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KVR24N17S8/4: Memory Module Specifi Cations

This document provides specifications for the KVR24N17S8/4 4GB DDR4 memory module. It is a 512Mx64bit module with a CL of 17 at 1.2V. Key specs include a minimum tRC of 45.75ns, tRFC of 260ns, tRAS of 32ns, and operating temperature range of 0-85°C. The module has 1Rx8 configuration, onboard SPD, and measures 31.25mm in height.

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84 views2 pages

KVR24N17S8/4: Memory Module Specifi Cations

This document provides specifications for the KVR24N17S8/4 4GB DDR4 memory module. It is a 512Mx64bit module with a CL of 17 at 1.2V. Key specs include a minimum tRC of 45.75ns, tRFC of 260ns, tRAS of 32ns, and operating temperature range of 0-85°C. The module has 1Rx8 configuration, onboard SPD, and measures 31.25mm in height.

Uploaded by

Geepee Flores
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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Memory Module Specifications

KVR24N17S8/4
4GB 1Rx8 512M x 64-Bit PC4-2400
CL17 288-Pin DIMM

DESCRIPTION SPECIFICATIONS
This document describes ValueRAM's KVR24N17S8/4 is a 512M CL(IDD) 17 cycles
x 64-bit (4GB) DDR4-2400 CL17 SDRAM (Synchronous DRAM), Row Cycle Time (tRCmin) 45.75ns(min.)
1Rx8, memory module, based on eight 512M x 8-bit FBGA 260ns(min.)
Refresh to Active/Refresh
components. The SPD is programmed to JEDEC standard Command Time (tRFCmin)
latency DDR4-2400 timing of 17-17-17 at 1.2V. Each 288-pin
Row Active Time (tRASmin) 32ns(min.)
DIMM uses gold contact fingers. The electrical and mechanical
Maximum Operating Power TBD W*
specifications are as follows:
UL Rating 94 V - 0
Operating Temperature 0o C to +85o C
FEATURES Storage Temperature -55o C to +100o C
• Power Supply: VDD=1.2V Typical
*Power will vary depending on the SDRAM used.
• VDDQ = 1.2V Typical

• VPP - 2.5V Typical

• VDDSPD=2.2V to 3.6V

• Nominal and dynamic on-die termination (ODT) for

data, strobe, and mask signals

• Low-power auto self refresh (LPASR)

• Data bus inversion (DBI) for data bus

• On-die VREFDQ generation and calibration

• Single-rank

• On-board I2 serial presence-detect (SPD) EEPROM

• 16 internal banks; 4 groups of 4 banks each

• Fixed burst chop (BC) of 4 and burst length (BL) of 8

via the mode register set (MRS)

• Selectable BC4 or BL8 on-the-fly (OTF)

• Fly-by topology

• Terminated control command and address bus

• PCB: Height 1.23” (31.25mm)

• RoHS Compliant and Halogen-Free

Continued >>

kingston.com Document No. VALUERAM1534-001.A00 05/13/16 Page 1


continued HyperX

MODULE DIMENSIONS

Front

Back

133.35

129.55

2.10±
±0.15
31.25

3.00
11.00
14.60

Detail A Detail B Detail D Detail E Detail C


17.60
2.70±0.15

8.00

Pin 1 Pin 35 Pin 47 Pin 105 Pin 117

3.35
64.60 56.10
28.90 22.95

kingston.com Document No. VALUERAM1534-001.A00 Page 2

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