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DRV5011
SLVSCY6B – DECEMBER 2017 – REVISED JANUARY 2020

DRV5011 Low-Voltage, Digital-Latch Hall Effect Sensor

1 Features 3 Description
1• Ultra-small X2SON, SOT-23, DSBGA or TO-92 The DRV5011 device is a digital-latch Hall effect
package sensor designed for motors and other rotary systems.
• High magnetic sensitivity: ±2 mT (typical) The device has an efficient low-voltage architecture
• Robust hysteresis: 4 mT (typical) that operates from 2.5 V to 5.5 V. The device is
offered in standard SOT-23, low-profile X2SON,
• Fast sensing bandwidth: 30-kHz DSBGA and TO-92 packages. The output is a push-
• VCC operating range: 2.5-V to 5.5-V pull driver that requires no pullup resistor, enabling
• Push-pull CMOS output more compact systems.
– Capable of 5-mA sourcing, 20-mA sinking When a south magnetic pole is near the top of the
• Operating temperature: –40°C to +135°C package and the BOP threshold is exceeded, the
device drives a low voltage. The output stays low until
a north pole is applied and the BRP threshold is
2 Applications crossed, which causes the output to drive a high
• Brushless dc motor sensors voltage. Alternating north and south poles are
• Incremental rotary encoding: required to toggle the output, and integrated
hysteresis separates BOP and BRP to provide robust
– Brushed dc motor feedback switching.
– Motor speed (tachometer)
The device produces consistent performance across
– Mechanical travel a wide ambient temperature range of –40°C to
– Fluid measurement +135°C.
– Knob turning
Device Information(1)
– Wheel speed
PART NUMBER PACKAGE BODY SIZE (NOM)
• E-bikes
DSBGA (4) 0.80 mm × 0.80 mm
• Flow meters SOT-23 (3) 2.92 mm × 1.30 mm
DRV5011
X2SON (4) 1.10 mm × 1.40 mm
TO-92 (3) 4.00 mm × 3.15 mm
(1) For all available packages, see the package option addendum
at the end of the data sheet.

Typical Schematic Magnetic Response

VCC OUT

S N DRV5011 Controller VCC

N S VCC
OUT GPIO BHYS
S N GND
N S

0V
Copyright © 201 7, Texas Instrumen ts Incorpor ate d
B
north BRP 0 mT BOP south

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
DRV5011
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Table of Contents
1 Features .................................................................. 1 8 Application and Implementation ........................ 11
2 Applications ........................................................... 1 8.1 Application Information............................................ 11
3 Description ............................................................. 1 8.2 Typical Applications ................................................ 11
4 Revision History..................................................... 2 8.3 Dos and Don'ts........................................................ 14
5 Pin Configuration and Functions ......................... 3 9 Power Supply Recommendations...................... 15
6 Specifications......................................................... 4 10 Layout................................................................... 15
6.1 Absolute Maximum Ratings ...................................... 4 10.1 Layout Guidelines ................................................. 15
6.2 ESD Ratings ............................................................ 4 10.2 Layout Examples................................................... 15
6.3 Recommended Operating Conditions....................... 4 11 Device and Documentation Support ................. 16
6.4 Thermal Information .................................................. 5 11.1 Device Support...................................................... 16
6.5 Electrical Characteristics........................................... 5 11.2 Documentation Support ........................................ 16
6.6 Magnetic Characteristics........................................... 5 11.3 Receiving Notification of Documentation Updates 16
6.7 Typical Characteristics .............................................. 6 11.4 Community Resources.......................................... 16
7 Detailed Description .............................................. 7 11.5 Trademarks ........................................................... 16
7.1 Overview ................................................................... 7 11.6 Electrostatic Discharge Caution ............................ 16
7.2 Functional Block Diagram ......................................... 7 11.7 Glossary ................................................................ 16
7.3 Feature Description................................................... 7 12 Mechanical, Packaging, and Orderable
7.4 Device Functional Modes........................................ 10 Information ........................................................... 16

4 Revision History
Changes from Revision A (April 2019) to Revision B Page

• Added LPG (TO-92) package to the data sheet .................................................................................................................... 1

Changes from Original (December 2017) to Revision A Page

• Added YBH (DSBGA) package to data sheet ........................................................................................................................ 1

• Added recommendation to limit power supply voltage variation to less than 50 mVPP to Power Supply
Recommendations section ................................................................................................................................................... 15

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5 Pin Configuration and Functions

DBZ Package DMR Package

3-Pin SOT-23 4-Pin X2SON With Exposed Thermal Pad
Top View Top View

OUT
VCC
VCC 1

4
3 GND
Thermal
Pad
OUT 2

3
Not to scale

GND

NC
Not to scale

YBH Package LPG Package

4-Pin DSBGA 3-Pin TO-92
Top View Top View
1 2

3 OUT

2 GND
A GND NC
1 VCC

B VCC OUT

Not to scale

Pin Functions
PIN
I/O DESCRIPTION
NAME DSBGA SOT-23 X2SON TO-92
GND A1 3 2 2 — Ground reference
No-connect. This pin is not connected to the silicon. Leave this pin floating or
NC A2 — 3 — —
tied to ground, and soldered to the board for mechanical support.
OUT B2 2 4 3 O Push-pull CMOS output. Drives a VCC or ground level.
2.5-V to 5.5-V power supply. TI recommends connecting this pin to a ceramic
VCC B1 1 1 1 —
capacitor to ground with a value of at least 0.01 µF.
Thermal Thermal Leave thermal pad floating or tied to ground, and soldered to the board for
— — — —
Pad Pad mechanical support.

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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
MIN MAX UNIT
VCC Power-supply voltage VCC –0.3 5.5 V
Power-supply voltage slew rate VCC Unlimited V/µs
VO Output voltage OUT –0.3 VCC + 0.3 V
IO Output current OUT –5 30 mA
B Magnetic flux density Unlimited T
TJ Operating junction temperature 140 °C
For SOT-23 (DBZ), X2SON (DMR) and TO-
–40 135
TA Operating ambient temperature 92 (LPG) °C
For DSBGA (YBH) –40 125
Tstg Storage temperature –65 150 °C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) ±6000
V(ESD) Electrostatic discharge V
Charged-device model (CDM), per JEDEC specification JESD22-C101 (2) ±750

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VCC Power supply voltage VCC 2.5 5.5 V
VO Output voltage OUT 0 VCC V
IO Output current (1) OUT –5 20 mA
TJ Operating junction temperature 140 °C
For SOT-23 (DBZ), X2SON (DMR) and
–40 135
TA Operating ambient temperature TO-92 (LPG) °C
For DSBGA (YBH) -40 125

(1) Device-sourced current is negative. Device-sunk current is positive.

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6.4 Thermal Information

DRV5011
(1) DBZ DMR YBH LPG
THERMAL METRIC UNIT
(SOT-23) (X2SON) (DSBGA) (TO-92)
3 PINS 4 PINS 4 PINS 3 PINS
RθJA Junction-to-ambient thermal resistance 356 159 194.1 183.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 128 77 1.6 74.2 °C/W
RθJB Junction-to-board thermal resistance 94 102 68 158.8 °C/W
ψJT Junction-to-top characterization parameter 11.4 0.9 0.8 15.2 °C/W
ψJB Junction-to-board characterization parameter 92 100 67.9 158.8 °C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.

6.5 Electrical Characteristics

for VCC = 2.5 V to 5.5 V, over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ICC Operating supply current 2.3 3 mA
tON Power-on time (see Figure 10) 40 70 µs
td Propagation delay time From change in B to change in OUT 13 25 µs
VOH High-level output voltage IO = –1 mA VCC – 0.35 VCC – 0.1 V
VOL Low-level output voltage IO = 20 mA 0.15 0.4 V

6.6 Magnetic Characteristics

for VCC = 2.5 V to 5.5 V, over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
fBW Sensing bandwidth 30 kHz
Magnetic threshold operate point
BOP 0.6 2 3.8 mT
(see Figure 8)
Magnetic threshold release point
BRP –3.8 –2 –0.6 mT
(see Figure 8)
BHYS Magnetic hysteresis: |BOP – BRP| 2 4 6 mT

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6.7 Typical Characteristics

5 0

Magnetic Threshold Release Point (mT)

Magnetic Threshold Operate Point (mT)

4 -1

3 -2

2 -3

1 -4

0 -5
-40 -10 20 50 80 110 135 -40 -10 20 50 80 110 135
Temperature (qC) D002
Temperature (qC) D004

Figure 1. BOP vs Temperature Figure 2. BRP vs Temperature

5 0

Magnetic Threshold Release Point (mT)

Magnetic Threshold Operate Point (mT)

4 -1

3 -2

2 -3

1 -4

0 -5
1.5 2.5 3.5 4.5 5.5 1.5 2.5 3.5 4.5 5.5
Supply Voltage (V) D001
Supply Voltage (V) D003

Figure 3. BOP vs VCC Figure 4. BRP vs VCC

2.6
1.65 V
3V
Operating Supply Current (mA)

2.5 5.5 V

2.4

2.3

2.2

2.1

2
-40 -10 20 50 80 110 135
Temperature (qC) D005

Figure 5. ICC vs Temperature

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7 Detailed Description

7.1 Overview
The DRV5011 is a magnetic sensor with a digital output that latches the most recent pole measured. Applying a
south magnetic pole near the top of the package causes the output to drive low, whereas a north magnetic pole
causes the output to drive high, and the absence of a magnetic field causes the output to continue to drive the
previous state, whether low or high.
The device integrates a Hall effect element, analog signal conditioning, offset cancellation circuits, amplifiers, and
comparators. This provides stable performance across a wide temperature range and resistance to mechanical
stress.

7.2 Functional Block Diagram

Voltage VCC
Regulator
0.01 F
(minimum)
REF
GND
VCC
Element Bias
Offset Amp Output
OUT
Cancellation Control
Temperature
Compensation

Copyright © 201 7, Texas Instrumen ts Incorpor ate d

7.3 Feature Description

7.3.1 Magnetic Flux Direction
The DRV5011 is sensitive to the magnetic field component that is perpendicular to the top of the package, as
shown in Figure 6.

TO-92

B B
SOT-23
X2SON DSBGA

PCB

Figure 6. Direction of Sensitivity

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Feature Description (continued)

The magnetic flux that travels from the bottom to the top of the package is considered positive in this data sheet.
This condition exists when a south magnetic pole is near the top of the package. The magnetic flux that travels
from the top to the bottom of the package results in negative millitesla values. Figure 7 shows the flux direction
polarity.
positive B negative B

N S

S N

PCB PCB

Figure 7. Flux Direction Polarity

7.3.2 Magnetic Response

Figure 8 shows the device functionality and hysteresis.
OUT

VCC

BHYS

0V
B
north BRP 0 mT BOP south
Figure 8. Device Functionality

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Feature Description (continued)

7.3.3 Output Driver
Figure 9 shows the device push-pull CMOS output that can drive a VCC or ground level.
VCC

Output Output
Control

Figure 9. Push-Pull Output (Simplified)

7.3.4 Power-On Time

Figure 10 shows that after the VCC voltage is applied, the DRV5011 measures the magnetic field and sets the
output within the tON time.
VCC

2.5 V
tON

time

Output

Invalid Valid

time
Figure 10. tON Definition

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Feature Description (continued)

7.3.5 Hall Element Location
The sensing element inside the device is in the center of both packages when viewed from the top. Figure 11
shows the tolerances and side-view dimensions.
SOT-23
Top View

SOT-23
Side View

centered 650 µm
±70 µm ±80 µm

X2SON
Top View

X2SON
Side View
centered 250 µm
±60 µm ±50 µm

DSBGA
Top View
DSBGA
Side View
centered
±20 µm 150 µm
±20 µm

TO-92
Top View
2 mm 2 mm
TO-92
1.54 mm Side View

±50 µm 1030 µm
1.61 mm ±115 µm

Figure 11. Hall Element Location

7.4 Device Functional Modes

The DRV5011 has one mode of operation that applies when the Recommended Operating Conditions are met.

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8 Application and Implementation

NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.

8.1 Application Information

The DRV5011 is typically used in rotary applications for brushless DC (BLDC) motor sensors or incremental
rotary encoding.
For reliable functionality, the magnet must apply a flux density at the sensor greater than the maximum BOP and
less than the minimum BRP thresholds. Add additional margin to account for mechanical tolerance, temperature
effects, and magnet variation. Magnets generally produce weaker fields as temperature increases.

8.2 Typical Applications

8.2.1 BLDC Motor Sensors Application
VCC

3 Outputs
GPIOs VCC
DRV5011
Microcontroller DRV5011
6 Gate Drivers
GPIOs
PWM & MOSFETs M DRV5011

Copyright © 201 7, Texas Instrumen ts Incorpor ate d

Figure 12. BLDC Motor System

8.2.1.1 Design Requirements

For this design example, use the parameters listed in Table 1.

Table 1. Design Parameters

DESIGN PARAMETER EXAMPLE VALUE
Number of motor phases 3
Motor RPM 15 k
Number of magnet poles on the rotor 12
Magnetic material Bonded Neodymium
Maximum temperature inside the motor 125°C
Magnetic flux density peaks at the Hall
±11 mT
sensors at maximum temperature
Hall sensor VCC 5 V ±10%

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8.2.1.2 Detailed Design Procedure

Three-phase brushless DC motors often use three Hall effect latch devices to measure the electrical angle of the
rotor and tell the controller how to drive the three wires. These wires connect to electromagnet windings, which
generate magnetic fields that apply forces to the permanent magnets on the rotor.
Space the three Hall sensors across the printed-circuit board (PCB) so that they are 120 electrical degrees apart.
This configuration creates six 3-bit states with equal time duration for each electrical cycle, which consists of one
north and one south magnetic pole. From the center of the motor axis, the number of degrees to space each
sensor equals 2 / [number of poles] × 120°. In this design example, the first sensor is placed at 0°, the second
sensor is placed 20° rotated, and the third sensor is placed 40° rotated. Alternatively, a 3× degree offset can be
added or subtracted to any sensor, meaning the third sensor could alternatively be placed at
40° – (3 × 20°) = –20°.

8.2.1.3 Application Curve

Phase
V
Voltages

Hall 1

DRV5011
Hall 2
Outputs

Hall 3

Electrical Angle 0° 120° 240° 360°

Mechanical Angle 0° 30° 60°
.
Figure 13. Phase Voltages and Hall Signals for 3-Phase BLDC Motor

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8.2.2 Incremental Rotary Encoding Application

VCC
VCC DRV5011 Controller
VCC
OUT GPIO
GPIO
GND

S N
N S VCC DRV5011
VCC
OUT

GND

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Figure 14. Incremental Rotary Encoding System

8.2.2.1 Design Requirements

For this design example, use the parameters listed in Table 2.

Table 2. Design Parameters

DESIGN PARAMETER EXAMPLE VALUE
RPM range 0 to 45 k
Number of magnet poles 8
Magnetic material Ferrite
Air gap above the Hall sensors 2.5 mm
Magnetic flux density peaks at the Hall
±7 mT
sensors at maximum temperature

8.2.2.2 Detailed Design Procedure

Incremental encoders are used on knobs, wheels, motors, and flow meters to measure relative rotary movement.
By attaching a ring magnet to the rotating component and placing a DRV5011 nearby, the sensor generates
voltage pulses as the magnet turns. If directional information is also needed (clockwise versus counterclockwise),
a second DRV5011 can be added with a phase offset, and then the order of transitions between the two signals
describes the direction.
Creating this phase offset requires spacing the two sensors apart on the PCB, and an ideal 90° quadrature offset
is attained when the sensors are separated by half the length of each magnet pole, plus any integer number of
pole lengths. Figure 14 shows this configuration, as the sensors are 1.5 pole lengths apart. One of the sensors
changes its output every 360° / 8 poles / 2 sensors = 22.5° of rotation. For reference, TI Design TIDA-00480,
Automotive Hall Sensor Rotary Encoder, uses a 66-pole magnet with changes every 2.7°.
The maximum rotational speed that can be measured is limited by the sensor bandwidth. Generally, the
bandwidth must be faster than two times the number of poles per second. In this design example, the maximum
speed is 45000 RPM, which involves 6000 poles per second. The DRV5011 sensing bandwidth is 30 kHz, which
is five times the pole frequency. In systems where the sensor sampling rate is close to two times the number of
poles per second, most of the samples measure a magnetic field that is significantly lower than the peak value,
because the peaks only occur when the sensor and pole are perfectly aligned. In this case, add margin by
applying a stronger magnetic field that has peaks significantly higher than the maximum BOP.

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8.2.2.3 Application Curve

Two signals in quadrature provide movement and direction information. Figure 15 shows how each 2-bit state
has unique adjacent 2-bit states for clockwise and counterclockwise.
Voltage
Sensor 1
Sensor 2

time
Figure 15. Quadrature Output (2-Bit)

8.3 Dos and Don'ts

The Hall element is sensitive to magnetic fields that are perpendicular to the top of the package; therefore, the
correct magnet orientation must be used for the sensor to detect the field. Figure 16 shows correct and incorrect
orientations when using a ring magnet.

CORRECT

N
S N
N S
S

S N
N S

INCORRECT

S N
N S

Figure 16. Correct and Incorrect Magnet Orientations

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9 Power Supply Recommendations

The DRV5011 is powered from 2.5-V to 5.5-V dc power supplies. A 0.01-μF (minimum) ceramic capacitor rated
for VCC must be placed as close to the DRV5011 device as possible. Larger values of the bypass capacitor may
be needed to attenuate any significant high-frequency ripple and noise components generated by the power
source. TI recommends limiting the supply voltage variation to less than 50 mVPP.

10 Layout

10.1 Layout Guidelines

Magnetic fields pass through most nonferromagnetic materials with no significant disturbance. Embedding Hall
effect sensors within plastic or aluminum enclosures and sensing magnets on the outside is common practice.
Magnetic fields also easily pass through most PCBs, which makes placing the magnet on the opposite side
possible.

10.2 Layout Examples

VCC
VCC OUT

GND
GND NC Thermal
Pad

OUT
VCC GND OUT
VCC OUT
GND NC

DSBGA SOT-23 X2SON TO-92

Figure 17. Layout Examples

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11 Device and Documentation Support

11.1 Device Support

11.1.1 Development Support
For additional design reference, see the Automotive Hall Sensor Rotary Encoder TI design (TIDA-00480).
TI also offers the following evaluation modules (EVMs) for the DRV5011:
• Texas Instruments, DRV5011 Ultra-Low Power, Digital-Latch Hall Effect Sensor Evaluation Module
• Texas Instruments, Breakout Adapter for SOT-23 and TO-92 Hall Sensor Evaluation

11.2 Documentation Support

11.2.1 Related Documentation
For related documentation see the following:
• DRV5011-5012EVM user's guide
• HALL-ADAPTER-EVM user's guide

11.3 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.

11.4 Community Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.

11.5 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.6 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

11.7 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

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PACKAGING INFORMATION

Orderable part number Status Material type Package | Pins Package qty | Carrier RoHS Lead finish/ MSL rating/ Op temp (°C) Part marking
(1) (2) (3) Ball material Peak reflow (6)
(4) (5)

DRV5011ADDBZR Active Production SOT-23 (DBZ) | 3 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 135 1AD
DRV5011ADDBZR.A Active Production SOT-23 (DBZ) | 3 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 135 1AD
DRV5011ADDBZT Obsolete Production SOT-23 (DBZ) | 3 - - Call TI Call TI -40 to 135 1AD
DRV5011ADDMRR Active Production X2SON (DMR) | 4 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 135 1AD
DRV5011ADDMRR.A Active Production X2SON (DMR) | 4 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 135 1AD
DRV5011ADDMRT Obsolete Production X2SON (DMR) | 4 - - Call TI Call TI -40 to 135 1AD
DRV5011ADLPG Active Production TO-92 (LPG) | 3 1000 | BULK Yes SN N/A for Pkg Type -40 to 135 11AD
DRV5011ADLPG.A Active Production TO-92 (LPG) | 3 1000 | BULK Yes SN N/A for Pkg Type -40 to 135 11AD
DRV5011ADLPGM Active Production TO-92 (LPG) | 3 3000 | AMMO Yes SN N/A for Pkg Type -40 to 135 11AD
DRV5011ADLPGM.A Active Production TO-92 (LPG) | 3 3000 | AMMO Yes SN N/A for Pkg Type -40 to 135 11AD
DRV5011ADYBHR Active Production DSBGA (YBH) | 4 3000 | LARGE T&R Yes SAC396 Level-1-260C-UNLIM -40 to 125 A
DRV5011ADYBHR.A Active Production DSBGA (YBH) | 4 3000 | LARGE T&R Yes SAC396 Level-1-260C-UNLIM -40 to 125 A
DRV5011ADYBHT Obsolete Production DSBGA (YBH) | 4 - - Call TI Call TI -40 to 125 A

(1)
Status: For more details on status, see our product life cycle.

(2)
Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance,
reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional
waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind.

(3)
RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition.

(4)
Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum
column width.

(5)
MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown.
Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board.

(6)
Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part.

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 PACKAGE OPTION ADDENDUM

www.ti.com 30-Jun-2025

Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two
combined represent the entire part marking for that device.

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and other limited information may not be available for release.

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Addendum-Page 2
 PACKAGE MATERIALS INFORMATION

www.ti.com 16-Apr-2024

TAPE AND REEL INFORMATION

REEL DIMENSIONS TAPE DIMENSIONS

K0 P1

B0 W
Reel
Diameter
Cavity A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
W Overall width of the carrier tape
P1 Pitch between successive cavity centers

Reel Width (W1)

QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE

Sprocket Holes

Q1 Q2 Q1 Q2

Q3 Q4 Q3 Q4 User Direction of Feed

Pocket Quadrants

*All dimensions are nominal

Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
DRV5011ADDBZR SOT-23 DBZ 3 3000 180.0 8.4 3.15 2.77 1.22 4.0 8.0 Q3
DRV5011ADDMRR X2SON DMR 4 3000 180.0 8.4 1.27 1.57 0.5 4.0 8.0 Q1
DRV5011ADYBHR DSBGA YBH 4 3000 180.0 8.4 0.85 0.89 0.51 2.0 8.0 Q2

Pack Materials-Page 1
 PACKAGE MATERIALS INFORMATION

www.ti.com 16-Apr-2024

TAPE AND REEL BOX DIMENSIONS

Width (mm)
H
W

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
DRV5011ADDBZR SOT-23 DBZ 3 3000 183.0 183.0 20.0
DRV5011ADDMRR X2SON DMR 4 3000 200.0 183.0 25.0
DRV5011ADYBHR DSBGA YBH 4 3000 182.0 182.0 20.0

Pack Materials-Page 2
 PACKAGE OUTLINE
DBZ0003A SCALE 4.000
SOT-23 - 1.12 mm max height
SMALL OUTLINE TRANSISTOR

2.64 C
2.10
1.12 MAX
1.4
B A
1.2 0.1 C
PIN 1
INDEX AREA

0.95 (0.125)
3.04
1.9 2.80
3
(0.15)
NOTE 4

2
0.5
3X
0.3
0.2 C A B 4X 0 -15 0.10
(0.95) TYP
0.01

4X 4 -15

0.25
GAGE PLANE 0.20
TYP
0.08

0.6
TYP SEATING PLANE
0 -8 TYP 0.2

4214838/F 08/2024

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Reference JEDEC registration TO-236, except minimum foot length.
4. Support pin may differ or may not be present.
5. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed
0.25mm per side

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 EXAMPLE BOARD LAYOUT
DBZ0003A SOT-23 - 1.12 mm max height
SMALL OUTLINE TRANSISTOR

PKG
3X (1.3)
1

3X (0.6)

SYMM

3
2X (0.95)

(R0.05) TYP
(2.1)

LAND PATTERN EXAMPLE

SCALE:15X

SOLDER MASK
SOLDER MASK METAL METAL UNDER OPENING
OPENING SOLDER MASK

0.07 MAX 0.07 MIN

ALL AROUND ALL AROUND

NON SOLDER MASK SOLDER MASK

DEFINED DEFINED
(PREFERRED)

SOLDER MASK DETAILS

4214838/F 08/2024

NOTES: (continued)

5. Publication IPC-7351 may have alternate designs.

6. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

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 EXAMPLE STENCIL DESIGN
DBZ0003A SOT-23 - 1.12 mm max height
SMALL OUTLINE TRANSISTOR

PKG

3X (1.3)
1

3X (0.6)

SYMM
3
2X(0.95)

(R0.05) TYP
(2.1)

SOLDER PASTE EXAMPLE

BASED ON 0.125 THICK STENCIL
SCALE:15X

4214838/F 08/2024

NOTES: (continued)

7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
8. Board assembly site may have different recommendations for stencil design.

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 PACKAGE OUTLINE
LPG0003A SCALE 1.300
TO-92 - 5.05 mm max height
TRANSISTOR OUTLINE

4.1
3.9

3.25
3.05 0.55
3X
0.40 5.05
MAX
1 3

3X (0.8)

3X
15.5
15.1

0.48 0.51
3X 3X
0.35 0.36
2X 1.27 0.05
2.64
2.44

2.68
2.28
1.62
2X (45 ) 1.42

1 2 3
(0.5425) 0.86
0.66
4221343/C 01/2018

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.

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 EXAMPLE BOARD LAYOUT
LPG0003A TO-92 - 5.05 mm max height
TRANSISTOR OUTLINE

FULL R
0.05 MAX (1.07) TYP
METAL
ALL AROUND TYP 3X ( 0.75) VIA
TYP

2X
METAL

(1.7) 2X (1.7)

2X
SOLDER MASK
OPENING
1 2 3
(R0.05) TYP 2X (1.07)
(1.27)
SOLDER MASK
OPENING (2.54)

LAND PATTERN EXAMPLE

NON-SOLDER MASK DEFINED
SCALE:20X

4221343/C 01/2018

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 TAPE SPECIFICATIONS
LPG0003A TO-92 - 5.05 mm max height
TRANSISTOR OUTLINE

0 1
13.0 0 1
12.4

1 MAX
21
18

2.5 MIN
6.5
5.5
9.5
8.5 0.25
0.15

19.0
17.5

3.8-4.2 TYP 0.45

6.55 12.9 0.35
6.15 12.5

4221343/C 01/2018

www.ti.com
 GENERIC PACKAGE VIEW
DMR 4 X2SON - 0.4 mm max height
1.1 x 1.4, 0.5 mm pitch PLASTIC SMALL OUTLINE - NO LEAD

This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.

4229480/A

www.ti.com
 PACKAGE OUTLINE
DMR0004A SCALE 9.000
X2SON - 0.4 mm max height
PLASTIC SMALL OUTLINE - NO LEAD

1.15 A
B
1.05

PIN 1 INDEX AREA

1.45
1.35

(0.13) TYP

C
0.4 MAX

SEATING PLANE
0.05 NOTE 4
0.00 0.08 C

2X 0.5

SYMM

2 3
NOTE 4

EXPOSED
THERMAL PAD

5 SYMM
0.6 0.1

0.25
4X
PIN 1 ID 0.15
(OPTIONAL)

1 4
0.27
4X
0.17
0.8 0.1 0.1 C B A
0.05 C
4222825/B 05/2022
NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
4. Quantity and shape of side wall metal may vary.

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 EXAMPLE BOARD LAYOUT
DMR0004A X2SON - 0.4 mm max height
PLASTIC SMALL OUTLINE - NO LEAD

2X (0.5)
4X (0.22)
(R0.05) TYP
1 4

4X (0.4)

5
SYMM
(0.6)
(1.4)

( 0.2) VIA

2 3
SYMM

(0.8)

LAND PATTERN EXAMPLE

SCALE:35X

0.05 MAX 0.05 MIN

ALL AROUND ALL AROUND
METAL SOLDER MASK
OPENING

SOLDER MASK
OPENING METAL UNDER
SOLDER MASK
NON SOLDER MASK SOLDER MASK
DEFINED DEFINED
(PREFERRED)

SOLDER MASK DETAILS

4222825/B 05/2022
NOTES: (continued)

5. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
6. Vias are optional depending on application, refer to device data sheet. If all or some are implemented, recommended via locations are shown.
It is recommended that vias under paste be filled, plugged or tented.

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 EXAMPLE STENCIL DESIGN
DMR0004A X2SON - 0.4 mm max height
PLASTIC SMALL OUTLINE - NO LEAD

2X (0.5)
4X (0.22)
(R0.05) TYP
1 4

4X (0.4)

5
SYMM
(0.57)
(1.4)

METAL
TYP

2 3
SYMM

(0.76)

SOLDER PASTE EXAMPLE

BASED ON 0.1 mm THICK STENCIL

EXPOSED PAD 5:
90% PRINTED SOLDER COVERAGE BY AREA
SCALE:50X

4222825/B 05/2022

NOTES: (continued)

7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.

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 PACKAGE OUTLINE
YBH0004 SCALE 12.000
DSBGA - 0.4 mm max height
DIE SIZE BALL GRID ARRAY

B E A

BALL A1
CORNER

C
0.4 MAX

SEATING PLANE
0.16 BALL TYP 0.05 C
0.10

0.4
TYP

SYMM D: Max = 0.82 mm, Min = 0.76 mm

0.4
TYP
E: Max = 0.784 mm, Min =0.724 mm
A

0.225 1 2
4X SYMM
0.185
0.015 C A B

4224051/A 11/2017

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.

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 EXAMPLE BOARD LAYOUT
YBH0004 DSBGA - 0.4 mm max height
DIE SIZE BALL GRID ARRAY

(0.4) TYP
4X ( 0.2)
1 2

A
SYMM
(0.4) TYP

SYMM

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN
SCALE: 50X

0.05 MAX 0.05 MIN METAL UNDER

( 0.2) SOLDER MASK
METAL

EXPOSED ( 0.2)
SOLDER MASK EXPOSED
METAL SOLDER MASK
OPENING METAL OPENING
SOLDER MASK
NON-SOLDER MASK DEFINED
DEFINED (PREFERRED)

SOLDER MASK DETAILS

NOT TO SCALE

4224051/A 11/2017

NOTES: (continued)

3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
See Texas Instruments Literature No. SNVA009 (www.ti.com/lit/snva009).

www.ti.com
 EXAMPLE STENCIL DESIGN
YBH0004 DSBGA - 0.4 mm max height
DIE SIZE BALL GRID ARRAY

(0.4) TYP

4X ( 0.21) (R0.05) TYP

1 2

A
SYMM
(0.4) TYP

METAL
TYP SYMM

SOLDER PASTE EXAMPLE

BASED ON 0.075 mm THICK STENCIL
SCALE: 50X

4224051/A 11/2017

NOTES: (continued)

4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.

www.ti.com
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