TPS61322

SLVSDY5E – JANUARY 2018 – REVISED FEBRUARY 2024

TPS61322 6.5-µA Quiescent current, 1.8-A switch current boost converter

1 Features 3 Description
• Operating input voltage range: 0.9 V to 5.5 V The TPS61322 is a synchronous boost converter
• Output voltage range: 1.8 V to 5.5 V with only 6.5-µA quiescent current. The TPS61322
• 6.5-µA Quiescent current into VOUT pin provides a power-supply solution for products
• ±3% Output voltage accuracy over temperature powered by alkaline battery, NiMH rechargeable
• Minimum switch peak-current limit: battery, or one-cell Li-ion battery. The boost
– 0.42 A for TPS613223A converter is based on a hysteretic control topology
– 0.5 A for TPS61322 using synchronous rectification to obtain maximum
– 0.75 A for TPS613221A and TPS613226A efficiency at minimal quiescent current. The
– 1.10 A for TPS613222A TPS61322 also allows the use of small external
• Higher than 90% efficiency at 10-mA load from inductor and capacitors. Higher than 90% efficiency
1.5-V to 2.2-V conversion is achieved at 10-mA load from 1.5-V input to 2.2-V
• Thermal shutdown protection output conversion.
• 2.9-mm × 1.3-mm 3-pin SOT package and 2.9-mm The TPS61322 can also support high output current
× 1.6-mm 5-pin SOT package applications with an external schottky diode. The
• Create a custom design using the TPS61322 with TPS613222A provides higher than 500-mA output
the WEBENCH® Power Designer current capability at 3-V input voltage to 5-V output
2 Applications voltage conversion with an external Schottky diode in
parallel with the internal rectifier FET.
• 1-cell to 3-cell Alkaline or NiMH battery-powered
applications The output voltage is set internally to a fixed output
• Gaming control voltage from 1.8 V to 5.5 V in increments of 0.1
• Tablet V. Thus, it only needs two external components to
• Portable electronics get the desired output voltage. The TPS61322 also
• Medical equipment implements thermal shutdown protection function.
The TPS61322 is available in a 2.9-mm × 1.3-mm
3-pin SOT package or a 2.9-mm × 1.6-mm 5-pin SOT
package.
Device Information(1)
PART NUMBER PACKAGE BODY SIZE (NOM)
SOT-23 (3) 2.90 mm × 1.30 mm
TPS61322
SOT-23 (5) 2.90 mm × 1.60 mm

(1) For all available packages, see the orderable addendum at

the end of the data sheet.

SW VOUT VOUT
L1 C1
Battery
TPS61322xx
GND

Typical Application Circuit

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
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Table of Contents
1 Features............................................................................1 8.1 Application Information..............................................11
2 Applications..................................................................... 1 8.2 Typical Application.................................................... 11
3 Description.......................................................................1 8.3 System Examples..................................................... 19
4 Device Comparison Table...............................................3 9 Power Supply Recommendations................................20
5 Pin Configuration and Functions...................................3 10 Layout...........................................................................21
Pin Functions.................................................................... 3 10.1 Layout Guidelines................................................... 21
6 Specifications.................................................................. 4 10.2 Layout Examples.................................................... 22
6.1 Absolute Maximum Ratings........................................ 4 11 Device and Documentation Support..........................23
6.2 ESD Ratings............................................................... 4 11.1 Device Support........................................................23
6.3 Recommended Operating Conditions.........................4 11.2 Documentation Support.......................................... 23
6.4 Thermal Information....................................................4 11.3 Receiving Notification of Documentation Updates.. 23
6.5 Electrical Characteristics.............................................5 11.4 Support Resources................................................. 23
6.6 Typical Characteristics................................................ 6 11.5 Trademarks............................................................. 23
7 Detailed Description........................................................9 11.6 Electrostatic Discharge Caution.............................. 23
7.1 Overview..................................................................... 9 11.7 Glossary.................................................................. 24
7.2 Functional Block Diagram........................................... 9 12 Revision History.......................................................... 24
7.3 Feature Description.....................................................9 13 Mechanical, Packaging, and Orderable
8 Application and Implementation.................................. 11 Information.................................................................... 24

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4 Device Comparison Table

PART NUMBER OUTPUT VOLTAGE TYPICAL CURRENT LIMIT
TPS61322 2.2 V 0.75A
TPS613221A 3.3 V 1.2 A
TPS613222A 5V 1.8 A
TPS613223A 2V 0.75 A
TPS613224A(1) 2.5 V 0.75 A
TPS613225A(1) 3V 1.2 A
TPS613226A 3.6 V 1.2 A

(1) Product Preview. Contact TI factory for more information.

5 Pin Configuration and Functions

VOUT GND

TPS61322 TPS61322xA

GND SW VOUT SW

Figure 5-1. DBZ Package 3-Pin SOT Top View

NC VOUT

TPS61322xA

SW GND NC

Figure 5-2. DBV Package 5-Pin SOT Top View

Pin Functions
PIN
TPS61322 TPS61322xA TYPE DESCRIPTION
NAME
DBZ DBZ DBV
1 3 2 GND PWR Ground of the IC.
2 2 1 SW PWR The switch pin of the converter. It is connected to the inductor.
3 1 4 VOUT PWR Boost converter output.
- - 3 NC - No connection inside the device.
- - 5 NC - No connection inside the device.

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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Voltage range at terminals(2) SW, VOUT –0.3 6.0 V
Operating Junction Temperature,TJ –40 150 °C
Storage Temperature, Tstg –65 150 °C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress
ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under
Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability.
(2) All voltage values are with respect to network ground terminal.

6.2 ESD Ratings

VALUE UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000
V(ESD) Electrostatic discharge Charged-device model (CDM), per JEDEC specification JESD22- V
±500
C101(2)

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VIN Input voltage range 0.9 5.5 V
VOUT Output voltage range 1.8 5.5 V
L Inductor (effective) 0.7 2.2 13 µH
COUT Output capacitor (effective) 4.7 16 100 µF
TJ Operating junction temperature -40 125 °C

6.4 Thermal Information

TPS61322
THERMAL METRIC(1) DBZ (SOT-23) DBV (SOT-23) UNIT
3-PIN 5-PIN
RθJA Junction-to-ambient thermal resistance 322.2 189.7 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 107.0 109.4 °C/W
RθJB Junction-to-board thermal resistance 65.8 56.5 °C/W
ψJT Junction-to-top characterization parameter 7.5 33.3 °C/W
ψJB Junction-to-board characterization parameter 64.5 56.5 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A °C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.

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6.5 Electrical Characteristics

TJ = –40°C to +125°C and VIN = 0.9 V to 5.5 V. Typical values are at VIN = 1.2 V, TJ = 25°C, unless otherwise noted
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
POWER SUPPLY
VIN Input voltage range 0.9 5.5 V
Minimum voltage for
VVOUT_START RLoad ≥ 250Ω ,TJ =-40°C to 85°C 0.83 0.87 V
startup at VOUT pin
Quiescent current into
IQ VOUT = 1.2×Target 6.5 10 uA
VOUT pin
OUTPUT
TPS61322 VIN < VOUT, TJ =-40°C to 125°C 2.134 2.2 2.266 V
TPS613221A VIN < VOUT, TJ =-40°C to 125°C 3.2 3.3 3.4 V
VOUT TPS613222A VIN < VOUT, TJ =-40°C to 125°C 4.85 5.0 5.15 V
TPS613223A VIN < VOUT, TJ =-40°C to 125°C 1.94 2.0 2.06 V
TPS613226A VIN < VOUT, TJ =-40°C to 125°C 3.49 3.6 3.71 V
Leakage current into
ISW_LKG VSW = VOUT = 1.2×Target 3.5 nA
SW pin
POWER SWITCH
TPS61322 300 mΩ
TPS613221A 200 mΩ
Low side switch on
RDS(on)_LS TPS613222A 150 mΩ
resistance
TPS613223A 400 mΩ
TPS613226A 190 mΩ
TPS61322 1300 mΩ
TPS613221A 1000 mΩ
High side switch on
RDS(on)_HS TPS613222A 750 mΩ
resistance
TPS613223A 1680 mΩ
TPS613226A 950 mΩ
TPS61322 0.50 0.75 1.20 A
TPS613221A 0.75 1.20 1.60 A
Peak switch current
ILIM TPS613222A 1.10 1.80 2.50 A
limit
TPS613223A 0.42 0.75 1.2 A
TPS613226A 0.75 1.20 1.60 A
Protection
Over-temperature
TSD TJ rising 150 °C
protection
Over-temperature
TSD_HYS 20 °C
protection hysteresis

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6.6 Typical Characteristics

TJ = 25°C unless otherwise noted.

100 2.25
90 2.24
80 2.23
70 2.22

Output Voltage (V)

Efficiency (%)

60 2.21
50 2.2
40 2.19
30 2.18
VIN = 0.9 V VIN = 0.9 V
20 VIN = 1.2 V 2.17 VIN = 1.2 V
10 VIN = 1.5 V 2.16 VIN = 1.5 V
VIN = 1.8 V VIN = 1.8 V
0 2.15
0.0001 0.001 0.01 0.1 1 0.0001 0.001 0.01 0.1 1
Output Current (A) D005
Output Current (A) D006

TPS61322 L = 4.7 µH TPS61322 L = 4.7 µH

Figure 6-1. Load Efficiency with Different Inputs Figure 6-2. Load Regulation
100 3.45
95
90 3.4
85
Output Voltage (V)
Efficiency (%)

80 3.35
75
70 3.3
Vin=0.9V Vin=0.9V
65 Vin=1.5V Vin=1.5V
Vin=2.5V Vin=2.5V
60 3.25
Vin=3.0V Vin=3.0V
55 Vin=3.3V Vin=3.3V

50 3.2
0.0001 0.001 0.01 0.02 0.05 0.1 0.2 0.5 1 0.0001 0.001 0.01 0.02 0.05 0.1 0.2 0.5 1
Iout (A) D003
Iout (A) D008

TPS613221A L = 2.2 µH TPS613221A L = 2.2 µH

Figure 6-3. Load Efficiency with Different Inputs Figure 6-4. Load Regulation
100 5.15

95
90 5.1
85
Efficiency (%)

80
Output Voltage (%)

5.05
75
70
Vin=0.9V 5
65 Vin=1.5V
60 Vin=3.0V
Vin=3.6V Vin=0.9V
55 Vin=4.2V 4.95 Vin=1.5V
Vin=3.0V
50 Vin=3.6V
0.0001 0.001 0.01 0.02 0.05 0.1 0.2 0.5 1 Vin=4.2V
Iout (A) D004 4.9
0.0001 0.001 0.01 0.02 0.05 0.1 0.2 0.5 1
TPS613222A L = 2.2 µH Iout (A) D007

Figure 6-5. Load Efficiency with Different Inputs TPS613222A L = 2.2 µH

Figure 6-6. Load Regulation

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100 3.75

95
90 3.7

Output Voltage (V)

85
Efficiency (%)

80 3.65

75
3.6
70
Vin=0.9V Vin=0.9V
65 Vin=1.5V
Vin=1.5V
3.55 Vin=2.5V
Vin=2.5V
60 Vin=3.0V
Vin=3.0V Vin=3.3V
55 Vin=3.3V
3.5
50 0.0001 0.001 0.01 0.02 0.05 0.1 0.2 0.5 1
0.0001 0.001 0.01 0.02 0.05 0.1 0.2 0.5 1 Iout (A) D006
Iout (A) D005
TPS613226A L = 2.2 µH
TPS613226A L = 2.2 µH
Figure 6-8. Load Regulation
Figure 6-7. Load Efficiency with Different Inputs
100 2.15
Vin=0.9V
95 Vin=1.2V
Vin=1.5V
90
Y Axis Title (Unit)
2.1 Vin=1.8V

85

80
Efficiency (%)

2.05

75

70
2
65

60 Vin=0.9V
Vin=1.2V
1.95
Vin=1.5V 0.0001 0.001 0.005 0.02 0.05 0.1 0.2
55
Vin=1.8V Iout (A) D008
50 TPS613223A L = 4.7 µH
0.0001 0.001 0.005 0.02 0.05 0.1 0.2
Iout (A) D020 Figure 6-10. Load Regulation
TPS613223A L = 4.7 µH

Figure 6-9. Load Efficiency with Different Inputs

1500 2000

1400 1900
Current Limit (mA)

Current Limit (mA)

1300 1800

1200 1700

1100 1600

1000 1500
-50 -25 0 25 50 75 100 125 -50 -25 0 25 50 75 100 125
Temperature (°C) D009
Temperature (°C) D001

TPS613221A L = 2.2 µH TPS613222A L = 2.2 µH

Figure 6-11. Current Limit with Different Figure 6-12. Current Limit with Different
Temperature Temperature

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1500 1

1400 0.9
Current Limit (mA)

Current Limit (A)

1300 0.8

1200 0.7

1100 0.6

1000 0.5
-50 -25 0 25 50 75 100 125 -60 -30 0 30 60 90 120 150
Temperature (°C)
Temperature (°C) D001
D022

TPS613226A L = 2.2 µH TPS613223A L = 4.7 µH

Figure 6-13. Current Limit with Different Figure 6-14. Current Limit with Different
Temperature Temperature

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7 Detailed Description
7.1 Overview
The TPS61322xx is a low quiescent current, high efficiency synchronous boost converter. The TPS61322xx
uses hysteretic current control scheme. The TPS61322xx is designed for systems powered by alkaline battery,
NiMH rechargeable battery, Li-ion battery or Li-polymer battery. The input voltage range is from 0.9 V to
5.5 V. After start-up is completed, the TPS61322xx can work with the input voltage down to 0.4 V. The
TPS61322xx consumes only 6.5-µA quiescent current and achieves high efficiency under light load conditions.
The TPS61322xx is designed as an always-on power. Higher than 90% efficiency is achieved under 10-mA
load from 1.5-V input voltage to 2.2-V output voltage conversion to extend battery lifetime. The TPS613222A
can support as high as 500-mA output current from 3-V input voltage to 5-V output voltage conversion with an
external schottky diode in parallel with internal high-side MOSFET.
7.2 Functional Block Diagram

SW 2 3 VOUT
VOUT
VOUT

Gate Driver
UVLO Gate Driver

Current
Logic PWM Control Sense

Soft Start &

Thermal Current Limit EA
Shutdown Control
GND 1
VREF

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7.3 Feature Description

7.3.1 Soft Start
When the input voltage is applied, the high side MOSFET is turned on. The input voltage charges the output
capacitors through the inductor and the high side MOSFET. When the output capacitors are charged to 0.83-V
typical value, the TPS61322xx starts switching at 1.6-MHz fixed frequency and the high-side MOSFET is turned
off. When the output voltage goes up to typical 1.6 V, an internal soft-start control circuit ramps the reference
voltage to 0.8 V within 2 ms. In this way, the soft-start function reduces the input inrush current. After the output
voltage reaches the target value, soft start ends, and the inductor peak current is determined by the output of an
internal error amplifier. After start-up, the TPS61322xx can work with the input voltage down to 0.4 V.
7.3.2 Boost Controller Circuit
The TPS61322xx boost converter is controlled by a hysteretic current mode scheme. The TPS61322xx regulates
the output voltage by keeping the inductor ripple constant of 200-mA typical value and adjusting the offset of

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this inductor current depending on the output load. If the required average input current is lower than average
inductor current defined by this constant ripple current, the inductor current becomes discontinuous to keep the
efficiency high under light load conditions. Figure 7-1 illustrates the hysteretic current operation.
The output voltage VOUT is monitored via the internal feedback network connected to a voltage error amplifier.
To regulate the output voltage, the voltage error amplifier compares this feedback voltage to the internal voltage
reference and adjusts the required offset of the inductor current accordingly.
IL

Continuous Current Operation

Discontinuous Current Operation

200mA
200mA

t
Figure 7-1. Hysteretic Current Operation

7.3.3
The TPS61322xx boost converter can increase the output load capacity by connecting an external schottky
diode from SW pin to VOUT pin. Higher than 500 mA output current is supported for 5-V output voltage
applications such as USB OTG and HDMI power supply. For such applications, an adaptive constant off time
circuit will generate the signal to turn off high-side FET. The inductor current ripple is greater than 200 mA if with
this external diode. A higher inductance can help reduce the inductor current ripple.
7.3.4 Undervoltage Lockout
An undervoltage lockout function stops operation of the converter if the input voltage drops below the typical
undervoltage lockout threshold of 0.4 V while the output voltage is still higher than 1.8 V. A hysteresis of 100 mV
is added so that the device does not switch again until the input voltage goes up to 0.5 V.
7.3.5 Current Limit Operation
The TPS61322xx employs cycle-by-cycle peak current limit operation. If the inductor peak current hits the peak
current limit ILIM, the low-side MOSFET is turned off and stops the further increase of the inductor current. In
this case the output voltage drops until power balance between the input side and output side is achieved. If the
output voltage drops below the input voltage, the inductor current will be clamped by the DCR of the inductor and
the on-resistance (Rds,on) of the high-side MOSFET.
7.3.6 Overtemperature Protection
The TPS61322xx has a built-in temperature sensor which monitors the internal junction temperature in boost
mode operation. If the junction temperature exceeds the threshold 150°C, the device stops operating. As soon
as the junction temperature drops below the shutdown temperature minus the hysteresis, typically 130°C, the
device starts operating again.
7.3.7 Device Functional Modes
• Section 7.3.2 - Continuous and discontinuous current operation
• Protective mechanisms
– Section 7.3.5
– Section 7.3.4
– Section 7.3.6

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8 Application and Implementation

Note
Information in the following applications sections is not part of the TI component specification,
and TI does not warrant its accuracy or completeness. TI’s customers are responsible for
determining suitability of components for their purposes, as well as validating and testing their design
implementation to confirm system functionality.

8.1 Application Information

The TPS61322xx is designed to operates at a wide input voltage range from 0.9-V to 5.5-V. The minimum
peak switch current limit is 0.5 A for TPS61322, with 0.75 A for TPS613221A and 1.1 A for TPS613222A.
The TPS61322xx supports output voltage from 1.8 V to 5.5 V with increment of 0.1 V, refer to Section 4 for
device details to select the right device for the target applications. Use the following design procedure to select
component values for the TPS61322xx.
8.2 Typical Application
8.2.1 Boost without Schottky Diode
A typical application example is the wireless mouse, which normally requires 2.2-V voltage as its supply voltage
and consumes less than 50-mA current from one-cell alkaline battery. The following design procedure can be
used to select external component values for TPS61322xx.
4.7uH
SW VOUT VOUT
L1 C1
Battery 22uF
TPS61322xx
GND

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Figure 8-1. Typical Application Circuit without Schottky Diode

8.2.1.1 Design Requirements

Table 8-1. Design Requirements
PARAMETERS VALUES
Input voltage 0.9 V to 1.6 V
Output voltage 2.2 V
Output current 50 mA
Output voltage ripple ±10 mV

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8.2.1.2 Detailed Design Procedure

8.2.1.2.1 Custom Design With WEBENCH® Tools
Click here to create a custom design using the TPS61322 device with the WEBENCH® Power Designer.
1. Start by entering the input voltage (VIN), output voltage (VOUT), and output current (IOUT) requirements.
2. Optimize the design for key parameters such as efficiency, footprint, and cost using the optimizer dial.
3. Compare the generated design with other possible solutions from Texas Instruments.
The WEBENCH Power Designer provides a customized schematic along with a list of materials with real-time
pricing and component availability.
In most cases, these actions are available:
• Run electrical simulations to see important waveforms and circuit performance
• Run thermal simulations to understand board thermal performance
• Export customized schematic and layout into popular CAD formats
• Print PDF reports for the design, and share the design with colleagues
Get more information about WEBENCH tools at www.ti.com/WEBENCH.
8.2.1.2.2 Maximum Output Current
For boost converters, the maximum output current capability is determined by the input to output ratio, the
efficiency, the inductor current ripple and the current limit. The maximum output current can be estimated by
Equation 1

I LH
V IN u ( I LIM ) uK
I OUT 2
(max)
V OUT (1)

where
• ILIM is the peak inductor current limit
• ILH is the inductor current ripple
• η is the boost converter power convert efficiency
Minimum input voltage, maximum boost output voltage and minimum current limit should be used as the worst
case condition for the estimation.
In this example, assume the power efficiency is 70% at the minimum input voltage of 0.9 V. The calculated
maximum output current is 114 mA, which satisfies the application requirements.
8.2.1.2.3 Inductor Selection
Because the inductor affects steady state operation, transient behavior, and loop stability, the inductor is the
most important component in power regulator design. There are three important inductor specifications, inductor
value, saturation current, and dc resistance (DCR).
The TPS61322xx is optimized to work with inductor values between 0.7 µH and 13 µH. The inductor values
affect the switching frequency. The estimated switching frequency in continuous conduction mode(CCM) can
be calculated by Equation 2. The switching frequency ƒSW is not a constant value, which is determined by the
inductance, the inductor current ripple, the input voltage and the output voltage. The current ripple ILH is fixed to
200 mA typically, but it can be affected by the inductor value indirectly. Normally when a smaller inductor value
is applied, the inductor current ramps up and down more quickly. The current ripple becomes bigger because the
internal current comparator has delay to respond. If a smaller inductor peak current is required in applications,
a higher inductor value can be used. However, The inductor and output capacitor must be considered together
for the loop stability. The output capacitor and the inductance will influence the bandwidth and phase margin of
the converter. Consequently, with a larger inductor, a bigger capacitor normally must be used to ensure the same
L/C ratio for a stable loop. For best stability consideration, a 4.7-µH inductor is recommended for 2.2-V output
voltage application.

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VIN u (VOUT VIN uK)

f SW
L u I LH uVOUT (2)

where
• fSW is the switching frequency of the converter
• ILH is the inductor current ripple
• η is the boost converter power convert efficiency
Having selected the inductance value, follow Equation 3 to Equation 5 to calculate the inductor's peak current
for the application. Depending on different load conditions, the TPS61322xx works in continuous current mode
or discontinuous conduction mode(DCM). In different modes, the peak currents of the inductor are also different.
Equation 3 provides an easy way to estimate whether the device works in CCM or DCM. Equation 4 shows the
peak current when the device works in CCM and Equation 5 shows the peak current when the device works in
DCM.

VOUT u IOUT I LH
!
VIN uK 2 (3)

where
• ILH is the inductor current ripple
• η is the boost converter power convert efficiency

VOUTuIOUT ILH
IL,peak
VIN uK 2 (4)

where
• IL,peak is the peak current of the inductor
• ILH is the inductor current ripple
• η is the boost converter power convert efficiency

I L , peak I LH (5)

where
• IL,peak is the peak inductor.
• ILH is the inductor current ripple
The saturation current of the inductor must be higher than the calculated peak inductor current, otherwise the
excessive peak current in the inductor harms the device and reduces the system reliability.
8.2.1.2.4
In this example, the maximum load for the boost converter is 50 mA, the minimum input voltage is 0.9 V, and the
efficiency under this condition can be estimated at 80%, so the boost converter works in continuous operation
mode by the calculation. The inductor peak current is calculated as 258 mA. To have some margin, a 4.7-µH
inductor with at least 300 mA saturation current is recommended for this application. A 10-µH inductor can be
used as well by increasing the output capacitance to higher than 22 µF to make the loop stable. Table 8-2 lists
the recommended inductors for TPS61322xx device.
Table 8-2. List of Inductors
DC
INDUCTAN SATURATION CURRENT
RESISTANC SIZE (L×W×H)(mm) PART NUMBER MANUFACTURER(1)
CE [µH] [A]
E [mΩ]
4.7 1.7 165 2.5 × 2 × 1.2 DFE252012P-4R7M=P2 MURATA
4.7 1.5 141 3 × 3 × 1.5 74438335047 Wurth

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Table 8-2. List of Inductors (continued)

DC
INDUCTAN SATURATION CURRENT
RESISTANC SIZE (L×W×H)(mm) PART NUMBER MANUFACTURER(1)
CE [µH] [A]
E [mΩ]
4.7 1.5 209 2.5 × 2 × 1.2 SDEM25201B-4R7MS CYNTEC

(1) See Third-party Products Disclaimer

8.2.1.2.5 Capacitor Selection

For better output voltage filtering, TI recommends low ESR X5R or X7R ceramic capacitors.
For the output capacitor at the VOUT pin, TI recommends small ceramic capacitors. Place the capacitors as
close as possible to the VOUT and GND pins of the device to depress the SW spike. The device can normally
work with SW negative spike of -0.7V within 1ns. However, larger negative spike may potentially shoot the
MOSFET inside. If, for any reason, the application requires the use of large capacitors that cannot be placed
close to the device, the use of a small ceramic capacitor with a capacitance value of 1μF in parallel to the large
one is recommended. Place this small capacitor as close as possible to the VOUT and GND pins of the device.
Considering loop stability, for inductance of 4.7 µH, the minimal output capacitor value is 10 μF (effective value).
Refer to Table 8-3 for inductor and capacitor combination. Increasing the output capacitor makes the output
ripple smaller.
When selecting capacitors, ceramic capacitor’s derating effect under DC bias voltage must be considered.
Choose the right nominal capacitance by checking capacitor's DC bias characteristics. In this example,
GRM188R60J106ME84D, which is a 10-µF ceramic capacitor with high effective capacitance value at DC
biased condition, is selected for VOUT rail. Two 10-μF capacitors in parallel are recommended to get the desired
effective capacitance.
8.2.1.2.6
Table 8-3. List of Inductor and Capacitor
INDUCTAN
CAPACITANCE [µF] LOAD [mA] PACKAGE PART NUMBER MANUFACTURER(1)
CE [µH]
1.0 2 × 10 50 0603 GRM188R60J106ME84D MURATA
2.2 2 × 10 50 0603 GRM188R60J106ME84D MURATA
4.7 22 50 0805 GRM21BZ71A226ME15 MURATA

(1) See Third-party Products Disclaimer

8.2.1.3 Application Curves

SW
1V/Div
SW
1V/Div

VOUT(2.2V Offset)
10mV/Div
VOUT(2.2V Offset)
10mV/Div

Inductor Current
50mA/Div
Inductor Current
200mA/Div

VIN = 1.2V TPS61322 IOUT = 0.1 mA VIN = 1.2 V TPS61322 IOUT = 50 mA

Figure 8-2. Switching Waveform at Light Load Figure 8-3. Switching Waveform at Heavy Load

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VIN VIN
1V/Div 500mV/Div

SW
2V/Div
SW
1V/Div

VOUT(2.2V Offset)
10mV/Div

VOUT
1V/Div
Inductor Current
200mA/Div

Inductor Current
100mA/Div

VIN = 1.2 V TPS61322 Rload = 250 Ω VIN = 1.2 V to 1.5 V TPS61322 IOUT = 50 mA

Figure 8-4. Start-up by VIN Figure 8-5. Line Transient

IOUT IOUT
50mA/Div 50mA/Div

SW SW
2V/Div 2V/Div

VOUT(2.2V Offset) VOUT(2.2V Offset)

20mV/Div 50mV/Div

Inductor Current Inductor Current

200mA/Div 200mA/Div

VIN = 1.2 V TPS61322 IOUT = 10 mA to 50 mA VIN = 1.2 V TPS61322 IOUT = 10 mA to 100 mA

Figure 8-6. Load Transient Figure 8-7. Load Transient

100
95
90
85
Efficiency (%)

80
75
70
65
60 L = 2.2 PH
55 L = 4.7 PH
L = 10 PH
50
0.0001 0.001 0.01 0.1
Output Current (A) D007

Wurth Electronics, 74438335XXX family 2.2 µH, 4.7 µH, 10 µH VIN = 1.2 V TPS61322

Figure 8-8. Efficiency with Different Inductance

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8.2.2 Boost with Schottky Diode

Another typical application example is the USB OTG which normally requires 5-V output as its supply voltage
and consumes as high as 500-mA current. The following design procedure can be used to select external
component values for this application.

R1 C2

D1

2.2uH 5.0V, 500mA

SW VOUT VOUT
L1
C1
Battery 22uF
TPS613222A
GND

Figure 8-9. Typical Application Circuit with Schottky Diode

8.2.2.1 Design Requirements

Table 8-4. Design Requirements
PARAMETERS VALUES
Input voltage 3 V to 4.35 V
Output voltage 5V
Output vurrent 500 mA
Output voltage ripple ± 25 mV

8.2.2.2 Detailed Design Procedure

8.2.2.2.1 Inductor Selection
The peak current is calculated according to Equation 4 and Equation 5.The saturation current of the inductor
must be higher than the calculated peak inductor current.
In this example, the maximum load for the boost converter is 500 mA, and the minimum input voltage is 3 V.
Assuming the efficiency under this condition is 90%, and a typical 2.2-µH inductor is adopted in this application,
so the boost converter works in continuous operation mode by the calculation. The current ripple is 500mA
and the inductor peak current is calculated as 1.18 A. To leave some margin, a 2.2-µH inductor with at least
1.4-A saturation current is recommended for this application.Table 8-5 lists the recommended inductors for
TPS613222A device.
Table 8-5. List of Inductors
DC
INDUCTAN SATURATION CURRENT
RESISTANC SIZE (L×W×H) (mm) PART NUMBER MANUFACTURER(1)
CE [µH] [A]
E [mΩ]
2.2 2.3 82 2.5 × 2 × 1.2 DFE252012F-2R2M MURATA
2.2 2.4 89 2.5 × 2 × 1 HMLQ25201T-2R2MSR CYNTEC
2.2 2.5 75 3.2 × 2.5 × 1.2 HMME32251B--2R2MS CYNTEC

(1) See Third-party Products Disclaimer

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8.2.2.2.2 Schottky Diode Selection

The high switching frequency of TPS61322xx demands a high-speed rectifying switch for optimum efficiency.
Ensure that the average and peak current rating of the diode exceeds the average output current and peak
inductor current. In addition, the reverse breakdown voltage of the diode must exceed the maximum output
voltage of the converter. A snubber circuit consisting of a resistor R1 and a capacitor C2 is needed if the
Schottky diode D1 is soldered. The capacitance of C2 must be larger than triple times of the diode capacitance.
The typical value of the resistor R1 is 5 Ω, and the typical value of the capacitor C2 is 120 pF.
8.2.2.2.3 Capacitor Selection
Refer to Section 8.2.1.2.5 for the detailed design steps.Table 8-6 lists the recommended inductor and capacitor
combination. Three 10-μF capacitors in parallel are recommended to get the desired effective capacitance.
Table 8-6. List of Inductor and Capacitor
INDUCTAN
CAPACITANCE [µF] LOAD [mA] PACKAGE PART NUMBER MANUFACTURER(1)
CE [µH]
1 3 × 10 500 0603 GRM188R60J106ME84D MURATA
2.2 3 × 10 500 0603 GRM188R60J106ME84D MURATA
4.7 2 × 22 500 0805 GRM21BZ71A226ME15 MURATA

(1) See Third-party Products Disclaimer

8.2.2.3 Application Curves

VIN = 3.6 V TPS613222A IOUT = 0.1 mA VIN = 3.6 V TPS613222A IOUT = 100 mA

Figure 8-10. Switching Waveform at Light Load Figure 8-11. Switching Waveform at Heavy Load

VIN = 3.6 V TPS613222A IOUT = 500 mA VIN = 3.6 V TPS613222A Rload = 250 Ω

Figure 8-12. Switching Waveform at Heavy Load Figure 8-13. Start-up by VIN

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VIN = 2.7 V to 4.3 V TPS613222A IOUT = 500 mA VIN = 2.7 V to 4. V TPS613222A IOUT = 500 mA
Figure 8-14. Line Transient Figure 8-15. Line Regulation

VIN = 3.6 V TPS613222A IOUT = 10 mA to 500 mA VIN = 3.6 V TPS613222A IOUT = 0 mA to 500 mA

Figure 8-16. Load Transient Figure 8-17. Load Regulation

100 5.15

90 5.1
Output Voltage (V)
Efficiency (%)

80 5.05

70 5
VIN=1.5V VIN=1.5V
VIN=2.5V VIN=2.5V
VIN=3.0V VIN=3.0V
60 4.95
VIN=3.6V VIN=3.6V
VIN=4.2V VIN=4.2V

50 4.9
0.0001 0.001 0.01 0.02 0.05 0.1 0.2 0.5 1 0.0001 0.001 0.01 0.02 0.05 0.1 0.2 0.5 1
Iout (A) Iout (A) D012
D011

TPS613222A L = 2.2 µH D1:ZLLS410TA TPS613222A L = 2.2 µH D1:ZLLS410TA

Figure 8-18. Efficiency with Different Input Voltage Figure 8-19. Load Regulation

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8.3 System Examples

TPS61322xx can be easily shut down with an external switch Q1 as shown in Figure 8-20. The switch can be
mechanical switch, a P-channel MOSFET, or a PNP transistor. For a mechanical switch, there is no control logic
circuit needed to turn on or turn off the switch.
D1

(optional for large current)

L1 2.2 µH
Q1
SW VOUT VOUT
C2
Battery 2.2 µF 22 µF
C1 TPS6132xx
GND

Copyright © 2017, Texas Instruments Incorporated

Figure 8-20. True Shutdown for TPS61322xx

8.3.1 Detail Design Schematics

The Figure 8-21 shows the application circuit when the power supply of the micro controller unit (MCU) is not
less than the battery voltage. The Figure 8-22 shows the application circuit when the power supply of the micro
controller unit (MCU) is less than the battery voltage

D1 D1

(optional for large current) (optional for large current)

Q1 L1 2.2 µH Q1 L1 2.2 µH
SW VOUT VOUT SW VOUT VOUT
C2 C2
Battery 2.2 µF 22 µF Battery 2.2 µF 22 µF
R1 C1 TPS6132xx R1 C1 TPS6132xx
V_MCU V_MCU
GND GND

GPIO Q2 GPIO
MCU MCU

Copyright © 2017, Texas Instruments Incorporated Copyright © 2017, Texas Instruments Incorporated

Figure 8-21. True Shutdown, V_MCU Voltage No Figure 8-22. True Shutdown, V_MCU Voltage Less
Less than Battery Voltage than Battery Voltage

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9 Power Supply Recommendations

The TPS61322xx is designed to operate from an input voltage supply range between 0.9 V to 5.5 V. The power
supply can be alkaline battery, NiMH rechargeable battery, Li-Mn battery or rechargeable Li-ion battery. The
input supply must be well regulated with the rating of the TPS61322xx.

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10 Layout
10.1 Layout Guidelines
As for all switching power supplies, the layout is an important step in the design, especially at high peak currents
and high switching frequencies. If the layout is not carefully done, the regulator could show stability problems as
well as EMI problems. Therefore, use wide and short traces for the main current path and for the power ground
paths. Place the output capacitor, as well as the inductor, as close as possible to the device.

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10.2 Layout Examples

A large ground plane on the top and bottom is good for thermal performance.

GND
VOUT
GND SW VOUT
TPS61322

VOUT

SW
VIN TPS61322xA
VIN
VOUT

GND
GND
Figure 10-1. TPS61322 Layout
Figure 10-2. TPS61322xA DBZ Package Layout

GND

VIN
NC VOUT

TPS61322xA

VOUT
SW GND NC

Figure 10-3. TPS61322xA DBV Package Layout

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11 Device and Documentation Support

11.1 Device Support
11.1.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT
CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES
OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER
ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
11.1.2 Development Support
11.1.2.1 Custom Design With WEBENCH® Tools
Click here to create a custom design using the TPS61322 device with the WEBENCH® Power Designer.
1. Start by entering the input voltage (VIN), output voltage (VOUT), and output current (IOUT) requirements.
2. Optimize the design for key parameters such as efficiency, footprint, and cost using the optimizer dial.
3. Compare the generated design with other possible solutions from Texas Instruments.
The WEBENCH Power Designer provides a customized schematic along with a list of materials with real-time
pricing and component availability.
In most cases, these actions are available:
• Run electrical simulations to see important waveforms and circuit performance
• Run thermal simulations to understand board thermal performance
• Export customized schematic and layout into popular CAD formats
• Print PDF reports for the design, and share the design with colleagues
Get more information about WEBENCH tools at www.ti.com/WEBENCH.
11.2 Documentation Support
11.2.1 Related Documentation
For related documentation see the following:
TPS61322-BMC001 Evaluation Module User's Guide
11.3 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
11.4 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
11.5 Trademarks
TI E2E™ is a trademark of Texas Instruments.
WEBENCH® is a registered trademark of Texas Instruments.
All trademarks are the property of their respective owners.
11.6 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.

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11.7 Glossary
TI Glossary This glossary lists and explains terms, acronyms, and definitions.

12 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from February 19, 2019 to February 21, 2024 (from Revision D (February 2019) to
Revision E (February 2024)) Page
• Updated second paragraph with additional information................................................................................... 14

Changes from Revision C (May 2018) to Revision D (February 2019) Page

• Deleted quasi-GPNs from TPS61322 title and changed "TPS61322xx" to "TPS61322"................................... 1
• Added links for WEBENCH ............................................................................................................................... 1
• Changed the NFET symbol in Section 7.2 ........................................................................................................ 9
• Added Section 7.3.7 ........................................................................................................................................ 10

Changes from Revision B (April 2018) to Revision C (May 2018) Page

• Deleted Cross Reference to Section 4 and the Electrical Characteristics table footnotes regarding device
TPS61223A, that was Product Preview device in the SLVSDY5B revision........................................................3
• Deleted Cross Reference to Section 6.5 footnote regarding device TPS61223A, that was Product Preview in
the SLVSDY5B revision. ....................................................................................................................................5
• Added graphs pertaining to TPS613223A device to the Typical Characteristics matrix. ...................................6

Changes from Revision A (January 2018) to Revision B (April 2018) Page

• Deleted Cross Reference to Section 4 and the Electrical Characteristics table footnotes regarding devices
TPS61221A, TPS61222A, and TPS61226A that were Product Preview devices in the SLVSDY5A revision....3
• Deleted Cross Reference to Section 6.5 footnote regarding devices TPS61221A, TPS61222A, and
TPS61226A that were Product Preview in the SLVSDY5A revision. .................................................................5
• Added Figure 6-3, Figure 6-4 and Figure 6-5 ....................................................................................................6
• Added Figure 6-7, Figure 6-8, and Figure 6-11 ................................................................................................. 6

Changes from Revision * (September 2017) to Revision A (January 2018) Page

• Production Data release January 2018. ............................................................................................................ 1

13 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

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PACKAGING INFORMATION

Orderable part number Status Material type Package | Pins Package qty | Carrier RoHS Lead finish/ MSL rating/ Op temp (°C) Part marking
(1) (2) (3) Ball material Peak reflow (6)
(4) (5)

TPS613221ADBVR Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R Yes NIPDAU | SN Level-1-260C-UNLIM -40 to 125 1N4L
TPS613221ADBVR.B Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 1N4L
TPS613221ADBVT Active Production SOT-23 (DBV) | 5 250 | SMALL T&R Yes NIPDAU | SN Level-1-260C-UNLIM -40 to 125 1N4L
TPS613221ADBVT.B Active Production SOT-23 (DBV) | 5 250 | SMALL T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 1N4L
TPS613222ADBVR Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R Yes NIPDAU | SN Level-1-260C-UNLIM -40 to 125 1N5L
TPS613222ADBVR.B Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 1N5L
TPS613222ADBVT Active Production SOT-23 (DBV) | 5 250 | SMALL T&R Yes NIPDAU | SN Level-1-260C-UNLIM -40 to 125 1N5L
TPS613222ADBVT.B Active Production SOT-23 (DBV) | 5 250 | SMALL T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 1N5L
TPS613222ADBVTG4 Active Production SOT-23 (DBV) | 5 250 | SMALL T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 1N5L
TPS613222ADBVTG4.B Active Production SOT-23 (DBV) | 5 250 | SMALL T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 1N5L
TPS613223ADBVR Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R Yes NIPDAU | SN Level-1-260C-UNLIM -40 to 125 1NRL
TPS613223ADBVR.B Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 1NRL
TPS613223ADBVT Active Production SOT-23 (DBV) | 5 250 | SMALL T&R Yes NIPDAU | SN Level-1-260C-UNLIM -40 to 125 1NRL
TPS613223ADBVT.B Active Production SOT-23 (DBV) | 5 250 | SMALL T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 1NRL
TPS613226ADBVR Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R Yes NIPDAU | SN Level-1-260C-UNLIM -40 to 125 1N6L
TPS613226ADBVR.B Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 1N6L
TPS613226ADBVT Active Production SOT-23 (DBV) | 5 250 | SMALL T&R Yes NIPDAU | SN Level-1-260C-UNLIM -40 to 125 1N6L
TPS613226ADBVT.B Active Production SOT-23 (DBV) | 5 250 | SMALL T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 1N6L
TPS61322DBZR Active Production SOT-23 (DBZ) | 3 3000 | LARGE T&R Yes NIPDAU | SN Level-1-260C-UNLIM -40 to 125 1EME
TPS61322DBZR.B Active Production SOT-23 (DBZ) | 3 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 1EME
TPS61322DBZT Active Production SOT-23 (DBZ) | 3 250 | SMALL T&R Yes NIPDAU | SN Level-1-260C-UNLIM -40 to 125 1EME
TPS61322DBZT.B Active Production SOT-23 (DBZ) | 3 250 | SMALL T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 1EME
XTPS61322DBZT Obsolete Preproduction SOT-23 (DBZ) | 3 - - Call TI Call TI -

(1)
Status: For more details on status, see our product life cycle.

(2)
Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance,
reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional
waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind.

Addendum-Page 1
 PACKAGE OPTION ADDENDUM

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(3)
RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition.

(4)
Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum
column width.

(5)
MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown.
Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board.

(6)
Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part.

Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two
combined represent the entire part marking for that device.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and
makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative
and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers
and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

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TAPE AND REEL INFORMATION

REEL DIMENSIONS TAPE DIMENSIONS

K0 P1

B0 W
Reel
Diameter
Cavity A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
W Overall width of the carrier tape
P1 Pitch between successive cavity centers

Reel Width (W1)

QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE

Sprocket Holes

Q1 Q2 Q1 Q2

Q3 Q4 Q3 Q4 User Direction of Feed

Pocket Quadrants

*All dimensions are nominal

Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TPS613221ADBVR SOT-23 DBV 5 3000 180.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS613221ADBVR SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS613221ADBVT SOT-23 DBV 5 250 180.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS613222ADBVR SOT-23 DBV 5 3000 180.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS613222ADBVR SOT-23 DBV 5 3000 180.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS613222ADBVT SOT-23 DBV 5 250 180.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS613222ADBVT SOT-23 DBV 5 250 180.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS613222ADBVTG4 SOT-23 DBV 5 250 180.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS613223ADBVR SOT-23 DBV 5 3000 180.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS613223ADBVR SOT-23 DBV 5 3000 180.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS613223ADBVT SOT-23 DBV 5 250 180.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS613223ADBVT SOT-23 DBV 5 250 180.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS613226ADBVR SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS613226ADBVT SOT-23 DBV 5 250 180.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS61322DBZR SOT-23 DBZ 3 3000 178.0 9.0 3.15 2.77 1.22 4.0 8.0 Q3
TPS61322DBZR SOT-23 DBZ 3 3000 180.0 8.4 2.9 3.35 1.35 4.0 8.0 Q3

Pack Materials-Page 1
 PACKAGE MATERIALS INFORMATION

www.ti.com 19-Jun-2025

Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1

Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TPS61322DBZT SOT-23 DBZ 3 250 178.0 9.0 3.15 2.77 1.22 4.0 8.0 Q3
TPS61322DBZT SOT-23 DBZ 3 250 180.0 8.4 2.9 3.35 1.35 4.0 8.0 Q3

Pack Materials-Page 2
 PACKAGE MATERIALS INFORMATION

www.ti.com 19-Jun-2025

TAPE AND REEL BOX DIMENSIONS

Width (mm)
H
W

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TPS613221ADBVR SOT-23 DBV 5 3000 210.0 185.0 35.0
TPS613221ADBVR SOT-23 DBV 5 3000 208.0 191.0 35.0
TPS613221ADBVT SOT-23 DBV 5 250 210.0 185.0 35.0
TPS613222ADBVR SOT-23 DBV 5 3000 210.0 185.0 35.0
TPS613222ADBVR SOT-23 DBV 5 3000 210.0 185.0 35.0
TPS613222ADBVT SOT-23 DBV 5 250 210.0 185.0 35.0
TPS613222ADBVT SOT-23 DBV 5 250 210.0 185.0 35.0
TPS613222ADBVTG4 SOT-23 DBV 5 250 210.0 185.0 35.0
TPS613223ADBVR SOT-23 DBV 5 3000 210.0 185.0 35.0
TPS613223ADBVR SOT-23 DBV 5 3000 210.0 185.0 35.0
TPS613223ADBVT SOT-23 DBV 5 250 210.0 185.0 35.0
TPS613223ADBVT SOT-23 DBV 5 250 210.0 185.0 35.0
TPS613226ADBVR SOT-23 DBV 5 3000 208.0 191.0 35.0
TPS613226ADBVT SOT-23 DBV 5 250 210.0 185.0 35.0
TPS61322DBZR SOT-23 DBZ 3 3000 180.0 180.0 18.0
TPS61322DBZR SOT-23 DBZ 3 3000 210.0 185.0 35.0
TPS61322DBZT SOT-23 DBZ 3 250 180.0 180.0 18.0
TPS61322DBZT SOT-23 DBZ 3 250 210.0 185.0 35.0

Pack Materials-Page 3
 PACKAGE OUTLINE
DBV0005A SCALE 4.000
SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR

3.0 C
2.6
1.75 0.1 C
B A
1.45
PIN 1
INDEX AREA

1 5

2X 0.95 (0.1)
3.05
2.75
1.9 1.9
2
(0.15)

4
3
0.5
5X
0.3
0.15
0.2 C A B NOTE 5 4X 0 -15 (1.1) TYP
0.00
1.45
0.90
4X 4 -15

0.25
GAGE PLANE 0.22
TYP
0.08

8
TYP 0.6
0 TYP SEATING PLANE
0.3

4214839/K 08/2024

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Refernce JEDEC MO-178.
4. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.25 mm per side.
5. Support pin may differ or may not be present.

www.ti.com
 EXAMPLE BOARD LAYOUT
DBV0005A SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR

PKG
5X (1.1)
1
5
5X (0.6)

SYMM
(1.9)
2
2X (0.95)

3 4

(R0.05) TYP (2.6)

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN
SCALE:15X

SOLDER MASK
SOLDER MASK METAL METAL UNDER OPENING
OPENING SOLDER MASK

EXPOSED METAL EXPOSED METAL

0.07 MAX 0.07 MIN

ARROUND ARROUND

NON SOLDER MASK SOLDER MASK

DEFINED DEFINED
(PREFERRED)

SOLDER MASK DETAILS

4214839/K 08/2024

NOTES: (continued)

6. Publication IPC-7351 may have alternate designs.

7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

www.ti.com
 EXAMPLE STENCIL DESIGN
DBV0005A SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR

PKG
5X (1.1)
1
5
5X (0.6)

SYMM
2 (1.9)
2X(0.95)

3 4

(R0.05) TYP
(2.6)

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL
SCALE:15X

4214839/K 08/2024

NOTES: (continued)

8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.

www.ti.com
 PACKAGE OUTLINE
DBZ0003A SCALE 4.000
SOT-23 - 1.12 mm max height
SMALL OUTLINE TRANSISTOR

2.64 C
2.10
1.12 MAX
1.4
B A
1.2 0.1 C
PIN 1
INDEX AREA

0.95 (0.125)
3.04
1.9 2.80
3
(0.15)
NOTE 4

2
0.5
3X
0.3
0.2 C A B 4X 0 -15 0.10
(0.95) TYP
0.01

4X 4 -15

0.25
GAGE PLANE 0.20
TYP
0.08

0.6
TYP SEATING PLANE
0 -8 TYP 0.2

4214838/F 08/2024

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Reference JEDEC registration TO-236, except minimum foot length.
4. Support pin may differ or may not be present.
5. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed
0.25mm per side

www.ti.com
 EXAMPLE BOARD LAYOUT
DBZ0003A SOT-23 - 1.12 mm max height
SMALL OUTLINE TRANSISTOR

PKG
3X (1.3)
1

3X (0.6)

SYMM

3
2X (0.95)

(R0.05) TYP
(2.1)

LAND PATTERN EXAMPLE

SCALE:15X

SOLDER MASK
SOLDER MASK METAL METAL UNDER OPENING
OPENING SOLDER MASK

0.07 MAX 0.07 MIN

ALL AROUND ALL AROUND

NON SOLDER MASK SOLDER MASK

DEFINED DEFINED
(PREFERRED)

SOLDER MASK DETAILS

4214838/F 08/2024

NOTES: (continued)

5. Publication IPC-7351 may have alternate designs.

6. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

www.ti.com
 EXAMPLE STENCIL DESIGN
DBZ0003A SOT-23 - 1.12 mm max height
SMALL OUTLINE TRANSISTOR

PKG

3X (1.3)
1

3X (0.6)

SYMM
3
2X(0.95)

(R0.05) TYP
(2.1)

SOLDER PASTE EXAMPLE

BASED ON 0.125 THICK STENCIL
SCALE:15X

4214838/F 08/2024

NOTES: (continued)

7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
8. Board assembly site may have different recommendations for stencil design.

www.ti.com
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