STUDY
Practice Test 1
ECEN 350
Handro
Computer Industry has ___% to ___% of the gross product of the U.S.
___________________ become more important in our lives.
___________________ becomes more and more affordable.
How can a program be run on a computer?
What are inside a computer?
What affects the performance of the computer?
How to design a computer?
Computer completes tasks using high level languages. Fill in the blanks BRO:
A+B
______________________________
_____________
add A,B
______________________________
_____________
10001100101
______________________________
What do the following stand for?
FORTRAN:
_________________________________________________
ALGO:
COBOL:
_________________________________________________
_________________________________________________
These are examples of what type of languages (C language is also this type)?
Match the definitions BRO:
___ Processor
___ CPU
___ Datapath
B ) Central Processor Unit
___ Control
C ) Performs the arithmetic operations
___ Memory
___ DRAM
___ Cache
___ Implementation
___ Instruction Set Architecture
___ Integrated Circuit
___ VLSI
___ Defect
___ Yield
D ) Where the programs and data are kept.
E ) (a safe place for hiding things) consists of a
small, fast memory that acts as a buffer for the
DRAM memory.
F ) combined dozens to hundreds of transistors
into a single chip.
G ) hardware that obeys the architecture
design of principal technique
H ) Tells the datapath, memory and I/o device
what to do according to the wishes of the
instructions of the program
I ) Dynamic Random Access Memory, takes the
same amount of time to access memory no
matter what portion of the memory is read
J ) Includes anything programs need to know to
make a binary machine language program
work correctly, including instructions, I/O
devices and so on.
K ) Very Large Scale Integrated circuit:
integrates hundreds of thousands to millions of
transistors into a chip
L ) Microscopic flaw in a wafer. Any single
microscopic flaw can cause failure. Chopping
wafer into dies allows us to discard only those
dies containing the flaws rather than the whole
wafer.
M ) Percentage of good dies from the total
number of dies on the wafer.
A ) Active part of the computer: Adds numbers,
tests numbers, signal I/O
Fill in the blanks:
The manufacture of a chip begins with _____________________________________.
Fill in the manufacturing process:
_____________________ ingot
Sliced into _____________________
Chopped into _____________________
Each wafer costs the same, fewer dies means higher cost.
If we get twice the average yield then we have _____________ the cost.
Finish the equations:
CostPerDie=
DiesPerWafer=
( )
DieYield= 1+
What is ?
MOS has an of ___________________.
Bipolar Junction Transistors (BJTs) has a ____________ valued .
NOPE REMEMBER YOURSELF
Please convert the following instructions to machine code:
R-type: add $13, $7, $9
000000 |
100000
srl $6, $2, 14
000000 |
000010
I-type: beq $5, $17, 0x00000030Hex
000100 |
J-type: j 0x00000002
000010 |
Extract the jump address (In HEX) from the following machine code, the instruction
is at the address 0xABCDEF1:
000010 |
00 0000 0000 0000 0000 0000 0010
Using 2s compliment and 8 bit storage, do a binary addition for the following
equation: 185+122
Overflow?
Do the Binary division for the following equation: 9/2
Code the following conditions using slt, beq, and bne:
A<B
A>B
A <= B
A >= B
