Sheet No.
: EN Troubleshooting Guide
Revision: 04/30/04T-626
IMDS ID No.: Not Relevant
Technical Information
Electroless Nickel
Troubleshooting Guide
Subject
General Troubleshooting Guidelines
Discussion of Impurities in EN Plating Solutions
Critical Contaminant Levels in EN Plating Solutions
Specific EN Plating Problems:
Low Deposition Rate
No Deposition (New EN Solution Will Not Plate)
Pitted Deposits
Rough Deposits
Porous Deposits
Non-Uniform Deposits
Blistering (Ferrous & Non-Ferrous Metals)
Poor Adhesion
Streaky or Patterned Deposits
Skip Plating
Turbid or Milky Appearing Solution
Deposition on Tank Walls and/or Equipment
Rapid Solution pH Change
Test Procedures
Metric Conversion Tables
Temperature Conversion Tables
Page
2
3-5
6
7
8
8
9
10
10
10
11
11
12
12
13
13
14
15-16
17
Important Notice Regarding the Attached Information:
The statements, technical information and recommendations contained in this document are based on tests and data that are believed to be reliable. Further, as the actual use of
our products by others is beyond our control, no guarantee of any kind is made as to the effects of such use, or the results to be obtained, whether the use is made in accordance
with the recommendations or suggestions contained herein or otherwise. This document is not contractual and NOTHING HEREIN CONSTITUTES A REPRESENTATION OR
WARRANTY THAT THE GOODS DESCRIBED ARE FIT FOR A PARTICULAR PURPOSE OF A CUSTOMER or that their use does not conflict with any existing patent rights. The
exclusive source of any warranty and of any other customer rights whatsoever is on the Atotech invoice. Also, since this data sheet may be provided by electronic media, Atotech
cannot guarantee the accuracy or originality hereof. Any alterations made to this document other than by Atotech corporate headquarters is expressly prohibited.
Atotech USA Inc. 1750 Overview Drive, Rock Hill, SC 29730
Telephone: 803-817-3500 Fax: 803-817-3666
Electroless Nickel Troubleshooting Guide
PAGE 2
GENERAL TROUBLESHOOTING GUIDELINES
Areas to Investigate
! Substrate - Nature and Condition
! Substrate Preparation - Cleaners, Acid Dips, Rinsing
! Operator Handling - Movement of Parts Down the Production Line
! Electroless Nickel Bath - Chemistry, Maintenance, Control
! Post-Treatment Steps - Passivates, Heat Hardening, Baking
Methodology
! What is the Problem?
Deposit Roughness, Pitting, Edge Skip, Premature Corrosion
! Where Does the Problem Occur and Not Occur?
Some Substrates, All Substrates,
Some Parts (which ones) or All Parts
From Some Tanks or All Tanks
! When Does the Problem Occur and Not Occur?
All of the Time, Some of the Time
! When Did the Problem First Start?
With a New EN Bath, With a New Job, With a New Pre-treatment Cycle
! How Does the Defect Appear?
Pattern, Random, Hit or Miss
! Look for Differences
What is the Difference between Parts Showing the Problem and Those That Do Not?
! Look for Patterns or Changes That Might Have Been Made
Do They Correlate With the Time That the Problem Started?
! Seek Out A Logical Cause of the Problem
Arrive at a True Solution (Not a Band-Aid) to the Problem
Electroless Nickel Troubleshooting Guide
PAGE 3
EFFECTS OF IMPURITIES ON ELECTROLESS NICKEL PLATING SOLUTIONS
There are many different sources of contamination of electroless nickel solutions. Dissolved metals, organic
compounds, anions and silicon compounds can all adversely affect the operation of the plating solution and the
deposit it produces. The level at which an individual compound becomes a problem depends upon the
compound and may be synergistic with other contaminants in the bath. The following discussion describes the
effect of different contaminants and establishes limits for their presence in an electroless nickel bath.
Metallic Contamination
Metals can be grouped into two categories - those that stabilize or inhibit the electroless nickel reaction and
those that catalyze it. Most metals are stabilizers, tend to reduce the plating rate of the bath, and may cause
skip-plating, edge-pullback, or no plating at all. Metals such as cadmium and lead are especially detrimental
even at very low concentrations. Their effects can sometimes be overcome by raising the activity of the bath by
increasing temperature, concentration and/or pH. Increasing the load factor can also help overcome this type of
contamination, especially with borderline levels of metals.
Catalyzing contaminants, like palladium and platinum, cause electroless nickel solutions to become unstable
and decompose. This type of contaminant is normally introduced into the bath by using racks or barrels that
previously had been used for precious metal plating, or through drag-in of catalysts from plating-on- plastics
operations. Unfortunately, there is no method to remove these metals and the solution must be discarded.
Organic Contamination
Organic contamination usually appears as fine pitting on all the surfaces of the part. Because there are many
potential sources, the cause of organic contamination is often difficult to establish. In addition, it is usually not
possible to analyze an electroless nickel bath to identify the specific organic that is present. However, some of
the more common sources of organic contamination are solvents from improperly cured stop-offs, oils and
grease left on the part (or in pores or holes), drippage of lubricant from equipment, and organic compounds
present in water sources that are not removed by the deionizing system.
Once an electroless nickel solution has been contaminated with an organic compound, it often cannot be
cleaned up. While carbon filtration can sometimes be used to remove solvents and oils from electrolytic nickel
plating baths, this method is not practical for electroless solutions. Because of this, contaminated baths are
often dumped.
Anionic Contamination
Certain anions, especially sulfides, can cause dark, porous deposits when present in electroless nickel baths.
They also tend to stabilize and slow down the bath. Sulfides also depress the phosphorus content of an
electroless nickel coating and increase its internal stress. Some sources of this contamination include sulfides
in steel, dry film lubricants, sulfide containing greases, and ground water contamination.
Nitrates, when present in concentrations greater than a few ppm, can cause streaky, discolored deposits, slow
plating rates or no plating. This type of contamination most commonly occurs when electroless nickel tanks are
improperly rinsed and neutralized after nitric acid passivation. Nitrate contamination of water used to rinse
tanks after nitric acid passivation can easily be detected with nitrate test papers. If a positive result is obtained
to this test, rinsing should be repeated until no signs of nitrate are seen.
Electroless Nickel Troubleshooting Guide
PAGE 4
Chlorides
The presence of chlorides in an electroless nickel solution usually results in increased porosity and reduced
corrosion resistance of the deposited coating. Their presence can also lead to etching and corrosion of
anodically protected stainless steel tanks. Chlorides are generally introduced into the bath by drag-in of
hydrochloric acid from the pre-treatment line. Whatever the source and cause of anion contamination, once
they are present, they can be very difficult to remove. Thus, baths contaminated with anions are generally
discarded.
Orthophosphite
The build-up of orthophosphite in an electroless nickel solution is inevitable. It is the reaction product formed
when hypophosphite reduces nickel. For each gram of nickel reduced, about 4 grams of orthophosphite are
produced. When its concentration exceeds 100-150 g/l, orthophosphite tends to be co-deposited in the coating
and degrade its performance. Coatings deposited from baths containing excessive orthophosphite typically
exhibit high tensile stress, increased porosity and exhibit greatly reduced corrosion resistance. The presence of
excessive orthophosphite also tends to reduce plating rate and can cause the bath to white-out.
Silicon Compounds
The presence of some types of silicon compounds can cause instability in an electroless nickel solution and
produce rough deposits. Typically, this results from those silicon compounds, such as colloidal silica, that are
not soluble in the solution. Soluble compounds such as sodium silicate seem to have a minimal effect upon the
bath and its deposit. Silicon contamination is most commonly introduced into the bath as airborne particles of
dust or sand, as cleaner residues left on the part, or from improperly filtered deionized water. Colloidal silica,
which is often present in groundwater, can be as small as 0.25 m in diameter. Accordingly, the filters used in a
deionized water system must be adequately sized and properly maintained.
Contamination Levels
Some common contaminants of electroless nickel solutions and their critical concentrations are shown in the
following table. These levels are only guidelines. Their effect can vary depending upon bath formulation and
operation. The level at which most contaminants become a problem is dependent upon such factors as bath
loading, the nature of the substrate being plated and the activity of the solution (pH, temperature and
concentration). In addition, many contaminants have a synergistic effect and together may produce problems at
lower concentration levels than they would individually.
Bismuth, when present by itself, stabilizes electroless nickel solutions and can reduce plating rate and produce
skip plating. When antimony is also present, bismuth causes the coating's internal stress to become highly
tensile.
Tin at low concentrations, especially when introduced into electroless nickel solutions as a lubricant
component, can cause severe instability of electroless nickel solutions. At high concentrations, tin typically acts
as a stabilizer.
The performance of zinc contaminated electroless nickel solutions is dependent upon the loading factor of the
bath. Bulk plating facilities with large ratios can tolerate high levels of zinc without effect. Facilities with low bath
loading may experience problems at lower contaminant levels.
Electroless Nickel Troubleshooting Guide
PAGE 5
Silicon compound may be introduced into electroless nickel solutions in many different forms, as silica,
silicates, silicones, etc. Analysis to determine which form is present can be difficult. Common analytical
techniques probably measure only a small part of the total silicon present.
Every contaminant present in an electroless nickel solution changes the properties of the deposit obtained.
Engineering properties, such as corrosion resistance, can be greatly degraded. Solutions contaminated at
levels where operating characteristics are normal may still produce inferior deposits. Thus, it is good practice to
eliminate the source of a contaminant rather than keeping contamination levels within acceptable limits.
Electroless Nickel Troubleshooting Guide
PAGE 6
CRITICAL CONTAMINANT LEVELS IN EN PLATING SOLUTIONS
Contaminant
Aluminum
Bismuth
Bismuth (with Sb)
Cadmium*
Chromium
Copper
Iron
Problem Level
>150 ppm
1-3 ppm
>3 ppm
1-3 ppm
1 ppm
1-2 ppm
Symptom
Reduced rate
Reduced rate
Skip plating
High Stress
No plating
Skip plating
Reduced rate
Skip plating
Copper deposits
Remedy
Discard
Increase activity or discard
Discard
Increase activity or discard
Increase activity or discard
Increase activity
Palladium
1 ppm
Reduced rate
Dark deposit
Reduced rate
No plating
Skip plating
Reduced rate
Skip plating
Decomposition
Platinum
1-3 ppm
Decomposition
Discard
Tin
1-3 ppm
Instability
Discard
>75 ppm
Lead*
2-5 ppm
Manganese
Tin
Titanium
Zinc
Organics
Sulfides
Nitrates
Chlorides
Not determined
3-10 ppm
Not determined
>15 ppm
Not determined
>1 ppm
> 50-75 ppm
Not determined
Orthophosphite
> 150-250 g/l
Silicon
Compounds
>6 ppm
Dull deposit
Reduced rate
Reduced rate
Skip plating
Reduced rate
Dark deposit
Fine pitting
Reduced rate
Dark deposit
Dark deposit
Streaky deposit
Porous deposits
White out
Stressed deposits
Porous Deposits
Roughness
Instability
Increase activity or discard
Increase activity or discard
Increase activity or discard
Discard
Increase activity or discard
Increase activity or discard
Increase activity or discard
Discard
Discard
Remove or discard
Discard
Discard
Discard
* NOTE: Heavy metals such as Cd and Pb are typically used in trace quantities as brightening and stabilizing
additives in most proprietary electroless nickel baths.
Electroless Nickel Troubleshooting Guide
PAGE 7
SPECIFIC EN PLATING PROBLEMS
Low Deposition Rate
Possible Causes
Corrective Action
Low nickel content
Analyze and adjust, as required
Low hypophosphite content
Analyze and adjust, as required
Low pH
Adjust to within recommended range
Low bath temperature
Increase to within recommended range
Bath is over-stabilized
Remove, if possible (by dummying using steel wool)
Nitrate contamination
Dump bath and remake
Identify source of contamination and eliminate
Low bath loading
Increase workload in bath
Add NICHEM Accelerator at daily start-up (mid-phos baths
only)
Excessive agitation
Reduce agitation
Solution is old and due for
replacement
Solution contamination (metallic or
organic)
Make up a new bath
Keep accurate records to determine life of bath.
Identify source and eliminate
Avoid using racks, baskets, and barrels which have been used
for other processes (e.g. Cd, Pb, Zn or Sn)
Contaminated rinses
Drag-in from pre-treatment solutions
Poor quality water used for make-up and rinsing of parts
Contaminated air used for agitation
Make up a new bath, if necessary
Electroless Nickel Troubleshooting Guide
PAGE 8
No Deposition (New EN Solution Will Not Plate)
Possible Causes
Corrective Action
Low bath temperature
Adjust to within recommended range
Low pH
Adjust to within recommended range
Low nickel content
Analyze and adjust, as required
Low hypophosphite content
Analyze and adjust, as required
Nitrate contamination
Dump bath and remake
Identify source of contamination and eliminate
Parts are non-catalytic
Copper, brass, etc. are not catalytic and require initiating
Solution contamination
Identify source and eliminate
Avoid using racks, baskets, and barrels which have been used
for other processes, e.g. Cd, Pb, Zn or Sn
Contaminated rinses
Drag-in from pre-treatment solutions
Poor quality water
Contaminated air used for agitation
Make up new bath, if necessary
Pitted Deposits
Possible Cause
Corrective Action
Organic contamination from filter
cartridges (wound polypropylene,
etc.)
Use pre-washed cartridges to remove harmful anti-static
spinning agents.
Drag-in of surfactants from cleaners
and wetted acids
Improve cleaning and rinsing
Do not use inhibitors in acid dips
Contamination from plastic in nonapproved pumps, piping, tank linings
(e.g., PVC, etc.)
Only use approved materials for EN installations
Bad or improper cleaning and
activation
Use approved EN cleaners and acid dips
Poor substrate condition
Discuss with customer and materials supplier
Poor filtration
Improve filtration
Electroless Nickel Troubleshooting Guide
PAGE 9
Rough Deposits
Possible Cause
Corrective Action
Poor filtration
Filter bath at 10 times per hour through a 1-5 m filter
Insufficient agitation
Increase airflow or use work movement
Roughness on upward facing (shelf)
surfaces
Re-rack work so affected surfaces do not face upward
Bath contamination from airborne
particles
Trace source of dirt and eliminate
Cover tank when not in use
Overactive electroless bath
Lower deposition rate
Residual magnetism in the work
Demagnetize parts prior to deposition
Stray electrical currents
Identify source and eliminate
Make-up pre-mixes added too quickly
Modify procedure so additions are made more slowly
Make-up pre-mixes impinge directly
on the work or heaters
Distribute pre-mixes evenly over the bath surface
Holes in PTFE heating coils
Check heat exchangers
Poor pre-treatment of the work
Check pre-treatment cycle, and keep rinse tanks clean
Incorrect tank materials
Check plastic or stainless for impurities, replace if necessary
Contamination dripping into the bath
Locate source and eliminate
Contamination from uncoated racks
Locate source and eliminate
Stabilizer content too low
Add NICHEM Stabilizer
Too high of a anodic current applied
to SS tank
Set as per manufacturers specs.
pH is too high
Adjust pH to recommended range
Temperature is too high
Adjust temperature to recommended range
Localized overheating
Improve tank design
Excessive work load
Adjust bath loading to recommended range
Electroless Nickel Troubleshooting Guide
PAGE 10
Porous Deposits
Possible Cause
Corrective Action
Organic impurities
Identify source and eliminate
Use clean air for agitation
Avoid drips from sources above the tank
Insufficient air agitation
Increase the uniformity and velocity of air flow
Suspended matter in solution
Improve filtration
Porous substrate
Improve the quality of the substrate surface
Flask plate with nickel sulfamate prior to EN
Old solution with high orthophosphite
Dump the bath and re-make
Non-Uniform Deposits
Possible Cause
Corrective Action
Operating parameters out of range
Check temperature, pH, nickel & hypophosphite
concentrations
Poor cleaning or activation
Check pre-treatment steps and change, as required
Interference from stray currents
Check for stray currents and eliminate
Blistering - Ferrous Metals
Possible Cause
Corrective Action
Substrate is not clean or activated
Improve cleaning and acid activation
Contaminated rinse water prior to EN
Improve quality of rinse water
Use separate rinse tank
EN bath is over-stabilized
Analyze solution and adjust, as required. Add NICHEM
Accelerator (mid-phos baths only!).
Blistering Non-Ferrous Metals
Possible Cause
Inadequate preparation or activation
of substrate
Corrective Action
Improve cleaning and acid activation
Electroless Nickel Troubleshooting Guide
PAGE 11
Poor Adhesion
Possible Cause
Corrective Action
Incorrect pre-treatment
Use the proper pre-treatment cycle(s)
Cleaning or pickling bath is
contaminated
Discard bath(s) and replace
EN bath is old and contaminated
Discard bath and replace
Improper cleaning or activation
Ensure that the correct pretreatment cycle(s) is being used
Poor cleaning
Check life of cleaner. Make up new, if required.
If cleaner has an oil film on surface, dump and clean out tanks.
Poor activation
Change acid dip
If cleaner has an oil film on surface, dump and clean out tanks.
Do not use inhibitors or wetting agents in acid dips.
Contaminated solution.
Check quality of make-up water for presence of heavy metals
(e.g., Pb, Fe, etc., or organics). Only use deionized water.
Contaminated rinse water
Check that rinses are clear and free running.
If cleaner has an oil film on surface, dump and clean out tanks.
Electroless nickel deposit is highly
tensile stressed
Dump EN bath and remake
Reduce plating rate
Streaky or Patterned Deposits
Possible Cause
Corrective Action
Poor agitation
Improve the degree of agitation, air and/or mechanical
Filtered solution return blocked
Relocate and baffle the filter solution return
Gas patterns
Reposition parts to avoid gas streaking
Drag-in of silicates
Improve rinsing; use non-silicated cleaners
Low tank loading
Increase loading to recommended range
Add NICHEM Accelerator (mid-phos baths only!)
Improper surface preparation
Improve cleaning, pickling and water rinsing.
Electroless Nickel Troubleshooting Guide
PAGE 12
Skip Plating
Possible Cause
Corrective Action
Heavy metal contamination of the EN
bath (e.g. Pb, Bi, Cd, Hg, Sn, Ag)
Identify source and eliminate
When processing leaded alloys, either strike plate with nickel
sulfamate or use a warm, alkaline hypophosphite pre-dip to
speed-up deposition prior to EN.
Excessive air agitation
Reduce velocity of the air flow
Improper cleaning
Ensure that the proper pretreatment cycle(s) is used
Improper activation
Change the acid dip.
Change the cleaners
If cleaner has an oil film on surface, dump and clean out tank
Contaminated EN bath
Check quality of make-up water for contamination by heavy
metals (e.g., Pb, Fe, etc. or organics). Use only deionized or
distilled water.
Contaminated rinses
Check that rinses are clear and free running.
Ensure that no oil contaminates any rinse water or tank walls.
Improper loading factor, small area of
work in large solution volume
Increase work area being plated and/or reduce agitation
Turbid, Milky or Steel Gray Appearing Solution (White-Out)
Possible Cause
Corrective Action
Complexor concentration is too low
Increase complexor concentration
pH is too high
Lower pH with dilute sulfuric acid
High orthophosphite content
Dilute or dump bath and remake
Poor mixing of the bath after
Add pre-mixes more slowly and allow to mix
additions
Hypophosphite content is too high
Check, lower pH and reduce the addition rate
Bath is too old (High orthophosphite)
Dump bath and remake
Impurities in air agitation
Replace the air filter
Impurities from poor water feed
Use deionized water
Drag in from pre-treatment steps
Improve rinsing
Electroless Nickel Troubleshooting Guide
PAGE 13
Deposition on Tank Walls and/or Equipment (Plate-out)
Possible Cause
Corrective Action
Stainless steel tank not passivated or
incorrectly anodically protected
Use the proper strength (> 25%) of nitric acid
Increase time of nitric acid passivation
Set potential to the proper voltage
Inadequate filtration
Improve filtration
Insufficient work movement
Install mechanical agitation of parts
Occlusion of suspended particles
Improve filtration of EN solution
Tank materials etched or damaged
Check for compatibility of tank materials with EN chemistry
Stabilizer content is too low
Add NICHEM Stabilizer
Parts dropped in a SS tank disturb
passivation
Improve racking to prevent parts from falling into tank
Bath temperature is too high
Reduce temperature to within recommended range
High pH cause salts to precipitate
Check and adjust pH
Filter the solution
Excessive additions
Make small, frequent additions
Always make additions away from coils and heaters and not
onto work
Localized overheating
Use derated type electric heaters
Increase the area between steam coil and tank walls to improve
solution circulation
Excessive work load
Reduce work load to recommended range
Rapid Solution pH Change
Possible Cause
Corrective Action
High work load
Reduce load size; recalculate surface area of parts
Plating on tank walls &/or equipment
Filter bath out; strip tank and equipment with nitric acid
Drag-in of pre-plate chemicals
Improve pre-plate rinsing
Electroless Nickel Troubleshooting Guide
PAGE 14
TEST PROCEDURES
Porosity Tests
Ferroxyl (Steel)
Immerse a cleaned EN plated sample in a solution containing 25 grams of potassium ferrocyanide and 15
grams of sodium chloride in one liter of deionized water at ambient temperature for 30 seconds. Blue spots
appearing on the sample indicate porosity in the EN coating.
Hot Deionized Water (Steel)
Immerse a cleaned sample in boiling deionized water for five minutes. Remove article and rinse in methanol
and dry. Rust spots appearing on the sample indicate porosity in the EN coating.
Copper Sulfate (Steel)
Immerse or swab the sample with a solution of saturated copper sulfate for 15 seconds. Pore sites are
indicated by copper-colored spots.
Hydrochloric Acid. (Steel and Aluminum)
Immerse a cleaned sample in 50% by volume hydrochloric acid for two minutes at ambient temperature.
Gassing indicates porosity over steel. Black spots indicate porosity over aluminum.
Alizarin (Aluminum)
Immerse a cleaned sample in a 10% (by wt.) solution of sodium hydroxide in water at ambient temperature (6575o F). After three minutes, the sample shall be removed, rinsed in water, and then immersed in ambient
temperature alizarin sulfonate solution. After four minutes, the sample shall be removed and repeatedly dipped
in glacial acetic acid until the violet color disappears. Any remaining red spots indicate porosity. The alizarin
sulfonate solution is prepared by dissolving 1.5 grams of methyl cellulose in 90 ml. of boiling deionized water to
which, after cooling, a solution of 0.1 grams alizarin sulfonic acid dissolved in 5 ml of ethanol is added.
Deposit Purity & Corrosion Resistance
Nitric Acid (High Phos. EN)
Immerse a cleaned, dry sample into concentrated 42o B Nitric acid for 30 seconds at ambient temperature. A
high phosphorus EN deposit should not darken in 30 seconds. NOTE: The nitric acid solution used for this test
must be fresh. Acid that has absorbed water from the air can cause parts to fail.
Electroless Nickel Troubleshooting Guide
PAGE 15
METRIC CONVERSION TABLES
Volume
Multiply
by
To Obtain
Cubic centimeters
0.061
cubic inches
Cubic centimeters
2.65x 10-4
gallons
Cubic centimeters
0.0338
ounces (fluid)
Cubic feet
28317
cubic centimeters
Cubic feet
1728
cubic inches
Cubic feet
7.48
gallons
Cubic feet of water 60F
62.37
pounds
Cubic inches
16.39
cubic centimeters
Cubic meters
35.3145
cubic feet
Cubic feet
0.0283
cubic meters
Multiply
by
To Obtain
Cubic feet
28.3162
liters
Cubic inches
0.0164
liters
Gallons
3785.4
cubic centimeters
Gallons (U.S.)
231
cubic inches
Gallons (U.S.)
3.785
liters
Gallons (U.S.)
128
ounces (fluid)
Liters
0.2642
gallons (U.S.)
Liters
0.0353
cubic feet
Liters
61.025
cubic inches
Multiply
by
To Obtain
Grams
0.0353
ounces
Kilograms
2.205
pounds
Ounces
28.35
grams
Pounds
453.6
grams
Capacity
Weight
Electroless Nickel Troubleshooting Guide
PAGE 16
Length
Multiply
by
To Obtain
Centimeters
0.3937
inches
Inches
2.54
centimeters
Feet
0.3048
meters
Meters
3.2808
feet
Miles
1.6093
kilometers
Kilometers
0.6214
miles
Multiply
by
To Obtain
psi
7,000
MPa
Pressure
Electroless Nickel Troubleshooting Guide
PAGE 17
TEMPERATURE CONVERSION TABLES
The numbers in bold face type represent the temperature in degrees Fahrenheit or Celsius that are to be
converted into the other scale. If converting from Fahrenheit to Celsius, the equivalent will be found in the left
column. If converting from Celsius to Fahrenheit, the answer appears in the right column.
o
C
-17.8
-17.2
-16.7
-16.1
-15.6
-15.0
-14.4
-13.9
-13.3
-12.8
-12.2
-11.7
-11.1
-10.6
-10.0
-9.44
-8.89
-8.33
-7.78
0 to 18
F/C
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
C
-7.22
-6.67
-6.11
-5.56
-5.00
-4.44
-3.89
-3.33
-2.78
-2.22
-1.67
-1.11
-0.56
0
0.56
1.11
1.67
2.22
2.78
19 to 37
F/C
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
F
32.0
33.8
35.6
37.4
39.2
41.0
42.8
44.6
46.4
48.2
50.0
51.8
53.6
55.4
57.2
59.0
60.8
62.6
64.4
C
3.33
3.89
4.44
5.00
5.56
6.11
6.67
7.22
7.78
8.33
8.89
9.44
10.0
10.6
11.1
11.7
12.2
12.8
13.3
38 to 56
F/C
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
C
13.9
14.1
15.0
15.6
16.1
16.7
17.2
17.8
18.3
18.9
19.4
20.0
20.6
21.1
21.7
22.2
22.8
23.4
23.9
57 to 75
F/C
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
F
100.4
102.2
104.0
105.8
107.6
109.4
111.2
113.0
114.8
116.6
118.4
120.2
122.0
123.8
125.6
127.4
129.2
131.0
132.8
C
24.4
25.0
25.6
26.1
26.7
27.2
27.8
28.3
28.9
29.4
30.0
30.6
31.1
31.7
32.2
32.8
33.3
33.9
34.4
76 to 94
F/C
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
C
35.0
35.6
36.1
36.7
37.2
37.8
43.0
49.0
54.0
60.0
66.0
71.0
77.0
82.0
88.0
93.0
99.0
100.0
101.7
95 to 215
F/C
95
96
97
98
99
100
110
120
130
140
150
160
170
180
190
200
210
212
215
F
66.2
68.0
69.8
71.6
73.4
75.2
77.0
78.8
80.6
82.4
84.2
86.0
87.8
89.6
91.4
93.2
95.0
96.8
98.6
F
168.8
170.6
172.4
174.2
176.0
177.8
179.6
181.4
183.2
185.0
186.8
188.6
190.4
192.2
194.0
195.8
197.6
199.4
201.2
F
134.6
136.4
138.2
140.0
141.8
143.6
145.1
147.2
149.0
150.8
152.6
154.4
156.2
158.0
159.8
161.6
163.4
165.2
167.0
F
203.0
204.8
206.6
208.4
210.2
212.0
230.0
248.0
266.0
284.0
302.0
320.0
338.0
256.0
374.0
392.0
410.0
413.0
419.0
