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Practical Exam I. Saw

The document discusses several aspects of wafer saw machines and wirebond machines. It describes the most important parts of each machine type including the blade and flange, camera, sensor, monitor, DI water, interface control panel, vacuum supply, and wafer chuck table for wafer saw machines. For wirebond machines, the most critical parts are identified as the bond head, wire feed, and camera and PR sensor. It also outlines three critical parameters for the wafer saw process: die thickness, die/diode size, and tape thickness. Finally, it provides recommendations for what an engineer should do after clocking in and their role on a critical failure team.

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PepC Malolos
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98 views2 pages

Practical Exam I. Saw

The document discusses several aspects of wafer saw machines and wirebond machines. It describes the most important parts of each machine type including the blade and flange, camera, sensor, monitor, DI water, interface control panel, vacuum supply, and wafer chuck table for wafer saw machines. For wirebond machines, the most critical parts are identified as the bond head, wire feed, and camera and PR sensor. It also outlines three critical parameters for the wafer saw process: die thickness, die/diode size, and tape thickness. Finally, it provides recommendations for what an engineer should do after clocking in and their role on a critical failure team.

Uploaded by

PepC Malolos
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
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Download as DOCX, PDF, TXT or read online on Scribd
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Practical Exam

I. Saw
1. Most important part of a Saw Machine.
The entirety of the whole machine, DAD341 and DAD3350, is vital to each other,
each part serves different purpose that helps the production is sawing wafers.
However considering the effectiveness of a wafer saw machine, blade and flange,
camera, sensor, monitor, DI water, interface control panel, vacuum supply, and
wafer chuck table are considered to be the most important.
Blade and flange – each customer has a requirement for the blade and flange to
be used for every die and it is most essential in cutting a wafer.
Monitor, camera and sensor – these serve as the eyes of the production in micro
level that the naked eye cannot see, and are used in pattern recognition that
guides the machine in sawing the wafers.
DI water - silicon dust and other foreign materials floats on water, and this
prevents the wafer from having foreign materials, scratch and stain.
Control panel - used by the operators to start and stop the machine, control the
parameters.
Vacuum supply and chuck table - holds the wafer to the chuck table preventing
washout of the die.

2. Three critical parameters in wafer saw process;


Die Thickness - determines the blade speed, blade height, and blade thickness
that are vital to produce good cuts of wafer.
Die/Diode Size – vertical and horizontal distance are set for the machine to know
the dimension of the dice and prevent the machine from cutting the wrong in
wrong points.
Tape thickness – using the correct thickness of tape prevents defects such as
cut-to-tape that will be obtained during die plating.

III. Wirebond
1. Three most critical part of a wirebond machine.
Like in saw machine, all parts of the M360C are important because each part has
its own purpose. However, the three most critical parts are; bond head, wire feed,
and camera and PR sensor.
Bond head - it is the most critical part of the machine, it is consisted of the
transducer, wedge, wireguide, and cutter. Whereas, the transducer is the heart of
the machine since it converts the electrical energy to mechanical energy to bond
the solder wire.
Wirefeed – it includes a proximity sensor that detects the wire movement and
automatically feed the wireguide with solder wire.
Monitor, camera and PR sensor - since bonding is in micro level, these parts
make it easier to bond the wire to the die pad or post minimizing the human
errors.

IV. Bonus
1. What is the next thing an Engineer should do after “time-in”?
An engineer should already have a clear mind and be in a good condition before
he goes to work. After time-in he should prepare his stuff and plan his day on how
he will accomplish tasks endorsed by the previous shift to him, planning the activities
for the whole day makes an engineer productive and effective on doing his job. A
good time management keeps the task from filing up.

2. What is the role of an Engineer on a CFT?


An engineer should be good on critical thinking, analyzing and solving problems.
Therefore, when it comes to critical times such as encountering low yields or gross
defects, he can think not only of a temporary solution but also a preventive action to
prevent such things from happening again. The engineer will recommend possible
solutions and the CFT should discuss and provide decision as a group, agreeing on
a solid solution and having a common understanding on such problems. Engineers
also address changes in the specification to the CFT to prevent confusions and
misunderstanding of the processes.

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