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KVR21N15S8/8: Memory Module Specifi Cations

This document provides specifications for the KVR21N15S8/8 8GB DDR4 memory module from ValueRAM. It is a 1Rx8 module with a data rate of 2133 MT/s and CL15 latency. The module uses eight 1Gb x8 DRAM chips and has a height of 1.23 inches. It operates at 1.2V with specifications including a minimum refresh time of 46.5ns, row active time of 33ns, and operating temperature range of 0-85°C.

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0% found this document useful (0 votes)
113 views2 pages

KVR21N15S8/8: Memory Module Specifi Cations

This document provides specifications for the KVR21N15S8/8 8GB DDR4 memory module from ValueRAM. It is a 1Rx8 module with a data rate of 2133 MT/s and CL15 latency. The module uses eight 1Gb x8 DRAM chips and has a height of 1.23 inches. It operates at 1.2V with specifications including a minimum refresh time of 46.5ns, row active time of 33ns, and operating temperature range of 0-85°C.

Uploaded by

jesus.frp2629
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
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Memory Module Specifications

KVR21N15S8/8
8GB 1Rx8 1G x 64-Bit PC4-2133
CL15 288-Pin DIMM

DESCRIPTION SPECIFICATIONS
This document describes ValueRAM's KVR21N15S8/8 is a 1G x 64-bit CL(IDD) 15 cycles
(8GB) DDR4-2133 CL15 SDRAM (Synchronous DRAM), 1Rx8, Row Cycle Time (tRCmin) 46.5ns(min.)
memory module, based on eight 1G x 8-bit FBGA components. The 350ns(min.)
Refresh to Active/Refresh
SPD is programmed to JEDEC standard latency DDR4-2133 timing of Command Time (tRFCmin)
15-15-15 at 1.2V. Each 288-pin DIMM uses gold contact fingers. The
Row Active Time (tRASmin) 33ns(min.)
electrical and mechanical specifications are as follows:
Maximum Operating Power TBD W*
UL Rating 94 V - 0
Operating Temperature 0o C to +85o C
FEATURES Storage Temperature -55o C to +100o C
Power Supply: VDD=1.2V Typical
*Power will vary depending on the SDRAM used.
VDDQ = 1.2V Typical

VPP - 2.5V Typical

VDDSPD=2.2V to 3.6V

Nominal and dynamic on-die termination (ODT) for

data, strobe, and mask signals

Low-power auto self refresh (LPASR)

Data bus inversion (DBI) for data bus

On-die VREFDQ generation and calibration

Single-rank

On-board I2 serial presence-detect (SPD) EEPROM

16 internal banks; 4 groups of 4 banks each

Fixed burst chop (BC) of 4 and burst length (BL) of 8

via the mode register set (MRS)

Selectable BC4 or BL8 on-the-fly (OTF)

Fly-by topology

Terminated control command and address bus

PCB: Height 1.23 (31.25mm)

RoHS Compliant and Halogen-Free

Continued >>

kingston.com Document No. VALUERAM1499-001.A00 03/03/16 Page 1


continued HyperX

MODULE DIMENSIONS

Front

Back

133.35

129.55

2.10
0.15
31.25

3.00
11.00
14.60
17.60
2.700.15

8.00

Pin 1

3.35
64.60 56.10
28.90 22.95

kingston.com Document No. VALUERAM1499-001.A00 Page 2

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