6-PIN DIP

HIGH SPEED LOGIC OPTOCOUPLERS

H11N1-M H11N2-M H11N3-M

PACKAGE SCHEMATIC

ANODE 1 6 VCC

6
6 CATHODE 2 5 GND
1

1 3 4 VO

DESCRIPTION Truth Table

The H11NX-M series has a high speed integrated circuit detector optically Input Output
coupled to an AlGaAs infrared emitting diode. The output incorporates a
Schmitt trigger, which provides hysteresis for noise immunity and pulse s H L
haping. The detector circuit is optimized for simplicity of operation and utilizes L H
an open collector output for maximum application flexibility.

FEATURES
• High data rate, 5 MHz typical (NRZ)
• Free from latch up and oscilliation throughout voltage and temperature ranges.
• Microprocessor compatible drive
• Logic compatible output sinks 16 mA at 0.5 V maximum
• Guaranteed on/off threshold hysteresis
• Wide supply voltage capability, compatible with all popular logic systems
• High common mode transient immunity, 2000 V/µs minimum
• Fast switching t r = 7.5ns typical, t f = 12ns typical
• Underwriter Laboratory (UL) recognized—file #E90700
• VDE recognized – File#102497 – Add option V (e.g., H11N1VM)

APPLICATIONS
• Logic to logic isolator
• Programmable current level sensor
• Line receiver—eliminate noise and transient problems
• A.C. to TTL conversion—square wave shaping
• Interfaces computers with peripherals
• Isolated power MOS driver for power supplies

© 2003 Fairchild Semiconductor Corporation Page 1 of 9 4/14/03

 6-PIN DIP
HIGH SPEED LOGIC OPTOCOUPLERS

H11N1-M H11N2-M H11N3-M

ABSOLUTE MAXIMUM RATINGS

Parameters Symbol Device Value Units
TOTAL DEVICE
Storage Temperature TSTG All -55 to +150 °C
Operating Temperature TOPR All -40 to +85 °C
Lead Solder Temperature TSOL All 260 for 10 sec °C
Total Device Power Dissipation @ 25°C 250 mW
PD All
Derate Above 25°C 2.94 mW/°C
EMITTER
Continuous Forward Current IF All 30 mA
Reverse Voltage VR All 6 V
Forward Current - Peak (1 µs pulse, 300 pps) IF(pk) All 1.0 A
LED Power Dissipation 25°C Ambient 120 mW
PD All
Derate Linearly From 25°C 1.41 mW/°C
DETECTOR
Detector Power Dissipation @ 25°C 150 mW
PD All
Derate Linearly from 25°C 1.76 mW/°C
V45 Allowed Range VO All 0 to 16 V
V65 Allowed Range VCC All 0 to 16 V
I4 Output Current IO All 50 mA

ELECTRICAL CHARACTERISTICS (TA = 0-70°C Unless otherwise specified.)

INDIVIDUAL COMPONENT CHARACTERISTICS
Parameters Test Conditions Symbol Device Min Typ* Max Units
EMITTER
IF = 10 mA 1.4 2
Input Forward Voltage VF All V
IF = 0.3 mA 0.75 1.25
Reverse Current VR = 5 V IR All 10 µA
Capacitance V = 0, f = 1.0 MHz CJ All 100 pF
DETECTOR
Operating Voltage Range VCC All 4 15 V
Supply Current IF = 0, VCC = 5V ICC(off) All 6 10 mA
Output Current, High IF = 0.3mA, VCC = VO = 15V IOH All 100 µA

*Typical values at TA = 25°C

© 2003 Fairchild Semiconductor Corporation Page 2 of 9 4/14/03

 6-PIN DIP
HIGH SPEED LOGIC OPTOCOUPLERS

H11N1-M H11N2-M H11N3-M

TRANSFER CHARACTERISTICS
DC Characteristics Test Conditions Symbol Device Min Typ* Max Units
Supply Current IF = 10mA, VCC = 5V ICC(on) All 6.5 10 mA
Output Voltage, low RL=270Ω,VCC=5V, IF=IF(on) max. VOL All 0.5 V
H11N1-M 0.8 3.2
RL=270Ω, VCC = 5V
Turn-On Threshold Current IF(on) H11N2-M 2.3 5 mA
note 1
H11N3-M 4.1 10
Turn-Off Threshold Current RL=270Ω, VCC = 5V IF(off) All 0.3 mA
Hysteresis Ratio RL=270Ω, VCC = 5V IF(off)/IF(on) All 0.65 0.95
AC Characteristics Test Conditions Symbol Device Min Typ Max Units
SWITCHING SPEED
Propagation delay time C=120pF, tP=1µs, RE: Note 2
tPHL All 100 330 ns
High to Low Fig. 1
C=120pF, tP=1µs, RE: Note 2
Rise Time tr All 7.5 ns
Fig. 1
Propagation delay time C=120pF, tP=1µs, RE: Note 2
tPLH All 150 330 ns
Low to High Fig. 1
C=120pF, tP=1µs, RE: Note 2
Fall time tf All 12 ns
Fig. 1
Data Rate All 5 MHz

ISOLATION CHARACTERISTICS
Parameters Test Conditions Symbol Min Typ* Max Units
Input-Output Isolation Voltage f = 60 Hz, t =1 sec. VISO 7500 VPEAK
Isolation Capacitance VI-O = 0V, f = 1 MHz CISO 0.4 0.6 pF
Isolation Resistance VI-O = ±500 VDC RISO 1011 Ω
*Typical values at TA = 25°C

NOTES:
1. Maximum IF(ON) is the maximum current required to trigger the output. For example, a 3.2mA maximum trigger current would
require the LED to be driven at a current greater than 3.2mA to guarantee the device will turn on. A 10% guard band is
recommended to account for degradation of the LED over its lifetime. The maximum allowable LED drive current is 30mA.
2. H11N1: RE = 910Ω
H11N2: RE = 560Ω
H11N3: RE = 240Ω

© 2003 Fairchild Semiconductor Corporation Page 3 of 9 4/14/03

 6-PIN DIP
HIGH SPEED LOGIC OPTOCOUPLERS

H11N1-M H11N2-M H11N3-M

C
I6 5V VIN 5V 50%
IF
0

RE 1 H11N1-M 6 RL 270Ω

VIN 4
VO
ton toff
tr = tf ≤ 0.01µS 2 5 0.1µF
Z = 50Ω
10%
VO
90%

tf tr

Figure 1. Switching Test Circuit and Waveforms

Figure 2. Transfer Characteristics Figure 3. Threshold Current vs. Supply Voltage

6 1.4
IF - NORMALIZED THRESHOLD CURRENT

VOH TURN ON THRESHOLD

D
1.2
5
VCC = 5V
VO - OUTPUT VOLTAGE (V)

RL = 270Ω
1.0
TA = 25°C
4
0.8
TURN OFF THRESHOLD
3
IF(OFF) IF(ON) 0.6

2
0.4
Hysteresis area NORMALIZED TO::
shaded for illustration TURN ON THRESHOLD AT
VCC = 5V, TA = 25°C
1 0.2

VOL
0.0
0 0 2 4 6 8 10 12 14 16
0 1 2 3 4
VCC - SUPPLY VOLTAGE (V)
IF - INPUT CURRENT (mA)

Figure 4. Threshold Current vs. Temperature Figure 5. Load Current vs. Output Voltage
1.2

100
1.0
NORMALIZED THRESHOLD

IO - LOAD CURRENT (mA)

CURRENT IF(On), IF(Off)

IF(On) IF(Off)
0.8

IF = IF(ON)
0.6
VCC = 5V
10

0.4
NORMALIZED TO :
VCC = 5V
TA = 25°C
0.2

0.0 1
0 10 20 30 40 50 60 70 0.0 0.2 0.4 0.6 0.8 1.0
TA - TEMPERATURE (°C) VO - OUTPUT VOLTAGE, LOW (V)

© 2003 Fairchild Semiconductor Corporation Page 4 of 9 4/14/03

 6-PIN DIP
HIGH SPEED LOGIC OPTOCOUPLERS

H11N1-M H11N2-M H11N3-M

Figure 6. Supply Current vs. Supply Voltage Figure 7. LED Forward Voltage vs. Forward Current
12 100

TA = -25°C
10

IF - FORWARD CURRENT (mA)

IC - SUPPLY CURRENT (mA)

8
TA = 85°C
TA = -25°C
TA = 25°C
TA = 25°C
6 10

TA = 85°C
4

ON STATE I F = 10mA
2
OFF STATE I F = 0

0 1
2 4 6 8 10 12 14 16 1.0 1.2 1.4 1.6 1.8 2.0

VCC - SUPPLY VOLTAGE (V) VF - FORWARD VOLTAGE (V)

© 2003 Fairchild Semiconductor Corporation Page 5 of 9 4/14/03

 6-PIN DIP
HIGH SPEED LOGIC OPTOCOUPLERS

H11N1-M H11N2-M H11N3-M

Package Dimensions (Through Hole) Package Dimensions (Surface Mount)

0.350 (8.89) 0.350 (8.89)

0.320 (8.13) 0.320 (8.13)

0.390 (9.90)
0.332 (8.43)
0.260 (6.60) 0.260 (6.60)
0.240 (6.10) 0.240 (6.10)

0.070 (1.77) 0.070 (1.77)

0.040 (1.02) 0.040 (1.02) 0.320 (8.13)
0.014 (0.36) 0.320 (8.13)
0.014 (0.36)
0.010 (0.25) 0.010 (0.25)

0.200 (5.08)
0.115 (2.93) 0.200 (5.08) 0.012 (0.30)
0.115 (2.93) 0.008 (0.20)

0.100 (2.54)
0.015 (0.38) 0.025 (0.63)
0.020 (0.51)
0.020 (0.50) 15° 0.100 [2.54]
0.100 (2.54) 0.035 (0.88)
0.016 (0.41) 0.020 (0.50)
0.012 (0.30) 0.006 (0.16)
0.016 (0.41)

Package Dimensions (0.4” Lead Spacing) Recommended Pad Layout for

0.350 (8.89)
Surface Mount Leadform
0.320 (8.13)

0.070 (1.78)
0.260 (6.60)
0.240 (6.10)

0.060 (1.52)

0.070 (1.77)
0.040 (1.02)
0.014 (0.36)
0.010 (0.25)
0.425 (10.79) 0.100 (2.54)

0.200 (5.08)
0.305 (7.75) 0.030 (0.76)
0.115 (2.93)

0.100 (2.54)
0.015 (0.38)

0.100 [2.54] 0.012 (0.30)

0.020 (0.50) 0.008 (0.21)
0.016 (0.41)
0.425 (10.80)
0.400 (10.16)

© 2003 Fairchild Semiconductor Corporation Page 6 of 9 4/14/03

 6-PIN DIP
HIGH SPEED LOGIC OPTOCOUPLERS

H11N1-M H11N2-M H11N3-M

ORDERING INFORMATION

Option/Order Entry Identifier Description

S Surface Mount Lead Bend
SR2 Surface Mount; Tape and reel
T 0.4" Lead Spacing
V VDE 0884
TV VDE 0884, 0.4" Lead Spacing
SV VDE 0884, Surface Mount
SR2V VDE 0884, Surface Mount, Tape & Reel

MARKING INFORMATION

H11N1 2

6
V X YY Q

3 4 5

Definitions
1 Fairchild logo
2 Device number
VDE mark (Note: Only appears on parts ordered with VDE
3
option – See order entry table)
4 One digit year code, e.g., ‘3’
5 Two digit work week ranging from ‘01’ to ‘53’
6 Assembly package code
*Note – Parts that do not have the ‘V’ option (see definition 3 above) that are marked with
date code ‘325’ or earlier are marked in portrait format.

© 2003 Fairchild Semiconductor Corporation Page 7 of 9 4/14/03

 6-PIN DIP
HIGH SPEED LOGIC OPTOCOUPLERS

H11N1-M H11N2-M H11N3-M

Carrier Tape Specifications

12.0 ± 0.1
4.5 ± 0.20
2.0 ± 0.05 Ø1.5 MIN
0.30 ± 0.05 4.0 ± 0.1
1.75 ± 0.10

11.5 ± 1.0
21.0 ± 0.1 24.0 ± 0.3
9.1 ± 0.20

0.1 MAX 10.1 ± 0.20 Ø1.5 ± 0.1/-0

User Direction of Feed

NOTE
All dimensions are in inches (millimeters)

Reflow Profile (White Package, -M Suffix)

300 230°C, 10–30 s

250 245°C peak
Temperature (°C)

200

150
Time above 183°C, 120–180 sec
100
Ramp up = 2–10°C/sec • Peak reflow temperature: 245°C (package surface temperature)
50 • Time of temperature higher than 183°C for 120–180 seconds
• One time soldering reflow is recommended
0
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5
Time (Minute)

© 2003 Fairchild Semiconductor Corporation Page 8 of 9 4/14/03

 6-PIN DIP
HIGH SPEED LOGIC OPTOCOUPLERS

H11N1-M H11N2-M H11N3-M

DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO
ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME
ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;
NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.

LIFE SUPPORT POLICY

FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES
OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR
CORPORATION. As used herein:
1. Life support devices or systems are devices or systems 2. A critical component in any component of a life support
which, (a) are intended for surgical implant into the body, or device or system whose failure to perform can be
(b) support or sustain life, and (c) whose failure to perform reasonably expected to cause the failure of the life support
when properly used in accordance with instructions for use device or system, or to affect its safety or effectiveness.
provided in the labeling, can be reasonably expected to
result in a significant injury of the user.

© 2003 Fairchild Semiconductor Corporation Page 9 of 9 4/14/03