Customer Stack-up
Proposed
Copper Thickness
Layer Structure figure Thickness
Weight (mm)
(mm)
Top Soldermask 0.01524
L1 l01_top.art 0.5oz+Plate 0.05004
Prepreg 0.10465
L2 l02_gnd1.art 2oz 0.0635
Core 0.10008
L3 l03_pwr1.art 2oz 0.0635
Prepreg 0.10465
L4 l04_bottom.art 0.5oz+Plate 0.05004
Bottom Soldermask 0.01524
Overall Thickness (mm) 0.56667
Stack-up Information
Single E
50ohm ±4
Reference
Structure Foil type Dk Df Customer
Layer
Design
LW(mm)
1/3oz+Plate H T E-PL. L2 0.1524
L2
L2
L2
L2
R5670K_1035*2 RC70 3.05 0.002
RTF
R1755V_106*2 RC71 3.68 0.019
RTF
R5670K_1035*2 RC70 3.05 0.002
1/3oz+Plate H T E-PL. L3 0.1524
L3
L3
L3
L3
Single Ended Single Ended
50ohm ±4.0ohm 55ohm ±4.4ohm
Customer
Calculated Calculated Calculated
Design
LW(mm) IMP(ohm) LW(mm)
LW(mm)
0.20066 50.00 0.12395 0.16256
0.20066 50.00 0.12395 0.16256
Ended Differential Differe
±4.4ohm 90ohm ±7.0ohm 100ohm ±
Customer Customer
Calculated Calculated Calculated
Design Design
IMP(ohm) LW/SP(mm) IMP(ohm)
LW/SP(mm) LW/SP(mm)
55.00 0.15875/0.24765 0.19558/0.21082 90.00 0.1016/0.1397
0.0889/0.10922
0.127/0.17272
0.127/0.254
0.1524/0.2667
55.00 0.15875/0.24765 0.19558/0.21082 90.00 0.1016/0.1397
0.0889/0.10922
0.127/0.17272
0.127/0.254
0.1524/0.2667
Differential
100ohm ±8.2ohm
Calculated Calculated
LW/SP(mm) IMP(ohm)
0.1143/0.127 100.00
0.09398/0.10414 100.00
0.13462/0.1651 100.00
0.15748/0.22352 100.00
0.1651/0.254 100.00
0.1143/0.127 100.00
0.09398/0.10414 100.00
0.13462/0.1651 100.00
0.15748/0.22352 100.00
0.1651/0.254 100.00