Winstar Display Co.

, LTD

: 407 163

WEB: http://www.winstar.com.tw
E-mail: sales@winstar.com.tw
Tel:886-4-24262208 Fax886-4-24262207

No.163 Chung Ching RD.,

Taichune, Taiwan, R.O.C

SPECIFICATION
CUSTOMER :
MODULE NO.:

WH1601A-YYH-JT#

APPROVED BY:
( FOR CUSTOMER USE ONLY )

SALES BY

VERSION

PCB VERSION:

APPROVED BY

DATE

CHECKED BY

REVISED
PAGE NO.

DATA:

PREPARED BY

SUMMARY

2011/10/28 15-19 Correct ST7066IC

information.
Page 1 of 29

Winstar Display Co., LTD MODLE NO

RECORDS OF REVISION

VERSION

DATE

0
A

2007.12.14
2008/9/12

DOC. FIRST ISSUE

REVISED
PAGE SUMMARY
NO.

First issue
13 Modify Character Generator
ROM Pattern
2011/10/28 15-19 Correct ST7066IC
information.

Page 2 of 29

Contents
1.Module Classification Information
2.Precautions in use of LCD Modules
3.General Specification
4.Absolute Maximum Ratings
5.Electrical Characteristics
6.Optical Characteristics
7.Interface Pin Function
8.Contour Drawing & Block Diagram
9.Function Description
10.Character Generator ROM Pattern
11.Instruction Table
12.Timing Characteristics
13.Initializing of LCM
14.Reliability
15.Backlight Information
16. Inspection specification
17. Material List of Components for RoHs
18. Recommendable storage

Page 3 of 29

1.Module Classification Information

W H 1 6 0 1 AY Y H

JT#

BrandWINSTAR DISPLAY CORPORATION

Display TypeHCharacter Type, GGraphic Type
Display FontCharacter 16 words, 1Lines.
Model serials no.
Backlight Type NWithout backlight
ALED, Amber
BEL, Blue green
RLED, Red
DEL, Green
OLED, Orange
WEL, White
GLED, Green
FCCFL, White
YLED, Yellow Green
LCD Mode
BTN Positive, Gray
TFSTN Negative
NTN Negative,
GSTN Positive, Gray
YSTN Positive, Yellow Green
MSTN Negative, Blue
FFSTN Positive
LCD Polarizer
AReflective, N.T, 6:00
HTransflective, W.T,6:00
Type/ Temperature DReflective, N.T, 12:00
KTransflective, W.T,12:00
range/ View
GReflective, W. T, 6:00
CTransmissive, N.T,6:00
direction
JReflective, W. T, 12:00
FTransmissive, N.T,12:00
BTransflective, N.T,6:00
ITransmissive, W. T, 6:00
ETransflective, N.T.12:00 LTransmissive, W.T,12:00
Special Code
JT : English and Japanese standard font ;
# : LEAD-FREE;

Page 4 of 29

2.Precautions in use of LCD Modules

(1)Avoid applying excessive shocks to the module or making any alterations or modifications to it.
(2)Dont make extra holes on the printed circuit board, modify its shape or change the components of
LCD module.
(3)Dont disassemble the LCM.
(4)Dont operate it above the absolute maximum rating.
(5)Dont drop, bend or twist LCM.
(6)Soldering: only to the I/O terminals.
(7)Storage: please storage in anti-static electricity container and clean environment.
(8) Winstar have the right to change the passive components, including R3,R6 & backlight adjust
resistors. (Resistors,capacitors and other passive components will have different appearance and
color caused by the different supplier.)
(9)Winstar have the right to change the PCB Rev. (In order to satisfy the supplying stability,
management optimization and the best product performance...etc, under the premise of not affecting
the electrical characteristics and external dimensions, Winstar have the right to modify the version.)

3.General Specification
Item

Dimension

Unit

16 characters x 1 Lines

80.0 x 36.0 x 13.2(MAX)

mm

View area

66.0 x 16.0

mm

Active area

59.62 x 6.56

mm

Dot size

0.55 x 0.75

mm

Dot pitch

0.63 x 0.83

mm

Character size

3.07 x 6.56

mm

Character pitch

3.77 x 6.56

mm

Number of Characters
Module dimension

LCD type

STN, Positive, Transflective , Yellow Green

(In LCD production, It will occur slightly color difference. We
can only guarantee the same color in the same batch.)

Duty

1/16

View direction

6 oclock

Backlight Type

LED Yellow Green

Page 5 of 29

4.Absolute Maximum Ratings

Item

Symbol

Min

Typ

Max

Unit

Operating Temperature

TOP

-20

+70

Storage Temperature

TST

-30

+80

Input Voltage

VI

VSS

VDD

Supply Voltage For Logic

VDD-VSS

-0.3

Supply Voltage For LCD

VDD-V0

-0.3

13

5.Electrical Characteristics
Item
Supply Voltage For Logic

Symbol

Condition

Min

Typ

Max

Unit

VDD-VSS

4.5

5.0

5.5

Ta=-20

5.6

Ta=25

4.5

Ta=70

3.7

Supply Voltage For LCD

VDD-V0

*Note

Input High Volt.

VIH

0.7 VDD

VDD

Input Low Volt.

VIL

VSS

0.6

Output High Volt.

VOH

3.9

Output Low Volt.

VOL

0.4

Supply Current

IDD

VDD=5V

1.0

1.2

1.5

mA

* Note: Please design the VOP adjustment circuit on customer's main board

d d

S S

L C M
V
1 0 K

R
M

~ 2 0 K

o d u le

Page 6 of 29

6.Optical Characteristics
Item

Symbol

Condition

Min

Typ

Max

Unit

(V)

CR2

20

40

deg

(H)

CR2

-30

30

deg

CR

T rise

150

200

ms

T fall

150

200

ms

View Angle
Contrast Ratio
Response Time

Definition of Operation Voltage (Vop)

Definition of Response Time ( Tr , Tf )

N o n - s e le c te d

S e le c te d

I n te n s ity

1 0 0

N o n - s e le c te d
S e le c te d

C o n itio n

a v e

N o n - s e le c te d

a v e

C o n itio n

C o n itio n

I n t e n s i t y

1 0

C r M

a x
C r =

L o n

/ L o f f

9 0
1 0 0

V o p
D r iv in g

[ p o s itiv e

T r

V o lta g e ( V )

T f

ty p e ]

[ p o s itiv e

ty p e ]

Conditions :
Operating Voltage : Vop

Viewing Angle() : 0 0

Frame Frequency : 64 HZ

Driving Waveform : 1/N duty , 1/a bias

Definition of viewing angle(CR2)

Page 7 of 29

7.Interface Pin Function

Pin No. Symbol

Level

Description

VSS

0V

Ground

VDD

5.0V

VO

RS

H/L

H: DATA, L: Instruction code

R/W

H/L

H: Read(MPUModule) L: Write(MPUModule)

H,HL

DB0

H/L

Data bit 0

DB1

H/L

Data bit 1

DB2

H/L

Data bit 2

10

DB3

H/L

Data bit 3

11

DB4

H/L

Data bit 4

12

DB5

H/L

Data bit 5

13

DB6

H/L

Data bit 6

14

DB7

H/L

Data bit 7

15

LED +

16

LED

Supply Voltage for logic

(Variable) Operating voltage for LCD

Chip enable signal

Page 8 of 29

8.Contour Drawing &Block Diagram

8 0 .0
4 .4

6 6 .0 ( V A )
A )

2 .4 5

2 .0

1 6 -

1 5 .4 6

P 2 .5 4 * 1 5 = 3 8 .1
2 .0

1 4 .7 2

5 .4

8 .0

1 .0

s s

d d

R S

R /W

a x

2 .5

5 9 .6 2 ( A

1 0 .1 9

1 1 .4 6

7 .0

1 0 .0

0 .5

7 1 .2

H 2

1 6

B 0

B 1

6 .5 6 ( A A )

5 .0 8

2 .5

4 -

2 . 5

4 -

5 .0

3 1 .0

1 3 .0 8

P T H

1 .6

P A D

4 -

1 .0

P T H
L E D

7 5 .0

B /L

ig h

H 1

1 3 .2

H 2

8 .6

B 2

1 0

B 3

1 1

B 4

1 2

B 5

1 3

B 6

1 4

B 7

1 5

1 6

3 .7 7
3 .0 7
0 .6 3
0 .5 5

n o n - s p e c if ie d

0 .7 5

0 .8 3

T h e

6 .5 6

1 6 .0 ( V A )

2 5 .2

3 6 .0

0 .5

S I Z E

Page 9 of 29

R S

C o m

1 ~ 8

to le r a n c e

o f

d im

e n s io n

is

0 .3 m

R S
C o n tr o lle r /C o m

R /W

C o m

1 ~ 8

C o m

9 ~ 1 6

D r iv e r

P U
E

H
D

d d

V o
1 0 K ~ 2 0 K
V s s

E x te r n a l c o n tr a s t a d ju s tm

R A

S e g 1 ~ 4 0

e n t.

C h a r a c te r
D

C ir c u it

E q u iv a le n t

a n d

s e r ie s

1 6 X

o r

B 7

e r

6 8

B 0 ~ D

4 4 7 8 0

P o w

s e r ie s
o r

B ia s

8 0

lo c a te d

1 0

1 1

1 2

1 3

1 4

1 5

1 6

a d d r e s s

0 0

0 1

0 2

0 3

0 4

0 5

0 6

0 7

4 0

4 1

4 2

4 3

4 4

4 5

4 6

4 7

o d e .

2 - lin e

d is p la y

Page 10 of 29

L C D

9.Function Description
The LCD display Module is built in a LSI controller, the controller has two 8-bit registers, an
instruction register (IR) and a data register (DR).
The IR stores instruction codes, such as display clear and cursor shift, and address information for
display data RAM (DDRAM) and character generator (CGRAM). The IR can only be written from
the MPU. The DR temporarily stores data to be written or read from DDRAM or CGRAM. When
address information is written into the IR, then data is stored into the DR from DDRAM or CGRAM.
By the register selector (RS) signal, these two registers can be selected.
RS

R/W

Operation

IR write as an internal operation (display clear, etc.)

Read busy flag (DB7) and address counter (DB0 to DB7)

Write data to DDRAM or CGRAM (DR to DDRAM or CGRAM)

Read data from DDRAM or CGRAM (DDRAM or CGRAM to DR)

Busy Flag (BF)

When the busy flag is 1, the controller LSI is in the internal operation mode, and the next instruction
will not be accepted. When RS=0 and R/W=1, the busy flag is output to DB7. The next instruction
must be written after ensuring that the busy flag is 0.
Address Counter (AC)
The address counter (AC) assigns addresses to both DDRAM and CGRAM
Display Data RAM (DDRAM)
This DDRAM is used to store the display data represented in 8-bit character codes. Its extended
capacity is 808 bits or 80 characters. Below figure is the relationships between DDRAM addresses
and positions on the liquid crystal display.
High bits

Low bits
Example: DDRAM addresses 4E

AC
(hexadecimal)

AC6 AC5 AC4 AC3 AC2 AC1 AC0

Page 11 of 29

Display position DDRAM address

1 2

9 10 11 12 13 14 15

00 01 02

03

04 05 06 07 40 41 42
2-Line display mode

43

44

45 46

16
47

Character Generator ROM (CGROM)

The CGROM generate 58 dot or 510 dot character patterns from 8-bit character codes. See Table 2.
Character Generator RAM (CGRAM)
In CGRAM, the user can rewrite character by program. For 58 dots, eight character patterns can be
written, and for 510 dots, four character patterns can be written.
Write into DDRAM the character code at the addresses shown as the left column of table 1. To show
the character patterns stored in CGRAM.

Page 12 of 29

Relationship between CGRAM Addresses, Character Codes (DDRAM) and Character patterns
Table 1.
F

o r

d o t

c h a r a c t e r

h a r a c t e r

p a t t e r n s

o d e s
C

i g h

d a t a

o w

i g h

h a r a c t e r

a t t e r n s

d d r e s s

o w

d a t a

i g h

o w

o r

1 0

d o t

i g h

"

i g h

p a t t e r n (

u r s o r

p a t t e r n

h a r a c t e r

p a t t e r n (

u r s o r

p a t t e r n

p a t t e r n s

o w

i g h

h a r a c t e r

a t t e r n s

d d r e s s

o d e s
d a t a

C
(

c h a r a c t e r

h a r a c t e r

h a r a c t e r

o w

d a t a

i g h

o w

p a t t e r n

"

Page 13 of 29

h a r a c t e r

u r s o r

p a t t e r n

10.Character Generator ROM Pattern

Table.2
U

p p e r
4

L o w
4

b i t

L L L L

e r

L L L H

L L H

L L H

L H

L L

L H

L H

L H

L H

L L L

b i t

L L L H

L L H

L L H

L H

L L

L H

L H

L H

L H

L L L L

L L L

L L H

L H

L H

L L

L H

Page 14 of 29

L L H

L H

L H

L L

L H

11.Instruction Table
Instruction Code
Instruction

Description
RS

Execution time
(fosc=270Khz)

R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0

Write "20H" to DDRAM. and

Clear Display

set DDRAM address to

1.52ms

"00H" from AC

Return Home

Entry Mode
Set
Display
ON/OFF
Control

I/D

SH

Set DDRAM address to 00H from

AC and return cursor to its original
position if shifted. The contents of
DDRAM are not changed.
Sets cursor move direction and
specifies display shift.
These operations are performed during
data write and read.

1.52ms

37s

D=1:entire display on
0

37s

C=1:cursor on
B=1:cursor position on
Set cursor moving and

Cursor or
Display Shift

S/C

R/L

display shift control bit, and

37s

the direction, without changing

DDRAM data.
DL:interface data is 8/4 bits

Function Set

DL

37s

N:number of line is 2/1

F:font size is 5x11/5x8

Set CGRAM
Address

Set DDRAM
Address

Read Busy
Flag and
Address

AC5 AC4 AC3 AC2 AC1 AC0

AC6 AC5 AC4 AC3 AC2 AC1 AC0

Set CGRAM address in

address counter
Set DDRAM address in
address counter

37s
37s

Whether during internal

0

BF

AC6 AC5 AC4 AC3 AC2 AC1 AC0 operation or not can be known by
reading BF. The contents of address
counter can also be read.

0s

Write data into internal

Write Data to
RAM

D7

D6

D5

D4

D3

D2

D1

D0 RAM
(DDRAM/CGRAM)

Read Data
from RAM

D7

D6

D5

D4

D3

D2

D1

D0 RAM
(DDRAM/CGRAM)

37s

Read data from internal

37s

dont care

Page 15 of 29

12.Timing Characteristics
12.1

Writing data from MPU to ST7066U

Ta=-30~+85, VDD=5.0 0.5V

TC

Enable Cycle Time

Pin E

1200

ns

TPW

Enable Pulse Width

Pin E

140

ns

TR,TF

Enable Rise/Fall Time

Pin E

25

ns

TAS

Address Setup Time

Pins: RS,RW,E

ns

TAH

Address Hold Time

Pins: RS,RW,E

10

ns

TDSW

Data Setup Time

Pins: DB0 - DB7

40

ns

TH

Data Hold Time

Pins: DB0 - DB7

10

ns

Page 16 of 29

12.2Reading data from ST7066U to MPU

Ta=-30~+85, VDD=5.0 0.5V

Read Mode

(Reading Data from ST7066U to MPU)

TC

Enable Cycle Time

Pin E

1200

ns

TPW

Enable Pulse Width

Pin E

140

ns

TR,TF

Enable Rise/Fall Time

Pin E

25

ns

TAS

Address Setup Time

Pins: RS,RW,E

ns

TAH

Address Hold Time

Pins: RS,RW,E

10

ns

TDDR

Data Setup Time

Pins: DB0 - DB7

100

ns

TH

Data Hold Time

Pins: DB0 - DB7

10

ns

Page 17 of 29

13.Initializing of LCM

Page 18 of 29

Page 19 of 29

14.Reliability
Content of Reliability Test (wide temperature, -20~70)
Environmental Test
Test Item
High Temperature
storage
Low Temperature
storage
High Temperature
Operation
Low Temperature
Operation
High Temperature/
Humidity Operation

Thermal shock
resistance

Content of Test
Endurance test applying the high storage temperature
for a long time.
Endurance test applying the high storage temperature
for a long time.
Endurance test applying the electric stress (Voltage &
Current) and the thermal stress to the element for a
long time.
Endurance test applying the electric stress under low
temperature for a long time.
The module should be allowed to stand at 60
,90%RH max
For 96hrs under no-load condition excluding the
polarizer,
Then taking it out and drying it at normal temperature.
The sample should be allowed stand the following 10
cycles of
operation
-20
25
70

30min

5min
1 cycle

Test Condition
80
200hrs
-30
200hrs

Note

70
200hrs

-20
200hrs

60,90%RH
96hrs

1,2

-20/70
10 cycles

Total fixed
amplitude : 15mm
Vibration
Frequency :
10~55Hz
One cycle 60 seconds
to 3 directions of
X,Y,Z for
Each 15 minutes

2
1,2

30min

Vibration test

Endurance test applying the vibration during

transportation and using.

Static electricity test

Endurance test applying the electric stress to the

terminal.

VS=800V,RS=1.5k

CS=100pF
1 time

Note1: No dew condensation to be observed.

Note2: The function test shall be conducted after 4 hours storage at the normal
Temperature and humidity after remove from the test chamber.
Note3: Vibration test will be conducted to the product itself without putting it in a container.

Page 20 of 29

15.Backlight Information
Specification
PARAMETER

SYMBOL MIN

TYP

MAX

UNIT

TEST

Supply Current

ILED

100

130

190

mA

V=4.2V

Supply Voltage

4.0

4.2

4.4

Reverse Voltage

VR

IV

135

195

CD/M2 ILED=130mA

Wave Length

565

575

585

nm

ILED=130mA

Life Time

100000

Hr.

ILED130mA

Color

Yellow Green

Luminous
Intensity

CONDITION

Note: The LED of B/L is drive by current only, drive voltage is for reference only.
drive voltage can make driving current under safety area (current between
minimum and maximum).

p in 1 5

r iv e

f r o m

p in 1 5 ,p in 1 6

R
A
B /L
K

p in 1 6

L C M

Page 21 of 29

16. Inspection specification

NO

01

02

Item

Criterion

AQL

Electrical
Testing

1.1 Missing vertical, horizontal segment, segment contrast defect.

1.2 Missing character , dot or icon.
1.3 Display malfunction.
1.4 No function or no display.
1.5 Current consumption exceeds product specifications.
1.6 LCD viewing angle defect.
1.7 Mixed product types.
1.8 Contrast defect.

0.65

Black or white 2.1 White and black spots on display 0.25mm, no more than
spots on LCD
three white or black spots present.
(display only) 2.2 Densely spaced: No more than two spots or lines within 3mm

3.1 Round type : As following drawing

=( x + y ) / 2
SIZE
0.10

03

04

LCD black
spots, white
spots,
contamination
(non-display)

Polarizer
bubbles

If bubbles are visible,

judge using black spot
specifications, not easy
to find, must check in
specify direction.

Acceptable Q TY
Accept no dense

0.100.20
0.200.25

2
1

0.25

3.2 Line type : (As following drawing)

Length
Width
--W0.02
L3.0 0.02W0.03
L2.5 0.03W0.05
--0.05W
Size

2.5

Acceptable Q TY
Accept no dense
2.5
2
As round type
Acceptable Q TY

0.20
0.200.50
0.501.00

Accept no dense
3
2

1.00
Total Q TY

0
3

Page 22 of 29

2.5

2.5

NO

Item

05

Scratches

Criterion

AQL

Follow NO.3 LCD black spots, white spots, contamination

Symbols Define:
x: Chip length
y: Chip width
z: Chip thickness
k: Seal width
t: Glass thickness a: LCD side length
L: Electrode pad length:
6.1 General glass chip :
6.1.1 Chip on panel surface and crack between panels:

06

Chipped
glass

z: Chip thickness

y: Chip width

x: Chip length

Z1/2t

Not over viewing area

x1/8a

1/2tz2t

Not exceed 1/3k

x1/8a

If there are 2 or more chips, x is total length of each chip.

6.1.2 Corner crack:

z: Chip thickness

y: Chip width

x: Chip length

Z1/2t

Not over viewing area

x1/8a

1/2tz2t

Not exceed 1/3k

x1/8a

If there are 2 or more chips, x is the total length of each chip.

Page 23 of 29

2.5

NO

Item

Criterion

AQL

Symbols :
x: Chip length
y: Chip width
z: Chip thickness
k: Seal width
t: Glass thickness a: LCD side length
L: Electrode pad length
6.2 Protrusion over terminal :
6.2.1 Chip on electrode pad :

y: Chip width

x: Chip length

z: Chip thickness

y0.5mm

x1/8a

0 zt

6.2.2 Non-conductive portion:

06

Glass
crack

2.5

y: Chip width

x: Chip length

z: Chip thickness

y L

x1/8a

0 zt

If the chipped area touches the ITO terminal, over 2/3 of the ITO must
remain and be inspected according to electrode terminal specifications.
If the product will be heat sealed by the customer, the alignment mark
not be damaged.
6.2.3 Substrate protuberance and internal crack.
y: width

x: length

y1/3L

xa

Page 24 of 29

NO

Item

07

Cracked glass

08

09

10

Backlight
elements

Bezel

PCBCOB

Criterion

AQL

The LCD with extensive crack is not acceptable.

2.5

8.1 Illumination source flickers when lit.

8.2 Spots or scratched that appear when lit must be judged. Using
LCD spot, lines and contamination standards.
8.3 Backlight doesnt light or color wrong.

0.65
2.5

9.1 Bezel may not have rust, be deformed or have fingerprints, stains
or other contamination.
9.2 Bezel must comply with job specifications.

10.1 COB seal may not have pinholes larger than 0.2mm or
contamination.
10.2 COB seal surface may not have pinholes through to the IC.
10.3 The height of the COB should not exceed the height indicated
in the assembly diagram.
10.4 There may not be more than 2mm of sealant outside the seal
area on the PCB. And there should be no more than three
places.
10.5 No oxidation or contamination PCB terminals.
10.6 Parts on PCB must be the same as on the production
characteristic chart. There should be no wrong parts, missing
parts or excess parts.
10.7 The jumper on the PCB should conform to the product
characteristic chart.
10.8 If solder gets on bezel tab pads, LED pad, zebra pad or screw
hold pad, make sure it is smoothed down.
10.9 The Scraping testing standard for Copper Coating of PCB

0.65

2.5
0.65

2.5
2.5
0.65
2.5

2.5
0.65

0.65
2.5
2.5

X
Y

11

Soldering

X * Y<=2mm2

11.1 No un-melted solder paste may be present on the PCB.

11.2 No cold solder joints, missing solder connections, oxidation or
icicle.
11.3 No residue or solder balls on PCB.
11.4 No short circuits in components on PCB.

Page 25 of 29

2.5
2.5
2.5
0.65

NO

12

Item

General
appearance

Criterion
12.1 No oxidation, contamination, curves or, bends on interface Pin
(OLB) of TCP.
12.2 No cracks on interface pin (OLB) of TCP.
12.3 No contamination, solder residue or solder balls on product.
12.4 The IC on the TCP may not be damaged, circuits.
12.5 The uppermost edge of the protective strip on the interface pin
must be present or look as if it cause the interface pin to sever.
12.6 The residual rosin or tin oil of soldering (component or chip
component) is not burned into brown or black color.
12.7 Sealant on top of the ITO circuit has not hardened.
12.8 Pin type must match type in specification sheet.
12.9 LCD pin loose or missing pins.
12.10 Product packaging must the same as specified on packaging
specification sheet.
12.11 Product dimension and structure must conform to product
specification sheet.

Page 26 of 29

AQL
2.5
0.65
2.5
2.5
2.5
2.5
2.5
0.65
0.65
0.65
0.65

17. Material List of Components for

RoHs
1. WINSTAR Display Co., Ltd hereby declares that all of or part of products (with the mark
#in code), including, but not limited to, the LCM, accessories or packages, manufactured
and/or delivered to your company (including your subsidiaries and affiliated company)
directly or indirectly by our company (including our subsidiaries or affiliated companies) do
not intentionally contain any of the substances listed in all applicable EU directives and
regulations, including the following substances.
Exhibit AThe Harmful Material List
.

Material

(Cd)

(Pb)

(Hg)

(Cr6+)

PBBs

PBDEs

Limited
Value

100
ppm

1000
ppm

1000
ppm

1000
ppm

1000
ppm

1000
ppm

Above limited value is set up according to RoHS.

2.Process for RoHS requirement
(1) Use the Sn/Ag/Cu soldering surfacethe surface of Pb-free solder is rougher than we used before.
(2) Heat-resistance temp.
Reflow250,30 seconds Max.
Connector soldering wave or hand soldering320, 10 seconds max.
(3) Temp. curve of reflow, max. Temp.2355
Recommended customers soldering temp. of connector280, 3 seconds.

18. Recommendable storage

1.
2.
3.

Place the panel or module in the temperature 25C5C and the humidity below 65% RH
Do not place the module near organics solvents or corrosive gases.
Do not crush, shake, or jolt the module

Page 27 of 29

winstar
LCM Sample Estimate Feedback Sheet
Module Number

Page: 1

1Panel Specification
1. Panel Type

Pass

NG ,

2. View Direction

Pass

NG ,

3. Numbers of Dots

Pass

NG ,

4. View Area

Pass

NG ,

5. Active Area

Pass

NG ,

6. Operating Temperature

Pass

NG ,

7. Storage Temperature

Pass

NG ,

1. PCB Size

Pass

NG ,

2. Frame Size

Pass

NG ,

3. Materal of Frame

Pass

NG ,

4. Connector Position

Pass

NG ,

5. Fix Hole Position

Pass

NG ,

6. Backlight Position

Pass

NG ,

7. Thickness of PCB

Pass

NG ,

8. Height of Frame to PCB Pass

NG ,

9. Height of Module

Pass

NG ,

10. Others

Pass

NG ,

1. Pitch of Connector

Pass

NG ,

2. Hole size of Connector

Pass

NG ,

3. Mounting Hole size

Pass

NG ,

4. Mounting Hole Type

Pass

NG ,

5. Others

Pass

NG ,

1. B/L Type

Pass

NG ,

2. B/L Color

Pass

NG ,

8. Others

2Mechanical Specification

3Relative Hole Size

4Backlight Specification

3. B/L Driving Voltage (Reference for LED Type) Pass

4. B/L Driving Current

Pass

NG ,

5. Brightness of B/L

Pass

NG ,

6. B/L Solder Method

Pass

NG ,

7. Others

Pass

NG ,

Go to page 2
Page 28 of 29

NG ,

winstar
Module Number

Page: 2

5Electronic Characteristics of Module

1. Input Voltage

Pass

NG ,

2. Supply Current

Pass

NG ,

3. Driving Voltage for LCD

Pass

NG ,

4. Contrast for LCD

Pass

NG ,

5. B/L Driving Method

Pass

NG ,

6. Negative Voltage Output

Pass

NG ,

7. Interface Function

Pass

NG ,

8. LCD Uniformity

Pass

NG ,

9. ESD test

Pass

NG ,

Pass

NG ,

10. Others

6Summary

Sales signature
Customer Signature

Date

Page 29 of 29