GE3271 ENGINEERING PRACTICE LAB TPGIT
(ELECTRONICS)
INDEX
S.No Date Experiment Name Page.No
Average
GE3271 ENGINEERING PRACTICE LAB TPGIT
(ELECTRONICS)
INTRODUCTION TO RESISTORS
Resistors are the most common components in electronic circuits. Its main function is to reduce the
high current to the desired value and also to provide desired voltage in the circuit. The resistors are
manufactured to have a specific value in ohm. The physical size of resistor determines how much
power can be dissipated in the form of heat. However there is co-relation between resistor physical
sizes and its resistance value. They are manufactured in variety of standard value and power
settings.
There are two types of resistors:
• Fixed resistor
• Variable resistor
Fixed resistor has a resistance value that does not change where as a variable resistor having variable
resistance range with 4 lines or color code. They indicate the resistance value in ohms out on a
larger resistor; the resistance value is printed on the body of the resistor. The important feature of
resistor is that its effect is same for both AC and DC circuits.
TYPESOFRESISTORS
• Wire wand resistors
• Carbon Composition resistors
• Film resistors
• Surface mount resistors
• Fusible resistors
GE3271 ENGINEERING PRACTICE LAB TPGIT
(ELECTRONICS)
GE3271 ENGINEERING PRACTICE LAB TPGIT
(ELECTRONICS)
FIND THE COLOUR OF THE RESISTOR:
Provided Resistor Value Resistor Values (Ω) Color Code
995Ω
3.39KΩ
1KΩ
15KΩ
330 Ω
FIND THE VALUE OF THE RESISTOR:
Value
Provided Color Code Theoretical Value Multimeter Value
(Excluding Tolerance)
Red Red Orange
Brown Green Red
Red Red Red
Orange Orange Orange
RESULT:
Thus the basics of resistor colour code is studied and verified.
GE3271 ENGINEERING PRACTICE LAB TPGIT
(ELECTRONICS)
SOLDERING: CIRCUIT DIAGRAM:
DE-SOLDERING:
CIRCUIT DIAGRAM:
GE3271 ENGINEERING PRACTICE LAB TPGIT
(ELECTRONICS)
Ex.No.:1 SOLDERING WORK : SOLDERING SIMPLE ELECTRONIC CIRCUITS AND
CHECKING CONTINUITY
Date:
AIM
To practice soldering and de-soldering for the electronic circuit by assembling and
Disassembling in the Printed Circuit Board (PCB) and check for its Continuity.
APPARATUS REQUIRED
NAME OF THE
S.NO RANGE QUANTITY
APPARATUS
1. PCB Board - 1
2. Soldering iron 60/40grade 1
3. Solder - As Required
4. Soldering Flux - As Required
5. Capacitor 100μf As Required
6. Resistor 1kΩ As Required
7. Multimeter - 1
THEORY:
Soldering is the process of joining electrical parts together to form an electric connection,
using a molten mixture of lead and tin (solder), with a soldering iron.
Soldering Iron:
It supplies sufficient heat to melt solder by heat transfer, when the iron tip is applied
to a connection to be soldered.
The soldering iron temperature is selected according to the work to be performed.
Soldering Iron Stand:
The stand is the safe place to put the iron when we are not holding it.
The stand includes a sponge which can be dampened for cleaning the tip of the iron.
Solder:
It is alloy of low melting metals like tin, lead, cadmium, silver etc.
The most commonly used alloy combination is 63% tin and 37%lead.
Soldering Flux:
It is a resin, applied on the work piece to be soldered, preventing contact with the
atmosphere.
It maintains a clean surface and dissolves oxides there by enabling good soldering.
Aluminium chloride or zinc chloride are commonly used as flux.
The flux also assists in the transfer of heat from the soldering iron tip to the joint area.
GE3271 ENGINEERING PRACTICE LAB TPGIT
(ELECTRONICS)
GE3271 ENGINEERING PRACTICE LAB TPGIT
(ELECTRONICS)
PROCEDURE:
SOLDERING:
1. Study the electronic circuit.
2. Clean the given PCB board.
3. Clean the tip of the soldering iron before heating and also the resistor, capacitor which are to
be soldered.
4. Heat the soldering iron and apply solder to the tip as soon as it is hot to melt on it.
5. Bend the resistor leads to fit into the holes on the board.
6. Insert the resistor, as per the circuits how in the figure and bend the leads.
7. Apply the hot tips to the joints and apply the solder.
8. Remove the soldering tip and hold the resistor tightly until the solder has cooled and set.
9. Trim excess component lead with side cutter.
10. Repeat the above steps to fix the other resistor and capacitor.
DE-SOLDERING:
1. Place the tip of the soldering iron on the joints until the solder is melt.
2. Using de-soldering wick remove the molten state.
3. On the component side using tweezers remove the de-soldered components.
CONTINUITY CHECK:
1. Set the Multimeter in continuity check mode or resistor mode.
2. Place the two leads (common, +ve lead) in the two points to be checked.
3. If the resistance value is displayed as zero, there exists continuity.
4. Otherwise two points are not internally connected. (When set in continuity check mode, a
beep sound is heard, if continuity exists between the two points)
RESULT:
Thus the soldering and de-soldering for the electronic circuit by assembling and disassembling
in the Printed Circuit Board (PCB) is practiced and continuity check was also done.
GE3271 ENGINEERING PRACTICE LAB TPGIT
(ELECTRONICS)
CIRCUIT DIAGRAM:
GE3271 ENGINEERING PRACTICE LAB TPGIT
(ELECTRONICS)
Ex.No:2 ELECTRONIC ASSEMBLY AND TESTING WORK:
ASSEMBLING AND TESTING ELECTRONIC COMPONENTS ON A SMALL PCB.
AIM:
To practice assembling and testing electronic components on a small PCB.
COMPONENTS REQUIRED:
S.NO COMPONENTS NAME VALUE QUANTITY
1. Power Supply 5V/1A 1
2 Digital multimeter (DMM) - 1
3 Resistors 330,560, 1K Each 1 no
4 Connecting wires - 1
5 Soldering kit - 1
6 Printed Circuit Board
GE3271 ENGINEERING PRACTICE LAB TPGIT
(ELECTRONICS)
GE3271 ENGINEERING PRACTICE LAB TPGIT
(ELECTRONICS)
PROCEDURE:
1) Assembling the circuit
a) Assemble the circuit by placing the LEDs and resistors in the PCB as per the assembly
diagram shown in the figure.
b) Bend the resistors lead to the appropriate size before inserting them into the board
c) Solder the resistor on bottom side of PCB board using soldering iron.
2) Testing the circuit
a) Connect the 5V DC source from power supply.
b) Connect the multimeter at A1, A2 and A3 nodes and measure its current.
3) TROUBLE SHOOTING:
a) Set the digital multimeter in the continuity mode. Unplug the device or switch off the
circuit before attempting a continuity test. Check the continuity between all five
nodes.
b) When the resistor value differs from the circuit, the output value also differs.
Measure the current and note the values in the table below.
Voltage Resistor Theoretical PracticalCurrent
Current(A) (A)
(V) (R)
5V 330Ω
5V 560 Ω
5V 1KΩ
RESULT:
Thus, the practice of assembling and testing electronic components on a small PCB has been
successfully done.
GE3271 ENGINEERING PRACTICE LAB TPGIT
(ELECTRONICS)
Ex.No.: 3 ELECTRONIC EQUIPMENT STUDY: STUDY AN ELEMENTS OF SMARTPHONE.
AIM:
To study the elements of a smart phone.
REQUIREMENTS:
1. Any smart Phone
2. Screw driver Tool Kit
DIAGRAM:
Touchscreen:
The digitizer pasted to the front glass together is called as a "Touch Screen".
Display:
The Display or The LCD (Bottom Layer) - The bottom layer which produces the
image. The display is the visual component underneath the glass that displays the
image on the screen.
Mobile enclosure (Top and Bottom):
Mobile enclosure with easy to hold rounded design. Frame is made from extruded
aluminum material, while the panel is ABS plastic.
PCB Interconnect:
GE3271 ENGINEERING PRACTICE LAB TPGIT
(ELECTRONICS)
Male PCB Connectors are often referred to as Pin Headers, as they are simply rows of
pins.
Female PCB Connectors can be called Sockets, Receptacles, or sometimes even Header
Receptacles.
Power/ Volume button assembly:
Power button: It's usually a single button located along the top or right edge of the phone.
Press and hold the power button to switch ON or OFF the smart phone.
Volume button assembly: Volume buttons are used to Slide the following volume levels
Media volume: Music, videos, games, other media
Call volume: Volume of the other person during a call
Ring volume: Phone calls, notifications
Alarm volume
USB connector PCB:
Android smartphones have used the USB Micro-B connector for both data transfer and
charging
Haptic/Vibration Motor:
Haptics allow non-responsive surfaces like touchscreens to emulate the feeling of using
real objects like buttons and dials. Haptic technology can involve vibrations, motors, and
even ultrasound beams to simulate the feeling of touch.
Loudspeaker, Ringer assembly:
The loud speaker is a small sound driver fitted within a mobile phone, or other
communication device, which is used to produce sound. The loudspeakers on mobile
phones are used to produce sound alerts for events such as incoming calls, incoming
messages and alarms.
WLAN Antenna:
A Wi-Fi antenna (WLAN antenna) transmits and receives signals in the air at specified
frequencies, such as 2.4GHz or 5.8GHz, enabling devices like laptops or smartphones to
connect within the same frequency range.
SIM tray:
A small holder for a phone's SIM card.
Fingerprint sensor assembly:
Fingerprint sensors are for added safety and security, and to easily identify users.
The two most common fingerprint sensors in use today are optical sensors and capacitive
sensors.
Camera Flash PCB:
The PCB (Printed Circuit Board) used to connect flash for mobile phone.
GE3271 ENGINEERING PRACTICE LAB TPGIT
(ELECTRONICS)
Microphone:
The microphone at the bottom of your phone. Speak into the mic directly to be heard
by others or to speak to your phone.
Primary camera:(Main Camera)
It refers to the rear-facing camera system. The lens or lenses reside on the rear of the
phone or within a backward facing pop-up camera module.
Secondary camera:
This is the Selfie Camera - refers to the front-facing camera system. The lens or lenses
reside on the front of the phone or within a forward-facing pop-up camera housing.
Audio jack:
A phone connector, also known as phone jack, audio jack, headphone jack or jack
plug, is a family of electrical connectors typically used for analog audio signals.
Loudspeaker:
The loudspeaker is a small sound driver fitted within a mobile phone, or other
communication device, which is used to produce sound. Traditionally, loudspeakers
on mobile phones are used to produce sound alerts for events such as incoming calls,
incoming messages and alarms.
RESULT:
Thus, the elements of a smartphone were studied.
