SN54HC595, SN74HC595

SCLS041J – DECEMBER 1982 – REVISED OCTOBER 2021

SNx4HC595 8-Bit Shift Registers With 3-State Output Registers

1 Features 3 Description
• 8-bit serial-in, parallel-out shift The SNx4HC595 devices contain an 8-bit, serial-in,
• Wide operating voltage range of 2 V to 6 V parallel-out shift register that feeds an 8-bit D-type
• High-current 3-state outputs can drive up to 15 storage register. The storage register has parallel 3-
LSTTL loads state outputs. Separate clocks are provided for both
• Low power consumption: 80-μA (maximum) ICC the shift and storage register. The shift register has
• tpd = 13 ns (typical) a direct overriding clear (SRCLR) input, serial (SER)
• ±6-mA output drive at 5 V input, and serial outputs for cascading. When the
• Low input current: 1 μA (maximum) output-enable (OE) input is high, the outputs are in
• Shift register has direct clear the high-impedance state.
• On products compliant to MIL-PRF-38535,
Device Information
all parameters are tested unless otherwise noted. (1)
PART NUMBER PACKAGE BODY SIZE (NOM)
On all other products, production processing does
not necessarily include testing of all parameters. SN54HC595FK LCCC (20) 8.89 mm × 8.89 mm
SN54HC595J CDIP (16) 21.34 mm × 6.92 mm
2 Applications SN74HC595N PDIP (16) 19.31 mm × 6.35 mm
• Network switches SN74HC595D SOIC (16) 9.90 mm × 3.90 mm
• Power infrastructure SN74HC595DW SOIC (16) 10.30 mm × 7.50 mm
• LED displays
SN74HC595DB SSOP (16) 6.20 mm × 5.30 mm
• Servers
SN74HC595PW TSSOP (16) 5.00 mm × 4.40 mm

(1) For all available packages, see the orderable addendum at

the end of the data sheet.
13
OE
12
RCLK
10
SRCLR
11
SRCLK
14
SER 1D 3R 15
C1 C3 QA
R 3S

2S
2R 3R 1
C2 C3 QB
R 3S

2S
2R 3R 2
C2 C3 QC
R 3S

2S
2R 3R 3
C2 C3 QD
R 3S

2S
2R 3R 4
C2 C3 QE
R 3S

2S
2R 3R 5
C2 C3 QF
R 3S

2S
2R 3R 6
C2 C3 QG
R 3S

2S
2R 3R 7
C2 C3 QH
R 3S
9
QH′
Pin numbers shown are for the D, DB, DW, J, N, NS, PW, and W packages.

Functional Block Diagram

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
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Table of Contents
1 Features............................................................................1 8.2 Functional Block Diagram......................................... 11
2 Applications..................................................................... 1 8.3 Feature Description...................................................12
3 Description.......................................................................1 8.4 Device Functional Modes..........................................12
4 Revision History.............................................................. 2 9 Application and Implementation.................................. 13
5 Pin Configuration and Functions...................................3 9.1 Application Information............................................. 13
6 Specifications.................................................................. 4 9.2 Typical Application.................................................... 13
6.1 Absolute Maximum Ratings........................................ 4 10 Power Supply Recommendations..............................15
6.2 ESD Ratings............................................................... 4 11 Layout........................................................................... 15
6.3 Recommended Operating Conditions.........................4 11.1 Layout Guidelines................................................... 15
6.4 Thermal Information....................................................5 11.2 Layout Example...................................................... 15
6.5 Electrical Characteristics.............................................5 12 Device and Documentation Support..........................16
6.6 Timing Requirements.................................................. 6 12.1 Documentation Support.......................................... 16
6.7 Switching Characteristics............................................8 12.2 Support Resources................................................. 16
6.8 Operating Characteristics........................................... 8 12.3 Trademarks............................................................. 16
6.9 Typical Characteristics................................................ 9 12.4 Electrostatic Discharge Caution..............................16
7 Parameter Measurement Information.......................... 10 12.5 Glossary..................................................................16
8 Detailed Description...................................................... 11 13 Mechanical, Packaging, and Orderable
8.1 Overview................................................................... 11 Information.................................................................... 16

4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision H (November 2009) to Revision I (August 2015) Page
• Added Applications section, Device Information table, Pin Configuration and Functions section, ESD Ratings
table, Thermal Information table, Feature Description section, Device Functional Modes, Application and
Implementation section, Power Supply Recommendations section, Layout section, Device and
Documentation Support section, and Mechanical, Packaging, and Orderable Information section .................. 1
• Deleted Ordering Information table. ...................................................................................................................1
• Added Military Disclaimer to Features list...........................................................................................................1

Changes from Revision I (August 2015) to Revision J (October 2021) Page

• Updated the device information table, ESD ratings table, and the device functional modes table to fit modern
data sheet standards.......................................................................................................................................... 1

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5 Pin Configuration and Functions

D, N, NS, J, DB, or PW Package

FK Package
16-Pin SOIC, PDIP, SO, CDIP, SSOP, or TSSOP
20-Pin LCCC
Top View
Top View

Table 5-1. Pin Functions

PIN
SOIC, PDIP,
SO, CDIP, I/O(1) DESCRIPTION
NAME LCCC
SSOP, or
TSSOP
GND 8 10 — Ground Pin
OE 13 17 I Output Enable
QA 15 19 O QA Output
QB 1 2 O QB Output
QC 2 3 O QC Output
QD 3 4 O QD Output
QE 4 5 O QE Output
QF 5 7 O QF Output
QG 6 8 O QG Output
QH 7 9 O QH Output
QH' 9 12 O QH' Output
RCLK 12 14 I RCLK Input
SER 14 18 I SER Input
SRCLK 11 14 I SRCLK Input
SRCLR 10 13 I SRCLR Input
1
16
NC — — No Connection
11
16
VCC — 20 — Power Pin

(1) Signal Types: I = Input, O = Output, I/O = Input or Output.

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6 Specifications
6.1 Absolute Maximum Ratings
(1)
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VCC Supply voltage –0.5 7 V
(2)
IIK Input clamp current VI < 0 or VI > VCC ±20 mA
(2)
IOK Output clamp current VO < 0 or VO > VCC ±20 mA
IO Continuous output current VO = 0 to VCC ±35 mA
Continuous current through VCC or GND ±70 mA
TJ Junction temperature 150 °C
Tstg Storage temperature –65 150 °C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

6.2 ESD Ratings

VALUE UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) 2000
V(ESD) Electrostatic discharge V
Charged device model (CDM), per ANSI/ESDA/JEDEC JS-002(2) 1000

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)(1)
SN54HC595 SN74HC595
UNIT
MIN NOM MAX MIN NOM MAX
VCC Supply voltage 2 5 6 2 5 6 V
VCC = 2 V 1.5 1.5
VIH High-level input voltage VCC = 4.5 V 3.15 3.15 V
VCC = 6 V 4.2 4.2
VCC = 2 V 0.5 0.5
VIL Low-level input voltage VCC = 4.5 V 1.35 1.35 V
VCC = 6 V 1.8 1.8
VI Input voltage 0 VCC 0 VCC V
VO Output voltage 0 VCC 0 VCC V
VCC = 2 V 1000 1000
Δt/Δv Input transition rise or fall time(2) VCC = 4.5 V 500 500 ns
VCC = 6 V 400 400
TA Operating free-air temperature –55 125 –40 85 °C

(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. See the TI application report,
Implications of Slow or Floating CMOS Inputs, SCBA004.
(2) If this device is used in the threshold region (from VILmax = 0.5 V to VIH min = 1.5 V), there is a potential to go into the wrong state
from induced grounding, causing double clocking. Operating with the inputs at tt = 1000 ns and VCC = 2 V does not damage the device;
however, functionally, the CLK inputs are not ensured while in the shift, count, or toggle operating modes.

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6.4 Thermal Information

SN74HC595
PW
THERMAL METRIC(1) D (SOIC) DB (SSOP) DW (SOIC) N (PDIP) NS (SO) UNIT
(TSSOP)
16 PINS 16 PINS 16 PINS 16 PINS 16 PINS 16 PINS
RθJA Junction-to-ambient thermal resistance 73 82 57 67 64 108 °C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.

6.5 Electrical Characteristics

over recommended operating free-air temperature range (unless otherwise noted)
TA = 25°C SN54HC595 SN74HC595
PARAMETER TEST CONDITIONS VCC UNIT
MIN TYP MAX MIN MAX MIN MAX
2V 1.9 1.998 1.9 1.9
IOH = –20 μA 4.5 V 4.4 4.499 4.4 4.4
6V 5.9 5.999 5.9 5.9
VOH VI = VIH or VIL QH′, IOH = –4 mA 3.98 4.3 3.7 3.84 V
4.5 V
QA – QH, IOH = –6 mA 3.98 4.3 3.7 3.84
QH′, IOH = −5.2 mA 5.48 5.8 5.2 5.34
6V
QA – QH, IOH = –7.8 mA 5.48 5.8 5.2 5.34
2V 0.002 0.1 0.1 0.1
IOL = 20 μA 4.5 V 0.001 0.1 0.1 0.1
6V 0.001 0.1 0.1 0.1
VOL VI = VIH or VIL QH′, IOL = 4 mA 0.17 0.26 0.4 0.33 V
4.5 V
QA – QH, IOL = 6 mA 0.17 0.26 0.4 0.33
QH′, IOL = 5.2 mA 0.15 0.26 0.4 0.33
6V
QA – QH, IOL = 7.8 mA 0.15 0.26 0.4 0.33
II VI = VCC or 0 6V ±0.1 ±100 ±1000 ±1000 nA
IOZ VO = VCC or 0, QA – QH 6V ±0.01 ±0.5 ±10 ±5 µA
ICC VI = VCC or 0, IO = 0 6V 8 160 80 µA
2 V to
Ci 3 10 10 10 pF
6V

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6.6 Timing Requirements

over operating free-air temperature range (unless otherwise noted)
TA = 25°C SN54HC595 SN74HC595
VCC UNIT
MIN MAX MIN MAX MIN MAX
2V 6 4.2 5
fclock Clock frequency 4.5 V 31 21 25 MHz
6V 36 25 29
2V 80 120 100
SRCLK or RCLK high or low 4.5 V 16 24 20
6V 14 20 17
tw Pulse duration ns
2V 80 120 100
SRCLR low 4.5 V 16 24 20
6V 14 20 17
2V 100 150 125
SER before SRCLK↑ 4.5 V 20 30 25
6V 17 25 21
2V 75 113 94
SRCLK↑ before RCLK↑(1) 4.5 V 15 23 19
6V 13 19 16
tsu Set-up time ns
2V 50 75 65
SRCLR low before RCLK↑ 4.5 V 10 15 13
6V 9 13 11
2V 50 75 60
SRCLR high (inactive) before SRCLK↑ 4.5 V 10 15 12
6V 9 13 11
2V 0 0 0
th Hold time, SER after SRCLK↑ 4.5 V 0 0 0 ns
6V 0 0 0

(1) This set-up time allows the storage register to receive stable data from the shift register. The clocks can be tied together, in which case
the shift register is one clock pulse ahead of the storage register.

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SRCLK

SER

RCLK

SRCLR

OE

QA

QB

QC

QD

QE

QF

QG

QH

QH’

NOTE: implies that the output is in 3-State mode.

Figure 6-1. Timing Diagram

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6.7 Switching Characteristics

Over recommended operating free-air temperature range.
FROM TO LOAD TA = 25°C SN54HC595 SN74HC595
PARAMETER VCC UNIT
(INPUT) (OUTPUT) CAPACITANCE MIN TYP MAX MIN MAX MIN MAX
2V 6 26 4.2 5
fmax 50 pF 4.5 V 31 38 21 25 MHz
6V 36 42 25 29
2V 50 160 240 200
SRCLK QH′ 50 pF 4.5 V 17 32 48 40
6V 14 27 41 34
tpd ns
2V 50 150 225 187
RCLK QA – QH 50 pF 4.5 V 17 30 45 37
6V 14 26 38 32
2V 51 175 261 219
tPHL SRCLR QH′ 50 pF 4.5 V 18 35 52 44 ns
6V 15 30 44 37
2V 40 150 255 187
ten OE QA – QH 50 pF 4.5 V 15 30 45 37 ns
6V 13 26 38 32
2V 42 200 300 250
tdis OE QA – QH 50 pF 4.5 V 23 40 60 50 ns
6V 20 34 51 43
2V 28 60 90 75
QA – QH 50 pF 4.5 V 8 12 18 15
6V 6 10 15 13
tt ns
2V 28 75 110 95
QH′ 50 pF 4.5 V 8 15 22 19
6V 6 13 19 16
2V 60 200 300 250
tpd RCLK QA – QH 150 pf 4.5 V 22 40 60 50 ns
6V 19 34 51 43
2V 70 200 298 250
ten OE QA – QH 150 pf 4.5 V 23 40 60 50 ns
6V 19 34 51 43
2V 45 210 315 265
tt QA – QH 150 pf 4.5 V 17 42 63 53 ns
6V 13 36 53 45

6.8 Operating Characteristics

TA = 25°C
PARAMETER TEST CONDITIONS TYP UNIT
Cpd Power dissipation capacitance No load 400 pF

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6.9 Typical Characteristics

40
OUTPUTS = µ+,¶
OE = µ/2:¶
35

30

25

20

ICC(nA) 15

10

-5
0 1 2 3 4 5 6
VCC(V)
Figure 6-2. SN74HC595 ICC vs. VCC

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7 Parameter Measurement Information

VCC
PARAMETER RL CL S1 S2

S1 tPZH 50 pF Open Closed

Test ten 1 kΩ or
From Output Point RL tPZL 150 pF Closed Open
Under Test tPHZ Open Closed
CL tdis 1 kΩ 50 pF
(see Note A) S2 tPLZ Closed Open

50 pF
tpd or tt or Open Open
150 pF
LOAD CIRCUIT

VCC
Reference 50%
VCC Input
High-Level 0V
50% 50%
Pulse tsu th
0V
tw Data VCC
90% 90%
Input 50% 50%
Low-Level VCC 10% 10% 0 V
Pulse 50% 50% tr tf
0V
VOLTAGE WAVEFORMS VOLTAGE WAVEFORMS
PULSE DURATIONS SETUP AND HOLD AND INPUT RISE AND FALL TIMES

VCC Output
VCC
Input 50% 50% Control
50% 50%
(Low-Level
0V 0V
Enabling)
tPLH tPHL
tPZL tPLZ
In-Phase VOH Output ≈VCC ≈VCC
90% 90%
Output 50% 50% Waveform 1 50%
10% 10% V 10%
OL (See Note B) VOL
tr tf
tPHL tPLH tPZH tPHZ
VOH Output VOH
90% 90% 90%
Out-of- 50% 50% Waveform 2 50%
Phase 10% 10%
VOL (See Note B) ≈0 V
Output tf tr
VOLTAGE WAVEFORMS
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES FOR 3-STATE OUTPUTS
PROPAGATION DELAY AND OUTPUT TRANSITION TIMES

NOTES: A. CL includes probe and test-fixture capacitance.

B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following
characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns.
D. For clock inputs, fmax is measured when the input duty cycle is 50%.
E. The outputs are measured one at a time, with one input transition per measurement.
F. t PLZ and tPHZ are the same as tdis.
G. tPZL and tPZH are the same as ten.
H. tPLH and tPHL are the same as tpd.

Figure 7-1. Load Circuit and Voltage Waveforms

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8 Detailed Description
8.1 Overview
The SNx4HC595 is part of the HC family of logic devices intended for CMOS applications. The SNx4HC595 is
an 8-bit shift register that feeds an 8-bit D-type storage register.
Both the shift register clock (SRCLK) and storage register clock (RCLK) are positive-edge triggered. If both
clocks are connected together, the shift register always is one clock pulse ahead of the storage register.
8.2 Functional Block Diagram
13
OE
12
RCLK
10
SRCLR
11
SRCLK
14
SER 1D 3R 15
C1 C3 QA
R 3S

2S
2R 3R 1
C2 C3 QB
R 3S

2S
2R 3R 2
C2 C3 QC
R 3S

2S
2R 3R 3
C2 C3 QD
R 3S

2S
2R 3R 4
C2 C3 QE
R 3S

2S
2R 3R 5
C2 C3 QF
R 3S

2S
2R 3R 6
C2 C3 QG
R 3S

2S
2R 3R 7
C2 C3 QH
R 3S
9
QH′
Pin numbers shown are for the D, DB, DW, J, N, NS, PW, and W packages.

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8.3 Feature Description

The SNx4HC595 devices are 8-bit Serial-In, Parallel-Out Shift Registers. They have a wide operating current of
2 V to 6 V, and the high-current 3-state outputs can drive up to 15 LSTTL Loads. The devices have a low power
consumption of 80-μA (Maximum) ICC. Additionally, the devices have a low input current of 1 μA (Maximum) and
a ±6-mA Output Drive at 5 V.
8.4 Device Functional Modes
Table 8-1 lists the functional modes of the SNx4HC595 devices.
Table 8-1. Function Table
INPUTS
FUNCTION
SER SRCLK SRCLR RCLK OE
X X X X H Outputs QA – QH are disabled.
X X X X L Outputs QA – QH are enabled.
X X L X X Shift register is cleared.
First stage of the shift register goes low.
L ↑ H X X Other stages store the data of previous stage,
respectively.
First stage of the shift register goes high.
H ↑ H X X Other stages store the data of previous stage,
respectively.
X X X ↑ X Shift-register data is stored in the storage register.

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9 Application and Implementation

Note
Information in the following applications sections is not part of the TI component specification,
and TI does not warrant its accuracy or completeness. TI’s customers are responsible for
determining suitability of components for their purposes, as well as validating and testing their design
implementation to confirm system functionality.

9.1 Application Information

The SNx4HC595 is a low-drive CMOS device that can be used for a multitude of bus interface type applications
where output ringing is a concern. The low drive and slow edge rates will minimize overshoot and undershoot on
the outputs.
9.2 Typical Application

QA 560
SRCLR
10 15

QB 560
SRCLK
11 1

5 560
RCLK QC
Controller 12 2

560
OE QD
13 3

560
SER QE
14 4

560
QF
5

560
QG
6

560
QH
7

+5V
9 Q+¶

VCC GND
16 8
0.1 F

Figure 9-1. Typical Application Schematic

9.2.1 Design Requirements

This device uses CMOS technology and has balanced output drive. Take care to avoid bus contention because
it can drive currents that would exceed maximum limits. The high drive will also create fast edges into light loads
so routing and load conditions should be considered to prevent ringing.

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9.2.2 Detailed Design Procedure

• Recommended input conditions
– Specified high and low levels. See (VIH and VIL) in Section 6.3 table.
– Specified high and low levels. See (VIH and VIL) in Section 6.3 table.
– Inputs are overvoltage tolerant allowing them to go as high as 5.5 V at any valid VCC
• Recommend output conditions
– Load currents should not exceed 35 mA per output and 70 mA total for the part
– Outputs should not be pulled above VCC
9.2.3 Application Curves

60

50

40

30
tpd(ns)

20

10

0
0 2 4 6 8
VCC(V)
Figure 9-2. SN75HC595 tpd vs. VCC

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10 Power Supply Recommendations

The power supply can be any voltage between the minimum and maximum supply voltage rating located in
Section 6.3 table.
Each VCC pin should have a good bypass capacitor to prevent power disturbance. For devices with a single
supply, 0.1 μf is recommended; if there are multiple VCC pins, then 0.01 μf or 0.022 μf is recommended for each
power pin. It is acceptable to parallel multiple bypass caps to reject different frequencies of noise. A 0.1 μf and
a 1 μf are commonly used in parallel. The bypass capacitor should be installed as close to the power pin as
possible for best results.
11 Layout
11.1 Layout Guidelines
When using multiple-bit logic devices, inputs should never float.
In many cases, functions or parts of functions of digital logic devices are unused, for example, when only two
inputs of a triple-input AND gate are used or only 3 of the 4 buffer gates are used. Such input pins should not
be left unconnected because the undefined voltages at the outside connections result in undefined operational
states. Figure 11-1 specifies the rules that must be observed under all circumstances. All unused inputs of digital
logic devices must be connected to a high or low bias to prevent them from floating. The logic level that should
be applied to any particular unused input depends on the function of the device. Generally they will be tied to
GND or VCC, whichever makes more sense or is more convenient. It is generally acceptable to float outputs,
unless the part is a transceiver. If the transceiver has an output enable pin, it will disable the output section of the
part when asserted. This will not disable the input section of the I/Os, so they cannot float when disabled.
11.2 Layout Example
Vcc
Input

Unused Input Output Output

Unused Input

Input

Figure 11-1. Layout Diagram

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12 Device and Documentation Support

12.1 Documentation Support
12.1.1 Related Documentation
For related documentation, see the following:
• Texas Instruments, Implications of Slow or Floating CMOS Inputs application brief
12.2 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
12.3 Trademarks
TI E2E™ is a trademark of Texas Instruments.
All trademarks are the property of their respective owners.
12.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.

12.5 Glossary
TI Glossary This glossary lists and explains terms, acronyms, and definitions.

13 Mechanical, Packaging, and Orderable Information

The following pages include mechanical packaging and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser based versions of this data sheet, refer to the left hand navigation.

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 PACKAGE OPTION ADDENDUM

www.ti.com 1-Aug-2025

PACKAGING INFORMATION

Orderable part number Status Material type Package | Pins Package qty | Carrier RoHS Lead finish/ MSL rating/ Op temp (°C) Part marking
(1) (2) (3) Ball material Peak reflow (6)
(4) (5)

5962-86816012A Active Production LCCC (FK) | 20 55 | TUBE No SNPB N/A for Pkg Type -55 to 125 5962-
86816012A
SNJ54HC
595FK
5962-8681601EA Active Production CDIP (J) | 16 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 5962-8681601EA
SNJ54HC595J
5962-8681601VEA Active Production CDIP (J) | 16 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 5962-8681601VE
A
SNV54HC595J
5962-8681601VEA.A Active Production CDIP (J) | 16 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 5962-8681601VE
A
SNV54HC595J
5962-8681601VFA Active Production CFP (W) | 16 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 5962-8681601VF
A
SNV54HC595W
5962-8681601VFA.A Active Production CFP (W) | 16 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 5962-8681601VF
A
SNV54HC595W
SN54HC595J Active Production CDIP (J) | 16 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 SN54HC595J
SN54HC595J.A Active Production CDIP (J) | 16 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 SN54HC595J
SN74HC595DBR Active Production SSOP (DB) | 16 2000 | LARGE T&R Yes NIPDAU | NIPDAU Level-1-260C-UNLIM -40 to 85 HC595
SN74HC595DBR.A Active Production SSOP (DB) | 16 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 HC595
SN74HC595DBRE4 Active Production SSOP (DB) | 16 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 HC595
SN74HC595DBRG4 Active Production SSOP (DB) | 16 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 HC595
SN74HC595DR Active Production SOIC (D) | 16 2500 | LARGE T&R Yes NIPDAU | SN Level-1-260C-UNLIM -40 to 85 HC595
SN74HC595DR.A Active Production SOIC (D) | 16 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 HC595
SN74HC595DRE4 Active Production null (null) | 2500 | LARGE T&R - Call TI Call TI -40 to 85
SN74HC595DRG3 Active Production SOIC (D) | 16 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 85 HC595
SN74HC595DRG3.A Active Production SOIC (D) | 16 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 85 HC595
SN74HC595DRG4 Active Production SOIC (D) | 16 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 HC595
SN74HC595DRG4.A Active Production SOIC (D) | 16 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 HC595
SN74HC595DT Obsolete Production SOIC (D) | 16 - - Call TI Call TI -40 to 85 HC595

Addendum-Page 1
 PACKAGE OPTION ADDENDUM

www.ti.com 1-Aug-2025

Orderable part number Status Material type Package | Pins Package qty | Carrier RoHS Lead finish/ MSL rating/ Op temp (°C) Part marking
(1) (2) (3) Ball material Peak reflow (6)
(4) (5)

SN74HC595DW Obsolete Production SOIC (DW) | 16 - - Call TI Call TI -40 to 85 HC595

SN74HC595DWR Active Production SOIC (DW) | 16 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 HC595
SN74HC595DWR.A Active Production SOIC (DW) | 16 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 HC595
SN74HC595N Active Production PDIP (N) | 16 25 | TUBE Yes NIPDAU N/A for Pkg Type -40 to 85 SN74HC595N
SN74HC595N.A Active Production PDIP (N) | 16 25 | TUBE Yes NIPDAU N/A for Pkg Type -40 to 85 SN74HC595N
SN74HC595NE4 Active Production PDIP (N) | 16 25 | TUBE Yes NIPDAU N/A for Pkg Type -40 to 85 SN74HC595N
SN74HC595NSR Active Production SOP (NS) | 16 2000 | LARGE T&R Yes NIPDAU | NIPDAU Level-1-260C-UNLIM -40 to 85 HC595
SN74HC595NSR.A Active Production SOP (NS) | 16 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 HC595
SN74HC595NSR.B Active Production SOP (NS) | 16 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 HC595
SN74HC595PW Obsolete Production TSSOP (PW) | 16 - - Call TI Call TI -40 to 85 HC595
SN74HC595PWR Active Production TSSOP (PW) | 16 2000 | LARGE T&R Yes NIPDAU | SN Level-1-260C-UNLIM -40 to 85 HC595
SN74HC595PWR.A Active Production TSSOP (PW) | 16 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 HC595
SN74HC595PWR.B Active Production TSSOP (PW) | 16 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 HC595
SN74HC595PWRG4 Active Production TSSOP (PW) | 16 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 HC595
SN74HC595PWRG4.A Active Production TSSOP (PW) | 16 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 HC595
SN74HC595PWRG4.B Active Production TSSOP (PW) | 16 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 HC595
SNJ54HC595FK Active Production LCCC (FK) | 20 55 | TUBE No SNPB N/A for Pkg Type -55 to 125 5962-
86816012A
SNJ54HC
595FK
SNJ54HC595FK.A Active Production LCCC (FK) | 20 55 | TUBE No SNPB N/A for Pkg Type -55 to 125 5962-
86816012A
SNJ54HC
595FK
SNJ54HC595J Active Production CDIP (J) | 16 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 5962-8681601EA
SNJ54HC595J
SNJ54HC595J.A Active Production CDIP (J) | 16 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 5962-8681601EA
SNJ54HC595J

(1)
Status: For more details on status, see our product life cycle.

(2)
Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance,
reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional
waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind.

Addendum-Page 2
 PACKAGE OPTION ADDENDUM

www.ti.com 1-Aug-2025

(3)
RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition.

(4)
Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum
column width.

(5)
MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown.
Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board.

(6)
Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part.

Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two
combined represent the entire part marking for that device.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and
makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative
and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers
and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF SN54HC595, SN54HC595-SP, SN74HC595 :

• Catalog : SN74HC595, SN54HC595

• Enhanced Product : SN74HC595-EP, SN74HC595-EP
• Military : SN54HC595
• Space : SN54HC595-SP

NOTE: Qualified Version Definitions:

• Catalog - TI's standard catalog product

• Enhanced Product - Supports Defense, Aerospace and Medical Applications

Addendum-Page 3
 PACKAGE OPTION ADDENDUM

www.ti.com 1-Aug-2025

• Military - QML certified for Military and Defense Applications

• Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application

Addendum-Page 4
 PACKAGE MATERIALS INFORMATION

www.ti.com 1-Aug-2025

TAPE AND REEL INFORMATION

REEL DIMENSIONS TAPE DIMENSIONS

K0 P1

B0 W
Reel
Diameter
Cavity A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
W Overall width of the carrier tape
P1 Pitch between successive cavity centers

Reel Width (W1)

QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE

Sprocket Holes

Q1 Q2 Q1 Q2

Q3 Q4 Q3 Q4 User Direction of Feed

Pocket Quadrants

*All dimensions are nominal

Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
SN74HC595DBR SSOP DB 16 2000 330.0 16.4 8.35 6.6 2.4 12.0 16.0 Q1
SN74HC595DR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
SN74HC595DR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
SN74HC595DRG3 SOIC D 16 2500 330.0 16.4 6.6 9.3 2.1 8.0 16.0 Q1
SN74HC595DRG4 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
SN74HC595DWR SOIC DW 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 Q1
SN74HC595NSR SOP NS 16 2000 330.0 16.4 8.1 10.4 2.5 12.0 16.0 Q1
SN74HC595NSR SOP NS 16 2000 330.0 16.4 8.45 10.55 2.5 12.0 16.2 Q1
SN74HC595PWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
SN74HC595PWRG4 TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1

Pack Materials-Page 1
 PACKAGE MATERIALS INFORMATION

www.ti.com 1-Aug-2025

TAPE AND REEL BOX DIMENSIONS

Width (mm)
H
W

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74HC595DBR SSOP DB 16 2000 353.0 353.0 32.0
SN74HC595DR SOIC D 16 2500 340.5 336.1 32.0
SN74HC595DR SOIC D 16 2500 340.5 336.1 32.0
SN74HC595DRG3 SOIC D 16 2500 366.0 364.0 50.0
SN74HC595DRG4 SOIC D 16 2500 353.0 353.0 32.0
SN74HC595DWR SOIC DW 16 2000 350.0 350.0 43.0
SN74HC595NSR SOP NS 16 2000 353.0 353.0 32.0
SN74HC595NSR SOP NS 16 2000 353.0 353.0 32.0
SN74HC595PWR TSSOP PW 16 2000 356.0 356.0 35.0
SN74HC595PWRG4 TSSOP PW 16 2000 353.0 353.0 32.0

Pack Materials-Page 2
 PACKAGE MATERIALS INFORMATION

www.ti.com 1-Aug-2025

TUBE

T - Tube
height L - Tube length

W - Tube
width

B - Alignment groove width

*All dimensions are nominal

Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm)
5962-86816012A FK LCCC 20 55 506.98 12.06 2030 NA
5962-8681601EA J CDIP 16 25 506.98 15.24 13440 NA
5962-8681601VEA J CDIP 16 25 506.98 15.24 13440 NA
5962-8681601VEA.A J CDIP 16 25 506.98 15.24 13440 NA
5962-8681601VFA W CFP 16 25 506.98 26.16 6220 NA
5962-8681601VFA.A W CFP 16 25 506.98 26.16 6220 NA
SN74HC595N N PDIP 16 25 506 13.97 11230 4.32
SN74HC595N N PDIP 16 25 506 13.97 11230 4.32
SN74HC595N.A N PDIP 16 25 506 13.97 11230 4.32
SN74HC595N.A N PDIP 16 25 506 13.97 11230 4.32
SN74HC595NE4 N PDIP 16 25 506 13.97 11230 4.32
SN74HC595NE4 N PDIP 16 25 506 13.97 11230 4.32
SNJ54HC595FK FK LCCC 20 55 506.98 12.06 2030 NA
SNJ54HC595FK.A FK LCCC 20 55 506.98 12.06 2030 NA
SNJ54HC595J J CDIP 16 25 506.98 15.24 13440 NA
SNJ54HC595J.A J CDIP 16 25 506.98 15.24 13440 NA

Pack Materials-Page 3
 PACKAGE OUTLINE
NS0016A SCALE 1.500
SOP - 2.00 mm max height
SOP

8.2 SEATING PLANE

TYP
7.4
A PIN 1 ID 0.1 C
AREA
14X 1.27
16
1

10.4 2X
10.0 8.89
NOTE 3

8
9
0.51
16X
5.4 0.35
B 0.25 C A B 2.00 MAX
5.2
NOTE 4

0.15 TYP

SEE DETAIL A
0.25 0.3
GAGE PLANE 0.1

0 - 10
1.05
0.55 DETAIL A
TYPICAL
(1.25)

4220735/A 12/2021

NOTES:

1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm, per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm, per side.

www.ti.com
 EXAMPLE BOARD LAYOUT
NS0016A SOP - 2.00 mm max height
SOP

16X (1.85) SEE

SYMM DETAILS

1 16

16X (0.6)

SYMM

14X (1.27)

8 9

(R0.05) TYP

(7)

LAND PATTERN EXAMPLE

SCALE:7X

SOLDER MASK SOLDER MASK METAL

METAL OPENING OPENING

0.07 MAX 0.07 MIN

ALL AROUND ALL AROUND

NON SOLDER MASK SOLDER MASK

DEFINED DEFINED

SOLDER MASK DETAILS

4220735/A 12/2021

NOTES: (continued)

5. Publication IPC-7351 may have alternate designs.

6. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

www.ti.com
 EXAMPLE STENCIL DESIGN
NS0016A SOP - 2.00 mm max height
SOP

16X (1.85) SYMM

1 16

16X (0.6)

SYMM

14X (1.27)

8 9

(R0.05) TYP (7)

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL
SCALE:7X

4220735/A 12/2021

NOTES: (continued)

7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
8. Board assembly site may have different recommendations for stencil design.

www.ti.com
 PACKAGE OUTLINE
DB0016A SCALE 1.500
SSOP - 2 mm max height
SMALL OUTLINE PACKAGE

C
8.2
TYP
A 7.4
0.1 C SEATING
PIN 1 INDEX AREA
PLANE
14X 0.65
16
1

2X
6.5
4.55
5.9
NOTE 3

8
9
0.38
16X
0.22
5.6
B 0.1 C A B
5.0
NOTE 4

0.25
0.09

SEE DETAIL A
2 MAX
0.25
GAGE PLANE

0.95 0.05 MIN

0 -8 0.55

DETAIL A
A 15

TYPICAL

4220763/A 05/2022

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. Reference JEDEC registration MO-150.

www.ti.com
 EXAMPLE BOARD LAYOUT
DB0016A SSOP - 2 mm max height
SMALL OUTLINE PACKAGE

16X (1.85) SYMM

1 (R0.05) TYP

16X (0.45) 16

SYMM

14X (0.65)

8 9

(7)

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN
SCALE: 10X

SOLDER MASK METAL UNDER SOLDER MASK

METAL
OPENING SOLDER MASK OPENING

EXPOSED METAL EXPOSED METAL

0.05 MAX 0.05 MIN

ALL AROUND ALL AROUND

NON-SOLDER MASK SOLDER MASK

DEFINED DEFINED
(PREFERRED)
SOLDER MASK DETAILS
15.000

4220763/A 05/2022
NOTES: (continued)

5. Publication IPC-7351 may have alternate designs.

6. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

www.ti.com
 EXAMPLE STENCIL DESIGN
DB0016A SSOP - 2 mm max height
SMALL OUTLINE PACKAGE

16X (1.85) SYMM

(R0.05) TYP
1
16X (0.45) 16

SYMM

14X (0.65)

8 9

(7)

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL
SCALE: 10X

4220763/A 05/2022
NOTES: (continued)

7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
8. Board assembly site may have different recommendations for stencil design.

www.ti.com
 GENERIC PACKAGE VIEW
DW 16 SOIC - 2.65 mm max height
7.5 x 10.3, 1.27 mm pitch SMALL OUTLINE INTEGRATED CIRCUIT

This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.

4224780/A

www.ti.com
 PACKAGE OUTLINE
DW0016A SCALE 1.500
SOIC - 2.65 mm max height
SOIC

10.63 SEATING PLANE

TYP
9.97
PIN 1 ID 0.1 C
A
AREA
14X 1.27
16
1

10.5 2X
10.1 8.89
NOTE 3

8
9
0.51
16X
0.31
7.6
B 0.25 C A B 2.65 MAX
7.4
NOTE 4

0.33
TYP
0.10

SEE DETAIL A
0.25
GAGE PLANE

0.3
0 -8 0.1
1.27
0.40 DETAIL A
(1.4) TYPICAL

4220721/A 07/2016

NOTES:

1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm, per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm, per side.
5. Reference JEDEC registration MS-013.

www.ti.com
 EXAMPLE BOARD LAYOUT
DW0016A SOIC - 2.65 mm max height
SOIC

16X (2) SEE

SYMM DETAILS

1 16

16X (0.6)

SYMM

14X (1.27)

8 9

R0.05 TYP

(9.3)

LAND PATTERN EXAMPLE

SCALE:7X

SOLDER MASK SOLDER MASK METAL

METAL OPENING OPENING

0.07 MAX 0.07 MIN

ALL AROUND ALL AROUND

NON SOLDER MASK SOLDER MASK

DEFINED DEFINED

SOLDER MASK DETAILS

4220721/A 07/2016

NOTES: (continued)

6. Publication IPC-7351 may have alternate designs.

7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

www.ti.com
 EXAMPLE STENCIL DESIGN
DW0016A SOIC - 2.65 mm max height
SOIC

16X (2) SYMM

1 16

16X (0.6)

SYMM

14X (1.27)

8 9

R0.05 TYP
(9.3)

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL
SCALE:7X

4220721/A 07/2016

NOTES: (continued)

8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.

www.ti.com
 GENERIC PACKAGE VIEW
FK 20 LCCC - 2.03 mm max height
8.89 x 8.89, 1.27 mm pitch LEADLESS CERAMIC CHIP CARRIER

This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.

4229370\/A\

www.ti.com
 PACKAGE OUTLINE
PW0016A SCALE 2.500
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE

SEATING
PLANE
6.6 C
TYP
A 6.2
0.1 C
PIN 1 INDEX AREA
14X 0.65
16
1

2X
5.1 4.55
4.9
NOTE 3

4X (0 -12 )

8
9
0.30
4.5 16X 1.2 MAX
B 0.17
4.3
NOTE 4 0.1 C A B

(0.15) TYP
SEE DETAIL A

0.25
GAGE PLANE
0.15
0.05

0.75
0.50
0 -8
DETAIL A
A 20

TYPICAL

4220204/B 12/2023

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-153.

www.ti.com
 EXAMPLE BOARD LAYOUT
PW0016A TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE

16X (1.5) SYMM

(R0.05) TYP
1
16X (0.45) 16

SYMM

14X (0.65)

8 9

(5.8)

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN
SCALE: 10X

SOLDER MASK METAL UNDER SOLDER MASK

METAL SOLDER MASK OPENING
OPENING

EXPOSED METAL EXPOSED METAL

0.05 MAX 0.05 MIN

ALL AROUND ALL AROUND

NON-SOLDER MASK SOLDER MASK

DEFINED DEFINED
(PREFERRED) SOLDER MASK DETAILS
15.000

4220204/B 12/2023
NOTES: (continued)

6. Publication IPC-7351 may have alternate designs.

7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

www.ti.com
 EXAMPLE STENCIL DESIGN
PW0016A TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE

16X (1.5) SYMM

(R0.05) TYP
1
16X (0.45) 16

SYMM

14X (0.65)

8 9

(5.8)

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL
SCALE: 10X

4220204/B 12/2023
NOTES: (continued)

8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.

www.ti.com
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