DC POWER

SUPPLY

MODEL: OWON P4305

TYPE: PROGRAMMABLE LINEAR DC
POWER SUPPLY

OUTPUT RANGE:
VOLTAGE: 0–30V
CURRENT: 0–5A
POWER: MAX 150W

FUNCTIONS AND FEATURES:

Voltage & Current Display

Real-time digital display of output voltage (e.g., 14.399V)
Real-time digital display of output current (e.g., 0.065A)
Shows power output in watts (e.g., 0.395W)
Set Value Display
Shows preset voltage/current limits
Example: Set voltage to 14.399V, current limit to 2.050A
Protection Features
OVP: Over Voltage Protection (e.g., set to 31.000V)
OCP: Over Current Protection (e.g., set to 5.100A)
Control Panel
Keypad & Rotary Encoder: For easy voltage/current
adjustment
Memory/Recall Buttons: Save and retrieve commonly used

APPLICATIONS
settings
System Menu: Advanced configuration
Status Indicators
CV (Constant Voltage) Mode: Maintains a set voltage
Electronic circuit testing
CC (Constant Current) Mode: Maintains a set current (not Lab experiments
shown active here)
ON Indicator: Power output is currently active
PCB prototyping
Output Terminals Battery charging/testing
Color-coded:
Red = Positive (+) Embedded system development
Black = Negative (–) PCB Chip Level Repairing
⏚
Green = Ground ( )
Safety Labels
Clearly labeled for 2.5mm² wire compatibility and general
electrical caution.
 THERMAL IMAGING
CAMERA

MODEL: MEGA IDEA QIANLI

TYPE: IR THERMAL IMAGING CAMERA

3D EFFECT FOR VISUALIZING HEAT

DISTRIBUTION AND A RECTANGULAR
CURVE FOR COMPARING HEAT BANDS

FUNCTIONS AND FEATURES:

Thermal Imaging (Infrared Heat Mapping)

Detects temperature variations across a PCB in real time.
Helps locate short circuits, faulty ICs, or power-consuming
components by their heat signatures.
Smart Chip-Level Diagnosis
Shows where current is being consumed abnormally.
Identifies failing components without probing or physical
contact.
Non-Invasive Fault Detection
Ideal for finding hidden internal shorts in multilayer PCBs.
No need to inject voltage blindly or disassemble the board.
Cold Boot Short Detection
Useful with a DC power supply: apply voltage to a shorted line,
and the thermal camera shows where the board heats up.
High-Resolution IR Camera with Stand
Mounted on an adjustable vertical stand for stable, hands-free APPLICATIONS
operation. Electronic circuit testing.
Allows precise focusing on the component or chip area.
Image/Video Capture & Analysis
Mobile phone motherboard repair (e.g.,
Some models support saving snapshots or thermal videos for iPhone, Samsung)
documentation or analysis. Laptop/PC motherboard diagnostics.
Battery/power management IC faults.
Detecting dead shorts, leakage, thermal.
drift, or overheating components.
Quality assurance in electronics.
manufacturing.
PCB Chip Level Repairing .
 HOT AIR SMD
REWORK STATION

MODEL: SUGON 8650 PRO

TYPE: TRIPLE CHANNEL HOT AIR REWORK
STATION
PURPOSE: PRECISION HEATING FOR SMD
SOLDERING/DESOLDERING

FUNCTIONS AND FEATURES:

Hot Air Rework System (CH1, CH2, CH3)

Three independently controlled channels with digital
temperature and airflow settings.
Adjustable temperature (e.g., 100°C – 500°C) and air volume.
Suitable for lead-free soldering, IC/CPU reflow, and BGA chip
work.
Pre-set Memory Channels
CH1, CH2, CH3 store saved temperature/airflow settings for
quick recall.
Speeds up workflow during repetitive or complex repairs.
Spiral & Straight Air Modes
Supports spiral airflow (for precision on small components) and
straight airflow (for larger areas).
Useful for different component sizes and board types.
Digital Display Panel
Shows real-time temperature, air volume, and preset values. APPLICATIONS
Ensures precise control during heating. Soldering and desoldering SMD/SMT
Anti-static and Safety Features
Anti-static design to prevent ESD damage to sensitive
components (e.g., BGA, QFN, SOP, etc.)
components. Reflowing or replacing mobile ICs (CPU,
Auto sleep and cool-down modes to extend heater life and PMIC, NAND)
ensure safety.
Repairing laptops, motherboards, and
Nozzle Stand and Holder
Comes with a stand to hold the hot air gun when not in use. other multilayer PCBs
Prevents accidental burns or damage to your workspace. Heat shrinking tubing, removing adhesives
or coatings
PCB Chip Level Repairing .
 SOLDERING
STATION

MODEL: SUGON T26D

TYPE: DIGITAL TEMPERATURE-
CONTROLLED SOLDERING STATION
PURPOSE: PRECISION SOLDERING OF
ELECTRONIC COMPONENTS

FUNCTIONS AND FEATURES:

Digital Temperature Control

Real-time display of set temperature and actual temperature on
a large digital screen.
Temperature range: typically 200°C – 480°C, suitable for lead-
free and leaded soldering.
Preset Channels (CH1, CH2, CH3)
Store and quickly switch between commonly used temperature
settings for different soldering tasks.
ESD-Safe Design
Prevents electrostatic discharge damage to sensitive
components, essential for modern electronics.
🪛 T26 Soldering Handle Compatibility
Compatible with Hakko T26 tips, known for fast heat recovery
and precision.
Excellent for chip-level repairs, SMD soldering, and micro-joint
work. APPLICATIONS
Integrated Soldering Iron Holder with Brass Tip Cleaner SMD/Through-hole soldering
Convenient tip cleaning during work using brass wool.
Secure holder cradle keeps the iron safely in place when not in
Mobile phone and laptop chip-level
use. motherboard repair
Sleep Mode and Auto-Standby Features (in some versions) Microcontroller and embedded circuit
Conserves energy and extends tip life when idle.
development
Automatically reduces temperature after a period of inactivity.
LED, audio, and hobby electronics
Repair and rework in electronics service
labs
 DIGITAL STORAGE
OSCILLOSCOPE

MODEL EXAMPLE: UNI-T UTD2102CEX

TYPE: DUAL-CHANNEL DIGITAL
STORAGE OSCILLOSCOPE 200 MHZ
PURPOSE: SIGNAL ANALYSIS, WAVEFORM
VISUALIZATION, CIRCUIT DIAGNOSIS

FUNCTIONS AND FEATURES:

Waveform Display & Storage

Captures and displays real-time analog waveforms digitally.
Allows you to freeze, zoom, and analyze electrical signals.
Voltage & Frequency Measurement
Measures peak voltage, rms voltage, frequency, duty cycle, and
time intervals.
Helps identify issues like noise, distortion, and incorrect logic
levels.
Dual-Channel Input
Analyze two signals simultaneously — useful for comparing
input/output of ICs or two different parts of a circuit.
Digital Storage Capability
Stores waveforms for future analysis.
Supports USB export, screenshot capture, and PC connectivity.
Trigger System
Built-in triggering for stable waveform capture (e.g., edge, pulse, APPLICATIONS
slope trigger). Testing signal integrity in mobile phone or
Allows precise timing analysis of periodic or single-shot events.
Wide Bandwidth (Typically 100 MHz – 200 MHz)
motherboard repair
Suitable for most electronics troubleshooting including Debugging MCU or digital logic circuits
microcontroller, audio, communication, and power circuits. Measuring timing between clock and data
signals
Identifying intermittent faults or noisy
signals
Educational labs and electronics
development
 DIGITAL STEREO
MICROSCOPE

MODEL: MOS300
TYPE: TRINOCULAR STEREO
ZOOM MICROSCOPE
PURPOSE: PRECISION VISUAL
INSPECTION FOR ELECTRONICS,
SPECIALLY CHIP-LEVEL PCB REPAIR

FUNCTIONS AND FEATURES:

High-Definition Binocular Viewing

Offers a 3D stereoscopic view with high clarity, allowing users to
perceive depth and fine details of electronic components and
PCB traces.
Zoom Magnification System
Adjustable zoom range (commonly from 7X to 45X or more),
enabling close inspection of micro solder joints, IC pins, BGA
pads, and broken traces.
Ergonomic Viewing
Angled eyepieces for comfortable long-duration viewing without
eye strain. Ideal for professional use in rework labs or
electronics repair centers.
Solid Metal Base & Adjustable Stand
Stable working platform with vertical height adjustment for
working with components of various sizes and for focusing at
different depths. APPLICATIONS
Optional LED Ring Light Compatible Micro soldering and IC reballing
Supports ring lighting for shadow-free illumination, essential for
clearly seeing fine solder joints and damaged areas on PCBs.
Visual inspection of SMD components,
solder bridges, or dry joints
BGA pad evaluation and fault tracing
Use in mobile, laptop, and motherboard
repair
Soldering work under magnification for
precision and accuracy
 BENCH-TOP DIGITAL
MULTIMETER

MODEL: XDM2041
TYPE: HIGH-PRECISION BENCH-TOP
DIGITAL MULTIMETER (DMM)
PURPOSE: ACCURATE MEASUREMENT
OF ELECTRICAL PARAMETERS IN
ELECTRONICS TESTING, DEVELOPMENT,
AND REPAIR
FUNCTIONS AND FEATURES:

High-Accuracy Measurement
Offers full 5½-digit resolution for precise readings
Capable of measuring voltage, current, resistance, frequency,
capacitance, continuity, and diode
Large Color LCD Display
High-contrast screen for easy viewing of values and functions
Color-coded readouts and graphical user interface
Multiple Measurement Modes
Manual and auto-ranging support
Specialized modes: Relative mode, math functions, dual display
(e.g., voltage + frequency)
Multiple Input Terminals
4 input jacks for standard and precision measurements
High-voltage protection and category ratings (CAT I/II 1000V)
Data Logging and USB Connectivity
Save/recall measurement data APPLICATIONS
USB and RS232 ports for PC connectivity, ideal for test Chip-level PCB diagnostics
automation and data logging
Graphing and Trigger Functions
Voltage and current verification on
Trend chart display for real-time signal monitoring motherboards and circuits
External trigger input for controlled measurements Testing resistors, capacitors, and
semiconductors
Calibration and QC in R&D labs, repair
centers, and production lines
 FUME
EXTRACTOR

TYPE: PORTABLE SOLDERING SMOKE

ABSORBER
MODEL EXM: SIMILAR TO WELLER OR
GENERIC ESD-SAFE FUME EXTRACTORS
PURPOSE: REMOVES HARMFUL FUMES
GENERATED DURING SOLDERING

FUNCTIONS AND FEATURES:

Fume Extraction
Actively draws in smoke and fumes produced during soldering
Protects technicians from inhaling toxic vapors, especially from
rosin-based flux
Activated Carbon Filter
Equipped with a carbon filter that absorbs harmful gases and
particles
Easily replaceable filter system
Quiet Fan Operation
Built-in low-noise fan ensures continuous airflow without
disturbing the workspace
Adjustable Stand and Angles
Tiltable frame and adjustable legs to direct airflow towards
soldering area
Compact and lightweight for bench-top use
Plug-and-Play Power APPLICATIONS
Runs on standard AC power PCB Repair & Assembly
Some models also support USB power for portability
Mobile phone motherboard soldering
IC and SMD soldering/desoldering
ESD-sensitive environments
 HOT AIR
OVEN

TYPE: LABORATORY / INDUSTRIAL

HOT AIR OVEN
MODEL TYPE: MANUAL TEMPERATURE-
CONTROLLED, FRONT-LOAD OVEN
PURPOSE: CONTROLLED HEATING AND
BAKING OF ELECTRONIC COMPONENTS
AND PCBS
FUNCTIONS AND FEATURES:

Precise Thermal Processing

Used for preheating or drying PCBs before soldering
Ensures uniform heat distribution to prevent board warping
Temperature Control
Equipped with manual knobs for temperature and timing
control
Typically ranges between 50°C to 300°C, depending on model
Moisture Removal
Dries out moisture-sensitive electronic components
Prevents micro-cracking or soldering defects during reflow
Robust Build
Heavy-duty metal chamber with insulation for stable heat
retention
Front latch door with heat-resistant handle for safe operation
Post-Repair Baking
Sometimes used for baking repaired motherboards (after APPLICATIONS
reballing or chip replacement) to relieve mechanical stress On-chip PCB repair
Drying of solder paste, adhesives, or
conformal coatings
IC rebonding or reballing workflows
Storage and maintenance of moisture-
sensitive devices (MSDs)
 What is PCB Chip-Level Repair?

PCB chip-level repair refers to the process of diagnosing

and fixing faults directly on the components of a Printed
Circuit Board (PCB), rather than replacing the whole board.
This involves working with individual microchips, resistors,
capacitors, connectors, and other SMD (Surface Mount
Devices) components using specialized tools and
techniques.
Key Steps in Chip-Level Repair:
Fault Diagnosis: Using tools like multimeters, oscilloscopes, and thermal
cameras to identify faulty components or traces.
Component Replacement: Desoldering damaged chips (like ICs or
transistors) and replacing them using hot air stations or rework tools.
Soldering/Desoldering: Precise soldering using soldering stations,
rework stations, and flux to ensure solid connections.
Testing: Verifying repaired components using continuity and
functionality tests.

Conclusion:
Chip-level repair is a cost-
effective, skill-intensive method
for extending the life of electronic
devices, reducing e-waste, and
APPLICATIONS
saving critical hardware Mobile Phone Motherboards
Laptop Logic Boards
components from total
Telecommunication Equipment
replacement. Industrial Electronics
Medical Equipment
 Benefits of Chip-Level Repairing in
the Indian Railway Industry.

Chip-level repairing plays a crucial role in maintaining the

reliability and efficiency of electronic systems in the railway
sector. Here's how it benefits the industry:
1. Cost Efficiency
Reduces replacement costs: Instead of replacing entire PCBs or
modules, only the faulty components are repaired or replaced.
Lower maintenance expenses: Significant savings on high-value
electronic components used in signaling, control, and
communication systems.

2. Minimizes Downtime
Faster repair cycles: On-site or in-house chip-level repairs speed up
the restoration of failed equipment.
Prevents service disruptions: Ensures continuous operation of
critical railway systems, improving reliability.

3. Promotes Sustainability
Reduces e-waste: Repairing instead of discarding faulty
components supports green and eco-friendly practices.
Maximizes equipment lifecycle: Enhances the longevity of
electronic boards and systems.

4. Enhances System Reliability

Precision diagnostics and fixes: Ensures that only the faulty part is
addressed, reducing chances of future failure.
Mobile Phone Motherboards
Improved performance: Restored Laptop
components often undergo
Logic Boards
Telecommunication Equipment
rigorous testing, ensuring stable performance.
Industrial Electronics
Medical Equipment
5. Supports Skill Development
Boosts technical expertise: Encourages development of skilled
manpower capable of performing complex electronic repairs.
Self-reliance: Reduces dependency on OEMs (Original Equipment
Manufacturers) for every fault or issue.

Common Applications in Railways

Signaling systems
breaking systems
fire systems
Automatic ticketing machines
Onboard control units (OBUs)
Communication equipment
Display boards and control panels and many more.

Conclusion:
Chip-level repairing in the railway industry offers economic,
operational, and environmental advantages, making it an
essential practice for modern railway maintenance and
engineering operations.

Design by - Compufact Systems