Computer

Processor
 Generation is architecture of processor.
 Every generation is different with respect to energy efficient, power saving, clock speed, hyper-
threading, no. of cores, cache design, new sockets, pipeline technology, optimization, architecture
technology, integrated graphic system and more features.
 Mobile (M) processor has low clock speed and power restriction as compare to desktop processor (D).
 Hyper-threading is multitasking by single core. Hyper-threading shows operating system twice
amount of physical core in term of threads. The amount of virtual cores is amount of threads.
 More no. of cores, less speed of CPU in (Hz), hard over clocking.
 Base clock (normal speed of CPU), boost clock (more speed) & over clock (more speed than boost &
base)
 By over or boost clocking, processor more heats up thus require better cooling system.
 Over OR boost clocking has to be done manually by BIOS setting.
 Integrated graphic is built-in graphic processor, they are not supposed to run high resolution game.
 Manufacturing technology refers in nanometer (nm). It tells us the gap between transistors in
processor. Less gap, more transistor, high performance. (modern CPU has 14nm, 10nm)
 Latest CPU should has Multi-tasking, 1080p gaming, high single core performance.
 Single core performance is representation of IPC (instruction per cycle)
 Over-clocking should be supported by both motherboard & CPU.
 More cache, better performance.
 Most games and software are currently optimized by running on 4 cores.
 Socket type refers to the type of motherboard that CPU (processor) is compatible with.
 Microsoft DirectX is a collection of application programming interfaces (APIs) for handling tasks
related to multimedia, utilizing hyper threading, multi core processing especially game
programming and video on Microsoft platforms.
 Latest direct X 12 released 2015 is mostly prefer skylate generation and further.
 Different programs, games, application can be best utilized with their desired API.
 Direct X, Vulkan etc are APIs
 Vulkan is a new generation graphics and compute application program interface (API) that provides
high-efficiency, cross-platform access to modern GPUs used in a wide variety of devices from PCs and
consoles to mobile phones and embedded platforms.
 Direct X technology is limited only on Window operating system, whereas Vulkan Technology (cross
platform) is on MAC, Linux, windows, android etc.
 Mostly Intel HD 530, 630 integrated graphic card is common in i3, i5, i7.
 Mobile PCs are around 25% less efficient than Desktop PCs.
 Software, application, games are sometimes depended on multi-core/multi-hyper threading OR Single
core/ single hyper thread.
 Turbo boost technology performs its best work for single core/ single hyper thread processing.
 Mostly games depends on dual & Quad core processing and high core clock.

Intel Processor
 Intel Celeron (1998 – present)
 Intel Xeon (1998 – present) (these are high level desktop processors with higher core counts, support
for larger amounts of RAM, and larger cache memory. Some also support multi-socket systems with 2,
4, or 8 sockets. these processors mostly has not integrated graphic & not support over-clocking)
 Intel Pentium 2009 (2009 - present)
 Intel core i3 (2010 – present)
 Intel core i5 (2009 – present)
 Intel core i7 (2008 – present)
 Intel core i7 extreme edition X (2011 – present)
 Intel core i9 (2017 – present)
 64-bit core microarchitecture –based (core 2 solo, core 2 duo, core 2 extreme, core 2 quade)
 Nehalem microarchitecture –based (1st gen.) (core i3, i5, i7, Xeon)
 Westmere microarchitecture –based (1st gen.) (core i3, i5, i7, Pentium, Celeron)
 Sandy bridge microarchitecture –based (2nd gen.) (core i3, i5, i7, Pentium, Celeron, Xeon)
 Ivy bridge microarchitecture –based (3rd gen.) (core i3, i5, i7, Pentium, Celeron, Xeon)
 Haswell microarchitecture –based (4th gen.) (core i3, i5, i7, Pentium, Celeron, Xeon)
 Broadwell microarchitecture –based (5th gen.) (core i3, i5, i7, M, Xeon)
 Skylake microarchitecture –based (6th gen.) (core i3, i5, i7, Pentium, Celeron, Xeon)
 Kaby lake microarchitecture –based (7th gen.) (core i3, i5, i7, Pentium, Celeron, m3, Xeon)
 Kaby lake refresh microarchitecture –based (8th gen.) (core i5, i7)
 Coffee lake microarchitecture –based (8th gen.) (core 13, 15, i7, Xeon)
 Cannon lake microarchitecture –based (8th gen.)
 Skylake-X microarchitecture –based (7th gen.) (core i7, i9)
 Coffee lake-H microarchitecture –based (8th gen.) (core i5, i9, Xeon)
 There are more sub-types of each generation microarchitecture with alphabet like X, U, H etc OR with
different names.
 Core i3 has 2-4 cores, core i5 has 2-6 cores, core i7 has 4-6 cores, core i7 extreme edition has 4-10 cores
and core i9 has 10-18 cores.
 Core i3 has 7 generations in mobile processors and 8 generations in desktop processors
 Core i5 has 8 generations in mobile processors and 8 generations in desktop processors
 Core i7 has 8 generations in mobile processors and 8 generations in desktop processors
 Core i9 is updated version of core i7 has 1 generation in mobile processors and 1 generation in desktop
processors yet.
 Every new generation in intel has around 5-10% performance gain/ increment over the old generation
 Pentium G-series processor has equal single core performance as i3, i5, i7 processors.
 Mostly new generation processors doesn’t optimize fully old operating systems such as 6th and on-ward
generation processor support windows 8 and on-ward windows.
 Intel hyper threading technology available on the latest Intel Core vPro processors, the Intel Core
processor family, the Intel Core M processor family, and the Intel Xeon processor family.

 Intel processor with suffix “K” can be over-clocked.

 Intel processor with suffix “X” is extreme edition.
 Intel processor common socket types are LGA 1150, LGA 1151 & 2011-v3.
 Cache levels L1, L2 & L3. L1 is the fastest type of cache memory, L3 can store more data but slow speed.
 Intel motherboard with “z” designed chipset supports overclocking such as Z97, Z170 & Z270 etc.
 Turbo boosting technology present in i5, i7 and i9. Turbo boosting enables the processors to run above
its base clock (speed) OR base operating frequency via dynamic control of the processor’s clock rate.
 Turbo boosting only boost clock speed of 1 or 2 cores. Turbo mode is a sort of temporary overclock the
processor does to itself automatically when in need of a little extra juice. The turbo process itself is
totally un-noticeable and something you wouldn’t even realize is happening within the depths of your
PC. It’s not a feature that’s unique only to unlocked “k” processors.
 Turbo boosting allows 1 or 2 cores to operate with boost speed with high voltage & current level by
keeping rest of cores at low speed, voltage & current temporary.
 Overclocking applies an increase in the CPU's maximum clock rate at all times, but must be set in the
BIOS therefore can only be applied by rebooting the machine.
 Overclocking requires efficient processor cooling system to work stable while turbo boosting requires
normal processor cooler.
 Kaby lake and above generation processors doesn’t support windows 7, 8, 8.1.
 Single core overclocking is possible in coffee lake and above generation processors.
 Every Intel generation is about 5-10 % efficient than previous one.

AMD processors
 AMD only produce desktop CPU whereas intel produce desktop & mobile CPU (processor)
 There are current series/models of AMD processors such as Ryzen series, A-series, FX series & Athlon
series, Opteron series, Sempron series, fire Pro series, E-series, C-series, G-series, Z-series.
 A-series has APU (accelerated processing unit) technology means it has reserved CPU+GPU cores
inside it. Its integrated graphic card is much better than other in-built graphic cards in other
processors.
 1 core = 64 stream processors
 Only limited edition of A-series CPU can synchronize with AMD GPU through cross-fire cable.
 AMD currently building processors are ryzen, APU and EPYC based technology belongs to ZEN
architecture.
 ZEN architecture has at least one CCX (CPU complexes), each CCX has 4 cores, and each core has its
own L2 cashe not shared.
 Ryzen and APU technology based processors are both desktop and mobile processors.
 ZEN architecture processors (2017 - present)
 Jaguar architecture processors (2013 - present)
 Bulldozer architecture processors (late2011 - present)
 Bobcat architecture processors (early 2011 - present)
 Each AMD architecture has different technologies/families that built desktop and mobile processor
 Ryzen with 1 gen. of mobile processors and 2 gen. of desktop processors.
 Mostly AMD processors support over-clock.
 Suffix “X” shows double XFR (extended frequency range) means can be extra over-clocked.
 XFR is in almost every AMD Ryzen processor but X is slightly double of XFR
 Mostly AMD socket type motherboards support overclocking.
 AMD processor common socket types are FM+2, AM 4.
 AMD and Intel has different type of sockets that cannot interchangeable.
 Ryzen and above generation processors doesn’t support windows 7, 8, 8.1.
 Motherboard
 Motherboard comes at different sizes (form factors) such as mini-ITX, micro-ATX, ATX & EATX.
 Standard and most commonly used size is ATX.
 Motherboard should support correct max DDR RAM of different pins & different speed in (Mhz).
 Motherboard and GPU should support same generation of PCIe.
 PCIe generations are 1.0, 2.0, 3.0, 4.0 & 5.0.
 CPU cooler should support same socket on motherboard.
 Motherboard should have network adapter, PCIe slots for GPU, USB ports, storage ports such as PCIe
m.2 slots and u.2 connectors, multiple RAM slots and other features.
 PCI express slot for GPU to motherboard
 Motherboard and cooler should have same socket size.
 USB port 3.1 Gen 1, 3.1 Gen 2, 3.0, and 2.0. USB 3.1 Gen 2 has speed about 10gbps.
 GPU mostly has 2 PSI slots.
 Most SSD and HDD connect through SATA cable to motherboard and power supply.
 SATA 2 connector speed is 3gbps and SATA 3 connector speed is 6gbps.
 Motherboard comes with different ram channels such as single, dual, triple and quad channels. These
channels are for better optimization.
 Similarly RAMs comes with different channels as well for better performance.
 Motherboard IO shield for back sockets on casing.
 Whole CPU system form-factor case should be for your motherboard form-factor.
 Other things like internal USB cable is directly connects on motherboard at their respective position.
 RGB lights, power button, system fans, processor fan, audio jack, micro phone jack etc. these things has
to connect to motherboard at their respect position to get power through motherboard.
 There are different types of USB ports/female and USB male of different data transfer speed with
respect to their generations 1.0, 1.1, 2.0, 3.0/3.1 gen1 and 3.1 gen 2 & types A, B & C for different sizes.

 USB 1.0 & 2.0 symbol, USB 3.0/3.1 gen.1 symbol, USB 3.1 gen.2 symbol.
 Mother board does not effect the overall performance of components/ system.
 Different types of mother board gives different , additional & extra fetures.
 Mother board are classified on base of chipset, these chipset contain different &
additional features that decides the price of mother board.
 Chipset/ PCH is different from socket type.
 There are many types of chipsets by intel. some of them are consumer based & some of them are
business based.
 Below chipset (2015-2017) are recently used in most mother boards
 Z370, Z270, Z170, H270, H170, H110 are consumer based chipsets of mother board.
 B250, B150, Q270, Q250, Q150, Q170 are business based chipsets of mother board.
 Most gaming mother board are based on B150, Z170, H170 & H110
 Intel now doesn’t produce H210 chipset mother board
 Different generation of chipset like 100, 200, 300 series support different generation of processors
otherwise BOIS and features and application has to be updated/ flashed.
 Z170 is top chipset by Intel having all max. Present features.
 PCI-express lanes from CPU to GPU. More lanes, new generation GPU can be supported.
 PCI-express lanes from chipset to different components. more lanes, more component attachment
 PCI-express lanes are minimum group of 4 (x4)
 It is up to the manufacture of motherboard that he utilize fully the chipset or not. Sometimes
manufacture gives extra addition features on motherboard.
 High end motherboard offers USB type C 3.1 gen. 2 and so on, if despite your processor chip doesn’t
support them yet, than these ports are enabled through add-in chip by Manufacture Company of
motherboard called AS media.
 Display
 Display port>HDMI>DIV>VGA
 latest version HDMI 2.1, 2.0, 1.4
 latest version Display port 1.4, 1.3, 1.2

 VGA, DVI, HDMI, display port, their socket/port remains same for all their respective version. But the
size of socket/port is different denoted as Type etc.

Power supply
 PSU (Power supply unit) comes in different sizes (form factor) such as ATX & SFX.
 Power supply form factor should match with your case size and design.
 Power supply should be around 500Watt. Whole computer uses about 80% of its total power.
 GPU mostly draws power around 250Watt.
 Recommended computer system power 600 or greater Watt.
 Recommended power supply should be 100watt more than 600 watt at normal clock speed & for over-
clock speed 150watt more than 600watt
 Molex or SATA connector for video card to power supply.
 Power supply should have enough connectors like Molex, SATA etc.
 SATA and Molex power connector for storage devices, CD/DVD rom, GPU, CPU, motherboard etc.
 EPS CPU connector is mostly 4 pins or 8 pins for power supply to motherboard.
 ATX motherboard connect is mostly 20 or 24 pins for power supply to motherboard.
 GPU connector is mostly 2 or 6 pins for power supply to motherboard.
 Most SSD and HDD connect through SATA cable to motherboard and power supply.
 High power GPU requires direct power from power supply through connector of 6pin or 8pins.
 Low power GPU takes power from motherboard.
 Power supply could be modular OR semi-modular OR non-modular.
 If power supply is partially/semi modular power supply means some hard wiring directly comes out of
power supply and some extra peripheral, Molex, SATA, PCI-e, CPU cables are provided without directly
connected to power supply.

Hard drive
 External HHD capacities are 500GB and 1TB and max. 10TB.
 SATA connector for hard drives, SSD, CD/DVD rom etc.
 External SSD capacities are 1TB and max. 4TB.
 Western Digital (WD) HHD mostly used since 2015 with different color represent different specs.
 Western Digital (WD) also manufactures SSD with different color depending on their specs.
 SSDs is more than 20 times faster than HDDs and Hybrid drives.
 Types of SSDs are AHCI, SATA, PCIe, NVMe, MSATA and M.2.
 SATA SSD requires SATA cables and connectors for power to power supply and data transfer to
motherboard at SATA port 3 or 2.
 MSATA SSD directly connects on motherboard at MSATA port
 M.2 SSD directly connects on motherboard at M.2 port
 PCI-e SSD directly connects on motherboard at PCI-e port.
 NVMe SSD faster version of M.2 SSD and directly connects on motherboard at NVMe port.
 M.2 SSD can be connected at NVMe port but it’s up to motherboard whether it supports or not.
 Some motherboards support m.2 and NVMe SSD together at same port.
 External storage Intel octane hard drive and hybrid drives as well.
 SATA SSD and HDD mostly uses same SATA cable for power supply and data transfer.
 SSD connects with PCIe latest gen. & NWMe SSD operate much faster than SATA SSDs.

RAM
 Mostly DDR RAMs are used. DDR1 (240 pins, max. 400MTs), DDR2 (240 pins, max. 1066MTs), DDR3
(240 pins, up to 2133MTs), DDR4 (288pins, up to 4266MTs)
 RAM sizes are 512MB, 1, 2, 4, 8, 16GB.
 Normally said DIMM are RAMs actually. DIMM is actually assembly over which RAM is installed.
 RAMs can also be over-clocked by BOIS, but must has RAM heat spreaders.
 DIMM slots supports DDR RAMs. These slots should support different types DDR RAMs depending on
their pins and clock speed (MHz or MTs).
 Heat spreaders are also come for cooling the RAMs
 There are 2 types of RAM. Buffered and unbuffered.
 In buffered RAMs, there is a buffer between RAM and CPU thus takes more for processing time, more
latency.
 In unbuffered RAMs, there is direct parallel data bus between RAM and CPU thus no time wastage for
processing and less latency.
 For gaming purpose unbuffered RAMs are preferred.
 RAM slots defined by motherboard that they are single, dual, triple & quad channel for better utilization
of RAMs. But in order to use either dual, triple or quad channel RAMs should be same at all aspects
such as size, rank, speed, company etc.
 More RAM does not means high system speed.
 When less RAM is used then system uses external storage device such as hard drive which has less
speed as compare to system RAM, then your hard drive is utilized full with no spaces left then whole
system hangs.
 Latency rate (Time delay) of RAM should be low, so that Data does not delay between CPU and RAM.
 CPU normally uses its full RAM capacity at bottleneck point but with less speed if not overclocked.
 Coolers
 CPU cooler is non-liquid cooler and liquid cooler.
 TDP (thermal design power). More core means high demand of power OR high TDP. (mostly
around 500 watts)
 More the TDP, more better cooling system is required to vanish that heat (TDP).
 Less TDP shows better CPU power requirement.
 CPU requires cooler/radiator to dissipate their TDP, whereas GPU has their own built-in
Cooler/radiator.
 Cooler/Radiator TDP must be 100 or 150 watts greater than your required TDP of CPU or system.
 Better cooling, better and stable overclocking of CPU.
 Few processor comes with their own cooler mostly or you can purchase extra cooler for CPU.

GPU
 1440p and up to games are GPU depended.
 Multi GPU/graphic card on single motherboard are also available. Multi GPU connection is SLI and
Crossfire for NVIDIA and AMD respectively.
 Motherboard manufacture and chipset design decide what kind of GPU and how many GPU can be
installed depending upon PCIe lanes and types and no. of PCIe slots.
 Modern GPU comes with 2 slot design.
 GTX 750 Ti is one the best-selling GPU in amazon
 Pentium new series has potential to support up to Nvidia GTX 960 GPUs
 Asynchronous Technology present in AMD, it support parallel computing.
 AMD Asynchronous compute engines in GCN based GPU can be used to leverage Direct X 12.0
Asynchronous shaders features and improving performance up to 46%
 Parallel computing in AMD’s GPU
 Series computing in NVIDIA’s GPU
 More pixel rate more VRAM required, more texture rate more VRAM.
 Anti-aliasing is post processing work in VRAM, it is done in VRAM before frame is sent to display, more
anti-aliasing more VRAM required.
 Anti-aliasing technology removes stair-case effect in real time and make smoother the frames for video
games and other high resolution display.
 When less VRAM is used then GPU uses system RAM which has slow speed as compare to GPU ram,
therefore frame rate decreases.
 NVIDIA GPU need minimum 8 lanes (8x) from CPU to GPU through PCI- express slots.
 Maximum use of something is bottleneck. for gaming GPU should be bottleneck, for video editing or
some other calculation work CPU should be bottleneck, for high resolution intensive game GPU and
CPU unfortunately both bottleneck
 For gaming GPU usage should be at max (99-100%) greater then CPU usage, if CPU usage is max. than
GPU usage then is not good thing. Similarly for video editing CPU usage should be at max (99-100%)
greater then GPU usage, if GPU usage is max. than CPU usage then again bad thing.
 If both GPU and CPU usage is low for any game or any video editing work, then it means your game or
video editing work is small/not demanding
 CPU intensive game not only require high GPU usage but also requires high CPU usage thus better use
high hyper thread processor OR over-clocked processors
 High resolution of game more GPU usage.
 As game start then CPU does all tasks such as processor logic, handle input, run physics, run AI, Mix
audio then GPU does render graphics in order to complete cycle and generate frame.