,01% + 300 uV (2
thru 20 V)
0,01% + 3 mV (20
thru 30 V)
Input impedance:
> 1000 MOhm (0 thru
20 V)
>10 MOhm (20 thru
30 V)
Ohmmeter range:
0 thru 20 MOhm with
accuracy of 1% +
0,1 Ohm

Special Tools, Fixtures and Equipment

Table 901

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3. Materials
'The following table lists the materials required to perform all the procedures
detailed in this manual. All Fokker originated material numbers are prefixed
by the identity code Fk. For further details on materials and their vendor
codes refer to the consumable material list. Equivalent substitutes can be used
for listed items.

ITEM DESIGNATION MATERIAL NUMBER/ VENDOR UTILIZATION

NO. AND PART NUMBER CODE
SPECIFICATION
T D c C R A
E I L H E S
S S E E P S
T A A C A Y
I S N K I /
N S I R S
G Y N T
G 0
R
E

1 Solder Fk05-085 H0643 X X X

2 Anaerobic Resin Fk08-051 05972 X
3 Desiccant Fkl5-010 16210 X
4 Conformal Coating Fk09-039 71984 X X X
5 Lacing Tape Fk05-090 H0643 X
6 Masking Tape Fk05-115 H1248 X X X
7 Adhesive FK08-001 S5278 X
8 Lint-free Cloth Fk05-044 Local X
9 Heat Conducting FK08-002 05820 X
Paste
10 Anti-static Bag (MIL-B-81705 Local X
type 2)
11 ESDS Label (JEDEC 14, Local X
Form 9892)
12 Anti-static Local X
Shuntfoam
13 Identification Label Local X
Materials
Table 902
"END"

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ILLUSTRATED PARTS LIST

1. ' Introduction
A. Purpose
The purpose of this illustrated parts list is to provide a means of
locating and identifying component parts of the module and to facilitate
the provisioning, storing and issuing of replaceable parts, in accordance
with the approved shop maintenance policy.
B. How to Use the IPL
A series of illustrations are provided on which the replaceable items in
the module are shown. Each illustration identifies the parts by means of
item numbers and, in the case of electrical and electronic components, by
the use of an equipment designator. Each illustration is followed by a
detailed parts list in which all the parts are listed in item number
sequence. From this list the user can obtain the part number,
nomenclature, usage and quantity of each item. The nomenclature is
indented to show the relationship to the main assembly.
A dash (-) in the figure/item number column, preceding the number,
indicates that the item is not shown on the illustration. Where
applicable, vendors are identified by a code number, preceded by a capital
V, following the item description in the nomenclature column. The code
number is as specified in the current issue of federal supply codes for
manufacturers, catalogue handbooks H4-8 and/or NATO codes. The effectivity
codes column gives a letter to each main assembly in an IPL figure. The
same letter then denotes items which can be used with all non-coded items
in the main assembly.
For detailed information concerning FoN numbers refer to standards manual,
substitutes and equivalents list, technical handbook (TH)-16.
Two further lists are given in this page-block. The first of these is a
list of all the equipment designators, together with the relevant
figure/item numbers. The second list is a tabulation of all the part
numbers in the detailed parts lists, in alphanumeric sequence. This list
also gives the total quantity of each item and provision is made for an
airline part number to be inserted against each item.
2. Vendor Names and Addresses
CODE VENDOR'S NAME AND ADDRESS
#1085 See vendor code 71468.
D0080 Leach International Germany GmbH
Hofer Strasse 5, 86720 NOERDLINGEN, Germany
F0326 EFCO SA
P.O. Box 17, 35404 SAINT-MALO, France

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CODE VENDOR'S NAME AND ADDRESS

H2320 AMP Holland BV
Postbus 288, 5201 AG 'S-HERTOGENBOSCH. The Netherlands
H2761 Koning en Hartman Elektrotechniek BV
Postbus 125, 2600 AC DELFT. The Netherlands
H2806 Nijkerk Elektronika BV
Postbus 7920, 1008 AC AMSTERDAM. The Netherlands
K4491 BICC Vero Electronics Ltd.
Electron Way Industrial Way
CHANDLERS FORD. HANTS SOS 3RZ. United Kingdom
04713 Motorola Inc., Semiconductor Products Sector
P.O. Box 2953, PHOENIX. AZ 85008. U.S.A.
12969 Unitrode Corporation
5 Forbes Road, LEXINGTON. MA 02173. U.S.A.
13103 Thermalloy Co. Inc.
P.O. Box 810839, DALLAS. TX 75381. U.S.A.
17856 Siliconix Inc
2201 Laurel Wood Road, SANTA CLARA. CA 95054. U.S.A.
2S738 Sylvan Ginsbury Ltd.
P.O. Box 419, ORADELL. NJ 07649. U.S.A.
34899 Fair-Rite Products Corporation
1 Commercial Row, WALLKILL. NY 12589. U.S.A.
44655 Ohmite Manufacturing Corporation
3601 West Howard Street, SKOKIE. IL 60076. U.S.A.
57550 Relli Technology Inc.
1 South Central Avenue, VALLEY STREAM. NY 11582. U.S.A.
64155 Linear Technology Corporation
1630 McCarthy Boulevard, MILPITAS. CA 95035. U.S.A.
71468 ITT Corporation, ITT Cannon Division
666 East Dyer Road, SANTA ANA. CA 92702. U.S.A.
8N187 TTI International
4033 East Belknap Street, FORT WORTH. TX 76111. U.S.A.
8V269 Knight Electronics International Inc.
31 Myrtle Street, MANHASSET. NY 11030. U.S.A.
80223 See vendor code H2761.
96214 Texas Instruments Inc., Defence Systems and Electronics Group
P.O. Box 226015 M/S, DALLAS. TX 75266. U.S.A.
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THIS PAGE INTENTIONALLY LEFT BLANK

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3. Equipment Designator Index

EQUIPMENT FIG. EQUIPMENT FIG. EQUIPMENT FIG. ,

DESIGNATOR ITEM DESIGNATOR ITEM DESIGNATOR ITEM

CR11 1-240 C501 3-130 C628 2-300

CR12 1-240 C502 3-170 C629 2-350
CR501 3-200 C503 3-170 C630 2-220
CR502 3-190 C504 3-100 C631 2-220
CR503 3-220 C505 3-100 C632 2-220
CR504 3-220 C506 3-180
CR505 3-220 C508 3-110 FL1 1-100
CR506 3-210 C509 3-160 FL2 1-100
CR507 3-210 C510 3-170 FL3 1-100
CR508 3-210 C511 3-110 FL4 1-100
CR509 3-220 C512 3-160
CR510 3-220 C513 3-170 J9 2-610
CR511 3-220 C514 3-120 J10 2-610
CR512 3-220 C515 3-120 J12 3-370
CR513 3-210 C516 3-120 J13 2-620
CR5H 3-210 C517 3-140 J14 1-220
CR515 3-210 C518 3-140 J15 1-260
CR516 3-220 C519 3-150
CR517 3-220 C601 2-340 K1 5- 90
CR518 3-220 C602 2-280 K2 5- 70
CR519 3-220 C603 2-270 K3 5- 30
CR601 2-360 C604 2-280
CR602 2-390 C605 2-250 L1 1-250
CR603 2-380 C606 2-230 12 1-250
CR604 2-370 C607 2-290 L3 1-250
CR605 2-370 C608 2-260 L501 3-270
CR606 2-370 C609 2-250 L502 3-300
CR607 2-370 C610 2-280 L503 3-270
CR608 2-370 C611 2-330 L504 3-270
CR609 2-370 C612 2-230 L601 2-670
CR610 2-400 C613 2-280 L602 2-670
CR611 2-370 C614 2-310
CR612 2-370 C615 2-330 P9 4-110
CR613 2-370 C616 2-330 P10 4-110
CR614 2-370 C617 2-240 P11 2-650
CR615 2-370 C618 2-310
CR617 2-370 C619 2-310 Q501 1-170
CR618 2-370 C620 2-310 Q502 3-230
CR619 2-380 C621 2-280 Q503 1-170
CR620 2-370 C622 2-280 Q504 1-170
CR701 4- 50 C623 2-280 Q505 1-170
CR702 4- 60 C624 2-300 Q506 1-170
CR703 4- 50 C625 2-320 Q507 1-170
CR704 4- 50 C626 2-300 Q601 2-410
CR705 4- 50 C627 2-320 Q602 2-420

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EQUIPMENT FIG. EQUIPMENT FIG. EQUIPMENT FIG.

DESIGNATOR ITEM DESIGNATOR ITEM DESIGNATOR ITEM

Q603 2-430 R626 2- 60

Q604 2-440 R627 2- 60
Q605 2-450 R628 2-200
Q701 4- 70 R629 2-200
R630 2-200
R501 3- 60 R701 4- 20
R502 3- 80 R702 4- 40
R503 3- 30 R703 4- 10
R504 3- 40 R704 4- 30
R505 3- 50
R506 3- 50 TP501 3-330
R507 3- 10 TP601 2-660
R508 3- 30 TP602 2-660
R509 3- 90
R511 3- 10 T501 3-260
R512 3- 20 T601 2-680
R513 3- 20
R514 3- 70 U501 3-240
R515 3- 10 U502 3-250
R516 3- 20 U503 3-250
R517 3- 20 U601 2-530
R601 2-210 U602 2-510
R602 2-160 U603 2-530
R603 2-140 U604 2-470
R604 2-110 U605 2-530
R605 2- 70 U606 2-520
R606 2- 90 U607 2-460
R607 2- 90 U608 2-480
R608 2-120 U609 2-530
R609 2- 50 U610 2-500
R610 2-170 U611 2-490
R611 2-190
R612 2- 20 VR601 2-540
R613 2-100
R614 2- 10
R615 2- 10
R616 2- 30
R617 2- 80
R618 2-180
R619 2-150
R620 2-180
R621 2-100
R622 2- 40
R623 2-100
R624 2-100
R625 2-130

Page 1005
27-36-13 OCT 01/93
 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

4. Numerical Index

AIRLINE TOTAL
' PART NUMBER PART NUMBER FIG. ITEM REQUIRED

CA0391-002 3 350 1
CDR32BX103BKUM 2 220 3
CKM550-150NF100VM 3 160 2
CR100 2 380 2
DBMM5W5P 1 220 1
D110551 1 230 2
EAMBC8816-431 1 1 RF
EAMBC8816D2 3 390 1
EAMBC8816D2-451 1 110 1
3 1 RF
EAMBC8816E2 2 720 1
EAMBC8816E2-451 1 50 1
2 1 RF
EAHBC8816F2 4 120 1
EAMBC8816F2-451 1 180 1
4 1 RF
E3-4-107X001 5 140 1
E3-4-107X002 5 160 1
E3-4-123X001 5 10 1
E3-4-123X002 5 240 1
E3-4-123X003 1 10 1
1 20 1
E3-4-123X004 5 180 1
E3-5-008X001 5 60 1
E3-5-011X005 4 100 2
E3-5-012X005 5 120 5
E3-5-021X001 5 110 1
E3-5-027X002 1 200 4
E3-8-026X001 5 200 1
E3-8-030X005 5 260 2
E3-8-033X006 1 80 1
E3-8-052X004 5 250 4
E3-8-103X001 1 40 2
FON9-1193-20 1 260 1
FON9-1264-20 1 270 1
FON9-1516-03 5 220 1
FON9-1517-1 5 280 1
HCPL5400 2 520 1
IRFM250 1 170 6
4 70 1
IR2110L 3 250 2
JAN1N4148-1 2 370 14
JAN1N4979 3 200 1
4 60 1

Page 1006
27-36-13 OCT 01/93
 COMPONENT MAINTENANCE MANUAL
P/N E A M B C 8 8 1 6

AIRLINE TOTAL
PART NUMBER PART NUMBER FIG. ITEM REQUIRED

JAN1N5552 1 240 2
3 190 1
JAN1N5618 4 50 4
JAN1N5645A 2 390 1
JAN2N2222A 2 410 1
3 230 1
JAN2N2905A 2 420 1
JAN2N4858 2 450 1
JAN2N5116 2 440 1
JAN2N6661A 2 430 1
LM111H 2 490 1
LT1009MH 2 400 1
LT1013AMJ8 2 500 1
LT117AK 2 540 1
LVR2-0-015-1PCT 3 70 1
LVR3-0-005-5PCT 3 90 1
LVR3-0-025-5PCT 3 80 1
4 40 1
MC54HCT08J 2 460 1
MC54HCT73J 2 470 1
MC54HC132J 2 480 1
MS20426AD3-4 5 210 2
MS20426A4-4 5 230 1
MS21042L04 2 580 1
2 640 2
MS21042L06 1 150 4
3 290 1
3 320 1
4 90 1
MS51957-4 1 190 2
1 210 4
MS51957-9 1 70 2
M215D2A 5 70 1
M230D2N 5 90 1
M300D2A 5 30 1
M39003-01-6073 2 320 2
M39003-01-6078 2 330 3
3 150 1
H39003-01-6194 2 350 1
M39003-01-6214 2 340 1
H39014-01-1219V 2 230 2
H39014-01-1225V 3 110 2
M39014-01-1227V 3 100 2
H39014-01-1230V 3 120 3
M39014-01-1231V 2 240 1
M39014-01-1237V 2 250 2
M39014-01-1238V 3 130 1

Page 1007
27-36-13 OCT 01/93
 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816
K1_X

AIRLINE TOTAL
PART NUMBER PART NUMBER FIG. ITEM REQUIRED

H39014-01-1240V 3 140 2
M39014-01-1457V 2 260 1
M39014-01-1467V 2 270 1
H39014-01-1473V 2 280 7
M39014-02-1222V 2 290 1
M39014-02-1230V 2 300 3
M39014-02-1407V 2 310 4
M55342K07B1HOOM 2 200 3
M55342K07B10GOM 3 10 3
M55342K07B100GM 3 30 2
H55342K07B15HOM 3 40 1
M55342K07B22GOH 3 20 4
NAS514P440-4P 5 150 4
5 170 4
5 190 4
NAS514P440-5P 1 30 4
5 270 2
NAS514P632-6P 1 130 6
NAS600-4P 1 60 4
1 120 4
5 20 2
5 40 1
5 80 1
5 100 3
5 130 1
NAS600-6P 2 630 2
NAS600-9P 2 560 1
NAS600-10P 5 50 1
NAS601-4P 1 90 2
NAS601-5P 4 80 1
NAS601-12P 3 280 1
NAS601-16P 3 310 1
NAS620-6 1 140 4
NAS620B4 2 570 2
PA0391-001 3 260 1
PA0391-002 2 680 1
RLR07C10ROGM 2 10 2
RLR07C1001GM 2 50 1
RLR07C1002GM 2 100 4
4 30 1
RLR07C1801GM 2 60 2
RLR07C2200GM 4 10 1
RLR07C2202GM 2 110 1
RLR07C2203GM 2 130 1
RLR07C27ROGM 2 20 1
RLR07C2701GM 2 70 1
RLR07C3002GM 2 120 1

Page 1008
27-36-13 OCT 01/93
 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

AIRLINE TOTAL
PART NUMBER PART NUMBER FIG. ITEM REQUIRED

RLR07C4701GH 2 80 1
4 20 1
RLR07C6801GM 2 90 2
RLR07C7500GM 2 30 1
RLR07C8200GH 2 40 1
RLR20C2200GM 3 50 2
RNC55H1002FM 2 180 2
RNC55H2490FM 2 140 1
RNC55H2741FM 2 160 1
RNC55H5622FH 2 190 1
RNC55H6040FH 2 150 1
RNC55H7151FM 2 170 1
SRA88 2 270 3
SRC400 3 300 1
TE2Q4TA1MH2-0 2 670 2
TIL103 2 530 4
TSC427MJA 3 240 1
UC1526AJ 2 510 1
0-826629-6 2 610 2
1N4005 2 360 1
10025DAP 2 700 1
10117DAP 2 690 6
3 340 1
10310DAP 2 710 5
2DA31SBRP 2 620 1
20-2136J 2 660 2
3 330 1
2230B5 2 550 1
2673000801 1 250 3
3365-20 3 380 AR
3422-0001T 2 650 1
3 360 RF
3 370 1
4804 2 600 1
5806SH 3 210 6
5811SM 3 220 11
6103BASE 2 590 1
674D277H050GE5A 3 170 4
674D277H060HE5A 3 180 1
826044-6 4 110 2
8836 1 160 2
9051-100-0000 1 100 4
91J22R 2 210 1
93J270 3 60 1

27-36-13 Page 1009/1010

OCT 01/93
 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

5. Detailed Parts Lists

FIG. AIRLINE EFF. UNITS

• ITEM PART NUMBER PART NO. NOMENCLATURE CODE PER
1234567 ASSY.

1- 1 EAMBC8816-431 MODULE-POWER (ESDS - RF

SEE NOTE)
10 E3-4-123X003 -PLATE-SIDE, RH 1
20 E3-4-123X003 -PLATE-SIDE, LH 1
ATTACHING PARTS
FOR ITEMS 10 AND 20
30 NAS514P440-5P -SCREW 4
* * *
40 E3-8-103X001 -PLATE-INSULATING 2
50 EAMBC8816E2-451 -BOARD-PRINTED 1
CIRCUIT, ASSEMBLY E
(ESDS - SEE NOTE)
(FOR DETAILED
BREAKDOWN R E F E R TO
IPL FIGURE 2)
ATTACHING PARTS
60 NAS600-4P -SCREW 4
70 MS51957-9 -SCREW 2
* * *
80 E3-8-033X006 -PLATE-FILTER 1
ATTACHING PARTS
90 NAS601-4P -SCREW 2
* * *
100 9051-100-0000 -FILTER VH2806 4
(SUPPLIED WITH
ATTACHING PARTS)
110 EAMBC8816D2-451 -BOARD-PRINTED 1
CIRCUIT, ASSEMBLY D
(ESDS - SEE NOTE)
(FOR DETAILED
BREAKDOWN R E F E R TO
IPL FIGURE 3)
ATTACHING PARTS
120 NAS600-4P -SCREW 4
130 NAS514P632-6P -SCREW 6

NOTE: Electrostatic discharge sensitive (ESDS). Do not subject to

electromagnetic, electrostatic/ magnetic or radioactive fields
unless protected by a static shielded container.

- ITEM NOT ILLUSTRATED

Page 1013
27-36-13 OCT 01/93
 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

FIG. AIRLINE EFF. UNITS

ITEM PART NUMBER PART NO. NOMENCLATURE CODE PER
1234567 ASSY.

1 140 NAS620-6L -WASHER 4

150 MS21042L06 -NUT 4
160 8836 -SPACER-THREADED 2
V2S738
* * *
170 IRFM250 -TRANSSTR-N CHANNEL 6
ENHANCEMENT MODE
MOS FIELD E F F E C T
(ESDS - SEE NOTE)
V57550
180 EAMBC8816F2-451 -BOARD-PRINTED 1
CIRCUIT, ASSEMBLY F
(ESDS - SEE NOTE)
(FOR DETAILED
BREAKDOWN REFER TO
IPL FIGURE 4)
ATTACHING PARTS
190 MS51957-4 -SCREW 2
* * *
200 E3-5-027X002 -SPACER-THREADED 4
ATTACHING PARTS
210 MS51957-4 -SCREW 4
* * *
220 DBMM5W5P -CONNECTR V2S738 1
ATTACHING PARTS
230 D110551 -POST-JACK V8V269 2
* * *
240 JAN1N5552 -DIODE-ZENER 2
250 2673000801 -INDUCTOR V34899 3
260 FON9-1193-20 -CONNECTR-JIFFY 1
JUNCTION
-270 FON9-1264-20 -CONTACT (FOR ITEM 1
260)
280 NP27-36-13-001 -CASE, ASSEMBLY (FOR RF
DETAILED BREAKDOWN
R E F E R TO IPL
FIGURE 5)

NOTE: E Lectrostatic discharge sensitive (ESDS). Do not subject to

e lectrowagnet ic, electrostatic, magnetic or radioactive fields
u nless protected by a static shielded container.

- ITEM NOT ILLUSTRATED

Page 1014
27-36-13 OCT 01/93
 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

ATTENTION
STATIC SENSITIVE COMPONENTS (ESDS)
HANDLE ONLY AT STATIC SAFE TRACK SIDE
WORKSTATION
300 60 370 100 130 720 60 110 370 540 370 40 100 370 10 250 280 160 140 660 370 350
490 \ \ \ \
710.

670

530
710

220 200 200 220 200 220

DETAIL Q602

560
PCB

DETAIL VR6Q1
\ \ CR601[jP\CR604 *
\ \ M\l\ \CR605 >

CCD

PCB

530 590
710

410 170 / 260 / 90 430 I 70 \ 100 \ 360 380 460 530

690 700 I \ \ 690 710 600
640 290 620 190 50 280 310 210 280 230

CMM-27-5227A
Printed C i r c u i t Board Assembly E
IPL Figure 2

Page 1015/1016
27-36-13 OCT 01/93
 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816
210
200
ATTENTION
10
STATIC SENSITIVE COMPONENTS (ESDS)
HANDLE ONLY AT STATIC SAFE
WORKSTATION 40
120

20

170
(Q505)

170
(Q504)

70

250
60
(LI)

230 — VIEW A CMM-27-5223A

Power Module
IPL Figure 1

Page 1011/1012
27-36-13 OCT 01/93
 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

FIG. AIRLINE EFF. UNITS

ITEM PART NUMBER PART NO. NOMENCLATURE CODE PER
1234567 ASSY.

2- 1 EAMBC8816E2-451 BOARD-PRINTED CIRCUIT, RF

ASSEMBLY E (ESDS - SEE
NOTE) (REFER TO IPL
FIGURE 1 FOR N H A )
10 RLR07C10ROGM -RESISTOR 10 OHM 2
2%; 250 mW
20 RLR07C27ROGM -RESISTOR 27 OHM 1
2%; 250 mW
30 RLR07C7500GM -RESISTOR 750 OHM 1
2%; 250 mW
40 RLR07C8200GM -RESISTOR 820 OHM 1
2%; 250 mW
50 RLR07C1001GM -RESISTOR 1 kOHM 1
2%; 250 mU
60 RLR07C1801GM -RESISTOR 1k8 OHM 2
2X; 250 mU
70 RLR07C2701GM -RESISTOR 2k7 OHM 1
2%; 250 mW
80 RLR07C4701GM -RESISTOR 4k7 OHM 1
2X; 250 mW
90 RLR07C6801GM -RESISTOR 6k8 OHM 2
2%; 250 mW
100 RLR07C1002GM -RESISTOR 10 kOHM 4
2%; 250 mW
110 RLR07C2202GM -RESISTOR 22 kOHM 1
2%; 250 mW
120 RLR07C3002GM -RESISTOR 30 kOHM 1
2X; 250 mU
130 RLR07C2203GM -RESISTOR 220 kOHM 1
2%; 250 mW
140 RNC55H2490FM -RESISTOR 249 OHM 1
1%; 125 mU
150 RNC55H6040FM -RESISTOR 604 OHM 1
1%; 125 mW
160 RNC55H2741FM -RESISTOR 2k74 OHM 1
1%; 125 mU
170 RNC55H7151FM -RESISTOR 7k15 OHM 1
1%; 125 mU

NOTE: Electrostatic d i s c h a r g e sensitive (ESDS). Do not subject to

electromagnetic, electrostatic, m a g n e t i c or r a d i o a c t i v e fields
unless protected by a static shielded container.

- ITEM NOT ILLUSTRATED

Page 1017
27-36-13 OCT 01/93
 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

FIG. AIRLINE EFF. UNITS

ITEM PART NUMBER PART NO. NOMENCLATURE CODE PER
1234567 ASSY.

2 180 RNC55H1002FM -RESISTOR 10 kOHM 2

1%; 125 mU
190 RNC55H5622FM -RESISTOR 56k2 OHM 1
U; 125 mW
200 M55342K07B1HOOM -RESISTOR 1 kOHM 3
V8N187
210 91J22R -RESISTOR 22 OHM 1
1,5 W
220 CDR32BX103BKUM -CAPACITR 10 nF; 100 V 3
V8N187
230 M390H-01-1219V -CAPACITR-CERAMIC 2
100 pF; 10% ; 200 V
240 M39014-01-1231V -CAPACITR-CERAMIC 1
470 pF; 10% ; 200 V
250 M39014-01-1237V -CAPACITR-CERAMIC 2
1 nF; 10% ; 200 V
260 MS9014-01-1457V -CAPACITR-CERAMIC 1
12 nF; 10% ; 50 V
270 M39014-01-1467V -CAPACITR-CERAMIC 1
47 nF; 10% ; 50 V
280 M39014-01-1473V -CAPACITR-CERAMIC 7
100 nF; 10% ; 50 V
290 M39014-02-1222V -CAPACITR-CERAMIC 1
22 nF; 10% ; 100 V
300 M39014-02-1230V -CAPACITR-CERAMIC 3
100 nF; 10% ; 100 V
310 M39014-02-1407V -CAPACITR-CERAMIC 4
1 uF ; 10% ; 50 V
320 M39003-01-6073 -CAPACITR-TANTALUM 2
2u2 F; 20 V; 10%
330 M39003-01-6078 -CAPACITR-TANTALUM 3
10 uF; 20 V; 10%
340 M39003-01-6214 -CAPACITR-TANTALUM 1
4u7 F; 50 V; 10%
350 M39003-01-6194 -CAPACITR-TANTALUM 1
1 uF; 50 V; 10%
360 1N4005 -DIODE 1 A; 1
600 V V8V269
370 JAN1N4148-1 -DIODE V8V269 14
380 CR100 -DIODE-CURRENT 2
REGULATING V17856
390 JAN1N5645A -DIODE-ZENER 33 V 1

- ITEM NOT ILLUSTRATED

27-36-13 Page 1018

OCT 01/93
 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

FIG. AIRLINE EFF. UNITS

ITEM PART NUMBER PART NO. NOMENCLATURE CODE PER
1234567 ASSY.

2 400 LT1009MH -DIODE-REFERENCE 1

2,5 V; 0,2% V64155
(ESDS - SEE NOTE)
410 JAN2N2222A -TRANSSTR-NPN V8V269 1
420 JAN2N2905A -TRANSSTR-PNP 1
430 JAN2N6661A -TRANSSTR-N CHANNEL 1
ENHANCEMENT MODE MOS
FIELD E F F E C T V8V269
(ESDS - SEE NOTE)
440 JAN2N5116 -TRANSSTR-P CHANNEL 1
JUNCTION FIELD E F F E C T
(ESDS - SEE NOTE)
V57550
450 JAN2N4858 -TRANSSTR-N CHANNEL 1
JUNCTION FIELD E F F E C T
(ESDS - SEE NOTE)
460 MC54HCT08J -IC-QUAD 2-INPUT AND 1
GATE V04713 (ESDS -
SEE NOTE)
470 MC54HCT73J -IC-DUAL JK FLIP FLOP 1
V04713 (ESDS - SEE
NOTE)
480 MC54HC132J -IC-QUAD 2-INPUT NAND 1
GATE V04713 (ESDS -
SEE NOTE)
490 LM111H -IC-COMPARATOR V8V269 1
500 LT1013AMJ8 -IC-DUAL OPERATIONAL 1
A M P L I F I E R V8V269
510 UC1526AJ -IC-PULSE WIDTH 1
MODULATOR V12969
520 HCPL5400 -IC-OPTO-ISOLATOR 1
V2S738 (ESDS - SEE
NOTE)
530 TIL103 -IC-OPTO-ISOLATOR 4
V96214
540 LT117AK -REGULATR-ADJUSTABLE 1
VOLTAGE V64155
550 2230B5 -HEATSINK VF0326 1
ATTACHING PARTS

NOTE: E l e c t r o s t a t i c discharge sensitive (ESDS). Do not subject to

electromagnetic, electrostatic, magnetic or radioactive fields
unless protected by a static shielded container.

- ITEM NOT ILLUSTRATED

Page 1019
27-36-13 OCT 01/93
 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

FIG. AIRLINE EFF. UNITS

ITEM PART NUMBER PART NO. NOMENCLATURE CODE PER
1234567 ASSY.

2 560 NAS600-9P -SCREW 1

570 NAS620B4 -WASHER 2
580 MS21042L04 -NUT 1
* * *
590 6103BASE -HEATSINK V13103 1
ATTACHING PARTS
600 4804 -KIT-MOUNTING V13103 1
* * *
610 0-826629-6 -CONNECTR V2S738 2
620 2DA31SBRP -CONNECTR V2S738 1
ATTACHING PARTS
630 NAS600-6P -SCREW 2
640 MS21042L04 -NUT 2
* * *
650 3422-0001T -CONNECTR V2S738 1
660 20-2136J -PIN-TEST VK4491 2
670 TE2Q4TA1MH2-0 -INDUCTOR 1 mH 2% 2
V8V269
680 PA0391-002 -TRNSFRMR 1
690 10117DAP -PAD-MOUNTING V8V269 6
(FOR ITEMS 380,400,
410,440 AND 450)
700 10028DAP -PAD-MOUNTING V8V269 1
(FOR ITEM 430)
710 10310DAP -PAD-MOUNTING V8V269 5
(FOR ITEMS 490 AND
530)
720 EAMBC8816E2 -BOARD-PRINTED CIRCUIT 1

- ITEM NOT ILLUSTRATED

Page 1020
27-36-13 OCT 01/93
 COMPONENT MAINTENANCE MANUAL
P/N EANBC8816

ATTENTION
STATIC SENSITIVE COMPONENTS (ESDS)
HANDLE ONLY AT STATIC SAFE
WORKSTATION

230 280 280 310 280

200 80 130 190 340 270 290 60 390 100 290 300 320 270 290 120 110 250 140 270 160 220 220 210 20 10 210 20 210

120 240 90 370 260 170 380 170 50 330 50 170 150 170 70 120 250 140 110 160 180 10

COMPONENT SIDE TRACK SIDE

CMM-27-5225A
Printed C i r c u i t Board Assembly D
IPL Figure 3

Page 1021/1022
27-36-13 OCT 01/93
 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

TP E4 TP E7 TP E8 TP E2 TP E3

TP 602

R620 || R619

JJL wm

o
0
in
Csl
LJ
CNI

1 _1
CS ^_

C£L o:
00
vO
o: ce
LJ
vO

i v
J10 II • J9 I
J

TP E9 TP E5 TP E6 TP E1 TP E11 TP E10

ATTENTION
STATIC SENSITIVE COMPONENTS (ESDS)
HANDLE ONLY AT STATIC SAFE
WORKSTATION

CMM-27-5269A

Printed C i r c u i t Board Assembly E - Component Layout

Figure 109 (Sheet 1)

Page 129
27-36-13 OCT 01/93
COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

so
0:1

R630 C632
I
C631 R629
II I
i cm

CMM-27-5270A
Printed C i r c u i t Board Assembly E - Component Layout
Figure 109 (Sheet 2)

Page 130
27-36-13 OCT 01/93
 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816
^^/

REVISION REVISION DESCRIPTION SERIAL NO.

CODE EFFECTIVITY

Revision Reference Sheet for Figure 110

Page 131/132
27-36-13 OCT 01/93
 COMPONENT MAINTENANCE MANUAL
P/N EAHBC8816

VR601
61 3
LT117AK P11

f28VDCI ° +15VDC
C629
J- C602 12 +15VDC
OOn 50V
+28VDCI TP E3

415V
ATTENTION
428VDCI STATIC SENSITIVE COMPONENTS (ESDS)
HANDLE ONLY AT STATIC SAFE
+28VDCI
WORKSTATION
PSCS-H

PSC5-L
I-28VRTN
*>28VRTN -CS +CS *ER -£R COMP TP E4
ERR
SifTDN
+5VDC
C611
PS-EN-H J-C610 t tO/A
OOn 20V
10 +45VDC
--C604 \ 6k8 J-C605 11
R629
PCTL-L 1k J13

UPA-H
.C631
'10n
29 UPA-L
nA-
P11
x—
17 PSDR
PA-EN-H BRSD
15 PCMDR-I
R630 1k
——————' V V V————— J UM-H
J13
t 26 UM-H

3 1 PS-INOP-H

I 1
)
- C632
N

L
10n
m
P11

20 PSODR

ENABLE LOGIC
CMM-27-5271A

Printed C i r c u i t Board Assembly E - Schematic Diagram

Figure 110 (Sheet 1)

Page 133/134
27-36-13 OCT 01/93
 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816
J9 J13
+28VGFS
5 4
+10V DPID
27

^
3
DPIS
CR607 < R614 •O TP E8 1 8
10R SO-MON-H
C615 2 6
TP 602 ATTENTION BCO-I2
4 12
20V
STATIC SENSITIVE COMPONENTS (ESDS) 6
HANDLE ONLY AT STATIC SAFE
C616 WORKSTATION
10/4
..NOT!^ UNLESS OTHERWISE STATED ALL J10
20V
DIODES ARE 1N4148 TYPE +28VRET1
-O TP E9 6 22
+28VDPS
-+ -10V 2 7
DPER
1 28
CURRENT MEASUREMENT POWER SUPPLY CIRCUIT ACT-EN-MON
C621 -L 3 2
100n £ DPDR
J13 5 5
U608-4 TP £10 _A_ -JU-
PCTL-H 25 U606
HCPL5400 U607-4 A 0
P11

>
54HCT08 12

> TV-
12

Q 1
VA2 13 BR1DR
13 •AAAr
VEYGN, R616 *5V
C617
3 7 5 750R 111!
PWM-L
420p
A C623
TP E11
Q
+10V
» , x «• jiii U~ C622

>
II 100n
3 2 u ^
U608-3 4 lillBllllI BR2DR
U609
TIL103 L U608-1

>
TP 601 54HC132
,8 1:1
: 111
CMCT-L 20
1 10

PWM PULSE CONDITIONER

§iiiiil
-10V +10V
1

TE2-Q4-TA1mH2
L601 R619 R620
•2 604k 10,0k
CMCI-H
+10V 4-10V
SHT. 2 4r C624

C618-J-
R617
4K7 R618
10KO
-WV
•^ T
C625 _L C626
2M2 T 100n
100n

V 20V V
UM-L CR611 - - X CR612

4 U610-1
CR610 LT1013 CMCP-L
^1009.1. C619
TE2-Q4-TA1mH2 ^2Y5 100n
L602
I ^' _ ^. ^_ L
CMCI-L 100nT 2/^2^. -10V CMCP-H
20V
CURRENT MEASUREMENT CIRCUIT ^ ^ VOLTAGE TO PULSE LENGTH CONVERTER

Printed C i r c u i t Board Assembly E - S c h e m a t i c Diagram

Figure 110 (Sheet 2)

Page 135/136
27-36-13 OCT 01/93
COMPONENT MAINTENANCE MANUAL
P/N EAHBC8816

CR702 1 CR701 1
c)
y
R701
1CR704 ||CR705
El i
R702 u_

(—
r-

©
u_
Q701
———>
m oo in
u_ u_ u_
A HID
——> m
rr\
0 0 o
C£ xO
CfL L_J LL_ LL_ u_

P9 •)! P10 •
O

ATTENTION
STATIC SENSITIVE COMPONENTS (ESDS)
HANDLE ONLY AT STATIC SAFE
WORKSTATION

CMM-27-5275A

Printed C i r c u i t Board Assembly F - Component Layout

F i g u r e 111

137/138
"" 1I OCT 01/93
 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

REVISION REVISION DESCRIPTION SERIAL NO.

CODE EFFECTIVITY

Revision Reference Sheet for Figure 112

Page 139/140
27-36-13 OCT 01/93
r WWI VlrWIMCIM 1 IVI/-\IIM 1 OMMSMV^C IV5MSMUML
rr«,y^
(^y P/N
EAMBC8816

P10

F1
O———————— 2 +28VDPS

F2 R701 A L ATTENTION
- STATIC SENSITIVE COMPONENTS (ESDS)
I 4K7 -L Ifo^L HANDLE ONLY AT STATIC SAFE
P9
X CR701 mMU K& WORKSTATION

0———————1-H ———————————————————*——————— DPID

1 _L> P10

£
Q701
IRFM250 ———VSA/———————r————————— DPDR
2
220R
V, rv CR702 P9
J ^ 1N497C)
75V i 1 DPIS
6 +28VRET1
<>> R702 <> R704
<> 25m <> 10K
P10

.
1- i
LVR3
F4

• 6 + 28VRET1

F5
0———————— 4 + 28VDC1

] I CR703
F6
o—————— 3 ACT-EN-MON

P9
F7
O———————— 5 + 28VGFS

] [ CR704 ] [ CR705
F8
O———————— 4 BCO-I2

P10
F9
o————— 1 DPER

P9

F10
o—————— 2 SO-MON-HI

F11
O——————|
DISPATCH POSITION DRIVER

CMM-27-5273A

Pr inted C i rcuit B o a r d A s s e m b l y F - Sch e m a t i c D i a g r a m

F i g u r e 112

27-;36-1: 5
3
Page 141
OCT 01/93
COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

ADJ

f
PIN CONFIGURATION FUNCTIONAL DIAGRAM

CMM-21-5028A
C R 6 1 0 - 2,5 Vdc R e f e r e n c e Diode
F i g u r e 113

C3 C2 C1

B3 ^ B2 B1
XI A1
A3 ^ A2 A1 (+)————ok
(-)———oJ>

PIN CONFIGURATION FUNCTIONAL DIAGRAM

CMM-27-5300A

K1 - Relay
F i g u r e 114

Page 142
27-36-13 OCT 01/93
COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

A3

X1 X2
o A2
©
A1

PIN CONFIGURATION FUNCTIONAL DIAGRAM

CMM-27-53Q1A
K2 - Relay
F i g u r e 115

A1 B1
X1 X2
A2 B2
A3 B3

PIN CONFIGURATION SCHEMATIC DIAGRAM

CMM-24-X053A
K3 - Relay
F i g u r e 116

Page 143
27-36-13 OCT 01/93
 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

DRAIN
o

GATE SOURCE
GATE o-

1
SOURCE

DRAIN

PIN CONFIGURATION FUNCTIONAL DIAGRAM

CMM-73-5029A
Q501, Q503 thru Q507 and Q701 - N Channel Enhancement Mode MOSFET
F i g u r e 117

BASE
COLLECTOR

BASE
EMITTER COLLECTOR

EMITTER

PIN CONFIGURATION FUNCTIONAL DIAGRAM

CMM-30-5040A
Q502 and Q601 - NPN Transistor
F i g u r e 118

Page 144
27-36-13 OCT 01/93
 COMPONENT MAINTENANCE MANUAL
P/N E A M B C 8 8 1 6

BASE
COLLECTOR

BASE
EMITTER COLLECTOR

EMITTER

PIN CONFIGURATION FUNCTIONAL DIAGRAM

CMM-73-5170A
Q602 - PNP T r a n s i s t o r
F i g u r e 119

GATE DRAIN
o

SOURCE DRAIN GATE O-

o
SOURCE

PIN CONFIGURATION FUNCTIONAL DIAGRAM

CMM-27-5298A
Q603 - N Channel Enhancement Mode MOSFET
Figure 120

Page 145
27-36-13 OCT 01/93
 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

DRAIN

DRAIN

SOURCE GATE
GATE

SOURCE

PIN CONFIGURATION FUNCTIONAL DIAGRAM

CMM-27-5330A
Q604 - P Channel J F E T
F i g u r e 121

DRAIN

DRAIN

SOURCE GATE GATE

SOURCE

PIN CONFIGURATION FUNCTIONAL DIAGRAM

CMM-27-5297A
Q605 - N Channel JFET
Figure 122

Page 146
27-36-13 OCT 01/93
 COMPONENT MAINTENANCE MANUAL
P/N EAHBC8816

OUTA

N/C N/C

INA OUTA

GND

INB OUTB

INB OUTB
PIN CONFIGURATION

GND

FUNCTIONAL DIAGRAM

CMM 27-5187A
U501 - Dual MOSFET D r i v e r
F i g u r e 123

•
-\j
LO [^ 1 14 ^j N/C

COM Q 2 13 U v-
v. H 3 12 [] LIN

N/C Q 4 A „ USD
vs Q 5 10 ^] HIN

VB Q 6 9 ^] VDD

HO Q 7 8 ^] N/C

PIN CONFIGURATION

CMM 27-5186A

U502 and U503 - MOSFET D r i v e r A m p l i f i e r

Figure 124

Page 147
27-36-13 OCT 01/93
 COMPONENT MAINTENANCE MANUAL
P/N E A M B C 8 8 1 6

BASE
ANODE COLLECTOR
BASE ( 2

CATHODE EMITTER

EMITTER CATHODE

(BOTTOM VIEW)
PIN CONFIGURATION FUNCTIONAL DIAGRAM

CMM 27-5020A

U601, U603, U605 and U609 - Opto-isolator

Figure 125

27-36-13 Page 148

OCT 01/93
 COMPONENT MAINTENANCE MANUAL
P/N E A M B C 8 8 1 6
\L^
^ERROR Q 1 18 ^\ VREF

-ERROR [^ 2 17 ^ WIN

COMPENSATION Q 3 16 ^] OUTPUT B

C SOFTSTART Q 4 15 ^] GROUND

RESET Q 5 ^t 14

-CURRENT SENSE Q 6 13 ~^j OUTPUT A

-^CURRENT SENSE Q 7 12 ^ SYNC

SHUTDOWN Q B 11 ~^\ RD

R TIMING Q 9 10 DCT
P IN CONFIGURATION
VREF

REFERENCE UNDER
+ VIN * REGULATOR f VOLTAGE ———
LOCKOUT
Tn INTFRNAI
nun* 1
^ CIRCUITRY

RD
* SYIC
OUTPUT
R TIMING *——— ———'——— 1
OSCILLATOR ——1————————— ^-4 A

CT »——f- pZ_^^
|
MEMORY TOGGLE
F/F F/F
kbbbi'i—— ——*—— \ \——— O S Q ---«
SOFT
C.SOFT START "
START*———'———————l - - r-D QJ Q---I
rnMPFN,,
SATION

+ERROR*——— "^^L
+yjN
,,

AMP "^>—i —— y'

X.

U >>~
r-
———^

———S
o
SQ

Q"
jy OUTPUT
B

-ERROR •——— -^ METERING

F/F
+CURRENT.___ >x^
SENSE ^^

-CURRENT S^
SENSE*——— -^

FUNCTIONAL DIAGRAM CMM-27-5191A

U602 - Pulse W i d t h Modulator
F i g u r e 126

27-36-13 Page 149

OCT 01/93
COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

F_ ^ J1 —————— J Q Q1
J ———
CLK 1 Q 1 14 H Ji CLK 1 ———C >CLK
r~l
LLr\D *il 11 2 13 ^| 01
M_ K
OR Q QT
K1C 3 12 H 01
ri n 1

vcc [2 4 A^ 11^] GND

CLK 2 Q 5 10 ^] K2 J2 ———— J Q Q2
2
CLFT [2 6 9 ^] 02 CLK 2 ———C »CLK

J2 £ 7 8 UQ2 I/O K 02
OR 0"

D IM rnNF iniiDATin M n r? 9

FUNCTIONAL DIAGRAM

INPUTS OUTPUTS
OR CLK J K Q Q
L X X X L H
H ^_ L L 00 00
H -x. H L H L
H "V L H L H
H H H TOGGLE
H H X X 00 00

X DONT CARE

TRUTH TABLE

CMM-27-X061A
U604 - Dual JK F l i p - F l o p
F i g u r e 127

Page 150
27-36-13 OCT 01/93
r—ri—i uuiviruiMCiM i IVIMIIM i ci
(TIuk&)
^^y P/N EAMBC8816

NC Q 1 8 H v^ INPUT +

INPUT + Q 2 7 ^ ENABLE
A OUTPUT
INPUT - Q 3 6 ^] OUTPUT
INPUT -
NC Q 4 5 ^ GND
GND
ENABLE

PIN CONFIGURATION FUNCTIONAL DIAGRAM

INPUT ENABLE OUTPUT

H H Z
H L H
L L L

TRUTH TABLE CMM-27-5195A

U606 - Opto-Isolator
F i g u r e 128

A1
__ ^ Y1
^———— B1
v+
A1 Q 1 14 Zl
Bid 2 13 ^] B4 A2
Y2
Y1C 3 12 ~^\ A4 B2

A2 Q 4 ^k 11
H Y4
A3
Y3
B2 Q 5 10 UBS B3
Y2 Q 6 9 H A3

GND Q 7 8 A4
U Y3
Y4
B4

Y = A.B
PIN CONFIGURATION FUNCTIONAL DIAGRAM

CMM 27-X065A
U607 - Quad 2-input AND Gate
Figure 129

27-36-13 Page 151

OCT 01/93
 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

• —v^
1A £ 1 14 m y+
1B £ 2 13 ^ 4B

1Y Q 3 12 ^] 4A

2AC 4 A * H4Y

2BC 5 10 U 3B

2Y Q 6 9 H 3A

GND Q 7 8 D3Y

Y = A.B

PIN CONFIGURATION FUNCTIONAL DIAGRAM

CMM 27-5192A
U608 - Quad 2-input NAND S c h m i t t T r i g g e r Gate
F i g u r e 130

-OUTPUT A
>M^
OUTPUT A Q 1 8

-IN A [^ 2 ^] OUTPUT B

4-IN A Q 3
A 6' U -IN B -|N B

•OUTPUT B
v- C 4 5 ^] 4-IN B 4-IN B ————

PIN CONFIGURATION
FUNCTIONAL DIAGRAM

CMM-27-5021A

U610 - Dual Op-Amp

Figure 131

Page 152
27-36-13 OCT 01/93
 COMPONENT MAINTENANCE MANUAL
P/N E A M B C 8 8 1 6

BALANCE
GND OUTPUT
V+-
BALANCE/
STROBE
BALANCE/ IN-*
STROBE OUTPUT

IN- GND

BALANCE V-

V-
PIN CONFIGURATION FUNCTIONAL DIAGRAM

CMM 24-5032A
U611 - C o m p a r a t o r
F i g u r e 132

ADJUSTMENT INPUT

OUTPUT(CASE)

PIN CONFIGURATION

CMM 29-5036A

VR 601 - A d j u s t a b l e V o l t a g e R e g u l a t o r
F i g u r e 133
"END 1 1

Page 153
27-36-13 OCT 01/93
 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

DISASSEMBLY
1. 'Techniques and Precautions
Standard techniques for the disassembly of electronic units apply. Before
making any electrical disconnections install identification tags on the wires
to aid correct reconnection. Before removal of electronic components, relays
and tantalum capacitors, note the polarity and position of the components for
correct assembly, for details refer to the IPL. Solder (CML-Fk05-085) may be
used for de-soldering components in the following procedures.
CAUTION: THIS MODULE CONTAINS DEVICES SENSITIVE TO STATIC ELECTRICITY.
OBSERVE THE ESDS CAUTION IN PAGE-BLOCK 101.
CAUTION: THE PRINTED CIRCUIT BOARD ASSEMBLIES ARE CONFORMAL COATED. REMOVE
THE CONFORMAL COATING (CML-Fk09-039) FROM AROUND THE WIRES, PINS OR
CONTACTS OF THE COMPONENT TO BE REMOVED BEFORE DE-SOLDERING.
CAUTION: WHEN UNSOLDERING TRANSISTORS, DIODES AND INTEGRATED CIRCUITS USE A
LOW WATTAGE, GROUNDED SOLDERING IRON.
2. Special Tools and Materials
The special tools and materials are listed in page-block 901.
3. Procedures
A. Removal of Components from Main Assembly
Unless otherwise stated, the item numbering used in the following
procedures refers to the numbered annotations in IPL figure 1.
(1) Removal of Sideplates (10 and 20)
(a) Remove the four screws (30) securing each sideplate to the case
assembly (280).
(b) Remove the sideplates from the case assembly (280).
(2) Removal of PCB Assembly E (50)
(a) Remove the two screws (60) and two screws (70) securing the PCB
assembly (50) to the case assembly (280).
(b) Disconnect connector Pll (IPL figure 2, item 650) from the PCB
assembly (50).
(c) Remove the PCB assembly (50) from the case assembly (280).
(3) Removal of Filter Plate (80) and Filters (100)
(a) Remove the two screws (90) securing the filter plate (80) to the
case assembly (280).

1 O0 Page 301
MAY 01/96
 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

(b) Desolder the wires from the two filters (100) attached to the
filter plate (80).
(c) Remove the filter plate (80) with the two filters (100) from the
case assembly (280).
(d) Desolder the wires from the two remaining filters (100) attached
to the case assembly (280).
(e) Remove the nuts securing the filters (100) to the filter plate
(80) and case assembly (280).
(f) Remove the filters (100).
(4) Removal of PCB Assemblies D and F (110 and 180)
(a) Remove the four screws (120), six screws (130), four washers
(140), four nuts (150) and two spacers (160) securing the PCB
assembly D (110) to the case assembly (280).
(b) Remove PCB assembly D (110) from the case assembly (280) with PCB
assembly F and the flat cable assembly (IPL figure 3, item 350)
still attached.
(c) Remove the two screws (190) securing PCB assembly F (180) to PCB
assembly D (110).
(d) Remove PCB assembly F (180) from PCB assembly D (110).
(e) Disconnect connector J12 (IPL figure 3, item 370) from PCB
assembly D (110) and remove the flat cable assembly (IPL figure 3,
item 350).
(5) Removal of Connector J14 (220) and Diodes CR11 and CR12 (240)
(a) Remove the two jack posts (230) securing the connector (220) to
the case assembly (280).
(b) Desolder the wires and the diodes CR11 and CR12 (240) from the
connector (220).
(c) Remove the connector (220) and the diodes (240) from the case
assembly (280).
(6) Removal of Inductors (250)
(a) Desolder the inductor (250) from the w i r i n g loom.
(b) Cut the lacing tape, if applicable, and remove the inductors (250)
from the case assembly (280).
(7) Removal of Connector J15 (260)
(a) Extract the wired contacts from the connector (260), for details
refer to paragraph 3A(8).
(b) Remove the connector (260).
(8) Wired Contact Extraction
NOTE: This is a general procedure, for more specific details refer to
vendor documentation.
(a) Place the wire of the contact to be extracted into the large
opening at the w h i t e end of the insertion/extraction tool.

P89 302
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 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

(b) Slide the tool back on the wire, holding the thumb against the
wire at the opening, until the wire slips into the tool.
(c) Push the tool into the cavity until it bottoms. At this point the
tool releases the tines on the retaining clip, and the contact can
be extracted.
(d) Maintaining a slight pressure on the tool, firmly hold the wire
against the serrated shoulder at the center of the tool, and
extract the wired contact and the tool from the connector.
(e) Repeat this operation for the remaining wired contacts.
B. Removal of Components from PCB Assembly E
Unless otherwise stated, the item numbering used in the following
procedures refers to the numbered annotations in IPL figure 2.
(1) Removal of Voltage Regulator VR601 (540) and Heatsink (590)
(a) Remove the mounting kit (600) securing the heatsink (590) to the
PCB (720).
(b) Desolder the pins and remove the voltage regulator (540) and the
heatsink (590) from the PCB (720).
(2) Removal of Transistor Q602 (420) and Heatsink (550)
(a) Remove the screw (560), two washers (570) and nut (580) securing
the heatsink (550) to the PCB (720).
(b) Desolder the pins and remove the transistor (420) and heatsink
(550) from the PCB (720).
(3) Removal of Connector J13 (620)
(a) Remove the two screws (630) and two nuts (640) securing the
connector (620) to the PCB (720).
(b) Desolder the contacts of the connector (620) from the PCB (720)
and remove the connector (620).
(4) Removal of Integrated C i r c u i t s (460 thru 530)
(a) Select the correct size extraction tool for the integrated c i r c u i t
to be removed.
(b) Open the extraction tool jaws by pressing the plunger, and
position the tool over the integrated circuit. Release the
plunger, ensuring that the integrated c i r c u i t is firmly gripped by
the jaws.
(c) Reflow the solder by applying a de-solder block to the integrated
c i r c u i t terminal joints.
(d) Withdraw the integrated c i r c u i t .
(e) Remove the mounting pad, if applicable.
(5) Removal of Other Components
(a) Desolder the component connections from the PCB, observing the
standard techniques.

Page 303
OCT 01/93
 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

(b) Withdraw the component from the PCB.

(d) Remove the mounting pad, if applicable.
C. Removal of Components from PCB Assembly D
Unless otherwise stated, the item numbering used in procedure 3C(1) refers
to the numbered annotations in IPL figure 1. For procedures 3C(2) thru
3C(5) refer to IPL figure 3.
(1) Removal of Transistors Q501 and Q503 thru Q507 (170)
(a) Desolder the pins of the transistor (170) from the PCB assembly
(110).
(b) Remove the transistor (170) from the PCB assembly (110).
(2) Removal of Integrated Circuits (240 and 250)
(a) Select the correct size extraction tool for the integrated circuit
to be removed.
(b) Open the extraction tool jaws by pressing the plunger, and
position the tool over the integrated circuit. Release the
plunger, ensuring that the integrated c i r c u i t is firmly gripped by
the jaws.
(c) Reflow the solder by applying a de-solder block to the integrated
circuit terminal joints.
(d) Withdraw the integrated circuit.
(3) Removal of Inductors L501, L503 and L504 (270)
(a) Remove the screw (280) and nut (290) securing the inductor (270)
to the PCB (390).
(b) Desolder the pins and remove the inductor (270) from the
PCB (390).
(4) Removal of Inductor L502 (300)
(a) Remove the screw (310) and nut (320) securing the inductor (300)
to the PCB (390).
(b) Desolder the pins and remove the inductor (300) from the
PCB (390).
(5) Removal of Other Components
(a) Desolder the component connections from the PCB, observing
standard techniques.
(b) Withdraw the component from the PCB.
(c) Remove the mounting pads, if applicable.

97-3A Page 304

L I - JO~ O C T 01/93
 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

D. Removal of Components from PCB Assembly F

Unless otherwise stated, the item numbering used in the following
procedures refers to the numbered annotations in IPL figure 4.
(1) Removal of Transistor Q701 (70)
(a) Remove the screw (80) and nut (90) securing the transistor (70)
the PCB (120).
(b) Desolder the pins and remove the transistor (70) from the
PCB (120).
(2) Removal of Other Components
(a) Desolder the component connections from the PCB, observing
standard techniques.
(b) Withdraw the component from the PCB.
E. Removal of Components from Case Assembly
Unless otherwise stated, the item numbering used in the following
procedures refers to the numbered annotations in IPL figure 5.
(1) Removal of Top Plate (10)
(a) Remove the two screws (20) securing the top plate (10) to the top
mounting blocks (250).
(b) Remove the top plate (10) to the extent of the wiring.
(2) Removal of Relay K3 (30)
(a) Desolder the relay (30) terminals and remove the wire from each
terminal.
(b) Remove the screw (40) and screw (50) securing the relay (30) to
the threaded spacers (110 and 120).
(c) Remove the relay (30) and spacer (60).
(d) Remove the screw (130) securing the threaded spacer (110) to the
top plate (10).
(e) Remove the threaded spacer (110).
(3) Removal of Relay K2 (70)
(a) Desolder the relay (70) terminals and remove the wire from each
terminal.
(b) Remove the screw (80) securing the relay (70) to the threaded
spacer (120).
(c) Remove the relay (70).
(d) Remove the two screws (130) securing the two threaded spacers
(120) to the top plate (10).
(e) Remove the two threaded spacers (120).

pa9 305
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 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

(4) Removal of Relay K1 (90)

(a) Desolder the relay (90) terminals and remove the wire from each
terminal.
(b) Remove the three screws (100) securing the relay (90) to the
threaded spacers (120).
(c) Remove the relay (90)
(d) Remove the three screws (130) securing the threaded spacers (120)
to the top plate (10).
(e) Remove the threaded spacers (120).
(5) Removal of Front Plate (140)
(a) Remove the four screws (150) securing the front plate (140) to the
two mounting blocks (250).
(b) Remove the front plate (140).
(6) Removal of Rear Plate (160)
(a) Remove the four screws (170) securing the rear plate (160) to the
two mounting blocks (250).
(b) Remove the rear plate (160).
(c) Remove the four screws (270) securing the two mounting blocks
(260) and remove the mounting blocks from the rear plate (160).
(7) Removal of Bottom Plate Assembly (180)
(a) Remove the four screws (190) securing bottom plate assembly (240)
to the mounting blocks (250).
(b) Remove the bottom plate assembly (180).

"END"

Pa9e306
27-36-13 OCT 01/93
 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

CLEANING

1. Precautions
• WARNING; WEAR GOGGLES WHEN USING AN AIR-JET. WARN OTHER PERSONS TO STAY
—————— AWAY FROM THE AREA. THE AIR-JET SHALL HAVE A MAXIMUM PRESSURE OF
193 kPa (28 PSD.
CAUTION: THIS MODULE CONTAINS DEVICES SENSITIVE TO STATIC ELECTRICITY.
————— OBSERVE THE ESDS CAUTION IN PAGE-BLOCK 101.

2. Special Tools and Materials

The special tools and materials are listed in page-block 901.
3. Procedures
A. External Cleaning
WARNING; WEAR GOGGLES WHEN USING AN AIR-JET (Refer to WARNING in
paragraph 1).
Using a lint-free cloth (CML-Fk05-044) and a camel hair brush clean all
metal parts. Use an air-jet fitted with an ionization nozzle to clean
places inaccessible to a cloth. Pay particular attention to dirt which may
be trapped between the contacts of the connectors.
B. Internal Cleaning
WARNING; WEAR GOGGLES WHEN USING AN AIR-JET (Refer to WARNING above).
Remove the RH and LH sideplates and PCB assemblies D thru F, for details
refer to page-block 301. Using a lint-free cloth (CML-Fk05-044) and a
camel hair brush clean all metal parts. Pay particular attention to dirt
which may be trapped inside the case assembly.
Using a small camel hair brush and an air-jet fitted with an ionization
nozzle, clean away all dust and dirt from around the components on the PCB
assemblies. Pay particular attention to dirt that may be trapped between
connector contacts, around the voltage regulator and heatsinks. Clean away
any flux and solder particles which may be trapped on the track side of the
board or between connector contacts.

"END"

Page 401
27-36-13 OCT 01/93
 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

CHECK

1. Precautions
CAUTION: THE MODULE CONTAINS DEVICES SENSITIVE TO STATIC ELECTRICITY.
OBSERVE THE ESDS CAUTION IN PAGE-BLOCK 101.

2. Special Tools, Fixtures and Equipment

The special tools, fixtures and equipment are listed in page-block 901.
3. Procedures
A. External Inspection
Inspect the case assembly and sideplates for cracks, dents, defective
securing devices and scratched paintwork. Inspect all connectors for
broken, bent, loose or corroded contacts, cracked insulation and defective
securing devices.
B. Internal Inspection
CAUTION: THE PRINTED CIRCUIT BOARD ASSEMBLIES CONTAIN DEVICES SENSITIVE
TO STATIC ELECTRICITY. OBSERVE THE ESDS CAUTION IN PAGE-BLOCK
101.

(1) Remove the RH and LH sideplates and PCB assemblies D thru F, for
details refer to page-block 301.
(2) Do the procedures in table 501.

ITEM INSPECT FOR

Case Assembly and Sideplates Broken, deformed, cracked or corroded metal
work. Scratched paintwork. Defective
securing devices.
Connectors Broken, bent, loose or corroded contacts.
Damaged insert, cracked insulation. Loose
pieces of solder around the base of the
connector. Defective securing devices, if
applicable.
Resistors Broken, cracked, charred or blistered
bodies. Loose or broken wires. Missing
color codes, or type numbers.
Capacitors Broken, cracked or leaking bodies. Loose
or broken wires. Correct polarity of
tantalum capacitors. Missing or unreadable
part numbers.
Transistors, Integrated Damage to housings, signs of overheating.
Circuits, Voltage Regulators Missing or unreadable part numbers.
and Relays Orientation.

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ITEM INSPECT FOR

Transformers Damage to core or windings, signs of
excessive heat. Missing or unreadable part
numbers.
Diodes Broken or cracked bodies, damaged leads,
missing or unreadable part numbers.
Missing polarity bands. Correct polarity.
Inductors Broken or cracked case, loose or broken
wires, missing or unreadable part numbers.
Soldered and Wired Connections Dry joints, overstripping, excessive
solder, wire strain.
Printed C i r c u i t Boards Broken, cracked or deformed board, loose
components. Damage to conformal coating.
Signs of overheating.
Test Pins and Wiring General damage and security.___________
Inspection Procedures
Table 501

"END"

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 COMPONENT MAINTENANCE MANUAL
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VL-X

1. Techniques and Precautions

Standard techniques for the repair of electronic units apply. Before waking
any electrical disconnections install identification tags on the wires to aid
correct reconnect ion. Before removal of electronic components, relays and
tantalum capacitors, note the polarity and position of the components for
correct assembly. Component locations are shown in the IPL.
CAUTION: THE MODULE CONTAINS DEVICES SENSITIVE TO STATIC ELECTRICITY.
OBSERVE THE ESDS CAUTION IN PAGE-BLOCK 101.

CAUTION: THE PRINTED CIRCUIT BOARD ASSEMBLIES ARE CONFORMAL COATED. REMOVE
THE C O N F O R M A L COATING (CML-Fk09-039) FROM THE AREA TO BE REPAIRED
B E F O R E DE-SOLDERING.

CAUTION: A R E P L A C E M E N T COMPONENT MUST BE FITTED IN THE EXACT POSITION FROM

W H I C H THE FAULTY COMPONENT WAS REMOVED. FOR COMPONENT LOCATIONS
R E F E R TO THE IPL.

CAUTION: THE HEATSINKS, TEST PINS, CONNECTORS J9, J10, P9, P10, P11 AND THE
CONTACTS OF CONNECTORS J12 AND J13 MUST NOT BE COATED WITH
C O N F O R M A L COATING (CML-Fk09-039). USE MASKING TAPE (CML-Fk05-
115) TO PROTECT A R E A S OF THE MODULE WHICH DO NOT R E Q U I R E C O N F O R M A L
COATING.

CAUTION: W H E N S O L D E R I N G AND UNSOLDERING TRANSISTORS, DIODES AND INTEGRATED

CIRCUITS, USE A LOW WATTAGE, GROUNDED SOLDERING IRON.

2. Special Tools and M a t e r i a l s

The special tools and m a t e r i a l s are listed in page-block 901.
3. Procedures
W i t h the exception of the components detailed in the following procedures, all
components are non-repairable. If any part of a component is damaged, the
whole component must be replaced. If a component has been replaced, the
module must be refitted to the MBCU (refer to page-block 701 of CMM 27-36-01)
and subjected to the applicable overall test detailed in page-block 101 of
CMM 27-36-01.
NOTE: Ensure all components are securely mounted.
A. Paintwork
Re-paint any scratched paintwork.
B. Wired Contact Replacement
No attempt should be made to straighten bent contacts at the rear of the
connector. For d e t a i l s of contact insertion/extraction, refer to page-
blocks 301 and 701.

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C. Soldered Connections
•Resolder (CML-Fk05-085) broken or bad connections, such as dry or corroded
joints. Remove excess solder.
D. Printed Circuit Boards
If broken, replace the printed circuit board using standard de-soldering
and identification techniques described in page-block 301. Clean off
damaged conformal coating and replace (CML-Fk09-039). Clean off damaged
adhesive joints between the two spacers (IPL figure 4, item 100) and PCB
assembly F and replace (CML-Fk08-001).
E. Inductors LI thru L3
(1) Remove any conformal coating from the area around the soldered wires.
(2) Desolder the inductor from the wiring loom or filters, as applicable,
observing standard techniques.
(3) Remove the lacing tape, if applicable, securing the inductor to the
bracket. Remove the inductor.
(4) Unwind and remove the damaged wiring from the shield bead of the
inductor.
(5) Rewind the inductor using one and a half turns of 24 AWG wire, refer
to figure 601.
(6) If applicable, secure the shield bead to the bracket using lacing tape
(CML-Fk05-090) and insert the wires through the bracket.
(7) Solder (CML-Fk05-085) the wires into the wiring loom, or on to the
filters, as applicable.
(8) Re-apply the conformal coating (CML-Fk09-039) to the repaired area.

INDUCTOR

100
(FL1)

250 CRIMP SLEEVE

(L1)
MOUNT WITH LACING TAPE

CMM-27-5224A

Details of Inductor LI
Figure 601
"END11

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 COMPONENT MAINTENANCE MANUAL
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ASSEMBLY AND STORAGE

1.' Techniques and Precautions
Standard techniques for the assembly of electronic units apply. Before
completion of the assembly procedures the module must be refitted to the MBCU
(refer to page-block 701 of CMM 27-36-01) and subjected to the applicable
overall test procedure detailed in page-block 101 of CMM 27-36-01. For special
mounting details applicable to components on the printed circuit board
assemblies, refer to the IPL.
CAUTION; A REPLACEMENT COMPONENT MUST BE FITTED IN THE EXACT POSITION FROM
WHICH THE FAULTY COMPONENT WAS REMOVED. CHECK THE POLARITY OF
DIODES AND TANTALUM CAPACITORS BEFORE FITTING. COMPONENT LOCATIONS
ARE SHOWN IN THE IPL.
CAUTION: THE MODULE CONTAINS DEVICES SENSITIVE TO STATIC ELECTRICITY. OBSERVE
THE ESDS CAUTION IN PAGE-BLOCK 101.
CAUTION: THE PRINTED CIRCUIT BOARDS ARE CONFORMAL COATED (CML-Fk09-039).
AFTER COMPLETION OF ASSEMBLY REPLACE THE CONFORMAL COATING. THE
HEATSINKS, ALL TEST PINS, CONNECTORS J9, J10, P9, P10, Pll AND THE
CONTACTS OF CONNECTORS J12 AND J13 MUST NOT BE CONFORMAL COATED.
USE MASKING TAPE (CML-Fk05-115) TO PROTECT AREAS OF THE MODULE WHICH
DO NOT REQUIRE CONFORMAL COATING.
CAUTION: WHEN SOLDERING TRANSISTORS, DIODES AND INTEGRATED CIRCUITS USE A LOW
WATTAGE, GROUNDED SOLDERING IRON.
2. Special Tools and Materials
The special tools and materials are listed in page-block 901.

3. Procedures
A. Fitting of Components to Case Assembly
Unless otherwise stated, the item numbering in the following procedures
refers to the numbered annotations in IPL figure 5.
(1) Fitting of Bottom Plate Assembly (180)
(a) Secure the bottom plate assembly (180) to the mounting blocks
(250) using the four screws (190). Apply anaerobic resin (CML-
Fk08-051) to the screws.
(2) Fitting of Rear Plate (160)
(a) Fit the mounting blocks (260) to the rear plate (160) and secure
using the four screws (270).
(b) Fit the rear plate (160) to the mounting blocks (250) and secure
using the four screws (170).

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(3) Fitting of Front Plate (140)

(a) Fit the front plate (140) to the mounting blocks (250) and secure
using the four screws (150).
(4) Fitting of Relay Kl (90)
(a) Fit the three threaded spacers (120) to the top plate (10) and
secure using the three screws (130).
(b) Fit the relay (90) to the threaded spacers (120) and secure using
the three screws (100).
(c) Solder (CML-Fk05-085) the wires to the relay (90) terminals.
(5) Fitting of Relay K2 (70)
(a) Fit the two threaded spacers (120) to the top plate (10) and
secure using the two screws (130).
(b) Fit the relay (70) to the threaded spacers (120) and secure using
the screw (80).
(c) Solder (CML-Fk05-085) the wires to the relay (70) terminals.
(6) Fitting of Relay K3 (30)
(a) Fit the threaded spacer (110) to the top plate (10) and secure
using the screw (130).
(b) Fit the relay (30) and spacer (60) to the threaded spacer (110)
and the base of relay K2 (70) and secure using the screw (40) and
screw (50).
(c) Solder (CML~Fk05-085) the wires to the relay (30) terminals.
(7) Fitting of Top Plate (10)
(a) Fit the top plate (10) to the mounting blocks (250) attached to
the front and rear plates (140 and 160) and secure using the two
screws (20). Apply anaerobic resin (CML-Fk08-051) to the screws.

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B. Fitting of Components to PCB Assembly F

Unless otherwise stated, the item numbering in the following procedures
refers to the numbered annotations in IPL figure 4.
(1) Fitting of Transistor Q701 (70)
(a) Fit the transistor (70) to the PCB (120) and solder (CML~Fk05-085)
the pins.
(b) Secure the transistor (70) using the screw (80) and nut (90).
(2) Fitting of Other Components
NOTE: When installing resistor R702 (40), leave a 1 mm gap between
the component body and the surface of the PCB (120), for
details refer to figure 701.
NOTE: The two spacers (100) are secured to the component side of the
PCB using adhesive (CML-Fk08-001).
(a) Position the component on the PCB (120) and solder (CML-Fk05-085)
the pins, contacts or wires of the component to the PCB, observing
standard techniques.
(b) Clean the PCB (120) to remove all traces of flux.
C. Fitting of Components to PCB Assembly D
Unless otherwise stated, the item numbering used in the following
procedures refers to the numbered annotations in IPL figure 3.
NOTE: For details of the fitting of transistors Q501 and Q503 thru Q507,
refer to paragraph 3E(4).
(1) Fitting of Inductor L502 (300)
(a) Insert the pins of the inductor (300) through the terminals holes
in the PCB (390) and secure using the screw (310) and nut (320).
(b) Solder (CML-Fk05-085) the pins of the inductor to the PCB (390).
(2) Fitting of Inductors L501, L503 and L504 (270)
(a) Insert the pins of the inductor (270) through the terminals holes
in the PCB (390) and secure using the screw (280) and nut (290).
(b) Solder (CML-Fk05-085) the pins of the inductor (270) to the PCB
(390).
(3) Fitting of Integrated Circuits (240 and 250)
(a) Select the correct size insertion tool for the integrated circuit
to be fitted.
(b) Open the jaws of the insertion tool by pressing the plunger, then
position the integrated circuit in the jaws. Release the plunger
ensuring that the jaws grip the integrated circuit firmly.

Page 703
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 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

(c) Insert the pins of the integrated circuit through the terminal
holes in the PCB (390).
(d) Solder (CML-Fk05-085) the integrated circuit to the PCB (390).
(e) Clean the PCB (390) to remove all traces of flux.
(4) Fitting of Other Components
NOTE: When installing resistors R501 (60), R502 (80), R509 (90) and
R514 (70), leave a 1 mm gap between the component body and the
surface of the PCB (390), for details refer to figure 701.
(a) Position the component on the PCB (390) and solder (CML- Fk05-085)
the pins, contacts or wires of the component to the PCB observing
standard techniques.
D. Fitting of Components to PCB Assembly E
Unless otherwise stated, the item numbering in the following procedures
refers to the numbered annotations in IPL figure 2.
(1) Fitting of Connector J13 (620)
(a) Fit the connector (620) to the PCB (720) and secure using the two
screws (630) and two nuts (640).
(b) Solder (CML-Fk05-085) the connector (620) to the PCB (720).
(2) Fitting of Transistor Q602 (420) and Heatsink (550)
NOTE: Avoid excessive application of heat conducting paste. Apply
thinly and evenly using a spatula.
(a) Apply heat conducting paste (CML-Fk08-002) to the mating surface
of heatsink (550).
(b) Fit the transistor (420) and the heatsink (550) to the PCB (720)
and secure using the screw (560), two washers (570) and nut
(580).
(c) Solder (CML-Fk05-085) the pins of the transistor (420) to the PCB
(720), observing standard techniques.
(3) Fitting of Voltage Regulator VR601 (540) and Heatsink (590)
NOTE: Avoid excessive application of heat conducting paste. Apply
thinly and evenly using a spatula.
(a) Apply heat conducting paste (CML-Fk08-002) to the mating surface
of the heatsink (590).
(b) Fit the voltage regulator (540) and heatsink (590) to the PCB
(720) and secure using the mounting kit (600).
(c) Solder (CML-Fk05-085) the pins of the voltage regulator (540) to
the PCB (720), observing standard techniques.

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(4) Fitting of Integrated Circuits

(a) Select the correct size insertion tool for the integrated circuit
to be fitted.
(b) Open the jaws of the insertion tool by pressing the plunger, then
position the integrated circuit in the jaws. Release the plunger
ensuring that the jaws grip the integrated circuit firmly.
(c) Insert the pins of the integrated circuit through the terminal
holes in the PCB (720).
(d) Solder (CML-Fk05-085) the integrated circuit to the PCB (720).
(e) Clean the PCB (720) to remove all traces of flux.
(5) Fitting of Other Components
NOTE: The following components are fitted with a mounting pad:

EQUIPMENT DESIGNATOR IPL FIGURE-ITEM

CR603 and CR619 2-380
CR610 2-400
Q601 2-410
Q603 2-430
Q604 2-440
Q605 2-450
U601, U603, U605 and U609 2-530
U611 2-490

NOTE; When installing resistor R601 (210), leave a 1 mm gap between

the component body and the surface of the PCB (720), for
details refer to figure 701.
(a) Position the component and, if applicable, mounting pad on the PCB
(720) and solder (CML- Fk05-085) the pins, contacts or wires of
the component to the PCB, observing standard techniques.

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 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

COMPONENT BODY

1rnm SPACING
PCB

CMM-61-5036A

Mounting Details for Resistors R501, R502, R509, R514, R601 and R702
Figure 701
Fitting of Components to Main Assembly
Unless otherwise stated, the item numbering in the following procedures
refer to the numbered annotations in IPL figure 1.
(1) Fitting of Connector J15 (260)
(a) Position the connector (260) in the wiring loom.
(b) Insert the wired contacts into the connector (260), for details
refer to paragraph 3E(8).
(2) Fitting of Inductors (250)
(a) Wind 1.5 turns of AWG 24 copper wire, on to the shield bead (250),
for details refer to figure 702.
(b) For inductor LI (250), repeat step (a) for the second coil.
(c) If applicable, secure the inductor (250) to the PCB assembly using
lacing tape (CML-Fk05-090).
(d) Solder (CML-Fk05-085) the wires of the inductor (250) into the
wiring loom.

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 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

SHIELD
BEAD

A W G 24
COPPER WIRE

CMM-61-5037A

Details of Inductors
Figure 702
(3) Fitting of Connector J14 (220) and Diodes CR11 and CR12 (240)
(a) Solder (CML-Fk05-085) the didoes CR11 and CR12 (240) to the
connector (220), observing standard techniques.
(b) Fit the connector (220) to the case assembly and secure using the
two jacks posts (230).
(c) Solder (CML-Fk05-085) the wiring loom connections to the connector
(220), observing standard techniques.
(4) Fitting of PCB Assemblies F thru D (180 and 110)
NOTE: Avoid excessive application of heat conducting paste, Apply
thinly and evenly using a spatula.
(a) Reconnect connector J12 (IPL figure 3, item 370) to PCB assembly
D (110) and insert the flat cable assembly (IPL figure 2t item
350) through the case assembly ready for mating with PCB assembly
E (50).
(b) Fit PCB assembly F (180) to the four threaded spacers (200) and
secure using the two screws (190).
(c) Apply heat conducting paste (CML-Fk08-002) to the mating surface
of the heatsinks of transistors Q501 and Q503 thru Q507 (170).
(d) Fit the transistors (170) to PCB assembly D (110) ensuring that
the transistor heatsink holes align with their respective holes
in the case assembly (280) when PCB assembly D is in its normal
mounted position.

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 COMPONENT MAINTENANCE MANUAL
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(e) Solder (CML-Fk05-085) the pins of the transistors (170) to the PCB
assembly D (110).
(f) Fit PCB assembly D (110) to the case assembly (280) and secure
using the four screws (120), six screws (130), four washers (140),
four nuts (150) and two spacers (160).
(5) Fitting of Filters (100) and Filter Plate (80)
NOTE: Maximum torque of the filters is 34 ± 5 Ncm.
(a) Fit the four filters (100) to their mounting bracket in the case
assembly (280) or the filter plate (80) and secure using the
filter securing nuts.
(b) Solder (CML-Fk05-085) the wires to the filters (100).
(c) Fit the filter plate (80) with the two filters (100) attached to
the case assembly (280) and secure using the two screws (90).
(6) Fitting of PCB Assembly E (50)
(a) Reconnect connector P12 (IPL figure 2, item 650) to the PCB
assembly E (50).
(b) Fit the PCB assembly E (50) to the case assembly (280) and secure
using the two screws (60) and two screws (70).
(7) Fitting of Sideplates (10 and 20)
(a) Fit the sideplates (10 and 20) to the case assembly (280) and
secure each sideplate using the four screws (30).
(8) Wired Contact Insertion
NOTE: This is a general procedure, for specific details refer to
vendor documentation.
(a) Place the wire to be inserted in the large opening at the colored
end of the insertion/extraction tool.
(b) Hold the tool so that the thumb is over the wire in the opening.
Slide the tool backwards until the wire has slipped into the tool.
Slide the tool forwards until it reaches the shoulder of the
contact.
(c) Push the wired contact into the correctly identified cavity with
a firm and even, but not excessive pressure. When the contact is
fully inserted, the tines of the retaining clip will close over
the shoulder of the contact. This will be denoted by a slight
click.
(d) Withdraw the tool from the rear of the connector. Check that the
contact is locked in position by gently pulling back on the wire.
Remove the tool from the wire.

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 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

4. Storage
A. General
(1) Store the module in its original packing or in a suitable container,
in accordance with ATA specification 300.
(2) Store in a clean, well-ventilated room at a temperature w i t h i n the
range -20° thru +70°C (-4°F thru +158°F) and a humidity of 65%
maximum.
(3) Do not store in the v i c i n i t y of corrosive fluids,electromagnetic,
electrostatic, magnetic and radioactive fields, or near heat or ozone
generating sources.
(4) Position the package so that the identification label can be checked
easily.
B. Preservation
(1) Before packing for storage, the module must be preserved in accordance
w i t h specification MIL-P-116.
C. Packing
(1) Attach an identification label and an ESDS sticker to the module.
(2) Place the module in a clean anti-static bag (for details refer to the
commercial process manual), together with a quantity of approved
desiccant (CML-Fk15-010). The desiccant must be separately contained
in a muslin or cotton bag.
(3) Expel as mush air as possible from the anti-static bag and heat-seal
the opening of the bag.
(4) Place the module into the packing and attach an identification label
and an ESDS sticker to the outside of the package.
D. Identification Labels
(1) Prepare two identification labels showing the module type, part
number, serial number and dates of test,, receipt into storage and
condition checks during storage.
(2) If the identification label is missing, the module cannot be approved
for storage or installation.

"END"

Pa9e709
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 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

FITS AND C L E A R A N C E S

1. General
Torque values for relevant items in the module are given in tabular format,
2. Torque Values
Torque values for relevant items in the module are given in table 801.

IPL FIG TORQUE

AND ITEM
ITEH NO.

1-100 Filter 34 ± 5 Ncm (3,01 ± 0,44 Ibf in)

Torque Values
Table 801

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 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

SPECIAL TOOLS, FIXTURES, EQUIPMENT AND MATERIALS

1. -Introduction
This page-block details the special tools, fixtures, equipment and materials
needed to perform all the procedures detailed in this manual.
2. Special Tools, Fixtures and Equipment
The following table lists the special tools, fixtures and equipment.
Equivalent substitutes can be used for listed items. For details of vendor
codes given in table 901, refer to the CMM introduction.

ITEM NAME SPECIFICATION/ QTY. VENDOR UTILIZATION

NO. PART NUMBER CODE
T D C C R A
E I L H E S
S S E E P S
T A A C A Y
I S N K I /
N S I R S
G Y N T
G 0
R
E

1 DC Power Supply 0-30 V, 3 A 1 Local X

2 Testbox type 27.1-4794-01 1 H0643 X
EGMBT9001
3 Accessories Case 27.1-4794-05 1 H0643 X
4 Grounded Work 8010-3M 1 H1248 X X X X X X
Station
5 Oscilloscope Digital storage 1 .oca! X
(dual channel)
6 Integrated Circuit General purpose AR Local X X
Insertion/
Extraction Tool
7 Contact Insertion/ M81969/14-02 1 71468 X X X
Extraction Tool (20 contact size)

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 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

ITEM NAME SPECIFICATION/ QTY. VENDOR UTILIZATION

NO. PART NUMBER CODE
T D C C R A
E I L H E S
S S E E P S
T A A C A Y
I S N K I /
N S I R S
G Y N T
G 0
R
E

8 Digital Multimeter DC voltage range 0 1 Local X

thru 30 Vdc with
accuracy of:
0,01% + 10 uV (0
thru 200 mV)
0,01% + 30 uV (200
thru 2000 mV)
0,01% + 300 uV (2
thru 20 V)
0,01% + 3 mV (20
thru 30 V)
Input impedance:
> 1000 MOhm (0 thru
20 V)
>10 MOhm (20 thru
30 V)
Ohmmeter range:
0 thru 20 MOhm with
accuracy of 1% +
0,1 Ohm

Special Tools, Fixtures and Equipment

Table 901

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 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

3. Materials
'The following table lists the materials required to perform all the procedures
detailed in this manual. All Fokker originated material numbers are prefixed
by the identity code Fk. For further details on materials and their vendor
codes refer to the consumable material list. Equivalent substitutes can be used
for listed items.

ITEM DESIGNATION MATERIAL NUMBER/ VENDOR UTILIZATION

NO. AND PART NUMBER CODE
SPECIFICATION
T D c C R A
E I L H E S
S S E E P S
T A A C A Y
I S N K I /
N S I R S
G Y N T
G 0
R
E

1 Solder Fk05-085 H0643 X X X

2 Anaerobic Resin Fk08-051 05972 X
3 Desiccant Fkl5-010 16210 X
4 Conformal Coating Fk09-039 71984 X X X
5 Lacing Tape Fk05-090 H0643 X
6 Masking Tape Fk05-115 H1248 X X X
7 Adhesive FK08-001 S5278 X
8 Lint-free Cloth Fk05-044 Local X
9 Heat Conducting FK08-002 05820 X
Paste
10 Anti-static Bag (MIL-B-81705 Local X
type 2)
11 ESDS Label (JEDEC 14, Local X
Form 9892)
12 Anti-static Local X
Shuntfoam
13 Identification Label Local X
Materials
Table 902
"END"

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 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

ILLUSTRATED PARTS LIST

1. ' Introduction
A. Purpose
The purpose of this illustrated parts list is to provide a means of
locating and identifying component parts of the module and to facilitate
the provisioning, storing and issuing of replaceable parts, in accordance
with the approved shop maintenance policy.
B. How to Use the IPL
A series of illustrations are provided on which the replaceable items in
the module are shown. Each illustration identifies the parts by means of
item numbers and, in the case of electrical and electronic components, by
the use of an equipment designator. Each illustration is followed by a
detailed parts list in which all the parts are listed in item number
sequence. From this list the user can obtain the part number,
nomenclature, usage and quantity of each item. The nomenclature is
indented to show the relationship to the main assembly.
A dash (-) in the figure/item number column, preceding the number,
indicates that the item is not shown on the illustration. Where
applicable, vendors are identified by a code number, preceded by a capital
V, following the item description in the nomenclature column. The code
number is as specified in the current issue of federal supply codes for
manufacturers, catalogue handbooks H4-8 and/or NATO codes. The effectivity
codes column gives a letter to each main assembly in an IPL figure. The
same letter then denotes items which can be used with all non-coded items
in the main assembly.
For detailed information concerning FoN numbers refer to standards manual,
substitutes and equivalents list, technical handbook (TH)-16.
Two further lists are given in this page-block. The first of these is a
list of all the equipment designators, together with the relevant
figure/item numbers. The second list is a tabulation of all the part
numbers in the detailed parts lists, in alphanumeric sequence. This list
also gives the total quantity of each item and provision is made for an
airline part number to be inserted against each item.
2. Vendor Names and Addresses
CODE VENDOR'S NAME AND ADDRESS
#1085 See vendor code 71468.
D0080 Leach International Germany GmbH
Hofer Strasse 5, 86720 NOERDLINGEN, Germany
F0326 EFCO SA
P.O. Box 17, 35404 SAINT-MALO, France

Pa e 1001
HQ 9
MAY 01/96
"IU
 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

CODE VENDOR'S NAME AND ADDRESS

H2320 AMP Holland BV
Postbus 288, 5201 AG 'S-HERTOGENBOSCH. The Netherlands
H2761 Koning en Hartman Elektrotechniek BV
Postbus 125, 2600 AC DELFT. The Netherlands
H2806 Nijkerk Elektronika BV
Postbus 7920, 1008 AC AMSTERDAM. The Netherlands
K4491 BICC Vero Electronics Ltd.
Electron Way Industrial Way
CHANDLERS FORD. HANTS SOS 3RZ. United Kingdom
04713 Motorola Inc., Semiconductor Products Sector
P.O. Box 2953, PHOENIX. AZ 85008. U.S.A.
12969 Unitrode Corporation
5 Forbes Road, LEXINGTON. MA 02173. U.S.A.
13103 Thermalloy Co. Inc.
P.O. Box 810839, DALLAS. TX 75381. U.S.A.
17856 Siliconix Inc
2201 Laurel Wood Road, SANTA CLARA. CA 95054. U.S.A.
2S738 Sylvan Ginsbury Ltd.
P.O. Box 419, ORADELL. NJ 07649. U.S.A.
34899 Fair-Rite Products Corporation
1 Commercial Row, WALLKILL. NY 12589. U.S.A.
44655 Ohmite Manufacturing Corporation
3601 West Howard Street, SKOKIE. IL 60076. U.S.A.
57550 Relli Technology Inc.
1 South Central Avenue, VALLEY STREAM. NY 11582. U.S.A.
64155 Linear Technology Corporation
1630 McCarthy Boulevard, MILPITAS. CA 95035. U.S.A.
71468 ITT Corporation, ITT Cannon Division
666 East Dyer Road, SANTA ANA. CA 92702. U.S.A.
8N187 TTI International
4033 East Belknap Street, FORT WORTH. TX 76111. U.S.A.
8V269 Knight Electronics International Inc.
31 Myrtle Street, MANHASSET. NY 11030. U.S.A.
80223 See vendor code H2761.
96214 Texas Instruments Inc., Defence Systems and Electronics Group
P.O. Box 226015 M/S, DALLAS. TX 75266. U.S.A.
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THIS PAGE INTENTIONALLY LEFT BLANK

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 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

3. Equipment Designator Index

EQUIPMENT FIG. EQUIPMENT FIG. EQUIPMENT FIG. ,

DESIGNATOR ITEM DESIGNATOR ITEM DESIGNATOR ITEM

CR11 1-240 C501 3-130 C628 2-300

CR12 1-240 C502 3-170 C629 2-350
CR501 3-200 C503 3-170 C630 2-220
CR502 3-190 C504 3-100 C631 2-220
CR503 3-220 C505 3-100 C632 2-220
CR504 3-220 C506 3-180
CR505 3-220 C508 3-110 FL1 1-100
CR506 3-210 C509 3-160 FL2 1-100
CR507 3-210 C510 3-170 FL3 1-100
CR508 3-210 C511 3-110 FL4 1-100
CR509 3-220 C512 3-160
CR510 3-220 C513 3-170 J9 2-610
CR511 3-220 C514 3-120 J10 2-610
CR512 3-220 C515 3-120 J12 3-370
CR513 3-210 C516 3-120 J13 2-620
CR5H 3-210 C517 3-140 J14 1-220
CR515 3-210 C518 3-140 J15 1-260
CR516 3-220 C519 3-150
CR517 3-220 C601 2-340 K1 5- 90
CR518 3-220 C602 2-280 K2 5- 70
CR519 3-220 C603 2-270 K3 5- 30
CR601 2-360 C604 2-280
CR602 2-390 C605 2-250 L1 1-250
CR603 2-380 C606 2-230 12 1-250
CR604 2-370 C607 2-290 L3 1-250
CR605 2-370 C608 2-260 L501 3-270
CR606 2-370 C609 2-250 L502 3-300
CR607 2-370 C610 2-280 L503 3-270
CR608 2-370 C611 2-330 L504 3-270
CR609 2-370 C612 2-230 L601 2-670
CR610 2-400 C613 2-280 L602 2-670
CR611 2-370 C614 2-310
CR612 2-370 C615 2-330 P9 4-110
CR613 2-370 C616 2-330 P10 4-110
CR614 2-370 C617 2-240 P11 2-650
CR615 2-370 C618 2-310
CR617 2-370 C619 2-310 Q501 1-170
CR618 2-370 C620 2-310 Q502 3-230
CR619 2-380 C621 2-280 Q503 1-170
CR620 2-370 C622 2-280 Q504 1-170
CR701 4- 50 C623 2-280 Q505 1-170
CR702 4- 60 C624 2-300 Q506 1-170
CR703 4- 50 C625 2-320 Q507 1-170
CR704 4- 50 C626 2-300 Q601 2-410
CR705 4- 50 C627 2-320 Q602 2-420

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 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

EQUIPMENT FIG. EQUIPMENT FIG. EQUIPMENT FIG.

DESIGNATOR ITEM DESIGNATOR ITEM DESIGNATOR ITEM

Q603 2-430 R626 2- 60

Q604 2-440 R627 2- 60
Q605 2-450 R628 2-200
Q701 4- 70 R629 2-200
R630 2-200
R501 3- 60 R701 4- 20
R502 3- 80 R702 4- 40
R503 3- 30 R703 4- 10
R504 3- 40 R704 4- 30
R505 3- 50
R506 3- 50 TP501 3-330
R507 3- 10 TP601 2-660
R508 3- 30 TP602 2-660
R509 3- 90
R511 3- 10 T501 3-260
R512 3- 20 T601 2-680
R513 3- 20
R514 3- 70 U501 3-240
R515 3- 10 U502 3-250
R516 3- 20 U503 3-250
R517 3- 20 U601 2-530
R601 2-210 U602 2-510
R602 2-160 U603 2-530
R603 2-140 U604 2-470
R604 2-110 U605 2-530
R605 2- 70 U606 2-520
R606 2- 90 U607 2-460
R607 2- 90 U608 2-480
R608 2-120 U609 2-530
R609 2- 50 U610 2-500
R610 2-170 U611 2-490
R611 2-190
R612 2- 20 VR601 2-540
R613 2-100
R614 2- 10
R615 2- 10
R616 2- 30
R617 2- 80
R618 2-180
R619 2-150
R620 2-180
R621 2-100
R622 2- 40
R623 2-100
R624 2-100
R625 2-130

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 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

4. Numerical Index

AIRLINE TOTAL
' PART NUMBER PART NUMBER FIG. ITEM REQUIRED

CA0391-002 3 350 1
CDR32BX103BKUM 2 220 3
CKM550-150NF100VM 3 160 2
CR100 2 380 2
DBMM5W5P 1 220 1
D110551 1 230 2
EAMBC8816-431 1 1 RF
EAMBC8816D2 3 390 1
EAMBC8816D2-451 1 110 1
3 1 RF
EAMBC8816E2 2 720 1
EAMBC8816E2-451 1 50 1
2 1 RF
EAHBC8816F2 4 120 1
EAMBC8816F2-451 1 180 1
4 1 RF
E3-4-107X001 5 140 1
E3-4-107X002 5 160 1
E3-4-123X001 5 10 1
E3-4-123X002 5 240 1
E3-4-123X003 1 10 1
1 20 1
E3-4-123X004 5 180 1
E3-5-008X001 5 60 1
E3-5-011X005 4 100 2
E3-5-012X005 5 120 5
E3-5-021X001 5 110 1
E3-5-027X002 1 200 4
E3-8-026X001 5 200 1
E3-8-030X005 5 260 2
E3-8-033X006 1 80 1
E3-8-052X004 5 250 4
E3-8-103X001 1 40 2
FON9-1193-20 1 260 1
FON9-1264-20 1 270 1
FON9-1516-03 5 220 1
FON9-1517-1 5 280 1
HCPL5400 2 520 1
IRFM250 1 170 6
4 70 1
IR2110L 3 250 2
JAN1N4148-1 2 370 14
JAN1N4979 3 200 1
4 60 1

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 COMPONENT MAINTENANCE MANUAL
P/N E A M B C 8 8 1 6

AIRLINE TOTAL
PART NUMBER PART NUMBER FIG. ITEM REQUIRED

JAN1N5552 1 240 2
3 190 1
JAN1N5618 4 50 4
JAN1N5645A 2 390 1
JAN2N2222A 2 410 1
3 230 1
JAN2N2905A 2 420 1
JAN2N4858 2 450 1
JAN2N5116 2 440 1
JAN2N6661A 2 430 1
LM111H 2 490 1
LT1009MH 2 400 1
LT1013AMJ8 2 500 1
LT117AK 2 540 1
LVR2-0-015-1PCT 3 70 1
LVR3-0-005-5PCT 3 90 1
LVR3-0-025-5PCT 3 80 1
4 40 1
MC54HCT08J 2 460 1
MC54HCT73J 2 470 1
MC54HC132J 2 480 1
MS20426AD3-4 5 210 2
MS20426A4-4 5 230 1
MS21042L04 2 580 1
2 640 2
MS21042L06 1 150 4
3 290 1
3 320 1
4 90 1
MS51957-4 1 190 2
1 210 4
MS51957-9 1 70 2
M215D2A 5 70 1
M230D2N 5 90 1
M300D2A 5 30 1
M39003-01-6073 2 320 2
M39003-01-6078 2 330 3
3 150 1
H39003-01-6194 2 350 1
M39003-01-6214 2 340 1
H39014-01-1219V 2 230 2
H39014-01-1225V 3 110 2
M39014-01-1227V 3 100 2
H39014-01-1230V 3 120 3
M39014-01-1231V 2 240 1
M39014-01-1237V 2 250 2
M39014-01-1238V 3 130 1

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P/N EAMBC8816
K1_X

AIRLINE TOTAL
PART NUMBER PART NUMBER FIG. ITEM REQUIRED

H39014-01-1240V 3 140 2
M39014-01-1457V 2 260 1
M39014-01-1467V 2 270 1
H39014-01-1473V 2 280 7
M39014-02-1222V 2 290 1
M39014-02-1230V 2 300 3
M39014-02-1407V 2 310 4
M55342K07B1HOOM 2 200 3
M55342K07B10GOM 3 10 3
M55342K07B100GM 3 30 2
H55342K07B15HOM 3 40 1
M55342K07B22GOH 3 20 4
NAS514P440-4P 5 150 4
5 170 4
5 190 4
NAS514P440-5P 1 30 4
5 270 2
NAS514P632-6P 1 130 6
NAS600-4P 1 60 4
1 120 4
5 20 2
5 40 1
5 80 1
5 100 3
5 130 1
NAS600-6P 2 630 2
NAS600-9P 2 560 1
NAS600-10P 5 50 1
NAS601-4P 1 90 2
NAS601-5P 4 80 1
NAS601-12P 3 280 1
NAS601-16P 3 310 1
NAS620-6 1 140 4
NAS620B4 2 570 2
PA0391-001 3 260 1
PA0391-002 2 680 1
RLR07C10ROGM 2 10 2
RLR07C1001GM 2 50 1
RLR07C1002GM 2 100 4
4 30 1
RLR07C1801GM 2 60 2
RLR07C2200GM 4 10 1
RLR07C2202GM 2 110 1
RLR07C2203GM 2 130 1
RLR07C27ROGM 2 20 1
RLR07C2701GM 2 70 1
RLR07C3002GM 2 120 1

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P/N EAMBC8816

AIRLINE TOTAL
PART NUMBER PART NUMBER FIG. ITEM REQUIRED

RLR07C4701GH 2 80 1
4 20 1
RLR07C6801GM 2 90 2
RLR07C7500GM 2 30 1
RLR07C8200GH 2 40 1
RLR20C2200GM 3 50 2
RNC55H1002FM 2 180 2
RNC55H2490FM 2 140 1
RNC55H2741FM 2 160 1
RNC55H5622FH 2 190 1
RNC55H6040FH 2 150 1
RNC55H7151FM 2 170 1
SRA88 2 270 3
SRC400 3 300 1
TE2Q4TA1MH2-0 2 670 2
TIL103 2 530 4
TSC427MJA 3 240 1
UC1526AJ 2 510 1
0-826629-6 2 610 2
1N4005 2 360 1
10025DAP 2 700 1
10117DAP 2 690 6
3 340 1
10310DAP 2 710 5
2DA31SBRP 2 620 1
20-2136J 2 660 2
3 330 1
2230B5 2 550 1
2673000801 1 250 3
3365-20 3 380 AR
3422-0001T 2 650 1
3 360 RF
3 370 1
4804 2 600 1
5806SH 3 210 6
5811SM 3 220 11
6103BASE 2 590 1
674D277H050GE5A 3 170 4
674D277H060HE5A 3 180 1
826044-6 4 110 2
8836 1 160 2
9051-100-0000 1 100 4
91J22R 2 210 1
93J270 3 60 1

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OCT 01/93
 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

5. Detailed Parts Lists

FIG. AIRLINE EFF. UNITS

• ITEM PART NUMBER PART NO. NOMENCLATURE CODE PER
1234567 ASSY.

1- 1 EAMBC8816-431 MODULE-POWER (ESDS - RF

SEE NOTE)
10 E3-4-123X003 -PLATE-SIDE, RH 1
20 E3-4-123X003 -PLATE-SIDE, LH 1
ATTACHING PARTS
FOR ITEMS 10 AND 20
30 NAS514P440-5P -SCREW 4
* * *
40 E3-8-103X001 -PLATE-INSULATING 2
50 EAMBC8816E2-451 -BOARD-PRINTED 1
CIRCUIT, ASSEMBLY E
(ESDS - SEE NOTE)
(FOR DETAILED
BREAKDOWN R E F E R TO
IPL FIGURE 2)
ATTACHING PARTS
60 NAS600-4P -SCREW 4
70 MS51957-9 -SCREW 2
* * *
80 E3-8-033X006 -PLATE-FILTER 1
ATTACHING PARTS
90 NAS601-4P -SCREW 2
* * *
100 9051-100-0000 -FILTER VH2806 4
(SUPPLIED WITH
ATTACHING PARTS)
110 EAMBC8816D2-451 -BOARD-PRINTED 1
CIRCUIT, ASSEMBLY D
(ESDS - SEE NOTE)
(FOR DETAILED
BREAKDOWN R E F E R TO
IPL FIGURE 3)
ATTACHING PARTS
120 NAS600-4P -SCREW 4
130 NAS514P632-6P -SCREW 6

NOTE: Electrostatic discharge sensitive (ESDS). Do not subject to

electromagnetic, electrostatic/ magnetic or radioactive fields
unless protected by a static shielded container.

- ITEM NOT ILLUSTRATED

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 COMPONENT MAINTENANCE MANUAL
P/N EAMBC8816

FIG. AIRLINE EFF. UNITS

ITEM PART NUMBER PART NO. NOMENCLATURE CODE PER
1234567 ASSY.

1 140 NAS620-6L -WASHER 4

150 MS21042L06 -NUT 4
160 8836 -SPACER-THREADED 2
V2S738
* * *
170 IRFM250 -TRANSSTR-N CHANNEL 6
ENHANCEMENT MODE
MOS FIELD E F F E C T
(ESDS - SEE NOTE)
V57550
180 EAMBC8816F2-451 -BOARD-PRINTED 1
CIRCUIT, ASSEMBLY F
(ESDS - SEE NOTE)
(FOR DETAILED
BREAKDOWN REFER TO
IPL FIGURE 4)
ATTACHING PARTS
190 MS51957-4 -SCREW 2
* * *
200 E3-5-027X002 -SPACER-THREADED 4
ATTACHING PARTS
210 MS51957-4 -SCREW 4
* * *
220 DBMM5W5P -CONNECTR V2S738 1
ATTACHING PARTS
230 D110551 -POST-JACK V8V269 2
* * *
240 JAN1N5552 -DIODE-ZENER 2
250 2673000801 -INDUCTOR V34899 3
260 FON9-1193-20 -CONNECTR-JIFFY 1
JUNCTION
-270 FON9-1264-20 -CONTACT (FOR ITEM 1
260)
280 NP27-36-13-001 -CASE, ASSEMBLY (FOR RF
DETAILED BREAKDOWN
R E F E R TO IPL
FIGURE 5)

NOTE: E Lectrostatic discharge sensitive (ESDS). Do not subject to

e lectrowagnet ic, electrostatic, magnetic or radioactive fields
u nless protected by a static shielded container.

- ITEM NOT ILLUSTRATED

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