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FGH40N60SFD

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FGH40N60SFD

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© © All Rights Reserved
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FGH40N60SFD 600V, 40A Field Stop IGBT

July 2008

FGH40N60SFD
600V, 40A Field Stop IGBT t

Features
General Description
• High current capability
Using Novel Field Stop IGBT Technology, Fairchild’s new
• Low saturation voltage: VCE(sat) =2.3V @ IC ses- ries of Field Stop IGBTs offer the optimum
= 40A performance for Induction Heating, UPS, SMPS and PFC
• High input impedance applications where low conduction and switching losses
• Fast switching are essential.
• RoHS compliant

Applications
• Induction Heating, UPS, SMPS, PFC

E C
C
G

COLLECTOR
(FLANGE) E

Absolute Maximum Ratings


Symbol Description Ratings Units
VCES Collector to Emitter Voltage 600 V
VGES Gate to Emitter Voltage  20 V
Collector Current @ TC = 25oC 80 A
IC
Collector Current @ TC = 100 C o
40 A
ICM (1) Pulsed Collector Current @ TC = 25 C
o 120 A
Maximum Power Dissipation @ TC = 25 C
o
290 W
PD
Maximum Power Dissipation @ TC = 100 C o
116 W
TJ Operating Junction Temperature -55 to +150 oC

Tstg Storage Temperature Range -55 to +150 oC

Maximum Lead Temp. for soldering


TL 300 oC
Purposes, 1/8” from case for 5 seconds

Notes:
1: Repetitive rating: Pulse width limited by max. junction temperature

Thermal Characteristics
Symbol Parameter Typ. Max. Units
o
RJC(IGBT) Thermal Resistance, Junction to Case - 0.43 C/W
RJC(Diode) Thermal Resistance, Junction to Case - 1.45 o
C/W
o
RJA Thermal Resistance, Junction to Ambient - 40 C/W

©2008 Fairchild Semiconductor Corporation 1


www.fairchildsemi.com
FGH40N60SFD Rev.C
FGH40N60SFD 600V, 40A Field Stop IGBT
Package Marking and Ordering Information
Max Qty
Packaging
Device Marking Device Package Type Qty per Tube per Box
FGH40N60SFD FGH40N60SFDTU TO-247 Tube 30ea -

Electrical Characteristics of the IGBT TC = 25°C unless otherwise noted

Symbol Parameter Test Conditions Min. Typ. Max. Units

Off Characteristics
BVCES Collector to Emitter Breakdown VGE = 0V, IC = 250A 600 - - V
Voltage
BVCES Temperature Coefficient of
VGE = 0V, IC = 250A - 0.6 - V/oC
T J Breakdown Voltage
ICES Collector Cut-Off Current VCE = VCES, VGE = 0V - - 250 A
IGES G-E Leakage Current VGE = VGES, VCE = 0V - - ±400 nA

On Characteristics
VGE(th) G-E Threshold Voltage IC = 250A, VCE = VGE 4.0 5.0 6.5 V
IC = 40A, VGE = 15V - 2.3 2.9 V
VCE(sat) Collector to Emitter Saturation
IC = 40A, VGE =
Voltage 15V, TC = 125oC - 2.5 - V

Dynamic Characteristics
Cies Input Capacitance - 2110 - pF
Coes Output Capacitance VCE = 30V, VGE = 0V, - 200 - pF
f = 1MHz
Cres Reverse Transfer Capacitance - 60 - pF

Switching Characteristics
td(on) Turn-On Delay Time - 25 - ns
tr Rise Time - 42 - ns
td(off) Turn-Off Delay Time VCC = 400V, IC = - 115 - ns
tf Fall Time 40A, RG = 10, VGE - 27 54 ns
= 15V,
Eon Turn-On Switching Loss Inductive Load, TC = 25oC - 1.13 - mJ
Eoff Turn-Off Switching Loss - 0.31 - mJ
Ets Total Switching Loss - 1.44 - mJ
td(on) Turn-On Delay Time - 24 - ns
tr Rise Time - 43 - ns
td(off) Turn-Off Delay Time VCC = 400V, IC = - 120 - ns
tf Fall Time 40A, RG = 10, VGE - 30 - ns
= 15V,
Eon Turn-On Switching Loss Inductive Load, TC = 125oC - 1.14 - mJ
Eoff Turn-Off Switching Loss - 0.48 - mJ
Ets Total Switching Loss - 1.62 - mJ
Qg Total Gate Charge - 120 - nC
Qge Gate to Emitter Charge VCE = 400V, IC = - 14 - nC
40A, VGE = 15V
Qgc Gate to Collector Charge - 58 - nC

FGH40N60SFD Rev. 2 www.fairchildsemi.c


C om
FGH40N60SFD 600V, 40A Field Stop IGBT
Electrical Characteristics of the Diode TC = 25°C unless otherwise noted

Symbol Parameter Test Conditions Min. Typ. Max Units


TC = 25oC - 1.95 2.6
VFM Diode Forward Voltage IF = 20A V
TC = 125oC - 1.85 -
TC = 25oC - 45 -
trr Diode Reverse Recovery Time ns
TC = 125oC - 140 -
IES =20A, dIES/dt =
200A/s TC = 25oC - 75 -
Qrr Diode Reverse Recovery nC
Charge TC = 125oC - 375 -

FGH40N60SFD Rev. 3 www.fairchildsemi.c


C om
FGH40N60SFD 600V, 40A Field Stop IGBT
Typical Performance Characteristics

Figure 1. Typical Output Characteristics Figure 2. Typical Output Characteristics


120
120
TC = o
o TC = 125 C
100 25 C 20V
20V 15V
15V 100 12V
Collector Current, IC [A]

Collector Current, IC [A]


80 80
12V

60 60

40 40 10V
10V
20 20

VGE = 8V VGE = 8V
0 0
0.0 1.5 3.0 4.5 6.0 0.0 1.5 3.0 4.5 6.0
Collector-Emitter Voltage, VCE [V] Collector-Emitter Voltage, VCE [V]

Figure 3. Typical Saturation Voltage Figure 4. Transfer Characteristics


Characteristics
80
120
Common Emitter
VGE = 15V Common Emitter
VCE = 20V
TC o
60 o TC = 25 C
Collector Current, IC [A]

= 25 C o
Collector Current, IC [A]

o TC = 125 C
TC = 125 C
80

40

40
20

0
0 1 2 3 4 0
Collector-Emitter Voltage, VCE [V] 6 8 10 12 13
Gate-Emitter Voltage,VGE [V]

Figure 5. Saturation Voltage vs. Case Figure 6. Saturation Voltage vs. VGE
Temperature at Variant Current Level
4.0
20
Common Emitter Common Emitter
VGE = 15V o
Collector-Emitter Voltage, VCE [V]

TC = -40 C
Collector-Emitter Voltage, VCE [V]

3.5
80A 16

3.0
12
2.5
40A
8
2.0
80A
IC = 20A 40A
1.5 4
IC = 20A

1.0 0
25 50 75 100 125 4 8 12 16 20
o
Collector-EmitterCase Temperature, TC [ C] Gate-Emitter Voltage, VGE [V]

FGH40N60SFD Rev. 4 www.fairchildsemi.c


C om
FGH40N60SFD 600V, 40A Field Stop IGBT
Typical Performance Characteristics

Figure 7. Saturation Voltage vs. VGE Figure 8. Saturation Voltage vs. VGE
20 20
Common Emitter
o Common Emitter
Collector-Emitter Voltage, VCE [V]

TC = 25 C o

Collector-Emitter Voltage, VCE [V]


TC = 125 C
16 16

12 12

8
8
40A 40A
80A 80A
4
4
IC = 20A IC = 20A

0
4 8 12 16 20 0
4 8 12 16 20
Gate-Emitter Voltage, VGE [V]
Gate-Emitter Voltage, VGE [V]

Figure 9. Capacitance Characteristics Figure 10. Gate charge Characteristics


5000
15
Common Emitter Common Emitter
VGE = 0V, f = o
4000 TC = 25 C
Gate-Emitter Voltage, VGE [V]

o
Ciss 1MHz TC = 25 C 12
200V
Capacitance [pF]

Vcc = 100V 300V


3000
9

Coss
2000 6

1000 3
Crss

0
0
0.1 1 10
30 0 50 100 150
Collector-Emitter Voltage, VCE [V]
Gate Charge, Qg [nC]

Figure 11. SOA Characteristics Figure 12. Turn-on Characteristics vs.


Gate Resistance
400
200
100
10s
100
Collector Current, Ic [A]

10 100s
Switching Time [ns]

1ms
tr
1 10 ms

DC Common Emitter

Single Nonrepetitive
VCC = 400V, VGE = 15V
0.1 Pulse TC = 25oC td(on) IC = 40A
Curves must be o
derated linearly with TC = 25 C
increase o
0.01 TC = 125 C
in temperature
10
1 10 100 1000 0 10 20 30 40 50
Collector-Emitter Voltage, VCE [V] Gate Resistance, RG []

FGH40N60SFD Rev. 5 www.fairchildsemi.c


C om
Typical Performance Characteristics

Figure 13. Turn-off Characteristics vs. Figure 14. Turn-on Characteristics vs.
Gate Resistance Collector Current
5500 500
Common Emitter Common Emitter
VCC = 400V, VGE = 15V VGE = 15V, RG =
10
o
IC = 40A TC = 25 C
1000 o
o
TC = 25 C TC = 125 C
Switching Time [ns]

Switching Time [ns]


TC = tr
o
125 C td(off) 100

100
td(on)
tf

10
0 10 20 30 40 50 10
20 40 60 80
Gate Resistance, RG []
Collector Current, IC [A]

Figure 15. Turn-off Characteristics vs. Figure 16. Switching Loss vs. Gate
Resistance Collector Current
500
10
Common Emitter Common Emitter
VGE = 15V, RG = VCC = 400V, VGE = 15V
10
o
TC = 25 C IC = 40A
o o
TC = 125 C T = 25 C
td(off)
Switching Time [ns]

T = Eon
C
Switching Loss [mJ]

100 125 C
o
C

tf

Eoff

10
20 40 60 80 0.2
0.3
0 10 20 30 40 50
Collector Current, IC [A]
Gate Resistance, RG []

Figure 17. Switching Loss vs. Collector Current Figure 18. Turn off Switching
SOA Characteristics
30 200
Common Emitter
VGE = 15V, RG = 100
10
10 o
T = 25 C
C
Eon
o
Collector Current, IC [A]

TC = 125 C
Switching Loss [mJ]

Eoff
1 10

0.1
Safe Operating Area
FGH40N60SFD Rev. 6 www.fairchildsemi.c
C om
VGE o

FGH40N60SFD 600V, 40A Field Stop IGBT


= 15V, = 125 C
1 TC
20 30 40 50 60 70 80 1 10 100 1000
Collector Current, IC [A] Collector-Emitter Voltage, VCE [V]

FGH40N60SFD Rev. 7 www.fairchildsemi.c


C om
FGH40N60SFD 600V, 40A Field Stop IGBT
Typical Performance Characteristics

Figure 19. Forward Characteristics Figure 20. Typical Reverse Current vs.
Reverse Voltage
80
200
100
o
TJ = 125 C
Forward Current, IF [A]

o
TJ = 125 C
10 10

Reverse Current , IR
TJ =
o
TJ = 75 C
o 1
25 C TJ =

[A]
o
75 C
1 o
TC = 25 C
0.1
o o
TC = 75 C TJ = 25 C

TC =
0.2
o 0.01
125 C
0 1 2 3 4 50 200 400 600
Forward Voltage, VF [V] Reverse Voltage, VR [V]

Figure 21. Stored Charge Figure 22. Reverse Recovery Time


100 60
Stored Recovery Charge, Qrr [nC]

Reverse Recovery Time, trr [ns]

80 200A/s

50
di/dt = 100A/s
60

200A/s
di/dt = 100A/s
40
40

20
5 10 20 30 40 30
Forward Current, IF [A] 5 10 20 30 40
Forward Current, IF [A]

Figure 23.Transient Thermal Impedance of IGBT

1
Thermal Response [Zthjc]

0.5

0.1 0.2
0.1
0.05
0.02
0.01 0.01 PDM

single pulse t1
t
2
Duty Factor, D = t1/t2
Peak Tj = Pdm x Zthjc +
1E-3 TC
1E-5 1E-4 1E-3 0.01 0.1 1
Rectangular Pulse Duration [sec]

FGH40N60SFD Rev. 8 www.fairchildsemi.c


C om
FGH40N60SFD 600V, 40A Field Stop IGBT
Mechanical Dimensions

TO-247AB (FKS PKG CODE 001)

Dimensions in Millimeters

FGH40N60SFD Rev. 9 www.fairchildsemi.c


C om
TRADEMARKS
The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global
subsidianries, and is not intended to be an exhaustive list of all such trademarks.
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Global Power Programmable TinyBoost™


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Current Transfer QFET® TinyBuck™
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EZSWITCH™ * RapidConfigure™ TinyPower™
™ IntelliMAX™
ISOPLANAR™ Saving our world, 1mW at a TinyPWM™
MegaBuck™ time™ SmartMax™ TinyWire™
® SMART START™
MICROCOUPLER™
Fairchild®
tm

MicroFET™ SPM®
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MillerDrive™ SuperFET™
® Ultra FRFET™
Semiconductor MotionMax™ SuperSOT™-
UniFET™
FACT Quiet Series™ 3
Motion- VCX™
FACT®
FAST SPM™ SuperSOT™-
VisualMax™
® OPTOLOGIC ® 6
FastvCore™ OPTOPLANAR® SuperSOT™-
FlashWriter ® 8
®
* SupreMOS™
tm

SyncFET™
®

* EZSWITCH™ and FlashWriter® are trademarks of System General Corporation, used under license by Fairchild Semiconductor.

DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO
IMPROVE
RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY
PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY
THEREIN, WHICH COVERS THESE PRODUCTS.

LIFE SUPPORT POLICY


FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT
THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.

As used herein:
1. Life support devices or systems are devices or systems 2. A critical component in any component of a life support,
which, (a) are intended for surgical implant into the body or device, or system whose failure to perform can be
(b) support or sustain life, and (c) whose failure to perform reasonably expected to cause the failure of the life support
when properly used in accordance with instructions for use device or system, or to affect its safety or effectiveness.
provided in the labeling, can be reasonably expected to
result in a significant injury of the user.
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Fairchild Semiconductor Corporation’s Anti-Counterfeiting Policy. Farichild’s Anti-Counterfeiting Policy is also stated on our external
website, www.fairchildsemi.com, under Sales Support.

Counterfeiting of semiconductor parts is a growing problem in the industry. All manufactures of semiconductor products are experiencing
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PRODUCT STATUS DEFINITIONS


Definition of Terms
Datasheet Identification Product Status Definition
Datasheet contains the design specifications for product development.
Advance Information Formative / In Design Specifications may change in any manner without notice.

Datasheet contains preliminary data; supplementary data will be published at a


Preliminary First Production later date. Fairchild Semiconductor reserves the right to make changes at
any time without notice to improve design.

Datasheet contains final specifications. Fairchild Semiconductor reserves the


No Identification Needed Full Production right to make changes at any time without notice to improve the design.
Datasheet contains specifications on a product that is discontinued by Fairchild
Obsolete Not In Production Semiconductor. The datasheet is for reference information only.
Rev. I35

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