Datasheet 17
Datasheet 17
010
5V DUAL CHANNEL PROGRAMMABLE LOAD SWITCH
VBIAS
supply current makes it ideal for use in battery powered distribution VBIAS 4 11 GND 11 4
Features V-DFN3020-14
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
CIN1 VBIAS
VBIAS SS1 CL1 RL1
CSS1
ON
EN1
AP22966 VOUT2
VIN 2 OFF
VIN2
CL2 RL2
CIN2 SS2
CSS2
ON
EN2 GND
OFF
VOUT2 8, 9
This pin connects to the Source of the 2nd N-channel MOSFET.
Channel 2 slew rate control
SS2 10
An external capacitor connected to this pin will set the ramp-up time for Channel 2 output.
Ground
GND 11/PAD
Connect Pin 11 and PAD together to system ground.
Channel 1 slew rate control
SS1 12
An external capacitor connected to this pin will set the ramp-up time for Channel 1 output.
Channel 1 output
VOUT1 13, 14
This pin connects to the Source of the 1st N-channel MOSFET
VINx VOUTx
SSx
Charge
VBIAS Pump
RDIS
ENx
GND
Electrical Characteristics (For each channel @ TA = -40°C to +85°C, VIN = 0.8V to 5.5V, VBIAS = 2.5V, CIN = 1µF, CL = 100nF,
typical values are at TA = +25°C, unless otherwise specified.)
50% 50%
VEN
tON tOFF
90% 90%
50% 50%
VOUT VOUT
NEW PRODUCT
10% 10%
tD
tRISE tFALL
Switching Characteristics
Symbol Parameters Conditions Min Typ Max Unit
VIN = VEN = VBIAS = 5V, TA = +25°C
tRISE Output Rise-time RL = 10, CSS = 1000pF, CL = 0.1µF – 1720 – µs
tON Output Turn-ON Delay Time RL = 10, CSS = 1000pF, CL = 0.1µF – 1270 – µs
tFALL Output Fall-time RL = 10, CSS = 1000pF, CL = 0.1µF – 2.3 – µs
tOFF Output Turn-OFF Delay Time RL = 10, CSS = 1000pF, CL = 0.1µF – 9.6 – µs
tD Output Start Delay RL = 10, CSS = 1000pF, CL = 0.1µF – 160 – µs
VIN = 0.8V, VEN = VBIAS = 5V, TA = +25°C
tRISE Output Rise-time RL = 10, CSS = 1000pF, CL = 0.1µF – 330 – µs
tON Output Turn-ON Delay Time RL = 10, CSS = 1000pF, CL = 0.1µF – 428 – µs
tFALL Output Fall-time RL = 10, CSS = 1000pF, CL = 0.1µF – 11 – µs
tOFF Output Turn-OFF Delay Time RL = 10, CSS = 1000pF, CL = 0.1µF – 146 – µs
tD Output Start Delay RL = 10, CSS = 1000pF, CL = 0.1µF – 253 – µs
VIN = 2.5V, VEN = 5V, VBIAS = 2.5V, TA = +25°C
tRISE Output Rise-time RL = 10, CSS = 1000pF, CL = 0.1µF – 1488 – µs
tON Output Turn-ON Delay Time RL = 10, CSS = 1000pF, CL = 0.1µF – 1381 – µs
tFALL Output Fall-time RL = 10, CSS = 1000pF, CL = 0.1µF – 3 – µs
tOFF Output Turn-OFF Delay Time RL = 10, CSS = 1000pF, CL = 0.1µF – 11 – µs
tD Output Start Delay RL = 10, CSS = 1000pF, CL = 0.1µF – 359 – µs
VIN = 0.8V, VEN = 5V, VBIAS = 2.5V, TA = +25°C
tRISE Output Rise-time RL = 10, CSS = 1000pF, CL = 0.1µF – 561 – µs
tON Output Turn-ON Delay Time RL = 10, CSS = 1000pF, CL = 0.1µF – 748 – µs
tFALL Output Fall-time RL = 10, CSS = 1000pF, CL = 0.1µF – 11 – µs
tOFF Output Turn-OFF Delay Time RL = 10, CSS = 1000pF, CL = 0.1µF – 123 – µs
tD Output Start Delay RL = 10, CSS = 1000pF, CL = 0.1µF – 415 – µs
VBIAS vs. QUIESCENT CURRENT (BOTH CHANNELS) VBIAS vs. QUIESCENT CURRENT
(SINGLE CHANNEL)
100 70
95
65
90
85 60
80
55
75 TA(°C) TA(°C)
70 50
IBIAS_Q (µA)
IBIAS_Q (µA)
65
-40 45
60 -40
55 40
25
NEW PRODUCT
50 25
35
45
70 70
40 30
35
85 25 85
30
25 20
20 VIN1=VIN2=VBIAS, VEN1=VEN2=5V, VOUT=Open VIN1=VIN2=VBIAS, VEN1=VEN2=5V, VOUT=Open
SW1=On, SW2=On 15 SW1=On, SW2=Off
15
10 10
2.5 2.75 3 3.25 3.5 3.75 4 4.25 4.5 4.75 5 5.25 5.5 2.5 2.75 3 3.25 3.5 3.75 4 4.25 4.5 4.75 5 5.25 5.5
VBIAS vs. SHUTDOWN CURRENT (BOTH CHANNELS) VIN vs. OFF-STATE VIN CURRENT
(SINGLE CHANNEL)
1.0 3.0
VBIAS=5.5V, VEN=0V, VOUT=0V
2.5
0.8
TA(°C) TA(°C)
2.0
IBIAS_OFF (µA)
IIN_SD (µA)
0.6
-40
-40
25 1.5
25
0.4 70
70
85 1.0
85
0.2
VIN1=VIN2=VBIAS, VEN1=VEN2=0V, VOUT=0V 0.5
0.0 0.0
2.5 2.75 3 3.25 3.5 3.75 4 4.25 4.5 4.75 5 5.25 5.5 0.8 1.2 1.6 2 2.4 2.8 3.2 3.6 4 4.4 4.8 5.2 5.6
0.8
RON (mΩ)
19 1.5
19
18 1.05 18 1.8
17 17
1.2 2.5
16 16
15 3.3
1.5 15
14 14 3.6
13 1.8 13 4.2
12 12
2.5 5.0
11 VBIAS=2.5V, IOUT=-200mA 11 VBIAS=5.5V, IOUT=-200mA
10 10 5.5
-40 -15 10 35 60 85 -40 -15 10 35 60 85
VIN vs. RON (VBIAS=2.5V, SINGLE CHANNEL) VIN vs. RON (VBIAS=5.5V, SINGLE CHANNEL)
26 26
25 25
24 24
23 23
22 22
TA(° C) TA(° C)
21 21
20 20
RON (mΩ)
RON (mΩ)
-40 -40
19 19
18 18
NEW PRODUCT
17 25 17 25
16 16
15 70 15 70
14 14
13 85 13 85
12 12
11 VBIAS=2.5V, IOUT=-200mA 11 VBIAS=5.5V, IOUT=-200mA
10 10
0.8 1.05 1.3 1.55 1.8 2.05 2.3 2.55 0.8 1.2 1.6 2 2.4 2.8 3.2 3.6 4 4.4 4.8 5.2 5.6
VIN vs. RON (TA=25°C, SINGLE CHANNEL) VIN vs. RDIS (VBIAS=5.5V, SINGLE CHANNEL)
19.0 220
Temperature=25oC, IOUT=-200mA
18.5
216
18.0
VBIAS (V)
RDIS (Ω)
17.5
RON (mΩ)
tD vs VIN, VBIAS=2.5V
VEN vs. VOUT (TA=25°C, SINGLE CHANNEL) (CIN=1µF, CSS=1nF, RL=10Ω, CL=0.1μF)
2.4 800
VIN=VBIAS, Temperature=25oC
700
2.0
600
VBIAS (V) TA (°C)
1.6
VOUT (V)
500
2.5 -40
tD (µs)
0.0 0
0.000 0.250 0.500 0.750 1.000 1.250 1.500 1.750 2.000 2.250 2.500 0.8 1 1.2 1.4 1.6 1.8 2 2.2 2.4 2.6
VEN (V) VIN (V)
450 16
400 14
350
TA (°C) 12 TA (°C)
300
10
tD (µs)
tF (µs)
250 -40 -40
8
NEW PRODUCT
200 25 25
6
150 70 70
4
100 85 85
50 2
0 0
0.8 1.2 1.6 2 2.4 2.8 3.2 3.6 4 4.4 4.8 5.2 5.6 0.8 1 1.2 1.4 1.6 1.8 2 2.2 2.4 2.6
16 160
14 140
10 100
tOFF (µs)
tF (µs)
-40 -40
8 80
25 25
6 60
70 70
4 40
85 85
2 20
0 0
0.8 1.2 1.6 2 2.4 2.8 3.2 3.6 4 4.4 4.8 5.2 5.6 0.8 1 1.2 1.4 1.6 1.8 2 2.2 2.4 2.6
250 2500
200 2000
TA (°C) TA (°C)
tOFF (µs)
tON (µs)
150 1500
-40 -40
25 25
100 1000
70 70
50 85 500 85
0 0
0.8 1.2 1.6 2 2.4 2.8 3.2 3.6 4 4.4 4.8 5.2 5.6 0.8 1 1.2 1.4 1.6 1.8 2 2.2 2.4 2.6
2000 2500
1800
1600 2000
TA (°C) TA(°C)
1400
1200 1500
tON (µs)
tR (µs)
-40 -40
1000
NEW PRODUCT
25 25
800 1000
70 70
600
400 85 500 85
200
0 0
0.8 1.2 1.6 2 2.4 2.8 3.2 3.6 4 4.4 4.8 5.2 5.6 0.8 1 1.2 1.4 1.6 1.8 2 2.2 2.4 2.6
3000 2500
2500
TA (°C) 2000
TA (°C)
2000
-40 1500
tR (µs)
-40
tR (µs)
1500
25 25
70 1000 70
1000
85 85
500 500
0
0
0.8 1.2 1.6 2 2.4 2.8 3.2 3.6 4 4.4 4.8 5.2 5.6
2.5 3 3.5 4 4.5 5 5.5
INPUT CAPACITOR
To limit the voltage drop on the input supply when the switch turns on into a discharged load capacitor resulting in a transient inrush current, a
NEW PRODUCT
capacitor needs to be placed between VIN and GND. Use 1μF capacitor or a larger value for high-current applications. Place the capacitor close
to the VIN pins.
OUTPUT CAPACITOR
The recommended output capacitor value is 0.1μF when switching lighter loads. For heavier loads close to 6A, it is recommended that the VIN and
VOUT trace lengths be kept to a minimum. In addition, a bulk capacitor (≥ 10μF) may also be placed close to the VOUT pins. If using a bulk
capacitor on VOUT, it is important to control the inrush current by choosing an appropriate soft-start time in order to minimize the droop on the
input supply.
SOFT-START TIME
A capacitor on the SS pins (to GND) sets the slew rate for each channel. To ensure desired performance, a capacitor with a minimum voltage
rating of 25V should be placed on the SS pins. The input inrush current can be controlled by choosing an appropriate soft-start time. The table
below shows the rise-time (10% to 90%) on VOUT for a variety of VIN and CSS conditions.
Soft-start Time (µs) 10% - 90%, VBIAS = 5V, CL = 0.1µF, CIN = 1µF, RL = 10Ω, Typical Values are at TA=+25°C
CSS(pF)
5V 3.3V 1.8V 1.5V 1.2V 1.05V 0.8V
0 129 93 67 61 59 57 47
220 452 310 177 148 125 112 96
470 898 610 351 290 241 210 166
1000 1609 1130 661 557 454 397 315
2200 3453 2371 1483 1224 1019 870 710
4700 7202 4978 2900 2394 2014 1728 1430
10000 13673 9774 5728 4778 3982 3370 2762
THERMAL CONSIDERATOIN
The maximum junction temperature should be restricted to +125°C under normal operating conditions. The maximum allowable power dissipation
PD(MAX) can be calculated as:
PD(MAX) = (TJ(MAX) - TA) / θJA
where,
TJ(MAX) is the maximum operating junction temperature. For AP22966, TJ(MAX) = 125°C
TA is the ambient temperature of the device
θJA is the junction-to-air thermal impedance
BOARD LAYOUT
Good PCB layout is important for improving the thermal performance of the device. All trace lengths should be kept as short as possible. Place
input and output capacitors close to the device to minimize the effects of parasitic inductance. The input and output PCB traces should be as wide
as possible. Use a ground plane to enhance the power dissipation capability of the device.
AP22966 XXX - 7
Package Packing
DC8 : V-DFN3020-14 -7 : Tape & Reel
Marking Information
V-DFN3020-14
( Top View )
XX : Identification Code
XX Y : Year : 0~9
W : Week : A~Z : 1~26 week;
YW X a~z : 27~52 week; z represents
52 and 53 week
X : Internal Code
V-DFN3020-14
A1 A3
A
V-DFN3020-14
Seating Plane Dim Min Max Typ
A 0.77 0.83 0.80
D A1 0 0.05 0.02
e
A3 - - 0.15
NEW PRODUCT
V-DFN3020-14
X3
C
Value
Dimensions
(in mm)
C 0.400
C1 0.600
X2
5 X 0.250
.17
Y2 Y1 R0 X1 0.650
X2 2.550
Y X3 2.650
Y 0.500
Y1 0.950
Y2 2.200
C1 X X1
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NEW PRODUCT
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