CDJ-500

SERVICE MANUAL US Model

Canadian Model

Model Name Using Similar Mechanism NEW

CD Mechanism Type CDM-56
Base Unit Type BU-24
Optical Pick-up Type SPU3212

SPECIFICATIONS

CD-ROM CHANGER

MICROFILM
 SAFETY CHECK-OUT
Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.
After correcting the original service problem, perform the follow-
ing safety checks before releasing the set to the customer:
This appliance is classified as Check the antenna terminals, metal trim, “metallized” knobs, screws,
a CLASS 1 LASER product. and all other exposed metal parts for AC leakage. Check leakage as
The CLASS 1 LASER PROD- described below.
UCT MARKING is located on
the rear exterior. LEAKAGE
The AC leakage from any exposed metal part to earth Ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microampers). Leak-
CAUTION
Use of controls or adjustments or performance of procedures age current can be measured by any one of three methods.
other than those specified herein may result in hazardous ra- 1. A commercial leakage tester, such as the Simpson 229 or RCA
diation exposure. WT-540A. Follow the manufacturers’ instructions to use these
instruments.
2. A battery-operated AC milliammeter. The Data Precision 245
Notes on chip component replacement digital multimeter is suitable for this job.
• Never reuse a disconnected chip component. 3. Measuring the voltage drop across a resistor by means of a VOM
• Notice that the minus side of a tantalum capacitor may be or battery-operated AC voltmeter. The “limit” indication is 0.75
damaged by heat. V, so analog meters must have an accurate low-voltage scale.
The Simpson 250 and Sanwa SH-63Trd are examples of a pas-
Flexible Circuit Board Repairing sive VOM that is suitable. Nearly all battery operated digital
• Keep the temperature of soldering iron around 270˚C multimeters that have a 2V AC range are suitable. (See Fig. A)
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times). To Exposed Metal
• Be careful not to apply force on the conductor when soldering Parts on Set
or unsoldering.

SAFETY-RELATED COMPONENT WARNING !!

AC
0.15µF
1.5kΩ voltmeter
COMPONENTS IDENTIFIED BY MARK ! OR DOTTED LINE (0.75V)
WITH MARK ! ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
Earth Ground
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
Fig. A. Using an AC voltmeter to check AC leakage.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE ! SUR
LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE
FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS
QUE PAR DES PIÈCES SONY DONT LES NUMÉROS
SONT DONNÉS DANS CE MANUEL OU DANS LES
SUPPLÉMENTS PUBLIÉS PAR SONY.

2
 TABLE OF CONTENTS

1. SERVICE NOTE ................................................................ 4

2. GENERAL ......................................................................... 29

3. DISASSEMBLY
3-1. Front Panel ......................................................................... 30
3-2. Illumination Assy ................................................................ 31
3-3. CD Mechanism Deck .......................................................... 31
3-4. Base Unit and Magnet Holder ............................................. 32
3-5. CD Mechanism Section ...................................................... 33

4. MECHANICAL ADJUSTMENTS
4-1. Disc Holder a Adjustment/Chucking Pulley
Position Adjustment ............................................................ 34
4-2. Disc Sensor Adjustment ...................................................... 36

5. ELECTRICAL ADJUSTMENTS
5-1. Tools and Measuring Instruments ....................................... 37
5-2. Trouble Shooting ................................................................. 40

6. THEORY OF OPERATION........................................... 52

7. DIAGRAMS
7-1. Circuit Boards Location ...................................................... 53
7-2. Block Diagrams
• CD-ROM Drive (1/2) Section ........................................... 54
• CD-ROM Drive (2/2) Section ........................................... 55
• Main Section ..................................................................... 56
• Power Supply Section ....................................................... 57
7-3. Printed Wiring Board – CD-ROM Drive Section – ............ 58
7-4. Printed Wiring Board – CD-ROM Drive Section – ............. 59
7-5. Schematic Diagram – CD-ROM Drive (1/6) Section – ...... 60
7-6. Schematic Diagram – CD-ROM Drive (2/6) Section – ...... 61
7-7. Schematic Diagram – CD-ROM Drive (3/6) Section – ...... 62
7-8. Schematic Diagram – CD-ROM Drive (4/6) Section – ...... 63
7-9. Schematic Diagram – CD-ROM Drive (5/6) Section – ...... 64
7-10. Schematic Diagram – CD-ROM Drive (6/6) Section – ..... 65
7-11. Schematic Diagram – Main Section – ............................... 66
7-12. Printed Wiring Board – Main Section – ............................ 67
7-13. Schematic Diagram – Panel Section – .............................. 68
7-14. Printed Wiring Board – Panel Section – ............................ 69
7-15. Schematic Diagram – Sensor Section – ............................ 70
7-16. Printed Wiring Board – Sensor Section – ......................... 71
7-17. Schematic Diagram – SCSI Section – ............................... 72
7-18. Printed Wiring Board – SCSI Section – ............................ 73
7-19. Schematic Diagram – Power Section – ............................. 74
7-20. Printed Wiring Board – Power Section – .......................... 75
7-21. IC Block Diagrams ............................................................ 76
7-22. IC Pin Functions ................................................................ 83

8. EXPLODED VIEWS
8-1. Case Section ........................................................................ 90
8-2. Front Panel Section ............................................................. 91
8-3. Chassis Section ................................................................... 92
8-4. Mechanism Deck Section-1 (CDM-56) .............................. 93
8-5. Mechanism Deck Section-2 (CDM-56) .............................. 94
8-6. Base Unit Section ................................................................ 95

9. ELECTRICAL PARTS LIST ........................................ 96

3
 SECTION 1
SERVICE NOTE
LOADING IN/OUT AGING TOTAL AGING
Loading in and loading out are repeatedly carried out in this aging This mode is used for executing loading in and loading out of discs
mode. in any slits sequentially.
Operations are stopped when an error occurs. (When loading in or Operations are stopped when an error occurs.
loading out took more than 6 seconds.)
Procedure:
Procedure: 1. Set the DIP switches on the back panel as shown below.
1. Set the DIP switches on the back panel as shown below.

SCSI TERM
SCSI TERM MODE
MODE ID SELECT
ID SELECT

4 2 1 4 2 1 ON
ON Remove the
4 2 1 4 2 1 ON
ON OFF Remove the DRIVE CHANGER shield.
DRIVE CHANGER shield.

2. While pressing the OPEN button, DISC SKIP – button, and

2. While pressing the OPEN button, DISC SKIP – button, and DISC SKIP + button simultaneously, press the U button to
DISC SKIP + button simultaneously, press the U button to turn ON the power. When the CHANGER indicator starts to
turn ON the power. When the CHANGER indicator starts to blink, release the OPEN , DISC SKIP – and DISC SKIP +
blink, release the OPEN , DISC SKIP – and DISC SKIP + buttons.
buttons. 3. The front door opens automatically. Set discs in any slot.
3. The front door opens automatically. Set one disc in any slot. 4. Close the front door to start aging.
4. Close the front door. 5. During aging, operations are repeated in the order of “rotation
5. Loading in and loading out of the disc are repeated. of disc table” n ”loading in” n ”disc access” n ”loading
6. To end, press the U button to turn OFF the power. out” n ”rotation of disc table”.
6. To end aging, press the OPEN button .
DISC TABLE AGING
* This mode is used for operating the disc table randomly.
Operations will continue unless an error occur.

Procedure:
1. Set the DIP switches on the back panel as shown below.

SCSI TERM
MODE
ID SELECT

4 2 1 4 2 1
ON ON OFF Remove the
DRIVE CHANGER shield.

2. While pressing the OPEN button, DISC SKIP – button, and

DISC SKIP + button simultaneously, press the U button to
turn ON the power. When the CHANGER indicator starts to
blink, release the OPEN , DISC SKIP – and DISC SKIP +
buttons.
3. The front door opens automatically.
4. Close the front door to start aging.
5. To end aging, press the OPEN button.

4
CHECKING OPERATIONS USING THE FIELD50.EXE Installing the “ASPI manager”:
PROGRAM 1. Create the desired directory in the C drive. The “EZSCSI” di-
• When this program is executed, the operations of each part are rectory is explained here as an example.
checked so that faulty parts can be investigated during repairs. 2. Copy the file of the ASPI manager corresponding to the direc-
It is recommended that this program is executed before returning tory created in step 1. The “ASPI8DOS.SYS” file is explained
the unit to the customer after completing repairs and that all test here as an example.
items are checked that they are satisfactory.
An instruction manual in PDF file format describing the details is
provided with the program file. Refer to this manual for further
details.

Preparations:
• IBM PC compatible Personal computer and display: File copied at item 2.
Use a personal computer with an HDD Directory created at item 1.
• OS;
MS-DOS or PC-DOS version 5.0 or later. 3. Edit the “CONFIG.SYS” file and add the device so that the file
• Floppy disk with latest “FIELD50.EXE” software (Includes the copied at 2 is referred to.
instruction manual (FIELD50.PDF)) (CDJ-001:J-2501-172-A)
• SCSI board;
The “Adaptec AVA-2904E” provided with the unit is recom-
mended. If this is not available, use an equivalent.
• Setting the ASPI manager
Install the “ASPI manager” suitable for the SCSI board, and re- Add the /D switch
write the “CONFIG. SYS” file. (Refer to the following proce- File copied at item 2.
dure.)
ASPI managers (In the case of Adaptec products) Directory created at item 1.

Note:
SCSI Board ASPI Manager ASPI manager version
AVA-2904E Aspi8dos. sys Operations of the “FIELD50.EXE” program are guaranteed when
AHA-1510B Aspi2dos. sys the following ASPI manager version is used. Operations using other
ASPI managers are not guaranteed.
AHA-1542CF Aspi4dos. sys
AHA-2940AU Aspi8dos. sys ASPI manager Usable Version
Aspi2dos. sys 3.661J 3.68 3.68s -------
• General CD-ROM
Aspi4dos. sys 3.34 3.35 3.36s 3.36s
• SONY test disc (TGRS-21: Green disc) (J-2501-110-A)
• SCSI cable Aspi8dos. sys 1.26 1.32 1.32s 1.32s
• Speakers with amplifier or equivalent. (Use only when checking
the AUDIO output)

Installing the “FIELD50.EXE”:

1. Create the directory “CDJC50S” in the C drive of the PC used,
and copy the “FIELD50.EXE” file there.
2. Create another directory “DATA” in the directory created in step
1.

5
Connection

Connected to
SCSI connector
of the PC
ANALOG-OUT
SCSI
IN OUT
SCSI TERM
MODE
ID SELECT

DIGITAL-OUT
4 2 1 4 2 1

DRIVE CHANGER

Connected to active speaker, etc.

SCSI cable (Accessory) SCSI IN (only when checking the audio output)

Fig. Connection of equipment

Setting
• DIP switch settings

1 Set SCSI TERM to “ON”, and do not

connect other SCSI equipment as much SCSI TERM
as possible. MODE
ID SELECT

2 Set MODE to “ON”.

ON: Normal mode. Control the changer
using the PC.
OFF: Manual mode. Control the changer 4 2 1 4 2 1
manually using buttons.
DRIVE CHANGER

3 Setting of SCSI ID of the drive 4 Setting of SCSI ID of the changer

Set a desired ID number except 7. Set a desired ID number except 7.
Be careful not to use an ID number Be careful not to use an ID number
already in use for the changer. already in use for the drive.

Fig. DIP Switch Setting

6
Operating procedure:
Note:
Operations of this program are not guaranteed when used in the
DOS prompt mode with starting up Windows.
Refer to the instruction manual of the PC used, set the DOS prompt
mode, and execute the program.

1. Turn on the power of the PC and set the DOS prompt mode.
2. Change the directory to “CDJC50S”.

3. Enter “FIELD50” and press the ENTER key.”

4. If directory for storing the data is not available, enter “Y” at the
following screen and press the ENTER key.

5. The following screen appears.

Default file name

(Suffix number of file name will increase automatically)

Enter a desired file name using less than 8 characters.

(If numbers are used for the suffix of the file name, these will be
counted up automatically the next time.)
When only the ENTER key is pressed, the default file name will
be set.
This file will be saved as the log file in the directory “DATA”.
After entering the file name, press the ENTER key.

6. If a file name already used once is specified, the following screen

appears. Enter “Y” or “N” according to whether to overwrite the
file, and press the ENTER key.

7
The following screen appears when the file name is not already in
use.

The SCSI ID of the changer detected is displayed as the default value.

For example, as the ID of the changer is set to “6” and the ID of the
drive is set to “3”, these values will be displayed.
Enter “6” for the ID of the media changer to be checked using this
program, and press the ENTER key.

7. The following screen appears. Enter the serial number of the

unit and press the ENTER key.

Enter the serial number of the unit.

8. The number of the slot set with a disc will be displayed. The
screen asks whether the inspection is started. Enter “Y” and press
the ENTER key.

Displays the slot number (s) holding a disc.

(If all slots are empty, — will be displayed.)

Enter Y.

8
9. The following screen appears. These inspection items can be
excuted one by one. The following describes the example of ex-
ecuting all the tests. Enter “A” to execute all the inspection items
and press the ENTER key.

Serial number entered

Enter “A”.

10. The following screen appears and the front door opens auto-
matically. Insert the general CD-ROM into the 14th slot, and
close the door.

11. The following screen appears and the front door opens auto-
matically. Insert the SONY test disc (TGRS-21: Green disc) in
the 1st slot, and close the door.

Take note that if the door is closed without inserting any disc, the
following screen appears and tests end.

9
12. When the inspections are executed, the status will be displayed
at the bottom of the screen. The results of each inspection will
be displayed on the right side of the screen.

The results of the inspection will be displayed as OK or NG.

The value of the test results will be displayed.

The status of the inspection currently performed are displayed at real-time.

13. The following appears at the bottom of the screen. Check the
audio signal here. During this test, analog audio signals are out-
put from the ANALOG OUT and digital audio signals from the
DIGITAL OUT.
Check the sounds according to the instructions on the screen.

After completing preparations to check the sounds, press the

space key.

14. When the following screen appears, the 1 KHz sine wave is
output from the L-CH. Enter “Y” and press the ENTER key if
OK. If no sounds are produced from the L-CH or produced from
R-CH, enter “N” and press the ENTER key for negative.

After checking, enter “Y” or “N”.

10
15. The following screen appears at the bottom, and 1 KHz sine
wave is out put from the R-CH. If OK, enter “Y” and press the
ENTER key. Like in step 14, enter “N” and press the ENTER
key if negative.

After checking, enter “Y” or “N”.

16. The following screen appears and the results of each test are
displayed.
If the test results are satisfactory, “OK” will be displayed. For
details on the test results, refer to the PDF file provided with
the “FIELD50.EXE” software.

To end, enter “E”, or to continue, enter the corresponding number.

17. If there is a inspection to be executed again, enter the corre-

sponding number and press the ENTER key. To end, enter “E”
and press the ENTER key.
18. The following screen appears at the bottom left of the screen.
Remove the disc and close the front door.

19. The program is completed, and the following will be displayed.

Referring to the Log File:

• The results executing “FIELD50.EXE” are stored as the log file.
This file is the file name entered at step 5. To see this file on the
screen, enter the following:

11
• If no problems occurred, the following will be displayed.

File name entered at step 5.

SCSI bus device

Structure of this unit detected

on the SCSI bus

Serial number entered at step 7.

Slot number (s) holding a disc.

Test results

12
• When an error has occurred, the following is displayed

inspection results

Displayed when
SCSI errors occur

For details of the error codes displayed here, refer to the PDF file of
the instruction manual provided with the “FIELD50.EXE” program.

13
TROUBLE SHOOTING FLOW

START

POWER ON? POWER FAILURE

POWER LED lights green

EXECUTE FIELD50.EXE

DETECT as SCSI DEVICE? SCSI FAILURE

CDU-625&CDJ-C50S/500 are recognized

as unique SCSI ID respectively.

CAUTION on SCREEN? HARDWARE ERROR

CHANGER LED FLASHING?

INSERT DISC? KEY FAILURE

General CD-ROM disc into SLOT 14

Green disc into SLOT 1

MEDIA MAPPING OK? DISC SENSOR FAILURE

Confirm the identification between

real location and media mapping

START
INSPECTION Select "A" on menu screen and start
NO.1to6

14
 START
INSPECTION
NO.1to6

NO.1 OK ? SCSI INTEGRITY FAILURE

NO.2 OK ? GO DRIVE CHECK SECTION

NO.3 to 5 OK ? CHECK MECHANICAL PARTS

NO.6 OK ? AUDIO FAILURE

END

15
CHECK POINT

POWER FAILURE
• POWER MOUNT
• FILTER MOUNT
• POWER CORD
• POWER HARNNES

SCSI FAILURE(except CDU-625)

• MAIN MOUNT
• SCSI IN/OUT MOUNT
• D.SW MOUNT
• SCSI FFC CABLE
• HARNNES(MAIN to D.SW)

HARDWARE ERROR
Check it out according to the sense code in the caution message,
There are 6 cases, as follows.

1. Mount Error (sense code 04-53-80)

• MAIN MOUNT
• MOTOR MOUNT
• PICKER
• HARNNES(MAIN to MOTOR)

2. Un mount Error(sense code 04-53-81)

Equivalent to 1

3. Disc Sensor Error

• DISC SENSOR ADJUSTMENT
• DISC SENSOR (S/R) MOUNT
• MAIN MOUNT
• HARNNES(MAIN to DISC SENSOR(S))

4. Drive Chuck Error(04-53-83)

• MAIN MOUNT
• DRIVE UNIT
• FFC (MAIN to MAC-30)

5. Drive Unchuck Error(04-53-84)

Equivalent to 4

6. Door Motor Error(04-53-85)

• D.MOTOR MOUNT
• MAIN MOUNT
• HARNNES (MAIN to D.MOTOR)

KEY FAILURE
• KEY MOUNT
• HARNNES (MAIN to KEY)

DISC SENSOR FAILURE

• DISC SENSOR ADJUSTMENT
• DISC SENSOR (S/R) MOUNT
• MAIN MOUNT
• HARNNES(MAIN to DISC SENSOR(S))

SCSI INTEGRITY FAILURE

• CSI TERMINATOR (SCSI OUT MOUNT)
• SCSI CABLE LENGTH

CHECK MECHANICAL PARTS

• MECHANICAL MAINTENANCE and ADJUSTMENT

AUDIO FAILURE
• P.JACK MOUNT
• MAC-30 MOUNT
• AUDIO HARNNES

16
DOWNLOADING THE CHANGER PROGRAM USING
THE UPDATEF.EXE PROGRAM
• Execute this program to rewrite the program of the changer of
this unit.

Preparations:
• IBM PC compatible Personal computer and display:
Use a personal computer with an HDD
• OS:
MS-DOS or PC-DOS version 5.0 or later.
• Floppy disk with latest UPDATEF.EXE software
(Includes the instruction manual (UPDATEF.PDF)) (CDJ-002:J-
2501-175-A)
• SCSI board;
The “Adaptec AVA-2904E” provided with the unit is recom-
mended.
If this is not available, use an equivalent.
• Setting the ASPI manager;
For details, refer to “Installing the ASPI manager” on page 5.
• SCSI cable

Connection:

Connected to
SCSI connector
of the PC
LINE-OUT
SCSI
IN OUT
SCSI TERM
MODE
ID SELECT

DIGITAL-OUT
4 2 1 4 2 1

DRIVE CHANGER

SCSI cable (Accessory) SCSI IN

Fig. Connection of equipment

Setting:
• DIP switch settings

1 Set SCSI TERM to “ON”, and do not

connect other SCSI equipment as much SCSI TERM
as possible. MODE
ID SELECT

2 Set MODE to “ON”.

ON: Normal mode. Control the changer
using the PC. 4 2 1 4 2 1
OFF: Manual mode. Control the changer
manually using buttons. DRIVE CHANGER

3 Setting of SCSI ID of the drive Set a

desired ID number except 7.
Each SCSI ID must be set exclusively.

17
Operations:
1. Create a desired directory in the C drive of the PC, and copy the
UPDATEF.EXE file and the HEX file supplied with it there (e.g.
XXXXXX.HEX).
(The following assumes that the “CDJC50S” directory is cre-
ated.)
2. The download program can be executed on Windows 95/98 run-
ning. Close all applications first. The following describes the
state where the DOS prompt is excuted from Windows 98. The
following screen appears.

3. Enter “CD \CDJC50S” and press the ENTER key. (The follow-
ing screen appears.)

4. Enter “UPDATEF” and press the ENTER key. The following

screen appears.
If CDJ-500 is detected, the number corresponded to SCSI adress
is displayed. Press the ENTER key to update program for this
changer.
(It is not necessary to enter number.)

Enter the number of the changer displayed or press the ENTER key.
The changer detected and corresponding number are displayed.

18
5. The program searches for the HEX file for the changer stored in
the directory and displays the lists. To download the latest HEX
file, only press the ENTER key. (It is necessary enter number,
to downlord another HEX file.)

Detected HEX file

Enter the number of the HEX file displayed or press the ENTER key.

6. As the HEX file selected is displayed, press the ENTER key.

(“Y” is entered as the default)

7. Revision 1.01 is rewritten to 1.02 and the display switches as

follows. The product information is still displayd old revision.

If downloaded successfully, “Finish Verifying” is displayed.

(If failed, “Failed Downloading” or “Failed Verifying” is displayed.)

19
8. The CHANGER indicator light up when download completes
successfully. To restart the updated proglam, press the U but-
ton to turn OFF the power, and press it again to turn ON the
power again.”
9. Enter “UPDATEF” and press the ENTER key. The following is
displayed on the screen.
10. Check the Revision here. Check that the Revision has been re-
written to that downloaded, enter “E”, and press the ENTER
key to end the program.”

Check that the Revision is the downloaded revision.

Recovering when writing failed:

• If this unit does not operate normally after writing, perform writ-
ing again using the following procedure.
1. Remove the shield with the power OFF, set the “RECOVERY”
DIP switch to OFF, press the U button and turn ON the power.
2. Execute the “UPDATEF” and perform the writing process again
using the method described earlier.
3. After writing, turn OFF the power of the unit once.
4. Set the “RECOVERY” DIP switch to ON, and press the U but-
ton to turn ON the power.
5. Execute the “UPDATEF” using item 10 of the procedure de-
scribed earlier.
Check that “Revision” has been updated.

SCSI TERM
MODE
ID SELECT

4 2 1 4 2 1
Remove the
DRIVE CHANGER shield.

RECOVERY DIP switch (Figure shows the ON state)

20
DOWNLOADING THE DRIVE PROGRAM USING THE
DWN-ASPI.EXE PROGRAM

• Execute this program to rewrite the program of the drive of this

unit.

Preparations:
• IBM PC compatible personal computer and display:
Use a personal computer with an HDD
• OS:
MS-DOS or PC-DOS version 5.0 or later.
Windows 95 or Windows 98 (When using Windows, follow the
settings on Windows described later.)
• Floppy disk with the “DWN-ASP1.EXE” and “625_XXX.HEX”
software
(CDM-002:J-2501-176-A)
• Floppy disk with latest drive program (625_XXX.HEX) (Supplied
as necessary)
• SCSI board:
Use “Adaptec AVA-2904E” provided with this unit.
If not available, use an equivalent.
• ASPI manager setting:
For details, refer to “Installing ASPI manager” on page 5.
• SCSI cable:

Connection:

Connected to
SCSI connector
of the PC
LINE-OUT
SCSI
IN OUT
SCSI TERM
MODE
ID SELECT

DIGITAL-OUT
4 2 1 4 2 1

DRIVE CHANGER

SCSI cable (Accessory) SCSI IN

Fig. Connection of equipment

Setting:
• DIP switch settings

1 Set SCSI TERM to “ON”, and do not

connect other SCSI equipment as much SCSI TERM
as possible. MODE
ID SELECT

2 Set MODE to “ON”.

ON: Normal mode. Control the changer
using the PC. 4 2 1 4 2 1
OFF: Manual mode. Control the changer
manually using buttons. DRIVE CHANGER

3 Setting of SCSI ID of the drive

Set a desired ID number except 7.
Each SCSI ID must be set exclusively.

21
Settings on WINDOWS:

• To run this program in Windows, it must be set using the follow-

ing procedure before hand.

1. Select “SYSTEM” on the “CONTROL PANEL” on Windows.

2. Display the “CD-ROM” device from “DEVICE MANAGER”,

and select “SONY CD-ROM CDU625”.
(See following diagram.)

Uncheck “Sync
data transfer”

Uncheck “Auto
insert notification”

3. Uncheck “Sync data transfer” and “Auto insert notification” at

this screen.
4. Restart and the changes made will be set.

22
Operations:
1. Create a desired directory in the C drive of the PC used, and
copy the DWN-ASPI.EXE file, and HEX file provided (e.g.
625_XXX.HEX).
(The following assumes that the “CDJC50S” directory is cre-
ated.)
2. The downloaded program can be executed on Windows 95/98.
The following describes the state where the DOS prompt is ex-
ecuted from Windows 98. The following screen appears.

3. Set the directory copied with the program at item 1. Enter

“CD\CDJC50S” and press the ENTER key.

4. Enter “DWN-ASPI” and press the ENTER key. The following

screen appears.
(The following explains the example of rewriting the program
1.0W of the drive with 1.0Y.)

The HEX file in the directory executing the program is displayed.

23
5. Check that the HEX file copied in item 1 is present in the HEX
file displayed.
6. Press any key and end the program.
7. Enter the HEX file name checked at step 6 as “DWN-ASPI
625_XXX” and press the ENTER key.

File name copied at item 1.

8. The following screen appears. Check that the HEX file is cor-
rect and enter “Y”.

9. The following screen appears. If the ID is correct, enter “Y”.

(When “N” is entered, the CD-ROM drive of another ID will be
detected.)

The version of the program currently set.

24
10. The following screen appears. Press the ENTER key.

11. The following screen appears and files are downloaded one by
one.

25
12. When downloading is finished, the following screen appears.

Newly rewritten
program version

26
13. When “Complete” is displayed at all items, it means that down-
loading”. If “Failure” or “Verify Error!” is displayed, correct
the cause and repeat the procedure again.
Note:
If downloading failed halfway through, the CD-ROM device name
changes to CD ROM LOADER. Check system environment espe-
cially SCSI configration.
To download another time, select this device.
(The screen shows the following for step 10.)

14. To end, press the ESC key.

15. The POWER indicator and CHANGER indicator of the unit
light up. To set the changes, press the U button to turn OFF
the power, and press it again to turn ON the power again.”

27
Note: Note on repairring the Base Unit assy.

When opening or repairing the unit, grounding is required to pre-

vent damage caused by static electricity and is as follows:

1. Grounding for the human body

Be sure to wear a wrist-strap for grounding (with impedance
lower than 108Ω) whose other end is ground. The strap works to
drain away the static electricity build-up on the human body.
2. Grounding for the work table
Be sure to lay a conductive sheet (with impedance lower than
109Ω) on the table, such as a sheet of copper, which is ground.
3. As static electricity built-up on clothes does not drain away, be
careful not to let your clothes touch the unit.

1 Wrist-Strap for grounding

1MΩ

Flexible cable

1MΩ
Base unit assy

2 Conductive sheet or copper plate

4. Do not apply excessive force to the lens when wiping. Optical

device is structured by very sensitive mechanical parts. The lens
holding mechanism may have damage if excessive force is ap-
plied.

Cotton Swab

BU holder assy

28
 SECTION 2
GENERAL
LOCATION OF PARTS AND CONTROLS

Front Panel

1 2 3

8 7 6 5 4

1 u button
2 Emergency eject hole
3 OPEN button
4 POWER indicator
5 DRIVE indicator
6 CHANGER indicator
7 DISC SKIP + button
8 DISC SKIP – button

29
 SECTION 3
DISASSEMBLY
Note: Follow the disassembly procedure in the numerical order given.

3-1. FRONT PANEL

3 Connector
LED board: CN841 5 Bracket (illumination)
(with illumination assy)
To MAIN board 1 Screw (BVTT3x6)

4 Two screws (BVTT3x6)

2 Screw (BVTT3x6)

!£ Claw
Expand the front panel
in the direction of arrow A
to release catching claws.

6 Two screws
(BVTT3x6)
7 Two clamps

8 Screw
(BVTT3x6)

A 9 Beam !¢ Claw
Expand the front panel
MAIN borad: CN601 in the direction of arrow B
to release catching claws.
0 Connector
MAIN borad: CN602

!∞ Front panel
!¡ Flat type wire
(9 core)

!™ Six screws (BVTT3x10)

30
3-2. ILLUMINATION ASSY

While pressing arrows A,B, and

C, rotate the illumination assembly
in arrow direction D and remove it.

Note: Adhesives are given to these places.

ILLUMINATION ASSY

A C

3-3. CD MECHANISM DECK

5 Three screws !¢ CD mechanism deck

(BVTT3x10)
7 Connectotr 6 Connector
DISC SENSOR (S) board: CN53

8 Flat type wire !£ Earth wire

(12 core)
!∞ Screw
1 Screw !§ Screw (BVTT3x10)
(PTPWH2.6x8) (BVTT3x14) 9 Connectotr

0 Connectotr
2 Table (50)
!¡ Connector SW board: CN54

3 Two screws !¶ Connector

(+BV SUMITITE B3) TABLE SENSOR board: CN52

!• Connector
TABLE SENSOR board: CN51

4 Ring (B2) !™ Connector

MOTOR board: CN61

!ª CD mechanism base unit

31
3-4. BASE UNIT AND MAGNET HOLDER

3 Two screws Remove the torsion spring

5
(BTP2.6x8) and take out the magnet holder
with pulling up the
6 claw toward you.

1 Two screws
(BTP2.6x8)
2 Braket (DS) assy

9 Magnet holder
8 PC board assy
4 Two screws
(PTPWH2.6x8)

0 Torsion spring (Holder)

!£ Screw
!¢ BU holder assy (PTPWH2.6x8) !¡ Screw P(2x4)

!™ Leaf spring (BU)

!∞ Two screws
(M) step

!§ Two screws
(M) step

!¶ Base unit

32
 3-5. CD MECHANISM SECTION

NOTE:
Adjust the position of the gear
as shown in the figure when
attaching.

1 Screw
(BTP2.6x8)
2 Cover
(Lever)

9 Slider (Lock)

0 Slider (Cam)

8 Screw 3 Disc holder

(PTPWH M2) (B)

7 Cam cover
!£ Slider
(Loading)
6 Screw
(BTP2.6x8)
!¡ Disc holder A2
!¢ Tension coil spring (Lever)

!™ Torsion spring
(Loading)
!∞ Loading lever Assy

4 Screw 5 SW board
(BTP2.6x8)

33
 SECTION 4
MECHANICAL ADJUSTMENTS
4-1. DISC HOLDER A ADJUSTMENT/CHUCKING Remove the screw and clamp
PULLEY POSITION ADJUSTMENT Remove these screws

Proceure: Remove this plate

1. Remove the plate shown in figure with the power OFF. (Fig.1)
2. Remove the shield, set the DIP switches on the back panel as
shown below.

SCSI TERM
MODE PARITY
ID SELECT

Fig. 1
4 2 1 4 2 1 OFF
OFF OFF Remove the Disc holder A2
DRIVE CHANGER shield.

3. Press the U button to turn ON the power, and press the OPEN
button to open the front door. Insert a disc in the “PLUS ONE”
slit. Prease use a flat disc.
Note: If the “PLUS ONE” slit is not at the front, press the OPEN
button and the “PLUS ONE” slit will come to the front auto-
matically.
4. Close the front door. The disc table rotates and the disc is
chucked. Pulley
5. Press the U button to turn OFF the power.
6. While pressing the OPEN button, DISC SKIP – button, and Fig. 2
DISC SKIP + button simultaneously, press the U button to Disc
turn ON the power. (Keep on pressing three buttons untill
CHANGER LED is flasing.)
7. Continue pressing the DISC SKIP + button until loading end.
8. Rotate the pulley with finger (Fig. 2) to stop the disc holder A2
slightly away from the disc (Fig. 3). Disc holder A2
9. Check that disc holder A2 is not touching the disc, and adjust
the adjusting screw A until the edge of the disc meets the edge
of the disc holder as shown in the figure. (Fig. 4, Fig. 5) Fig. 3

Disc

Clearance:0.1 to 0.3mm
Disc holder A2
Fig. 4

Apply screwlock

No clearance

BU holder
NOTE) No screwlock at the BU holder

Adjusting screw A

Disc Base loading

Fig. 5

34
10. After adjusting, apply screwlock. 15. After adjusting, apply screwlock.
11. Continue pressing the DISC SKIP – button. After loading out, 16. By pressing the DISC SKIP + and DISC SKIP - button, check
continue pressing the DISC SKIP + button until loading in the loading in and out operations can be performed properly.
again. 17. Remove the disc and press the U button to turn OFF the power.
12. Check that the disc is at the position adjusted to in step 7. 18. Set the DIP switch as below and attach the shield.
13. Continue pressing the DISC SKIP + button until loading end.
14. Visually check the chucking pulley, and adjust the adjusting
screw B shown in the figure so that the positional relation of the SCSI TERM
holder (magnet) and chucking pulley satisfies the specified val- MODE PARITY
ues. (Fig. 4, Fig. 5). ID SELECT

A
B
Holder

4 2 1 4 2 1 ON Attach the shield.

DRIVE CHANGER

19. Attach the plate removed in step 1.

Chucking pulley

Fig. 6

No clearance
Adjusting screw B

Apply screwlock

Fig. 7

Specified value: Clearance A = Clearance B

35
4-2. DISC SENSOR ADJUSTMENT 6. Press the DISC SKIP – button. The disc table starts to rotate in
the counterclockwise direction.
Connection: MAIN Board 7. Check that the waveform on the oscilloscope is the same as that
adjusted in step 5. Repeat from step 4 if it is not.
MAIN board 8. Tighten the fixed screw C properly to secure the holder (sensor
CN606
R). Check the adjustment in step 4 to 7.
oscilloscope
4 9. Apply screwlock and press the U button to turn OFF the power.
3 SENS 10. Remove the oscilloscope connected in step 1.
TP: Pin 1 11. Set the DIP switch as below and attach the shield.
2 GND
SENS: Pin 3
1 T.P GND: Pin 2
SCSI TERM
MODE PARITY
Note: Remove all discs before adjustment. ID SELECT
Procedure:
1. Connect the oscilloscope to CN606 of the MAIN board as shown
in the connection diagram.
2. Remove the shield, set the DIP switches on the back panel as
4 2 1 4 2 1 ON
shown below. Attach the shield.
DRIVE CHANGER

SCSI TERM
MODE PARITY
You can change the direction dinamically by pressing DISC SKIP+,
ID SELECT
DISC SKIP– button while adjustment mode.
You can stop rotation by pressing OPEN button.

Adjustment Location :
OFF 4 2 1 4 2 1
OFF ON Remove the shield.
[ MAIN BOARD ] — Side B —
DRIVE CHANGER

3. While pressing the OPEN button, DISC SKIP – button, and

DISC SKIP + button simultaneously, press the U button to
turn ON the power. (Keep on pressing three buttons untill
CHANGER LED is flashing.)
4. Press the DISC SKIP + . The disc table starts to rotate in the
clockwise direction. 18 1
5. Loosen the fixed screw C to move the holder (sensor R) and
secure it when the H portion of the T.P. waveform of the oscillo- IC603
scope comes to the center of the H portion of the SENSOR wave-
form. 10 9

CN606

SENS
GND
SENSOR T.P

T.P

Set to the center approximately.

More
than
10ms

Apply screwlock

Holder

Fixed screw C

36
 SECTION 5
ELECTRICAL ADJUSTMENTS
5-1. TOOLS AND MEASURING INSTRUMENTS 5-1-2. Setting Single-Operation of CDM-56 Mechanism
Block
5-1-1. GENERAL AND SPECIAL TOOLS LIST
Jig
The tools and measuring instruments for performing maintenance CD test disc (YEDS-18) : 3-702-101-01
on the CDM-56 series are listed below.

5-1-1-1. General Tools MAIN BOARD

SONY Parts No.
⊕Driver 2mm (7-700-749-01) CDM-56
⊕Driver 2.6mm (7-700-749-03)
Tweezers (7-700-753-02)
Round Nose Plier (7-700-757-01)
Cutter (7-700-758-02)
Soldering Iron (20W)
Desoldering Metal Braid (Solder Wick)
Multi Meter (DRM)

5-1-1-2. Special Tools

IBM PS/VP System

CNJ201
PS/VP and the monitor (640kbyte RAM, 3.5" FDD, HDD, Video
RAM-CGA or Higher, DOS Ver. 6.2 or later)
SCSI board AVA-2904E that is supplied as an accessory of CDJ-
500 or equivalent. Single-Operation of CDM-56
Active Speaker 1. Chuck the disc beforehand.
SCSI cable (Attached or equal cable) 2. Set the COMMAND SW of the controller to the test mode.

5-1-1-3. Test Disc ID2 ID1 ID0 PARITY

ON OFF ON ON
SONY Test Disc (YEDS-18) (3-702-101-01)
SONY Test Disc (TGRS-21) (J-2501-110-A)
3. While pressing the TEST button of the MAIN BOARD, turn
on the power of the CDJ-C50S or power supply unit.
5-1-1-4. Measuring Equipments
4. After about 1 second later, release the TEST button.
5. This sets the test mode. To enter the other mode, refer to the
Osilloscope Dual Trace 20MHz (probe x10)
following table, set the dip switch, and press the TEST button.
DC Volt Meter (min. 10mA)
Setting of Single-Operation Mode
5-1-1-5. Software

ATP625 Disc (CDM-001) (J-2501-173-A) Mode ID2 ID1 ID0 PARITY

Field50. EXE Disc (CDJ-001) (J-2501-172-A) (*NOTE) Test Mode ON OFF ON ON
Dwn-Aspi. EXE (CDM-002) (J-2501-176-A) (*NOTE)
Update f. EXE Disc (CDJ-002) (J-2501-175-A) (*NOTE) Command list of Single-Operation Mode
*: marked is refer to SERVICING NOTE
Mode ID2 ID1 ID0 PARITY
5-1-1-6. Expendable and Chemical Supplies Initialize ON ON ON ON
x1 speed ON ON OFF ON
Cotton Swab (200 pieces) (7-740-900-65) x4 speed ON OFF ON ON
Lens Cleaning Liquid (J-2501-000-A) x8 speed ON OFF OFF ON
Molykote Grease (EM-30L) (4-918-645-01) x12 –x24(Partial CAV) speed OFF ON ON ON
Hanarl (SFL-9) (7-400-000-00) Tracking servo OFF ON ON OFF OFF
Tracking servo ON ON ON ON OFF
PlayAudio (23’47”) OFF OFF ON ON
PlayAudio (5’00”) OFF ON OFF ON
PlayAudio (55’00”) OFF OFF OFF ON

37
5-1-3. SYSTEM CONFIGURATION Setting of SW and Configuration file.

5-1-3-1. Set up PS/VP System AHA-1520B (for ISA BUS)…

All of DIP SW (1 to 4) are OFF.…
a. Add the ANSI.SYS (Device = ANSI. SYS) and ASPI 8 DOS.SYS AHA-2940 (for PCI BUS)…AVA-2904E (for PCI BUS)
in Config. SYS. No Jumper and SW setting on the board.
(Refer to Instruction Manual for more detail) Use default parameter for SSI Select configuration utility.
b. Set the jumpers on the Adaptec SCSI Interface board as follows. It is not necessary to install the device driver when using on the
(Refer to Instruction Manual for Adaptec SCSI board AHA- windows ’95.
1520B or 2940 in detail) It is necessary to install the device driver at first line of config.
sys when using on DOS.
c. Install the SCSI Interface board in the PS/VP System.

5-1-3-2. System Configuration

Note: AVA-2904E is supplied as an accessory of the set.

PS/VP System
SCSI Interface board
Adaptec AHA-1520B or 2940 or AVA-2904

Attached or egual cable

ATP625 Disc
Firmware Program Disc To SCSI IN

SONY Test Disc

(TRGS-21) (for ATP) Active Speaker

ATP/DOWNLOAD System

38
 Dip SW

MAIN PCB

CDM-56

*Note:
It is not needed to disconnect the internal SCSI cable.
SCSI TERM : ON
MODE : OFF
SCSI TERM
MODE TEST
S707 S706
SW601
ON

OFF

ID2 ID1 ID0 PARITY

Dip SW MAIN BOARD

Function check

39
5-2. TROUBLE SHOOTING

This section describes trouble shooting methods. c. Program error of host system
Section 4-2-2. shows the flowchart of the processing routine of the d. The SCSI TERM of DIP SW on the rear of set is not set to ON.
unit. Section 4-2-3. describes the ATP procedures. These sections e. Wrong Drive Number selection
define the detective parts under operating conditions. f. Wrong supply voltage
g. Environmental conditions (where electrical noise easily jumps
5-2-1. BEFORE TROUBLE SHOOTING into signal)
h. Influence of strong magnetic field.
The following procedures are recommended to verify if the drive is
really faulty or not:
a. Poor connection with the host system
(esp. GND-related connection, frame GND, etc.)
b. Incorrect operational procedure.

5-2-2. FLOWCHART FOR TROUBLE SHOOTING

START

ATP Fail
(Refer to section 5-2-3.) Optical Pick-up Cleaning

Pass
Perform drive
Pass
function check
(Refer to section 5-2-4.)

END Fail

Part Replacement

40
5-2-3. PROCEDURE OF ATP TEST

5-2-3-1. Pre-setting

a. Connect the CDJ-500 to the Computer. (Refer to Fig. 5-1-3-2.)

b. Set the Jumpers on the Adaptec SCSI board. (Refer to Fig. 5-1-3-2.)
c. Set the COMMAND SW of back panel as below.

ID2 ID1 ID0 PARITY

OFF ON ON ON

d. Turn on the power of Computer.

e. After loading the system, “C >” is displayed on the screen. Then,
insert ATP625 Disc. (Carry out before starting up with Dos
prompt.)
f. Change the directory in the drive A. (“A >” is displayed on the
screen.)
g. Type A T P 6 2 5 and hit Enter key. (After loading the test
program, Display 5-2-3-1. (a) shows up.)

Sony SCSI CD-ROM Failure Verification Test Ver. 1.03.00 [MAR. -04-1997]
[ID:7]=ASW-1210 V 3.60 ADAPTEC AHA-1520ADAPTEC AHA-1520
ATP625.CFG X-XXX-XX-XX
00: Inquiry Check
01: TEST UNIT READY
02: TOC Read
03: Incremental Read
04: Random Seek &Read Drive Status Column
05: Spin Up/Down (X1)
06: Spin Up/Down (X4)
07: Spin Up/Down (MAX)
08: Full seek Read (X1)
09: 1/3 seek Read (X1)
10: Full seek Read (X4)
11: 1/3 seek Read (X4) Hit any key to start or Esc to exit.
12: Full seek Read (MAX)
13: 1/3 seek Read (MAX) ?
14: Play Audio (De-TRCK)
15: Play Audio (E-Volume)
16: Play Audio (Play Mode)
17: Play Audio (X’Talk L->R)
18: Play Audio (X’Talk R->L)
19: Sub Code Read

Display 5-2-3-1. (a)

41
5-2-3-2. Test Procedure

TEST item Check point

To execute ATP test of the drive.

1. Hit any key to start ATP test.
Note:
When some errors occurr during the test, “ A bort R etry I gnore”
message will be displayed i=on the drive status column, at that time
hit A key to exit and then check which part is broken in accordance
with 3-4.
Note:
If each test result satisfies the specification, the word of “Pass” or
value of the test result will be displayed on the judgement column.
a. Inquity check test will be executed.
b. “Returned Data OK ? (Y/N) = >?” message will be displayed
on the drive status column, then check the inquiry data and
hit Y key.
c. When “Place CD-ROM TEST DISC (TGRS-21)...” is dis-
played, press the OPEN button of the CDJ-500 to open the
door, insert the TGRS-21 DISC to the front slot and close the
door.
The TEST DISC will be carried to the DRIVE (CDM-56)
automatically, and the disc will be chucked.
d. TOC Read test will be executed.
e. Incremental Read Test will be executed.
f. Random Seek & Read test will be executed.
g. Spin Up, Spin Down test (normal) will be executed.
h. Spin Up, Spin Down test (quadruple) will be executed.
i. Spin Up, Spin Down test (Max) will be executed.
j. Full seek test (normal) will be executed.
k. 1/3 seek test (normal) will be executed.
l. Full seek test (quadruple) will be executed.
m. 1/3 seek test (quadruple) will be executed.
n. Full seek test (Max) will be executed.
o. 1/3 seek test (Max) will be executed.
2. After Seek test completion, Play Audio (DeTRCK) test will be The music (both left and right channel) can be heard from the ac-
executed. tive speaker.
a. “Hit any key when ready” message will be displayed on the
drive status column, then hit any key.
b. Play Audio (E-Volume) test will be executed. The music (both left and right channel) will be faded-out slowly.
(After several minutes, the drive is set to mute mode.)
c. “Any key when Okay or Esc when NG” message will be dis-
played on the drive status column, then hit any key.
d. Play Audio (Play Mode) test will be executed. The music (both left and right channel) can be heard from the ac-
tive speaker. And the play mode can be changed by pushing some
key.
e. “Space bar when ready, ESC to abort” message will be dis- (Refer to Drive Status Column)
played on drive status column, then hit space bar.
f. Play Audio (X’Talk LnR) test will be executed.
The sound (only left channel) can be heard for 3 sec. from the ac-
g. “Any key when Okay or Esc when NG” message will be dis- tive speaker.
played on drive status column, then hit any key.
h. Play Audio (X’Talk RnL) test will be executed.
The sound (only right channel) can be heard for 3 sec. from the
i. “Any key when Okay or Esc when NG” message will be dis- active speaker.
played on drive status column, then hit any key.
3. After Audio test completion, Sub Code Read test will be ex-
ecuted.

42
 TEST item Check point

4. After sub code Read test completion, Door will be opened auto- The disc will automatically be unchucked, the door will be opened.
matically. The ATP test ends. Remove the disc when the door is opened.
Note:
If all of test items are completed, words of OK will be displayed on
the screen.If not, NG will be displayed.

Sony SCSI CD-ROM Failure Verification Test Ver. 1.00.00 [Nov. -22-1996] Sony SCSI CD-ROM Failure Verification Test Ver. 1.00.00 [Nov. -22-1996]
[ID:7]=ASW-1210 V 3.60 ADAPTEC AHA-1520ADAPTEC AHA-1520 [ID:7]=ASW-1210 V 3.60 ADAPTEC AHA-1520ADAPTEC AHA-1520
ATP625.CFG ATP625.CFG

00: Inquiry check [ Pass ] [ ID:3 ]=SONY CD-ROM CDU625 X.Xx 0: Inquiry check [ Pass ] [ ID:3 ]=SONY CD-ROM CDU625 X.Xx
01: TEST UNIT READY [ Pass ] READY 1: TEST UNIT READY [ Pass ] READY
02: TOC read [ Pass ] 2: TOC read [ Pass ]
03: Incremental Read [ Pass ] 3: Incremental Read [ Pass ]
04: Random Seek & Read [ Pass ] 4: Random Seek & Read [ Pass ]
05: Spin Up/Down (X1) [ Pass ] Spin Up : XXXX [ms] Spin Down : XXX [ms] 5: Spin Up/Down (X1) [ Pass ] Spin Up : XXXX [ms] Spin Down : XXX [ms]
06: Spin Up/Down (X4) [ Pass ] Spin Up : XXXX [ms] Spin Down : XXX [ms] 6: Spin Up/Down (X4) [ Pass ] Spin Up : XXXX [ms] Spin Down : XXX [ms]
07: Spin Up/Down (Max) [ Pass ] Spin Up : XXXX [ms] Spin Down : XXXX [ms] 7: Spin Up/Down (Max) [ Pass ] Spin Up : XXXX [ms] Spin Down : XXXX [ms]
08: Full seek Read (X1) [ Pass ] Max : XXXX [ms] Ave : XXXX [ms] 8: Full seek Read (X1) [ Pass ] Max : XXXX [ms] Ave : XXXX [ms]
09: 1/3 seek Read (X1) [ Pass ] Max : XXXX [ms] Ave : XXXX [ms] 9: 1/3 seek Read (X1) [ Pass ] Max : XXXX [ms] Ave : XXXX [ms]
10: Full seek Read (X4) [ Pass ] Max : XXXX [ms] Ave : XXXX [ms] 10: Full seek Read (X4) [ Pass ] Max : XXXX [ms] Ave : XXXX [ms]
11: 1/3 seek Read (X4) [ Pass ] Max : XXXX [ms] Ave : XXXX [ms] 11: 1/3 seek Read (X4) [ Pass ] Max : XXXX [ms] Ave : XXXX [ms]
12: Full seek Read (Max) [ Pass ] Max : XXXX [ms] Ave : XXXX [ms] 12: Full seek Read (Max) [ Pass ] Max : XXXX [ms] Ave : XXXX [ms]
13: 1/3 seek Read (Max) [ Pass ] Max : XXXX [ms] Ave : XXXX [ms] 13: 1/3 seek Read (Max) [ Pass ] Max : XXXX [ms] Ave : XXXX [ms]
14: Play Audio (DeTRCK) [ Pass ] 14: Play Audio (DeTRCK) [ NG ]
15: Play Audio (E-Volume) [ Pass ] 15: Play Audio (E-Volume) [ Pass ]
16:
17:
18:
19:
Play Audio (Play Mode)
Play Audio (X’Talk L->R)
Play Audio (X’Talk R->L)
Sub Code Read
[ Pass
[ Pass
[ Pass
[ Pass
]
]
]
] LOAD : 4758 [ms]
OK 16:
17:
18:
19:
Play Audio (Play Mode)
Play Audio (X’Talk L->R)
Play Audio (X’Talk R->L)
Sub Code Read
[ Pass
[ Pass
[ Pass
[ Pass
]
]
]
] LOAD : 4698 [ms]
NG
Remove the DISC Hit any key when ready Remove the DISC Hit any key when ready

Note:
Even if one of items has an “NG”, the result of test will be reqarded
as NG.

43
5-2-4. DRIVE FUNCTION CHECK 5-2-4-1. Pre-Setting for Test Mode Operation

Since CDM-56 models is adjustment-free drive, there is no potenti- Note: This section is performed only specified following sections.
ometer fo electrical adjustment in the MA-C30 Mounted Board. Note: This section describes usages of Test Mode Operation and
Therefore BU or MA Mounted Board can be swapped over without signal checking on the CDM-56 drives with the with the
any manual adjustment so that you will easily find defective com- COMMAND SW on the back panel and the TEST button
ponents (if the trouble depends on BU or MA Mounted Board). (MAIN board).
(Refer to 5-2-4-2.)
Note: All of adjustment items, will be automatically performed af-
ter power-on by the function of CD DSP IC.
The page 23 shows the sequence of execution items in Power- SCSI TERM
On Reset Actions. It will help you finding any defective point MODE S706
on the drive to know the specified processing sequence of the S707
ON
auto adjustment items and drive’s action in the Power-On Re-
set Actions. OFF

ID2 ID1 ID0 PARITY

Preparing
The following tools and measuring equipments are necessary for
performing this section.
Oscilloscope TEST
Sony Test Disc (YEDS-18) (3-702-101-01)
SW601

a. Set the COMMAND SW on the back panel as below.

ID2 ID1 ID0 PARITY

ON OFF ON ON

b. While pressing the TEST button of the controller, turn on the

power of the CDJ-C50S.
d. About 1 second later, release the TEST button.

Note: Even if drive is Test Mode, OPEN button is activated.

44
5-2-4-2. Flowchart

Note: These flowchart is described assuming that IC failure causes any trouble.

Start

Mechanical or Electrical trouble ? Mechanical Checking/Repairing

Mechanical

Electrical

IC303 (CPU) failure

Nothing in action in Power-On ? IC305 (gate-array) failure
No action IC304 (Flash-ROM) failure
Proceeding Adjustment Action

BU/Main PWB/HP PWB BU/OP checking/Replace BU

dependent ? HP PWB checking
(check by swapping BU or PWBs.) BU dependent
HP PWB dependent

Main PWB dependent

Power-On Reset actions Completes or IC201 (CD DSP/servo IC) failure

Failed/action NG ? IC101 (RF Amp IC) failure
Failed /NG
Drive ICs failure

Completed

Refer to Flowchart (2)-Power-on Reset Actions

SCSI command execution

IC301 (CDROM/SCSI I/F IC) failure
communication OK or NG ?
NG IC304 (Flash-ROM) failure
(check with any SCSI command)

OK

Access Time NG IC201 (CD DSP/servo IC) failure

Read Operation
Motor Driver ICs failure

OK

End
IC301 (CDROM/SCSI I/F IC) failure
Read Data Error IC302 (buffer RAM) failure

Flowchart (1) Repairing/Trouble Shooting-General

45
 Power on Reset Action
Failed/Action NG

Retry for detailed checking

Focus Search (Refer to 5-2-4-6.) IC101

Trouble/Failed in Step (2)-(11) IC201
Spindle Motor Driver IC (Refer to 5-2-4-11.)
(Spin-up/Focus-on) NG IC106
RF Signal (Refer to 4-2-4-13.)

OK/Passed

Trouble/Failed in Step (12)-(15) Check Focus/Tracking Servo Error Signal IC101

(Auto Adjustment Functions) NG RF Signal (Refer to 5-2-4-13.) IC201

OK/Passed

Trouble/Failed in Step (16)-(21) RF Signal (Refer to 5-2-4-13.) IC101

(Read TOC/Set x8 speed) NG Spindle Motor Driver IC (Refer to 5-2-4-11.) IC106

OK/Passed

OK/Completed
(Try Read operation)

Flowchart (2) Repairing/Trouble Shooting-Power-on Reset Actions

46
Power on Reset Actions

Step Item Drive Action

(1) Drive Power-On
(2) Sled Offset/Hall element Adjustment
(3) Tentative spindle servo gain setting
(4) LD On LD to turn on
(5) Focus Search OP lens to move up and down
(6) Focus On
(7) Spindle servo gain setting
(8) Tracking Servo On
(9) Spindle Servo On
(10) — sync pattern detection —
(11) Focus Bias Voltage Auto Adjustment
(12) Focus Servo Gain Auto Adjustment (You will hear a small beep sound from the drive during these auto adjustment.)
(13) Track Servo Gain Auto Adjustment
(14) — sync pattern detection —
(15) Disc Diameter (8cm/12cm) Detection (You will see RF Signal with Spindle-Kicking waveform.)

(16) Read TOC

(17) Jump to 00:02:00
(18) — Subcode-Q detection —
(19) Disc Linear Speed Detection
(20) Set max. rotational speed
(21) — sync pattern detect & subcode-Q detection—
— Completed —

Note: When a disc is replaced, the above steps excluding item (1) to (3) will be executed.
The item (1) to (3) will be performed only after power-on.

47
5-2-4-3. Test Command List 5-2-4-5. Sled Gear Train

ID2 ID1 ID0 PARITY Drive Action Check the mechanical burden
ON ON ON ON Initialize Drive
ON ON OFF ON Set Normal Speed a. Disassemble the CHUCK HOLDER.
ON OFF ON ON Set Quadruple Speed b. Check if there is any broken tooth in the gears.
OFF OFF ON ON Play Audio (from 23’47”) c. Try to move sled gears by hand and check if it gets unsmooth in
ON ON ON OFF Tracking Servo on certain position.
ON ON OFF OFF Tracking Servo off d. In case there is unsmooth protion, replace Base Unit Ass'y.
OFF ON OFF ON Play Audio (from 5’00”)
OFF OFF OFF ON Play Audio (from 50’00”) 5-2-4-6. 2-Axis Actuator
OFF ON ON ON Partial CAV (x12–x24)
Check Focus search operation
OFF : PARITY or ID0 – 2 test point to be high (5V).
ON : PARITY or ID0 – 2 test point to be low (Ground). a. Disassemble the CHUCK HOLDER so that the optical pick-up
is exposed.
Command Execute b. Turn on the drive power and watch if the objective lens moves
In the test mode, above listed function can be executed. Turn on upward and downward.
COMMAND SW on the back panel of CDJ-500. c. If the lens does not move, check the resistance of the 2-axis ac-
The command will be latched by TEST down edge, and executed tuator coils. It should be 6.1±1.1Ω between FCS+ and FSC–.
by rising edge.

Command Setting

PARITY or ID0 – 2

TEST

Command Execute
(RELEASE TEST button) FCS+
TRK+
Command Latch TRK–
(PUSH TEST button) FCS–

5-2-4-4. Spindle Motor d. Otherwise replace the optical device.

e. If the coils are normal, replace the Driver IC (IC103).
Check resistance
a. Pull the spindle motor flexible cable out from the connector. 5-2-4-7. Focusing (Focus Bias)
b. Measure the resistance between 3 motor terminals respectively
(u-v, v-w, w-u). a. Insert any discs into the drive after the check of 5-2-4-4.
c. The resistance shall be 8Ω ± 10%. b. Check if the drive can make a focus.
d. Otherwise replace the motor. c. In case of failure, it is possible that Focus Bias or Focus Gain
Servo circuit had not been controlled well.
d. So watch RF signal by a oscilloscope and see if the quality is
good or not.
e. In case the quality is not good, check servo circuit.

5-2-4-8. Laser Power

Check Laser beam

W a. Disassemble the drive so that the optical device is exposed.

V
U b. Turn on the drive power and look into the objective lens care-
fully while the drive is in process of focus search.
Check noise from spindle motor c. Check if the red beam comes out from the optical pick-up.
a. Listen carefully the sound from the spindle motor while drive is Warning: Do not look into LD beam closely with naked eyes.
spinning up. d. In case of no beam from optical device, the LD must have been
b. If you hear the strong striking noise from the motor, it is sus- broken down, so replace the optical pick-up.
pected that there is too much clearance between the bearing metal
and the shaft, that is; NG motor!!

Note: As the CDM-56 adopts the CAM motor for the spindle mo-
tor, clattering sounds of the ball bearings are produced dur-
ing spinning up and spinning down.
Differentiate these from slipping sounds.

48
Check Laser Current 5-2-4-9. Chucking Mechanism

a. Touch the IOP test land IOP on the MA-C30 Mounted Board. a. Listen the sound from the drive while the drive is spinning up.
b. Measure the voltage generated by the laser current while the b. Check if there is any slipping noise among the Turntable, the
drive in process of focus search. Chucking Pulley Ass'y and the Disc.
c. It is supposed to be about 4.5V because the voltage of IOP will c. If you hear any, check the mechanical adjustments (SECTION 4).
drop by IOP x10Ω from 5V-A. d. Otherwise disassemble the drive and check if there is excessive
d. Otherwise replace the optical pick-up. dust or any contamination on the Turntable or the disc.
Note: As the CD-56 adopts the VCAN (Vibration Cancel) motor
Check G Sensor for the spindle motor, clattering sounds of the ball bearings
are produced during spinning up and spinning down.
a. Pull the SE-C7 P. W. B. cable out from the connector. Differentiate these from slipping sounds.
b. Measure the resistance between 3 terminals respectively.
(VSG-GND, GND-5V) 5-2-4-10. Sled Motor
c. The resistance should be 3.7 ± 1MΩ between VSG and GND,
and 94 ± 6kΩ between GND and 5V. a. Disconnect the SE-C7 P. W. B. cable from the SE-C7 board.
b. Check the resistance between 2 terminals of sled motor.
c. It should be 10.8Ω ± 10%.

VSG
GND
5V

[MA-C30 BOARD] (SIDE B)

TP IOP
Laser Current Check

CNJ102 CNJ103

IC106

IC104

CNJ201

CNJ104

49
5-2-4-11. EF Balance 5-2-4-12. RF Level

Note: Note:
• Before performing electrical block checks, solder a lead wire to • Before performing electrical block checks, solder a lead wire to
TP RF EQ, TP VC, and TP TE of the MA-C30 board. TP RFEQ and TP VC of the MA-C30 board.
• Chuck the disk (YEDS-18) beforehand. • Chuck the disk (YEDS-18) beforehand.
• Refer to 5-2-4-1. and set the test mode. • Refer to 5-2-4-1. and set the test mode.
• Insert a SONY test disc (YEDS-18) into the test drive. • Press the OPEN button to open the door, place the disc in the
• Press the OPEN button to open the door, place the disc in the slot in front, close the door to chuck the disc.
slot in front, close the door to chuck the disc.
1. Connect the oscilloscope to TP RF and TP VC of the MA-C30
1. Connect the oscilloscope to TP TE and TP VC of the MA-C30 board.
board. 2. Set the COMMAND SW of the controller to INITIALIZE and
2. Set the COMMAND SW of the controller to INITIALIZE and press the TEST button.
press the TEST button.
ID2 ID1 ID0 PARITY
ID2 ID1 ID0 PARITY ON ON ON ON
ON ON ON ON
3. Set the COMMAND SW of the controller to x1 speed, and press
3. Set the COMMAND SW of the controller to x1 speed, and press the TEST button.
the TEST button.
ID2 ID1 ID0 PARITY
ID2 ID1 ID0 PARITY ON ON OFF ON
ON ON OFF ON
4. Set the COMMAND SW of the controller to Play Audio (23’
4. Set the COMMAND SW of the controller to Play Audio (23’47”), 47”), and press the TEST button.
and press the TEST button.
ID2 ID1 ID0 PARITY
ID2 ID1 ID0 PARITY OFF OFF ON ON
OFF OFF ON ON
5. Check that the oscilloscope waveform is clear, and the RF level
5. Set the COMMAND SW of the controller to tracking off, and is proper.
press the TEST button. * A clear RF signal waveform is as follows.
ID2 ID1 ID0 PARITY
ON ON OFF OFF
6. Check the level B of the oscilloscope’s waveform and the A (DC level : 0.9V –1.6 V
voltage) of the center of the Traverse waveform. (RF Level Specification)
Confirm the following:
• A/B x 100 = less than ±22 (%)
Center of the waveform

Removing the disc

B (Traverse level) Press the OPEN button. The disc unloads from the drive,
comes to the front automatically, and the door opens.
0V (VC) A (DC voltage)
Loading the disc
Press the OPEN button to open the door, place the disc in the
slot in front, then close the door with your hand.
7. After checking, set the COMMAND SW of the controller to The disc will automatically be chucked in the drive.
tracking on, and press the TEST button.

ID2 ID1 ID0 PARITY

ON ON ON OFF

50
 SCSI TERM
MODE S706
S707
ON
OFF

ID2 ID1 ID0 PARITY

TEST
SW601

Adjustment Location :

[ MA-C30 BOARD ] — Side B —

TP VC
RF Level Check & EF balance Check

CNJ102 CNJ103

IC106

IC110

IC104

CNJ201 TP RF (RF EQ)

RF Level Check
TP TE
EF balance Check

CNJ104

51
 SECTION 6
THEORY OF OPERATION
P-CAV Drive Disc In Balalaned Disc cancellation function

By using latest P-CAV (partical CAV) technology, the CDM-56 re- 1 VCAN (Vibration Cancel) motor adopted by SPINDLE
alizes data transferring with variable transfer rate, from 12* (in- CDM-56 has new type of spindle motor that cancels imbalance of a
ner track) to 24X (outer track). disc automatically. Thanks to the new spindle motor, self -vibration
Achieving 20X (3000kBytes/s) average data transfer rate, the CDM- of the drive is reduced when the drive reads the imbalance disc.
56 shows excellent performance.
*In the case of scanning velocity 1.3m/s and 60 min. disk reading. 2 Shock sensor adopted
CDM-56 has a feature that can detect excess vibration caused by
FUNCTION OF PARTICAL CAV imbalance disc. Thanks to this feature, CDM-56 (CDM-57) auto-
CDM-56 (Drive unit) features Partical CAV capability for Maxi- matically reduce it's spindle speed to 8X-20X CAV mode when
mum Speed, taking advantage of Wide Capture Range capability of such imbalance disc is inserted. It contributes to less vibration, less
PLL (Phase Locked Loop) in its fastest speed mode. audible noise, better readability and provides comfortable operat-
ing condition to end user.
Refer to the illustration on the left-hand side;
Capable of Reading CD-RW disc
Spindle Motor rotates constantly at approximately 6,000 rpm, equal CDM-56 has the capability of reading CD-RW disc. CDM-56 can
to the rotational speed of 12X CLV on the innermost track, in the automatically adjust RF amp gain and error amp gain to the proper
area between the innermost track and the point of approximately 39 value for CD-RW disc, when CD-RW disc is inserted. But CDM-
minuites (CAV area). 56 can read CD-RW disc only at 4X speed.

In the disc area outside the fore said 39 minutes, the spindle motor Fast Access Time
follows the spindle speed curve of 24X CLV (CLV area). Random access time is 90 ms* at P-CAV mode, which reduces vi-
bration of spindle rotational speed so that the access time improved.
Spindle Rotational Speed
Power Saving Mode
Spindle Rotational Speed CDM-56 has a power saving mode. If any command which requires
12X-24X CAV area disc access (such as READ or SEEK command) is not issued to the
6000 drive for more than the inactivity time, which can be set by mode
24X CLV area
select command, the drive goes into "standby mode" automatically.
Any command that requires disc access can resume the drive from
5000 "standby mode".

0 39 60
Adress on the disc (min)

Data Transfer Rate

Average 20X
Data Transfer Rate (x 150kB/s)

24X

12X

0 39 60
Adress on the disc (min)

52
 CDJ-500
SECTION 7
DIAGRAMS

AC FILTER board

LED board D. SW board

P. JACK board

D. OUT board
P. SW board
SCSI OUT board

SCSI IN board

POWER board
KEY board

MAIN board

DOOR MOTOR board

DISC SENSOR (S) board

TABLE SENSOR board

SE-C7 board

DISC SENSOR (R) board

MA-C30 board

CHUCK SW board
MOTOR board

53 53
CDJ-500

7-2. BLOCK DIAGRAMS RF 1

DIGITAL SERVO,

RF1, RF3

RF3
– CD-ROM DRIVE (1/2) SECTION – DIGITAL SIGNAL PROCESSOR
IC201

VCOREF 29
Q202 IC202
PDOS 22
SWITCH LPF
OPTICAL PICK-UP PDO 23
BLOCK (SPU3212) + TMAXS 24 SRPLL
SWITCH WRPLL
RF AMP TMAX 25
IC101 Q207 LOCK
LPFN 26 LOCK
DETECTOR
LPFO 27
TNI RFNZ
E 9 7 30
RF3 LRCK
97 XHSO LRCK 100 LRCK
10 AGC IN BCK
FNI 27 BCK 2 BCK
+ 4 Q102, 104
IPF 6
C2P0
C2P0
A C 13 RFO
RF AMP 28 EQ SW AOUT 3 MDT
B D 11
FPI RFGO RFEQ SBOK 7 SBOK
+ 5 25 33 RFI
DATA 11
SBS
SBS
12 RFRPIN SOL102
24 SFSY 12 SFSY
FE
TPI FOCUS FEO
F 8 6 38 FEI SBSY 13 SBSY
ERROR 16 SBCK
AMP CLCK 8 SBCK
FEN
17 SDL101 DOUT 4
TE Q205, 206
TRACKING TEO L
ERROR 14 41 TEI LO 80 AUDIO
AMP GVSW MUTE J451
LASER INVERTER RO 77
TEN ANALOG OUT
DIODE 13 Q103 42 TEZI R
GVSW 26 46 RFGC Q203
LD Q101 RFGC
2 35 RFCT MUTE
14 14 LD LDO RFCT XAMUTE
9 22 37 RFRP SW
DRIVE RFRP
20 36 RFZI
AUTO SBAD IC451
15 39 SBAD
LD POWER 2VRO 2VRO OPTICAL
CONTROL 12 51 2VREF
POWER TEB D OUT 4 DIGITAL
11 20 P2VREF OUT
15 MDI SEL BUS 0 85 BUS 0

PD
8 10

GMAD 3
Q105
SWITCH
RF3
47
52
TEBC
SEL
BUS 1
BUS 2
86
87
BUS 1
BUS 2 A
BUS 3 88 BUS 3
VRO 19 VC 69 PXI
BUCK 91 BUCK
(Page 55)
X201
40MHz XCCE 92 XCCE
70 PXO
XRST 95 XRST

FLG A 53 FLG A
TRACKING FLG B 54 FLG B
TRACKING/FOCUS/ FILTER SW FLG C 55 FLG C
MOTOR DRIVER IC105 FLG D 56 FLG D
IC103
IC104 (3/4)
14 TRK + W OUT + V IN 3A 7 BUFFER 44 TRO XI 73 DCLK
22 10 1 IC203
TRACKING 6 43 FOO
LOW BOOST SRDR
COIL 14 TRK – W OUT – 50 DMO IO 0 59
21 5 PHASE SFDR
COMPENSATE IO 1 60
1 FCS + V OUT + MOTOR FILTER
24
FOCUS DRIVE VS 1 TRBST CVSW
27 IC104 (1/4)(2/4)
COIL 4 FCS – V OUT – VS 2
23 20
VSG
IC104 (4/4) SHOCK SENSOR VSG
V IN 2A X1 IC1
8 BUFFER
IC107
SLED MOTOR DRIVE/DECODER
MUTE 2 TKC
HE 1 H 34 HA + TKC 18 HVDET A
19 HVDET A
33 HA – A+ 32 HVDET B
DRVEN HE 2 H 30 HB + A– 31 SLDOM
HVDET B
T OUT IC111, 112 29 HB – B+ 28 SLDOP
SPINDLE SLED MOTOR B– 27 TKC
IC110 SLD +
MOTOR DRIVER SPEED CA + 17 SLCON –
M001 SPINDLE MOTOR M002
IC106 SENSOR CA – 16 SLCON +
SPINDLE CAV/CLV SELECT SLED M
MOTOR SDL108 MOTOR CB + 15 PWM 0
U OUT DRVEN SLD –
7 PS 23 SP 2 CB – 14 PWM 1
V OUT 4 PWM 0
4 22 • CTRL 25
W OUT 3 1
2 VLO 13
U IN 1 MOTOR VL – 19
9 13 5 SDL103
U IN 2 DRIVE ER – PWM 1
ERO +
CAVSW

11
CLVSW

10
V IN 1 10
11 SDC104 TRBST
V IN 2
12 DVO7 DRVEN
W IN 1 SLCON –
13
W IN 2
DV +
9 + FG
BUFFER DVI
14 12 SRDR CAVSW
HALL VH – IC109
15 HALL BIAS BYPS 26
FG SLCON + GLVSW
24
DV – 8 + GAVG 0
SFDR
CAVGO

SLDOM

SLDOP
FG

09

• Signal path
: DATA
: AUDIO
54 54
 CDJ-500
BUFFER MEMORY
IC302

UCAS
LCAS
– CD-ROM DRIVE (2/2) SECTION –

RAS

WE
I/O 1 I/O16 A0 A8
2-5 • 7-10 • 31-34 • 36-39 16-19 • 22-26 14 28 29 13

71-78 • 80-87 54-60 • 62 • 63 65 66 67 68

MDB0-MDB15 MA0 MA8

XRAS
XUCAS
XLCAS
XMWR
3 DB0 2 1
•
5 DB1
MDT 96 MDAT •
8 DB2
LRCK 97 LRCK •
BCK 10 DB3
BCK 95 BCLK XDBO-7 • SCSI DATA BUS 10
DB4 9
C2P0 94 C2P0 11
• DB5
15
SBS CD ROM DECODE • DB6
SBS 91 SBIN 17
SFSY & • DB7
SFSY 93 WFCK SCSI INTERFACE 19 DBP
SBSY 92 SBSY IC301 20 19
SBCK 100 GSCR XDBP 22
SBCK
SBDK 90 EXCK XATN 24 CN691
XBSY 26 OUT
XACK 29 SCSI
48 XTL 2 XSRS 30 30 29 CN681
SCSI CONTROL BUS IN
XMSG 35 ATN
X301
40MHz XSEL 36
XCD 39 BSY
49 XTL 1 43 FLASH MEMORY
XREQ 41 ACK
IC304

XWAT
XRES
XWR
XIO 43 RST 40 39

XRD

XCS

INT
D0 D7 A0 A6
MSG
131-138 123-129 143 144 142 50 141 122

WE
SEL

DE
D0 D7 A0 A15 A18
C/D
13-15 • 17-21 12-5 • 27 • 26 • 23 • 25 • 4 • 28 • 29 • 3 22 24 31
REQ

SCSI CONTROL BUS

I/O 50 49

SCSI DATA BUS

A18 54 53
ADDRESS BUS

DATA BUS DBP

ATN
BSY
ACK
RST

A
25-32 33-40 43 42 MSG
B
XWR
XRD

SBS D0-D7 A0-A4 • A17-A19 SEL

47 SBS
SFSY C/D
46 SFSY (Page 56)
(Page 54) SBSY
17 SBCY
REQ
I/O
SBCK
48 SBCK
SBOK SBOK
50 DB0-DB7
13-20 22-29 • 31-42 55 56
CLVSW 53 CLVO

RD
WR
CAVSW 54 CAVO D0-D7 A0 A19 XTIN
43 XWAT TDIR 5 TIN
CLVG 0 52 GN0O 71 XAIR
CLVG 1 51 GN1O ID 0 60 ID0
CAVG 0 55 CAV CCK 63 51 EXTAL ID 1 63 ID1
FG 49 FGIN GATE ARRAY F20M 45 70 XGAINT ID 2 64 ID2
XAMUTE 7 XAMUTE IC305 CXDCS 42 8 GVSW
DCLK
XRESET
62
12
DCLK
XDRS
9
10
WRPLL
TRBST
MICRO
COMPUTER
C
BUS 0 23 BUS 0 IC303 XTOUT
BUS 1 22 BUS 1
76
75
DRVEN
FLG A XUNLOAD
TOUT (Page 56)
UNCHUCK
BUS 2 21 BUS 2 2 FLG B XLD
BUS 3 20 BUS 3 3 FLG C
• SIGNAL PATH XEJET
CHUCK
XCCE XEJET
18 XCCE 4 FLG D SW601 : DATA
BUCK 19 BUCK 73 LOCK
XEJECT TEST 1
PWM 0 64 PWM 0 XEJC 5 6 RF 1
XBVSY
XLDO 9 59 VSG (MAIN BOARD)
INVERTER XLD
PWM 1 61 PWM 1 XLD 2 61 HVDET A
Q106 XUNLOAD
XULD 1
VSG 62 HVDET B (Page
RF 1
FLG A X302
57 EXC 0 XTOUT 8
XTOUT
65
66
SLDOM
SLDOP
PARITY 80 PARITY
D 56)
FLG B 33.86MHz 74 TKC
FLG C 77 SLCON –
58 EXCI
(Page
FLG D
LOCK
GVSW
79 SLCON + PWEN 7 PWEN
E 57)
TRBST
DRVEN XBUSY (Page
HVDET A
HVDET B
BUSY
F 56)
SLDOM
SLDOP
TKC
SLCON –
09 SLCON +

55 55
CDJ-500

– MAIN SECTION –

IC602
CPU IC603
MOTOR DRIVE
TIN TIN
79 P30 TO2 3 3 RIN OUT+ 8 M61
TOUT TOUT M LOADING MOTOR
80 P31 TO0 5
XEJECT XEJECT 2 FIN OUT– 9

C Q51 1 P32
CHUCK CHUCK PWM1 48 16 RIN OUT– 10
2 P33 M62
U CHK DISC TABLE SENSOR1-3 T.SENS1-3 U CHK M
4 P35 PWM0 47 17 FIN OUT+ 11 TABLE MOTOR
D ID0 SENSOR IC51-53 D ID0
15 P00
(Page D ID1 D ID1 16 P01
D ID2 D ID2
55) D.SENS D.SENS
17 P02
IC601
59 ANI3
T.SENS1 MOTOR DRIVE
S51 76 T.SENS1
UP T.SENS2
75 T.SENS2 P14 51 4 FIN OUT1 1 M005
T.SENS3 M
IC609 74 T.SENS3 DOOR MOTOR
P15 52 5 RIN OUT2 7
SCSI INTERFACE CHUCK
SWITCH

VREF 6 VCC BUFFER 12V

S52 53 P16
18 55 Q601
DOWN 54 P17
20 PAD0 58 43 AD0
• SD0 • AD0-7
DB0-DB7 SCSI DATA BUS 22 PAD7 60 36 AD7 S706, 707
D ID0
SD7 SWITCH
25 63 D ID1
• D ID2
27
49 24 A8 C ID0
P00 12 F_RECOV
DBP 28 XSDP • C ID1

D
26 A15 P01 13 MODE1 PRITY
A0 50
ATN 29 XATN • C ID2 MODE2

B
SCSI • P02 14
BSY CONTROL 30 XBSY A3 52 28 A17 MODE2 PARITY
• P76 62 S ID0-2 D701
ACK BUS 32 XACK MODE1
RST 33 XRST
53 34 A19 P75 61
MODE0
D ID0-2 POWER (Page 55)
MIS
(Page MSG 34 XMSG
XINT 42 72 INTP0
P77
P06
63
18
F RECOV TERM +5V
55) SEL
C/D
35
37
XSEL
XCD
XWR 45 22 XWR P26 77
DOOR M SENS
D701
XC LED
XRD 46 23 XRD

F
P12 49 BUSY (DRIVE)
REQ 38 XREQ DOOR SENS LED SW
P22 73 BUSY
I/O 39 XIO Q701
S703-705 IC607
XO KEY FLASH MEMORY
KEY SW
IC606 P72 58
XL KEY (OPEN) 2 A16 XC LED
(Page 55)
P71 57 (REW) +5V
RESET XR KEY
44 RESET P70 56 (RF) 2
IC608
12 DOOR SENS S702
7 XRESET • A0 DOOR SENS
SW602 44 ASTB 23
• A15 DOOR M SENS S701
25 DOOR MOTOR
29 WE 31 SENS
X602 DATA BUS !∞
5V 48 CLK CE 22
40MHz 13 OE 24
47 XCS 15 D0
ADDRESS BUS •
17 D7

21
IC606 IC605
LEVEL SHIFT ADDRESS DECODER
A17 IC610
7 Y7 A 1 IC604 S-RAM
A18
B 2 D LATCH
A19 1
C 3

!∞ 2 D1 Q1 12 21 A0
CE •
Y0 15
CE !¢ 9 D8 Q8 19 23 A14
Y1 14
!¢
26 CE 20
11 STB OE 22
11 WE 27
13 D0
•
15 D7

19

56 56
 CDJ-500

– POWER SUPPLY SECTION – WAVEFORMS

THIS NOTE IS COMMON FOR PRINTED WIRING – CD ROM SECTION –
BOARDS AND SCHEMATIC DIAGRAMS.
T901
(In addition to this, the necessary note is printed 1 8
POWER in each block.)
TRANSFORMER 1.2Vp-p
S901 1.8Vp-p
CNP901 For schematic diagrams.
+12V REG RECT POWER AC IN
+12V
IC901 D901 T902 Note:
(PLAY) 34MHz
+B BUFF LINE
• All capacitors are in µF unless otherwise noted. pF: µµF
PRV 12V
Q702 50 WV or less are not indicated except for electrolytics IC101 @∞ RFGO IC305 %¶ EXCO
FILTER
5V REG
5V–A
IC501
and tantalums. 2 9
E PWEN SWITCH
Q701
• All resistors are in Ω and 1/4 W or less unless otherwise
specified.
5Vp-p
(Page 55) +5V(5V–D) +5V REG • ¢ : internal component.
IC902
• C : panel designation. APPROX 40mVp-p
+5V–P (PLAY) 17MHz

–12V
–12V REG RECT Note: Note: IC101 !¢ TEO IC305 ^£ CCK
IC903 D905-908
The components identi- Les composants identifiés par
fied by mark ! or dotted une marque ! sont critiques 3 !º
line with mark ! are criti- pour la sécurité.
D51
DISC SENSOR (S) cal for safety. Ne les remplacer que par une 3Vp-p
Replace only with part piéce por tant le numéro APPROX 10mVp-p
+5V number specified. spécifié.
(5V–D) (PLAY) 40MHz
IC101 !§ FEO IC301 $• XTL2
• U : B+ Line.
D841 • V : B– Line. 4 !¡
INTERNAL • H : adjustment for repair.
D842 ILLUMINATION 2.5Vp-p
• Voltages and waveforms are dc with respect to ground
5.4Vp-p
D843 under no-signal (detuned) conditions.
09 no mark : STOP 40MHz
( ) : PLAY (PLAY) 1.415MHz

* : can not be mounted IC201 &º PXO IC301 (∞ BCK

• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc-
5 !™
tion tolerances. 2Vp-p
• Waveforms are taken with a oscilloscope. 5.4Vp-p
Voltage variations may be noted due to normal produc- 34MHz
tion tolerances. (PLAY) 44.2kHz
• Circled numbers refer to waveforms. IC201 &£ XI IC301 (¶ LRCK
• Signal path.
J : CD 6
F : AUDIO
• Abbreviation 5.4Vp-p
CND : Canadian model.
1.415MHz
For printed wiring boards. (PLAY)
Note: IC201 2 BCK
• X : parts extracted from the component side.
• Y : parts extracted from the conductor side. 7
• p : parts mounted on the conductor side.
5.4Vp-p
• ® : Through hole.
• b : Pattern from the side which enables seeing.
44.2kHz
(The other layers' patterns are not indicated.) (PLAY)
IC201 `⁄‚‚ LRCK
Caution:
Pattern face side: Parts on the pattern face side seen from the
(Side B) pattern face are indicated.
Parts face side: Parts on the parts face side seen from the
(Side A) parts face are indicated.

• Indication of transistor
C
Q These are omitted
B E

BC E
These are omitted

57 57
CDJ-500

7-3. PRINTED WIRING BOARD – CD-ROM DRIVE SECTION –

• See page 53 for Circuit Boards Location.
(Page 71)

• Semiconductor
Location

Ref. No. Location

IC104 B-4
IC106 B-5
IC110 B-5
IC112 B-2
IC501 B-2

Q205 C-2
Q206 C-2 (Page 75)
Q701 A-2

TP
(VC)

TP
(RFEQ)
TP
(TE)

(Page 67)

(Page 69)

(Page 69)

58 58
 CDJ-500

7-4. PRINTED WIRING BOARD – CD-ROM DRIVE SECTION –

• See page 53 for Circuit Boards Location.

• Semiconductor
Location

Ref. No. Location

D101 B-1
D201 C-3
D301 D-1
D701 B-5

IC101 A-2
IC103 A-3
IC105 B-3
IC107 A-3
IC109 B-1
IC111 B-4
IC201 C-4
IC202 B-3
IC203 C-3
IC301 D-4
IC302 D-3
IC303 D-3
IC304 D-1
IC305 D-1

Q101 A-1
Q102 B-2
Q103 A-2
Q104 B-2
Q105 B-2
Q106 C-2
Q202 B-4
Q203 C-3
Q207 B-3
Q702 A-4

(Page 67)

59 59
CDJ-500

7-5. SCHEMATIC DIAGRAM – CD-ROM DRIVE (1/6) SECTION –

• See page 57 for Waveforms.
• See page 76 for IC Block Diagrams.

(Page 64)

(Page 63)

(Page 68)

(Page
70) (Page 68)

(Page 61) (Page 62) (Page 62)

60 60
 CDJ-500
7-6. SCHEMATIC DIAGRAM – CD-ROM DRIVE (2/6) SECTION –
• See page 57 for Waveforms.
• See page 76 for IC Block Diagrams.

(Page 60)

(Page 62)

(Page 62)

(Page 62)

61 61
CDJ-500
7-7. SCHEMATIC DIAGRAM – CD-ROM DRIVE (3/6) SECTION –
• See page 57 for Waveforms.
• See page 76 for IC Block Diagrams.

(Page 60)

(Page
60)

(Page
66)

(Page
(Page
64)
61)

(Page
64)

(Page
64)

(Page
61)

(Page
64)

(Page
64)

(Page (Page
61) 64)

(Page
64)

62 62
 CDJ-500

7-8. SCHEMATIC DIAGRAM – CD-ROM DRIVE (4/6) SECTION –

• See page 57 for Waveforms.
• See page 78 for IC Block Diagrams.
• See page 83 for IC Pin Functions.

(Page
60)

(Page
64)
(Page 74)

(Page 66)

(Page
64)

(Page
64)

(Page 65) (Page 65)

63 63
CDJ-500
7-9. SCHEMATIC DIAGRAM – CD-ROM DRIVE (5/6) SECTION –
• See page 57 for Waveforms.
• See page 78 for IC Block Diagrams.
• See page 86 for IC Pin Functions.

(Page 62) (Page 62) (Page 62) (Page 62) (Page 62) (Page 62) (Page 62) (Page 60)

(Page 65) (Page 65) (Page 63) (Page 63) (Page 63)

64 64
 CDJ-500

7-10. SCHEMATIC DIAGRAM – CD-ROM DRIVE (6/6) SECTION –

• See page 57 for Waveforms.
• See page 79 for IC Block Diagrams.

(Page 63) (Page 63)

(Page
64)

(Page
64)

65 65
CDJ-500
7-11. SCHEMATIC DIAGRAM – MAIN SECTION –
• See page 80 for IC Block Diagrams.
• See page 88 for IC Pin Functions.

(Page 68) (Page 68)

(Page 68) (Page 70) (Page 62)

(Page 68)
(Page 74)

(Page 68)

(Page 74)

(Page 68)

(Page 68)

(Page (Page (Page

72) 72) 63)

66 66
 CDJ-500

7-12. PRINTED WIRING BOARD – MAIN SECTION –

• See page 53 for Circuit Boards Location.
(Page (Page (Page
73) 73) 58) (Page 75)

(Page 69)

(Page 75)

(Page 59)

(Page 69)

(Page 69)

(Page 69)

(Page 71)

(Page 69) (Page 69) (Page 69)

• Semiconductor • Semiconductor
Location Location
Ref. No. Location Ref. No. Location
IC601 D-4 IC603 C-2
IC602 C-3
IC604 C-2
IC605 B-2
IC606 B-2
IC607 D-1
IC608 D-1
IC609 B-3
IC610 B-1

Q601 D-3

67 67
CDJ-500

7-13. SCHEMATIC DIAGRAM – PANEL SECTION –

(Page 66)
(Page 60)

(Page 66)

(Page 60) (Page 72)

(Page 66)

(Page 66) (Page 66)

(Page 66)

(Page 66)

68 68
 CDJ-500

7-14. PRINTED WIRING BOARD – PANEL SECTION –

• See page 53 for Circuit Boards Location.

(Page 67)

(Page 58)
(Page 73) (Page 67)

(Page 67)

(Page 67)

(Page 58)

(Page 67)
(Page 67)

(Page 67)

69 69
CDJ-500

7-15. SCHEMATIC DIAGRAM – SENSOR SECTION –

(Page 66)

(Page 60)

70 70
 CDJ-500

7-16. PRINTED WIRING BOARD – SENSOR SECTION –

• See page 53 for Circuit Boards Location.

(Page 71)

(Page 67)

71 71
CDJ-500

7-17. SCHEMATIC DIAGRAM – SCSI SECTION –

(Page 74)

(Page 68)

(Page 66)

(Page 66)

72 72
 CDJ-500

7-18. PRINTED WIRING BOARD – SCSI SECTION –

• See page 53 for Circuit Boards Location.

(Page 67)
(Page 73)

(Page 69)

(Page 75)

73 73
CDJ-500

7-19. SCHEMATIC DIAGRAM – POWER SECTION –

• See page 82 for IC Block Diagrams.

(Page 63)

(Page 72)

(Page 66)

(Page 66)

74 74
 CDJ-500
7-20. PRINTED WIRING BOARD – POWER SECTION –
• See page 53 for Circuit Boards Location.

(Page 67) (Page 58)

(Page 67)
(Page 73)

• Semiconductor Location

Ref. No. Location Ref. No. Location

D902 D-2 D908 C-1
D903 B-2
D904 B-3 IC901 C-2
D905 C-1 IC902 C-3
D906 C-1 IC903 B-1
D907 C-1

75 75
CDJ-500

7-21. IC BLOCK DIAGRAMS

• MA-C30 Board

IC101 TA2112FN (EL) IC105 TC4W53FU IC106 BA6849FP-E2

VCC CH1 CH0 ADR

A3 2
20µA 36p 8 7 6 5
60k 60k A2 4 DRIVER 28 RNF
100k 20k 50k 50k A1 7
FEO 16 150k TSD
GAIN 27 VM1
10p 15k 15 SBAD
40p CONTROL 26 VM2
16.7k
15k 30k
FEN 17 1 2 3 4
14 TEO CURRENT 25 VCC
60k 36k 10k SENSE AMP
20k 10p COM INH VEE VSS
150k 10k
SEB 18
GND 8
40p 13 TEN TL
30k 24 FG
VRO 19
HALL AMP
12 2VRO PS 23 PS
20k 20k 20k 50µA H1+ 9 TORQUE
RFRP 20 SENSE AMP
100 11 TEB 22 EC
BTC 21 3 STATUE H1– 10
11k 12k 48k DET. 21 ECR
24k
2VRO 100k 20k 12k 83k
10 SEL VCC
RFCT 22 2.9k
9 LDO 20 FR
100k
1k
D R Q
PKC 23 11k SHORT BRAKE 18 SB
BOTTOM 8 MDI CK /Q
RFR PIN 24 1.4k
PEAK 13k 2.26k 17 CNF
20k 238k H2+ 11
HALL BIAS 15 VH
RFGO 25 H2– 12
15p I(1/5)
GUP 26 I–I 7 TNI
12k I(4/5) H3+ 13

5.5k H3– 14
238k
AGCIN 27
15p I(1/5)
4.9k I–I 6 TPI
RFO 28 I(4/5)
GND 29 1.2k 5 FPI
4 FNI
3 GMAD IC107 LA6527N
RFN2 30 2 RFGC

BYPS

CTRL

VCC1
1 VCC

HA+
HA–

HB+
HB–
A+

A–

B+

B–
34 33 32 31 30 29 28 27 26 25 24
VCC
MPU

INV. BUFFER A

INV. BUFFER B
IC103 LA6539M-TE-L

HALL AMP A

HALL AMP B
I/F
VCC2 1
WOUT+

WOUT–

MUTE2
UOUT+

UOUT–

VOUT+

VOUT–
VREF1

N.C.
VS1

VS2

VC
RF

RF

RF

RF

BUFFER
30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 23 VH+
MTR+ 2 22 VH–
VARIABLE
VOLTAGE
REF.
BUFFER AMP2

GND 3
EDGE
DET
21 GND
COMP
MUTE2
THERMAL SHUT DOWN

GND 4
AND
+
COMP 2 TO 4 DECODER

MTR– 5
MUTE1

BUFFER AMP1

VC

BUFFER
VC 6 VC VC

ER AMP 20 GND
DV AMP

19 VL–
VL AMP 18 TKC
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
7 8 9 10 11 12 13 14 15 16 17
RF

RF

GND

VIN1

VIN1A

MUTE1

VIN2

VIN2A

VIN3

VIN3A

BUFFER OUT1

BUFFER OUT2

VCC

RF

RF

CB+

CA–

CA+
DVO

DV+

ERO

ER–
DVI
VLO

CB–
DV–

76 76
IC110 MC14066BF

IN/OUT 1 14 VDD

OUT/IN 2 13 CONTROL IN

OUT/IN 3 12 CONTROL IN

IN/OUT 4 11 IN/OUT

CONTROL IN 5 10 OUT/IN

CONTROL IN 6 9 OUT/IN

VSS 7 8 IN/OUT

IC201 TC9449AF (BS, D, 24A)

/DMOUT
TESIO1

2VREF
/DACT
TESIN

/CKSE

FLGD
FLGC
FLGB
FLGA
PXO
/VDD

/VSS

SEL
PXI

IO3
IO2
IO1
IO0
VDD

VDD
VSS

VSS
XO

XI

75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51

50 DMO
DVDD 76 49 FVO
RO 77 48 FMO
DVSS 78 47 TEBC
PWM
DVR 79 1 BIT 46 RFGC
LPF
LO 80 DAC SERVO 45 VREF
CLOCK CONTROL 44 TRO
DVDD 81 D/A
GENERATOR
TEST1 82 43 FOO
TEST2 83 42 TEZI
TEST3 84 41 TEI
BUS0 85 40 TSIN
DIGITAL
ROM 39 SBAD
BUS1 86 ADDRESS EQUALIZER
MICRO CIRCUIT AUTOMATIC 38 FEI
BUS2 87 COMPUTER AD
BUS3 88 RAM ALIGNMENT 37 RFRP
INTERFACE CIRCUIT
VDD 89
VSS 90 36 RFZI
CLV SERVO 35 RFCT
BUCK 91
/CCE 92 16K RAM 34 AVDD
ERROR SYNC SIGNAL
TEST4 93 CORRECTOR PROTECT DATA 33 RFI
/TSMOD 94 EFM SLICER 32 SLCO
/RST 95 DEMODULATOR
PWM 31 AVSS
TEST0 96
30 VCOF
DIGITAL VCO
/HSO 97 29 VCOREF
AUDIO OUTPUT OUTPUT
/UHSO 98 SUBCODE 28 PVREF
CIRCUIT
DEMODULATOR PLL TMAX
EMPH 99 27 LPFO
LRCK 100 STATUS
26 LPFN

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25
BCK
AOUT
DOUT
MBOV
IPF
SBOK
CLCK

DATA
SFSY
SBSY
SPCK
SPDA
COFS
MONIT

TESIOO
P2VREF
SPDO
PDOS
PDD
TMAXS
TMAX
VSS

VDD
VSS

VDD

77
IC301 CXD1818R

MDB15
MDB14
MDB13
MDB12
MDB11
MDB10
DSPCK

MDAT

MDB9
MDB8

MDB7
MDB6
MDB5
MDB4
MDB3
MDB2
WFCK
DACD

GSCR

SCOR
LRCO

BCKO

DATO
DSTB

LRCK

C2PO
BCLK

EXCK
XLAT

SBIN
VDD

VDD
VSS

VSS

VSS

VSS
108 107 106 105 104 103 102 101 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73

72 MDB1
GRST 109 71 MDB0
XROF 110 70 VDD
TST0 111 69 VSS
TST1 112 XMWR
68

SEQUENCER
TST2 113 67 XLCAS

DMA
TST3 114 CD DSP
66 XUCAS
I/F

PRIORITY RESOIVER
VSS 115 65 XRAS
TST4 116
64 MA9
TST5 117
63 MA8
TST6 118
ERROR CORRECTION

62 MA7

ADDRESS GEN.
119
DEINTERLEAVE &
TST7
SYNC CONTROL
DESCRAMBLER

MAIN DATA

61 VSS

BUFFER
VSS 120
SUBCODE
60 MA6
VDD 121 ECC
59 MA5
XWAT 122
58 MA4
A0 123
57 MA3
A1 124
125 56 MA2
A2
55 MA1
A3 126
A4 127 54 MA0
A5 128 53 XRES
129 52 VDD
A6
VSS 130 51 VSS
MICROCODE
MICROCODE
CLK
24BIT TRANSFER BYTE COUNTER

D0 131 50
CORE
ROM
HANDSAKE

SUB CLOCK
BUFFER

D1 132 & 49 XTL1

CPU GEN.
D2 REGISTERS 48 XTL2
FIFO CONTROL

133 I/F
D3 134 47 AVDD
16 BYTE
D4 135 FIFO 46 AVSS
D5 136 45 AC
VCO
ARBIITRATION
PHASE CTRL

137 44 CM1
SELECTION

D6
HANDSAKE

138
SCSI

SCSI

D7 43 XIO
VSS 139 42 VSS
VDD 140 41 XREQ
INT 141 40 VSS
XCS 142 39 XCD
XWR 143 38 VDD
XRD 144 37 VSS

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36
VSS
VDD
XDB0
VSS
XDB1
VSS
VDD
XDB2
VSS
XDB3
XDB4
VSS
VSS
VDD
XDB5
VSS
XDB6
VSS
XDB7
VSS
VDD
XDBP
VSS
XATN
VSS
XBSY
VSS
VDD
XACK
XRST
VSS
VSS
VDD
VSS
XWSG
XSEL

IC302 MSM5416258B-35JDR1

13 WE

RAS 14 /RAS CLOCK /CAS CLOCK /WE CLOCK /OE CLOCK

NC 15 GENERATOR GENERATOR GENERATOR GENERATOR
12 NC
11 NC

10 I/O 8
DATA I/O BUS
9 I/O 7
8 I/O 6
7 I/O 5
COLUMN DECODERS
6 NC
5 I/O 4
REFRESH
Y0~Y8 4 I/O 3
COUNTER SENSE AMPLIFIERS
I/O BUFFER 3 I/O 2
A0 16 9 2 I/O 1
A1 17 512x16 1 VCC
A2 18
ROW DECODERS

A3 19
512 MEMORY
AND PREDECODERS

X0~X8
ADDRESS BUFFERS

VCC 20
ARRAY
VSS 21 256Kx16
A4 22
A5 23
A6 24
A7 25
A8 26
OE 27
VCAS 28
LCAS 29
30 31 32 33 34 35 36 37 38 39 40
NC
I/O 9
I/O 10
I/O 11
I/O 12
VSS
I/O 13
I/O 14
I/O 15
I/O 16
VSS

78
IC303 HD6433032SSNM11F

P60/WAIT
P71/AN1
P70/AN0

P65/WR
P64/RD

P53/A19
P52/A18
P63/AS

EXTAL
RESO
AVSS

STBY
XTAL

MD1
MD0
VCC

VSS
NMI
RES

Ø
60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41

PORT 6 PORT 5

ADDRESS BUS

DATA BUS (HIGH)

DATA BUS (LOW)

40 A17/P52
39 A16/P51
CLOCK H8/300H CPU BUS
OSCILLATOR CONTROLLER
38 A15/P27
37 A14/P26
36 A13/P25
P72/AN2 61

PORT 2
35 A12/P24
P73/AN3 62 34 A11/P23
P74/AN4 63
PORT 7

33 A10/P22
P75/AN5 64 ROM INTERNUPTION 32 A9/P21
P76/AN6 65 (MASK ROM) CONTROLLER
31 A8/P20
P77/AN7 66
VREF 67
AVSS 68 30 VSS
RAM WATCH DOG TIMER
(WDT) 29 A7/P17
28 A6/P16
27 A5/P15
P80/IRQ0 69 16 BIT 26 A4/P14

PORT 1
INTEGRATED SERIAL COMMUNICATION 25 A3/P13
P81/IRQ1 70
PORT 8

TIMER UNIT INTERFACE 24 A2/P12

P82/IRQ2 71 (SCI) x 1CH
(ITU) 23 A1/P11
P83/IRQ3 72
22 A0/P10
21 VCC
PROGRAMMABLE
TIMING PATTERN A/D CONVERTER
CONTROLLER
PA0/TP0/TCLKA 73 (TPC)
PA1/TP1/TCLKB 74
PA2/TP2/TIOCA0/TCLKC 75
PA3/TP3/TIOCB0/TCLKD 76
PORT A

PA4/TP4/TIOCA177
PA5/TP5/TIOCB178
PA6/TP6/TIOCA2 79
PA7/TP7/TIOCB2 80

PORT B PORT 9 PORT 3

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
TIOCA3/TP8/PB0
TIOCB3/TP9/PB1
TIOCA4/TP10/PB2
TIOCB4/TP11/PB3
TOCXA4/TP12/PB4
TOCXB4/TP13/PB5
TP14/PB6
ADTRG/TP15/PB7

TXD/P90
RXD/P92
IRQ4/SCK/P94
VSS

D0/P30
D1/P31
D2/P32
D3/P33
D4/P34
D5/P35
D6/P36
D7/P37

IC304 SST29EE512-90-4C-NHTR
I/O 7
I/O 6
I/O 5
I/O 4
I/O 3

I/O 2
I/O 1
I/O 0
GND
A11

A10
OE
A9

CE

26 25 24 23 22 21 20 19 18 17 16 15 14 13

A8 27
A13 28 DATA LATCH
A14 29 OE,CE,AND WE
LOGIC INPUT/OUTPUT
BUFFERS
NC 30
WE 31 Y-GATING
VCC 32
CELL MATRIX

Y DECODER

X DECODER

1 2 3 4 5 6 7 8 9 10 11 12
NC
NC

A15
A12
A7
A6
A5
A4
A3
A2
A1
A0

79
• MAIN Board IC604 SN74HC573BNS

IC601 BA6287F
OE 1 20 VCC

OUT1 1 8 GND
D0 2 D Q 19 Q0
G OE

D1 3 D Q 18 Q1
G OE

VM 2 7 OUT2
D2 4 D Q 17 Q2
G OE
DRIVER DRIVER
TSD D3 5 D Q 16 Q3
G OE

VCC 3 6 VREF 15 Q4
CONTROL LOGIC D4 6 D Q
G OE

POWER D5 7 D Q 14 Q5
SAVE G OE

FIN 4 5 RIN D6 8 D Q 13 Q6
G OE

D7 9 D Q 12 Q7
G OE
IC603 BA6780
GND 10 11 LE

VIN1 1 18 VIN2
IC605 SN74HC138ANS
VCC

DATA OUTPUTS
FWD/REV CONTROLLER
FWD/REV CONTROLLER
REVERSIBLE DRIVER

COVERNER DRIVER

FIN1 2 17 FIN2
VCC Y0 Y1 Y2 Y3 Y4 Y5 Y6
16 15 14 13 12 11 10 9

RIN1 3 16 RIN2
VEE
VEE

IOUT 4 15 CT2 Y0 Y1 Y2 Y3 Y4 Y5
REFERENCE
VOLTAGE
OUTPUT

A Y6
VREF 5 14 VEE

B C G2A G2B G1 Y7
LOW VOLTAGE

VREG 6 13 FBIN-
OUTPUT

LOAD CURRENT
DETECTION
COVERNER

AMPLIFIER

VCC 7 12 FBIN+
1 2 3 4 5 6 7 8
A B C G2A G2B G1 Y7 GND
OUTPUT
COVERNER

11 OUT2+
OUTPUT

OUT1+ 8 SELECT ENABLE

+
-

OUT1- 9 10 OUT2-

IC608 M51953BFP

GND 2

5k

5 REF
VOL
27k
+ 3 OUT
REFERENCE
ON/OFF 4 VOLTAGE –

OVERHEAT OVERCURRENT
PROTECTION LIMITTER
IN 1

80
IC602 uPD784031GC-8BT

P25/INTP4/ASCK/SCK1

P23/INTP2/CI
P30/RxD/S11
P31/TxD/S01

P26/INTP5

P24/INTP3

P22/INTP1
P21/INTP0

P77/AN17
P76/AN16
P75/AN15
P20/NMI
P27/S10

AVREF3
AVREF2

AVREF1
AVDD
ANO1
ANO0

AVSS
80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61

TIMER/
COUNTER 0
(16 BIT)

P32/SCL 1 A/D
P33/SDO/SDA 2 CONVERTER
PORT 2
PORT 3

P34/T00 3
P35/T01 4
P36/T02 5 60 P74/AN14
P37/T03 6 59 P73/AN13

PORT 7
D/A PROGRAMMABLE
58 P72/AN12
CLOCKED CONVERTER INTERRUPT
SERIAL I/F CONTROLLER 57 P71/AN11
UART 56 P70/AN10
RESET 7
TIMER/COUNTER 2
VDD 8 (16BIT) TIMER/COUNTER 1
X2 9 (16BIT)
X1 10
VSS 11

WATCH UART
DOG TIMER 55 VDD
54 P17
P00 12 53 P16
P01 13 52 P15

PORT 1
P02 14 51 P14/Tx02/S02
OUTPIT PORT
PORT 0

REALTIME

P03 15 50 P13/Rx02/S12
CPU CORE

49 P12/ASCK2/SCK2
MEMORY

P04 16
78K/IV

DATA

P05 17 48 P11/PWM1
P06 18 47 P10/PWM0
P07 19
CLOCKED
SERIAL I/F

PWM

46 TEST
BUS VF
45 VSS
44 ASTB/CLKOUT
43 P40/A00
PORT 6 PORT 5 PORT 4 42 P41/A01
P67/REFRQ/HLDAK 20 41 P42/A02

21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40
P66/WAIT/HLDRQ
P65/WR
P64/RD
P63/A19
P62/A18
P61/A17
P60/A16

P57/A15
P56/A14
P55/A13
P54/A12
P53/A11
P52/A10
P51/A9
P50/A8

P47/A07
P46/A06
P45/A05
P44/A04
P43/A03

81
82
SATION
COMPEN-
VCC
VOLTAGE/
INPUT
GND
OUTPUT
SWITCH
INPUT
FEEDBACK
VOLTAGE

4
1

5
3
2
• POWER Board

CURRENT
THERMAL
SENSE
SHUTDOWN
IC901 MC34166D2TR4

B+
UNDER
5.05V
PWM LATCH VOLTAGE
REFERENCE
LOCKOUT

PULSE
WIDTH B+
MODULATOR
R

ERROR
Q AMP

S
OSCILLATOR

B+
7-22. IC PIN FUNCTIONS
• IC301 CD-ROM DECODER AND SCSI INTERFACE (CXD1818R) (MA-C30 board)
Pin No. Pin Name I/O Function
1 VSS – Ground
2 VDD – Power supply (+5V)
3 XDB0 I/O SCSI data bus bit0
4 VSS – Ground
5 XDB1 I/O SCSI data bus bit1
6 VSS – Ground
7 VDD – Power supply (+5V)
8 XDB2 I/O SCSI data bua bit2
9 VSS – Ground
10 XDB3 I/O SCSI data bus bit3
11 XDB4 /O SCSI data bus bit4
12 VSS – Ground
13 VSS – Ground
14 VDD – Power supply (+5V)
15 XDB5 I/O SCSI data bus bit5
16 VSS – Ground
17 XDB6 I/O SCSI data bus bit6
18 VSS – Ground
19 XDB7 I/O SCSI data bus bit7
20 VSS – Ground
21 VDD – Power supply (+5V)
22 XDBP I/O SCSI data bus parity
23 VSS – Ground
24 XATN I/O SCSI control bus/ATN signal
25 VSS – Ground
26 XBSY I/O SCSI control bus/BSY signal
27 VSS – Ground
28 VDD – Power supply (+5V)
29 XACK I/O SCSI control bus/ACK signal
30 XSRS I/O SCSI control bus/RST signal
31 VSS – Ground
32 VSS – Ground
33 VDD – Power supply (+5V)
34 VSS – Ground
35 XMSG I/O SCSI control bus/MSG signal
36 XSEL I/O SCSI control bus/SEL signal
37 VSS – Ground
38 VDD – Power supply (+5V)
39 XCD I/O SCSI control bus/CD signal
40 VSS – Ground
41 XREQ I/O SCSI control bus/REQ signal
42 VSS – Ground
43 XIO I/O SCSI control bus/IO signal
44 XCM1 O VCO charge pump output for multiplying
45 AC I VCO control voltage input for multiplying
46 AVSS – Analog ground
47 AVDD – Analog power supply (+5V)
48 XTL2 O Output of crystal oscillating circuit
49 XTL1 I Input of crystal oscillating circuit
50 CLK O Clock output

83
Pin No. Pin Name I/O Function
51 VSS – Ground
52 VDD – Power supply (+5V)
53 XRES I CXD1804R reset signal
54 MA0 O Address bus output bit0 to buffer memory
55 MA1 O Address bus output bit1 to buffer memory
56 MA2 O Address bus output bit2 to buffer memory
57 MA3 O Address bus output bit3 to buffer memory
58 MA4 O Address bus output bit4 to buffer memory
59 MA5 O Address bus output bit5 to buffer memory
60 MA6 O Address bus output bit6 to buffer memory
61 VSS – Ground
62 MA7 O Address bus output bit7 to buffer memory
63 MA8 O Address bus output bit8 to buffer memory
64 MA9 O Address bus output bit9 to buffer memory
65 XRAS O Buffer memory RAS (Row Address Strobe) signal
66 XUCAS O Buffer memory CAS (Column Address Strobe) signal
67 XLCAS O Buffer memory CAS (Column Address Strobe) signal
68 XMWR O Buffer memory data write strobe signal
69 VSS – Ground
70 VDD – Power supply (+5V)
71 MDB0 I/O Buffer memory data bus bit0
72 MDB1 I/O Buffer memory data bus bit1
73 MDB2 I/O Buffer memory data bus bit2
74 MDB3 I/O Buffer memory data bus bit3
75 MDB4 I/O Buffer memory data bus bit4
76 MDB5 I/O Buffer memory data bus bit5
77 MDB6 I/O Buffer memory data bus bit6
78 MDB7 I/O Buffer memory data bus bit7
79 VSS – Ground
80 MDB8 I/O Buffer memory data bus bit8
81 MDB9 I/O Buffer memory data bus bit9
82 MDBA I/O Buffer memory data bus bit10
83 MDBB I/O Buffer memory data bus bit11
84 MDBC I/O Buffer memory data bus bit12
85 MDBD I/O Buffer memory data bus bit13
86 MDBE I/O Buffer memory data bus bit14
87 MDBF I/O Buffer memory data bus bit15
88 VSS – Ground
89 VDD – Power supply (+5V)
90 EXCK O SBIN reading clock (Connected to CXD3000 EXCK pin/pin 65)
91 SBIN I Subcode serial signal (Connected to CXD3000 SBSO pin/pin 64)
92 SBSY I Subcode sync signal (Connected to CXD3000 SBSY pin/pin 63)
93 WFCK I Write frame clock (Connected to CXD3000 WFCK pin/pin 62)
94 C2P0 I C2 pointer signal, indicating an error in MDAT.
95 BCLK I Bit clock, MDAT strobe signal
96 DATA I Serial data stream from DSP for CD
97 LRCK I LR signal, indicating Lch and Rch of MDAT.
98 VSS – Ground
99 DSPCK I Enter DSP clock
100 GSCR I SCOR syncronizing with DSP data output (Connected to CXD3000 GRSCOR pin/pin 113)

84
Pin No. Pin Name I/O Function
101 DATO O Serial data output from sub CPU to CD DSP
102 XLAT O DAT0 latch signal. Latch at leading edge
103 DSTB O DAT0 transfer clock
104 VSS – Ground
105 VDD – Power supply (+5V)
106 BCKO O Bit clock (Connected to CXD3000 BCKI pin/pin 30)
107 DACD O Audio data output to DAC (Connected to CXD3000 PCMDI pin/pin 28)
108 LRCO O LR clock output to DAC (Connected to CXD3000 LRCKI pin/pin 26)
109 GRST O Output for GRSCOR resyncronizing (Connected to CXD3000 SCSY pin/pin 68)
110 XROF I DSP RAM Overflow input (Connected to CXD3000/ROF pin/pin 45)
111 SD0 I Test pin0
112 SD1 I Test pin1
113 SD2 I Test pin2
114 SD3 I Test pin3
115 VSS – Ground
116 SD4 I Test pin4
117 SD5 I Test pin5
118 SD6 I Test pin6
119 SD7 I Test pin7
120 VSS – Ground
121 VDD – Power supply (+5V)
122 XWAT O Wait signal for sub CPU buffer memory access
123 A0 I CXD1804R built-in register address bus0
124 A1 I CXD1804R built-in register address bus1
125 A2 I CXD1804R built-in register address bus2
126 A3 I CXD1804R built-in register address bus3
127 A4 I CXD1804R built-in register address bus4
128 A5 I CXD1804R built-in register address bus5
129 A6 I CXD1804R built-in register address bus6
130 VSS – Ground
131 D0 I/O Sub CPU data bus0
132 D1 I/O Sub CPU data bus1
133 D2 I/O Sub CPU data bus2
134 D3 I/O Sub CPU data bus3
135 D4 I/O Sub CPU data bus4
136 D5 I/O Sub CPU data bus5
137 D6 I/O Sub CPU data bus6
138 D7 I/O Sub CPU data bus7
139 VSS – Ground
140 VDD – Power supply (+5V)
141 INT O Interruption to sub CPU
142 XCS I CXD1804R chip select signal
143 XWR I CXD1804R built-in register write signal
144 XRD I CXD1804R built-in register read signal

85
• IC305 GATA ARRAY (BU6260AKV) (MA-C30 board)
Pin No. Pin Name I/O Function
1 XULD I Switch
2 XLD I Switch
3 XUSL I Ground
4 XSLT I Ground
5 XEJC I Switch
6 XHMT O Headphone mute
7 XAMT O Audio mute
8 XTOUT O LED
9 XLDO O LED
10 GND – Ground
11 VDD – Power supply
12 XDRS O DSP reset
13 PRST O CPU/Monet reset
14 RSTB I/O Reset
15 VAIN I Reset
16 TST1 I Not used
17 SBSY I DSP subcode sync
18 XCCE O DSP
19 BUCK O DSP
20 BUS3 I/O DSP
21 BUS2 I/O DSP
22 BUS1 I/O DSP
23 BUS0 I/O DSP
24 GND – Ground
25 D0 I/O CPU data bus
26 D1 I/O CPU data bus
27 D2 I/O CPU data bus
28 D3 I/O CPU data bus
29 D4 I/O CPU data bus
30 D5 I/O CPU data bus
31 D6 I/O CPU data bus
32 D7 I/O CPU data bus
33 A0 I CPU address bus
34 A1 I CPU address bus
35 A2 I CPU address bus
36 A3 I CPU address bus
37 A4 I CPU address bus
38 A17 I CPU address bus
39 A18 I CPU address bus
40 A19 I CPU address bus
41 XCS2 O Monet chip enable
42 XRD I CPU read strobe
43 XWR I CPU write strobe
44 XAIR I Power supply
45 XINT O CPU interrupt
46 SFSY I DSP
47 SBS I DSP
48 SBCK I DSP
49 FGIN I Spindle driver
50 SBOK I DSP

86
Pin No. Pin Name I/O Function
51 GN1 O O Spindle driver 1 on
52 GN0 O O Spindle driver 0 on
53 CLV0 O CLV on
54 CAV0 O CAV on
55 CAV O Spindle control
56 VDD – Power supply
57 EXC0 O 33.86MHz
58 EXC1 I 16.93MHz
59 GND – Ground
60 TEST I Ground
61 PWM1 O Control the outside spindle motor
62 DCK O DSP clock 33.86MHz
63 CCK O DSP clock 33.86MHz
64 PWM0 O Control the outside spindle motor

87
• IC609 SCSI CONTROL (SYM53CF92A) (MAIN board)
Pin No. Pin Name I/O Function
1 VSS – Ground
2 DREQ O Not used
3 DACK I DMA controller
4 DBWR I DMA write signal
5 VDD – +5V Power supply
6 DB0 I/O DMA data bus
7 DB1 I/O DMA data bus
8 DB2 I/O DMA data bus
9 VSS – Ground
10 DB3 I/O DMA data bus
11 DB4 I/O DMA data bus
12 DB5 I/O DMA data bus
13 VSS – Ground
14 DB6 I/O DMA data bus
15 DB7 I/O DMA data bus
16 DBP I/O Odd parity for DB7–0
17 VDD – Power supply
18 SD0 I/O SCSI data signal
19 SD1 I/O SCSI data signal
20 SD2 I/O SCSI data signal
21 VSS – Ground
22 SD3 I/O SCSI data signal
23 SD4 I/O SCSI data signal
24 SD5 I/O SCSI data signal
25 SD6 I/O SCSI data signal
26 VSS – Ground
27 SD7 I/O SCSI data signal
28 SDP I/O SCSI data signal
29 ATN I Schmitt trigger input
30 BSY O SCSI output
31 VSS – Ground
32 ACK O SCSI output
33 RST O SCSI output
34 MSG I/O SCSI phase signal
35 SEL I Selector signal
36 VSS – Ground
37 C_D I/O SCSI phase signal
38 REQ O SCSI output
39 I_O I/O SCSI phase signal
40 VDD – +5V Power supply
41 MODE I Mode selector
42 INT I Interrupt status input
43 VSS – Ground
44 RESET I Reset signal input
45 WR I Write signal input
46 RD I Read signal input
47 CS I Select signal input
48 CLK I Clock signal input
49 A0 I Address inputs
50 A1 I Address inputs

88
Pin No. Pin Name I/O Function
51 VSS – Ground
52 A2 I Address inputs
53 A3 I Address inputs
54 TEST – Ground
55 PAD0 I/O Processor address data
56 PAD1 I/O Processor address data
57 PAD2 I/O Processor address data
58 PAD3 I/O Processor address data
59 VSS – Ground
60 PAD4 I/O Processor address data
61 PAD5 I/O Processor address data
62 PAD6 I/O Processor address data
63 PAD7 I/O Processor address data
64 VDD – Power supply

89
 SECTION 8
EXPLODED VIEWS
NOTE: The components identified by
• Items marked “*” are not stocked since they are mark ! or dotted line with mark
seldom required for routine service. Some delay ! are critical for safety.
should be anticipated when ordering these items. Replace only with part number
• The mechanical parts with no reference number in specified.
the exploded views are not supplied.
• Hardware (# mark) list and accessories and pack- Les composants identifiés par une
ing materials are given in the last of this parts list. marque ! sont critiques pour la
• Abbreviation sécurité.
CND : Canadian model Ne les remplacer que par une
piéce portant le numéro spécifié.

8-1. CASE SECTION

1
2 20
2

2
4
5 #3 not supplied
3 4 4 #3
#3 #1
6
#3 #3
#3 #3
#3 #3
not supplied
#3 #2
7 2 #3
14
#3 8
#3

#3
9
not supplied
15
12
#3 13
10
#3
11
#3
#3
18 not supplied
17
19
not supplied #3 not supplied 16
17

FRONT PANEL

#9

Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
* 1 4-214-126-01 CASE * 11 1-672-365-11 SCSI OUT BOARD
2 3-704-366-41 SCREW (CASE) (M3X6) * 12 1-672-161-11 P.JACK BOARD
* 3 4-214-105-01 COVER (PS) * 13 1-672-166-11 DOUT BOARD
4 4-951-620-41 SCREW (2.6), +BVTP 14 1-790-228-11 CORD (WITH CONNECTOR)
* 5 4-224-380-01 PANEL, BACK 15 X-4948-515-1 ILLUMINATION ASSY

6 3-703-244-00 BUSHING (2104), CORD 16 X-4946-543-2 FOOT (SMALL) ASSY

* 7 1-672-165-11 LED BOARD * 17 4-978-398-21 CUSHION
* 8 1-672-159-11 AC FILTER BOARD * 18 3-703-150-11 CLAMP
* 9 1-672-162-11 D.SW BOARD * 19 4-988-534-01 COVER, MOTOR
* 10 1-672-364-11 SCSI IN BOARD
20 1-783-531-41 CORD, POWER

90
8-2. FRONT PANEL SECTION

56 65 57

55 65
65 65
not supplied
59 60
#7 #8
65
#7
70
58 #7
61 64 65
not supplied 65 62 not supplied

65
M901
not supplied
66
65
54
65
63 65

65
52 65
#4

65
#4

#5 67 not supplied

#4

not supplied

68
69

53

51

Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
51 X-4950-435-1 DOOR ASSY 61 4-212-612-01 GEAR (A)
52 4-212-610-01 SHIELD (W) 62 X-4950-368-1 BRACKET (DL) ASSY
53 4-933-134-71 SCREW (+PTPWH M2.6X6) 63 3-354-963-32 DAMPER
54 X-4952-278-1 PANEL ASSY, FRONT * 64 A-4724-449-A KEY (A) BOARD, COMPLETE
55 4-212-602-01 BUTTON (POWER) 65 4-217-468-01 SCREW (2.6X8)

* 56 1-672-160-11 P.SW BOARD * 66 1-672-164-11 DOOR.M BOARD

* 57 4-213-893-02 COVER (PW) 67 4-212-818-01 CUSHION (W)
58 4-212-611-01 LEVER (LOCK) 68 4-212-819-01 CUSHION (B)
59 4-212-613-01 SPRING, TORSION 69 4-217-302-01 CUSHION (B2)
60 4-212-600-01 GEAR (CAM) 70 X-4951-511-1 DOOR MOTOR ASSY

* M901 1-541-590-11 MOTOR, DC

91
8-3. CHASSIS SECTION

101 #9
#10
102 #9
#9

114 103

104 #9 #9
#9

107
not supplied

114
not supplied
105
not supplied
106 #3
T901

#3 not supplied
#3

108 #3
109
#3
not supplied
#3 111
110
104 112
not supplied

114
113
#3
not supplied

#3
114
#3
#3
#3
not supplied

The components identified by Les composants identifiés par une

mark ! or dotted line with mark marque ! sont critiques pour la
! are critical for safety. sécurité.
Replace only with part number Ne les remplacer que par une
specified. piéce portant le numéro spécifié.

Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
101 4-214-144-01 TABLE (50) 108 4-214-106-01 CUSHION (RING)
102 4-957-577-11 SCREW PTP WH (2.6X8) (DIA. 10) * 109 A-4724-442-A POWER (A) BOARD, COMPLETE
103 4-951-620-41 SCREW (2.6), +BVTP 110 1-790-229-11 WIRE (FLAT TYPE) (9 CORE)
* 104 3-703-150-11 CLAMP
105 4-214-145-01 RING (A) 111 1-790-230-11 WIRE (FLAT TYPE) (12 CORE)
112 1-790-231-11 WIRE (FLAT TYPE) (12 CORE)
106 4-214-107-01 RING (B2) * 113 A-4724-461-A MAIN BOARD, COMPLETE
107 4-988-439-01 HOLDER, TABLE ! T901 1-433-542-11 TRANSFORMER, POWER

114 3-970-608-41 +BV SUMITITE (B3)

92
8-4. MECHANISM DECK SECTION-1 (CDM-56)

not supplied 219

#11 220 #13
228 227 223 #16
224
#12 #14 #13
211
229 #15

237 222 #16

221
225
228 #15
#14 218
216
226
217
207
215
206 211
214
205 230
233
#13 231 not supplied
232
202 203 213 #16
#15
212
204 208
209 210
211
#15

#16
201 233 not supplied
#15 #16
#16
236
not supplied
235 233

234
#16
not supplied

Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
* 201 1-672-171-11 CHUCK SW BOARD 220 4-214-316-01 COVER (PULLEY)
* 202 4-988-427-01 COVER, CAM
203 4-988-420-01 SLIDER (LOADING) 221 3-910-095-11 RUBBER, VIBRATION PROOF
204 4-214-140-01 SPRING (LD), TORSION 222 X-4950-566-1 BRACKET (DS) ASSY
205 4-218-013-01 HOLDER (A2), DISC * 223 1-672-170-11 DISC SENSOR (S) BOARD
224 4-214-267-01 BALANCER (K2)
* 206 4-988-417-01 SLIDER (CAM) 225 4-214-268-01 BALANCER (K3)
207 4-988-433-01 SLIDER (LOCK)
208 X-4950-568-1 LEVER (LD) ASSY 226 4-214-269-01 BALANCER (K4)
209 4-214-141-01 SPRING (LEVER), TENSION 227 4-974-711-01 SCREW (2X5)(P TYIGHT),(+)PTTWH
210 4-214-120-01 SPRING, HOLDER RETURN 228 4-981-923-01 SCREW (M), STEP
229 X-4950-567-1 HOLDER ASSY, BU
211 4-214-138-01 CUSHION (BU) 230 7-624-101-04 STOP RING 1.2 (E TYPE)
212 4-213-445-01 BASE, LOADING
213 4-214-117-01 SPRING (BU), LEAF 231 4-214-137-01 ROLLER (MG)
214 4-988-419-01 HOLDER (B), DISC 232 X-4950-569-1 SUPPORT (MG) ASSY
215 4-988-431-01 ROLLER (DISC) 233 4-957-577-11 SCREW PTP WH (2.6X8) (DIA. 10)
* 234 A-4724-437-A MA-C30 (A) BOARD, COMPLETE
216 4-992-069-01 SCREW (+PTPWH) (M2) (DIA. 7) * 235 4-214-119-01 COVER, PC BOARD
* 217 4-988-454-01 COVER (LEVER)
218 4-213-447-01 HOLDER (MAGNET) * 236 4-214-118-01 SHEET (CDM)
219 A-4672-779-A PULLEY ASSY, CHUCKING * 237 4-976-473-01 HOLDER (LED-S)
93
8-5. MECHANISM DECK SECTION-2 (CDM-56)

251 252
253

254
254

256 #18
258

255 259
257
252
252

260

M62
261

M61

262

#17

Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
* 251 1-672-168-11 TABLE SENSOR BOARD 257 4-988-432-01 GEAR (B) (LOADING)
252 4-219-823-01 SCREW (+PTPWH 2.6X8 B TYTE) * 258 1-672-169-11 DISC SENSOR (R) BOARD
253 4-214-143-01 BELT 259 8-729-926-31 PHOTO TRANSISTOR PT483F1
254 4-988-425-01 PULLEY * 260 4-990-669-01 HOLDER (SENSOR)
255 4-988-424-01 GEAR (TABLE)
* 261 4-988-426-01 BASE (CDM)
256 4-988-423-01 GEAR (A) (LOADING) * 262 1-672-167-11 MOTOR BOARD
M61 X-4591-512-1 MOTOR ASSY (LOADING)
M62 X-4591-512-1 MOTOR ASSY (TABLE)

94
8-6. BASE UNIT SECTION (BU-24)

301 301
312 M101

313
not supplied
305
314
306
not supplied
302 304 307
315
308
not supplied 301 301
317 310 309

303

311

317
318
not supplied
#11
317

M102

The components identified by Les composants identifiés par une

mark ! or dotted line with mark marque ! sont critiques pour la
! are critical for safety. sécurité.
Replace only with part number Ne les remplacer que par une
specified. piéce portant le numéro spécifié.

Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
301 4-974-711-01 SCREW (2X5) (P TYGHT), (+) PTTWH 312 A-4683-010-A GEAR ASSY, LIMITTER
302 1-777-692-11 WIRE (FLAT TYPE) (11 CORE) 313 4-974-767-01 SPRING, COMPRESSION
* 304 4-974-724-01 SHAFT (MAIN) * 314 4-973-786-01 GEAR (S-C1)
305 4-992-850-02 GEAR, RACK 315 A-4683-012-A GEAR ASSY (B), LIMITTER
306 4-214-266-01 CUSHION (K) 317 4-993-513-03 INSULATOR (K)

307 4-992-851-01 SPRING, COMPRESSION 318 4-974-725-01 SCREW (M1.7X2.5), P

! 308 1-758-088-11 OPTICAL PICK-UP SPU-3212 303 1-790-251-11 WIRE (FLAT TYPE) (11 CORE)
309 1-782-368-12 WIRE (FLAT TYPE) (16 CORE) M101 A-4672-641-A SPINDLE ASSY (SPINDLE)
* 310 4-214-264-01 PLATE, SHIELD * M102 X-4951-510-1 MOTOR, DC (SLED)
* 311 A-4724-441-A SE-C7 BOARD, COMPLETE

95
 AC FILTER CHUCK SW SECTION 9
D.OUT D.SW ELECTRICAL PARTS LIST
Note:

The components identified by • Due to standardization, replacements in the parts list • SEMICONDUCTORS
mark ! or dotted line with mark may be different from the parts specified in the In each case, u: µ , for example:
! are critical for safety. diagrams or the components used on the set. uA...: µ A..., uPA...: µ PA..., uPB...: µ PB...,
Replace only with part number • -XX, -X mean standardized parts, so they may have uPC...: µ PC..., uPD...: µ PD...
specified. some difference from the original one. • CAPACITORS
• Items marked “*” are not stocked since they are uF : µ F
Les composants identifiés par une seldom required for routine service. Some delay • COILS
marque ! sont critiques pour la should be anticipated when ordering these items. uH : µ H
sécurité. • RESISTORS • Abbreviation
Ne les remplacer que par une All resistors are in ohms CND : Canadian model
piéce portant le numéro spécifié. METAL: Metal-film resistor
METAL OXIDE: Metal Oxide-film resistor
When indicating parts by reference F : nonflammable
number, please include the board
name.

Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
* 1-672-159-11 AC FILTER BOARD * 1-672-166-11 D.OUT BOARD
*************** ***********

< CAPACITOR > < CAPACITOR >

! C902 1-113-925-11 CERAMIC 0.01uF 20% 250V C455 1-163-038-91 CERAMIC CHIP 0.1uF 25V
! C903 1-113-925-11 CERAMIC 0.01uF 20% 250V C456 1-126-964-11 ELECT 10uF 20% 50V
! C904 1-113-920-11 CERAMIC 0.0022uF 20% 250V C457 1-163-038-91 CERAMIC CHIP 0.1uF 25V
! C905 1-113-920-11 CERAMIC 0.0022uF 20% 250V
! C906 1-113-920-11 CERAMIC 0.0022uF 20% 250V < CONNECTOR >

! C907 1-113-920-11 CERAMIC 0.0022uF 20% 250V * CN452 1-568-941-11 PIN, CONNECTOR 3P

< CONNECTOR > < IC >

* CN902 1-580-230-11 PIN, CONNECTOR (PC BOARD) 2P IC451 8-749-921-12 IC GP1F32T

CN903 1-564-321-00 PIN, CONNECTOR 2P
* CN904 1-568-226-11 PIN, CONNECTOR 2P **************************************************************

< COMPOSITION CIRCUIT BLOCK > * 1-672-162-11 D.SW BOARD

**********
CP902 1-537-771-21 TERMINAL BOARD, GROUND
< CAPACITOR >
< FUSE >
C704 1-163-038-91 CERAMIC CHIP 0.1uF 25V
! F901 1-532-388-51 FUSE (2A/250V) C705 1-163-038-91 CERAMIC CHIP 0.1uF 25V
C706 1-163-038-91 CERAMIC CHIP 0.1uF 25V
< FUSE HOLDER > C707 1-163-038-91 CERAMIC CHIP 0.1uF 25V
C708 1-163-038-91 CERAMIC CHIP 0.1uF 25V
FH901 1-533-293-11 FUSE HOLDER
FH902 1-533-293-11 FUSE HOLDER C709 1-163-038-91 CERAMIC CHIP 0.1uF 25V
C710 1-163-038-91 CERAMIC CHIP 0.1uF 25V
< TRANSFORMER > C711 1-163-038-91 CERAMIC CHIP 0.1uF 25V
C712 1-163-038-91 CERAMIC CHIP 0.1uF 25V
T902 1-416-321-11 COIL, LINE FILTER C713 1-163-038-91 CERAMIC CHIP 0.1uF 25V
! T901 1-433-542-11 TRANSFORMER, POWER
C751 1-163-038-91 CERAMIC CHIP 0.1uF 25V
************************************************************** C752 1-163-038-91 CERAMIC CHIP 0.1uF 25V
C753 1-163-038-91 CERAMIC CHIP 0.1uF 25V
* 1-672-171-11 CHUCK SW BOARD
************** < CONNECTOR >

< CONNECTOR > CN702 1-779-549-11 CONNECTOR,FFC(LIF(NON-ZIF))12P

CN703 1-506-481-11 PIN, CONNECTOR 2P
* CN54 1-568-941-11 PIN, CONNECTOR 3P
< COMPOSITION CIRCUIT BLOCK >
< SWITCH >
CP701 1-537-771-21 TERMINAL BOARD, GROUND
S51 1-571-958-11 SWITCH, PUSH (1 KEY)(UP) CP702 1-537-771-21 TERMINAL BOARD, GROUND
S52 1-571-958-11 SWITCH, PUSH (1 KEY)(DOWN)
< JUMPER RESISTOR >
**************************************************************
JC701 1-216-295-91 SHORT 0

96
 D.SW DISC SENSOR (R) DISC SENSOR (S)
DOOR MOTOR KEY LED MA-C30
Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
< SWITCH > < SWITCH >

S706 1-570-598-11 SWITCH, DIP S701 1-762-149-11 SWITCH, PUSH (1 KEY)(DOOR)

S707 1-554-556-00 SWITCH, DIP S702 1-762-936-11 SWITCH, LEVER (DOOR MOTOR)
S703 1-554-303-21 SWITCH, TACTILE (OPEN)
************************************************************** S704 1-554-303-21 SWITCH, TACTILE (DISC SKIP -)
S705 1-554-303-21 SWITCH, TACTILE (DISC SKIP +)
* 1-672-169-11 DISC SENSOR (R) BOARD
********************* **************************************************************

************************************************************** * 1-672-165-11 LED BOARD

*********
* 1-672-170-11 DISC SENSOR (S) BOARD
********************* < CONNECTOR >

* 4-976-473-01 HOLDER (LED-S) CN841 1-506-481-11 PIN, CONNECTOR 2P

< CONNECTOR > < DIODE >

* CN53 1-568-951-11 PIN, CONNECTOR 2P D841 8-719-058-17 DIODE LNG401NPYJA

D842 8-719-058-17 DIODE LNG401NPYJA
< DIODE > D843 8-719-058-17 DIODE LNG401NPYJA

D51 8-719-055-84 DIODE GL-528VS1 < RESISTOR >

< RESISTOR > R841 1-216-029-00 METAL CHIP 150 5% 1/10W

R842 1-216-029-00 METAL CHIP 150 5% 1/10W
R54 1-259-151-21 CARBON 220 5% 1/4W R843 1-216-029-00 METAL CHIP 150 5% 1/10W

************************************************************** **************************************************************

* 1-672-164-11 DOOR MOTOR BOARD * A-4724-437-A MA-C30 BOARD, COMPLETE

**************** **********************

< CONNECTOR > < CAPACITOR >

* CN705 1-568-951-11 PIN, CONNECTOR 2P C101 1-164-004-11 CERAMIC CHIP 0.1uF 10% 25V
C102 1-164-004-11 CERAMIC CHIP 0.1uF 10% 25V
************************************************************** C103 1-124-778-00 ELECT CHIP 22uF 20% 6.3V
C104 1-124-778-00 ELECT CHIP 22uF 20% 6.3V
* A-4724-449-A KEY BOARD, COMPLETE C105 1-164-004-11 CERAMIC CHIP 0.1uF 10% 25V
*******************
C106 1-124-778-00 ELECT CHIP 22uF 20% 6.3V
< CAPACITOR > C107 1-163-038-91 CERAMIC CHIP 0.1uF 25V
C108 1-164-505-11 CERAMIC CHIP 2.2uF 16V
C701 1-163-038-91 CERAMIC CHIP 0.1uF 25V C110 1-164-505-11 CERAMIC CHIP 2.2uF 16V
C702 1-163-038-91 CERAMIC CHIP 0.1uF 25V C111 1-164-004-11 CERAMIC CHIP 0.1uF 10% 25V
C703 1-163-038-91 CERAMIC CHIP 0.1uF 25V
C112 1-164-489-11 CERAMIC CHIP 0.22uF 10% 16V
< CONNECTOR > C113 1-164-489-11 CERAMIC CHIP 0.22uF 10% 16V
C114 1-164-489-11 CERAMIC CHIP 0.22uF 10% 16V
CN701 1-778-720-11 CONNECTOR, FFC/FPC 9P C115 1-163-038-91 CERAMIC CHIP 0.1uF 25V
C116 1-163-227-11 CERAMIC CHIP 10PF 0.5PF 50V
< DIODE >
C118 1-163-087-00 CERAMIC CHIP 4PF 50V
D701 8-719-018-46 DIODE SEL3510C-CD (POWER) C120 1-163-038-91 CERAMIC CHIP 0.1uF 25V
D702 8-719-023-94 DIODE SEL3910A-CD (DRIVE) C121 1-163-038-91 CERAMIC CHIP 0.1uF 25V
D703 8-719-023-95 DIODE SEL3710K-CD (CHANGER) C122 1-163-038-91 CERAMIC CHIP 0.1uF 25V
C123 1-163-038-91 CERAMIC CHIP 0.1uF 25V
< TRANSISTOR >
C124 1-163-038-91 CERAMIC CHIP 0.1uF 25V
Q701 8-729-424-08 TRANSISTOR UN2111 C125 1-164-346-11 CERAMIC CHIP 1uF 16V
C126 1-163-005-11 CERAMIC CHIP 470PF 10% 50V
< RESISTOR > C127 1-163-023-00 CERAMIC CHIP 0.015uF 5% 50V
C129 1-164-004-11 CERAMIC CHIP 0.1uF 10% 25V
R701 1-216-031-00 METAL CHIP 180 5% 1/10W
R702 1-216-033-00 METAL CHIP 220 5% 1/10W C130 1-163-038-91 CERAMIC CHIP 0.1uF 25V
R703 1-216-033-00 METAL CHIP 220 5% 1/10W C131 1-163-038-91 CERAMIC CHIP 0.1uF 25V

97
 MA-C30
Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
C132 1-163-007-11 CERAMIC CHIP 680PF 10% 50V C235 1-163-251-11 CERAMIC CHIP 100PF 5% 50V
C134 1-163-038-91 CERAMIC CHIP 0.1uF 25V C236 1-163-251-11 CERAMIC CHIP 100PF 5% 50V
C138 1-163-031-11 CERAMIC CHIP 0.01uF 50V C238 1-164-004-11 CERAMIC CHIP 0.1uF 10% 25V
C240 1-124-778-00 ELECT CHIP 22uF 20% 6.3V
C139 1-163-031-11 CERAMIC CHIP 0.01uF 50V C241 1-163-809-11 CERAMIC CHIP 0.047uF 10% 25V
C140 1-163-031-11 CERAMIC CHIP 0.01uF 50V
C141 1-163-021-91 CERAMIC CHIP 0.01uF 10% 50V C242 1-163-038-91 CERAMIC CHIP 0.1uF 25V
C142 1-163-038-91 CERAMIC CHIP 0.1uF 25V C301 1-163-038-91 CERAMIC CHIP 0.1uF 25V
C143 1-163-038-91 CERAMIC CHIP 0.1uF 25V C302 1-163-141-00 CERAMIC CHIP 0.001uF 5% 50V
C303 1-163-038-91 CERAMIC CHIP 0.1uF 25V
C144 1-164-182-11 CERAMIC CHIP 0.0033uF 10% 50V C305 1-163-038-91 CERAMIC CHIP 0.1uF 25V
C145 1-164-182-11 CERAMIC CHIP 0.0033uF 10% 50V
C147 1-163-133-00 CERAMIC CHIP 470PF 5% 50V C306 1-164-346-11 CERAMIC CHIP 1uF 16V
C148 1-126-395-11 ELECT 22uF 20% 16V C307 1-163-038-91 CERAMIC CHIP 0.1uF 25V
C149 1-163-014-00 CERAMIC CHIP 0.0027uF 10% 50V C308 1-163-038-91 CERAMIC CHIP 0.1uF 25V
C309 1-163-038-91 CERAMIC CHIP 0.1uF 25V
C153 1-163-038-91 CERAMIC CHIP 0.1uF 25V C310 1-164-004-11 CERAMIC CHIP 0.1uF 10% 25V
C154 1-163-014-00 CERAMIC CHIP 0.0027uF 10% 50V
C155 1-163-014-00 CERAMIC CHIP 0.0027uF 10% 50V C311 1-163-038-91 CERAMIC CHIP 0.1uF 25V
C156 1-163-014-00 CERAMIC CHIP 0.0027uF 10% 50V C312 1-163-038-91 CERAMIC CHIP 0.1uF 25V
C157 1-163-809-11 CERAMIC CHIP 0.047uF 10% 25V C313 1-163-038-91 CERAMIC CHIP 0.1uF 25V
C314 1-163-038-91 CERAMIC CHIP 0.1uF 25V
C158 1-163-809-11 CERAMIC CHIP 0.047uF 10% 25V C315 1-163-038-91 CERAMIC CHIP 0.1uF 25V
C159 1-163-038-91 CERAMIC CHIP 0.1uF 25V
C160 1-163-038-91 CERAMIC CHIP 0.1uF 25V C316 1-164-505-11 CERAMIC CHIP 2.2uF 16V
C166 1-107-823-11 CERAMIC CHIP 0.47uF 10% 16V C318 1-163-038-91 CERAMIC CHIP 0.1uF 25V
C167 1-163-809-11 CERAMIC CHIP 0.047uF 10% 25V C319 1-115-565-11 CERAMIC CHIP 2.2uF 10% 10V
C330 1-163-038-91 CERAMIC CHIP 0.1uF 25V
C168 1-163-038-91 CERAMIC CHIP 0.1uF 25V C332 1-163-038-91 CERAMIC CHIP 0.1uF 25V
C169 1-164-346-11 CERAMIC CHIP 1uF 16V
C170 1-163-275-11 CERAMIC CHIP 0.001uF 5% 50V C333 1-164-346-11 CERAMIC CHIP 1uF 16V
C171 1-163-275-11 CERAMIC CHIP 0.001uF 5% 50V C334 1-163-038-91 CERAMIC CHIP 0.1uF 25V
C173 1-163-235-11 CERAMIC CHIP 22PF 5% 50V C335 1-163-038-91 CERAMIC CHIP 0.1uF 25V
C336 1-164-346-11 CERAMIC CHIP 1uF 16V
C176 1-163-038-91 CERAMIC CHIP 0.1uF 25V C340 1-163-017-00 CERAMIC CHIP 0.0047uF 5% 50V
C177 1-163-038-91 CERAMIC CHIP 0.1uF 25V
C178 1-163-038-91 CERAMIC CHIP 0.1uF 25V C342 1-163-038-91 CERAMIC CHIP 0.1uF 25V
C179 1-164-161-11 CERAMIC CHIP 0.0022uF 10% 100V C501 1-163-224-11 CERAMIC CHIP 7PF 0.25PF 50V
C180 1-164-004-11 CERAMIC CHIP 0.1uF 10% 25V C502 1-163-224-11 CERAMIC CHIP 7PF 0.25PF 50V
C701 1-126-204-11 ELECT CHIP 47uF 20% 16V
C181 1-163-038-91 CERAMIC CHIP 0.1uF 25V C702 1-126-392-11 ELECT CHIP 100uF 20% 6.3V
C182 1-163-038-91 CERAMIC CHIP 0.1uF 25V
C201 1-164-505-11 CERAMIC CHIP 2.2uF 16V C703 1-163-038-91 CERAMIC CHIP 0.1uF 25V
C204 1-163-243-11 CERAMIC CHIP 47PF 5% 50V C704 1-126-392-11 ELECT CHIP 100uF 20% 6.3V
C205 1-163-243-11 CERAMIC CHIP 47PF 5% 50V C705 1-163-038-91 CERAMIC CHIP 0.1uF 25V

C208 1-163-019-00 CERAMIC CHIP 0.0068uF 10% 50V < CONNECTOR >
C209 1-163-021-91 CERAMIC CHIP 0.01uF 10% 50V
C210 1-163-014-00 CERAMIC CHIP 0.0027uF 10% 50V * CNJ101 1-770-415-11 CONNECTOR, FFC/FPC 11P
C211 1-163-017-00 CERAMIC CHIP 0.0047uF 5% 50V CNJ102 1-770-674-11 CONNECTOR, FFC/FPC 16P
C213 1-164-505-11 CERAMIC CHIP 2.2uF 16V * CNJ103 1-770-415-11 CONNECTOR, FFC/FPC 11P
* CNJ104 1-564-518-11 PLUG, CONNECTOR 3P
C214 1-164-004-11 CERAMIC CHIP 0.1uF 10% 25V CNJ105 1-770-695-11 CONNECTOR, FFC/FPC 12P
C217 1-163-038-91 CERAMIC CHIP 0.1uF 25V
C218 1-163-809-11 CERAMIC CHIP 0.047uF 10% 25V * CNJ107 1-568-941-11 PIN, CONNECTOR 3P
C219 1-163-809-11 CERAMIC CHIP 0.047uF 10% 25V * CNJ201 1-770-416-11 PIN, CONNECTOR (PC BOARD) 54P
C220 1-163-038-91 CERAMIC CHIP 0.1uF 25V
< COMPOSITION CIRCUIT BLOCK >
C221 1-163-275-11 CERAMIC CHIP 0.001uF 5% 50V
C222 1-164-346-11 CERAMIC CHIP 1uF 16V CP103 1-690-880-51 LEAD (WITH CONNECTOR)
C223 1-164-004-11 CERAMIC CHIP 0.1uF 10% 25V
C224 1-164-004-11 CERAMIC CHIP 0.1uF 10% 25V < DIODE >
C227 1-164-004-11 CERAMIC CHIP 0.1uF 10% 25V
D101 8-719-987-69 DIODE DAN217
C228 1-164-004-11 CERAMIC CHIP 0.1uF 10% 25V D201 8-719-938-75 DIODE SB05-05CP
C229 1-164-004-11 CERAMIC CHIP 0.1uF 10% 25V D301 8-719-938-75 DIODE SB05-05CP
C230 1-164-004-11 CERAMIC CHIP 0.1uF 10% 25V D701 8-719-157-42 DIODE RD8.2M-B
C233 1-115-363-11 CERAMIC CHIP 10uF 10V
C234 1-115-363-11 CERAMIC CHIP 10uF 10V

98
 MA-C30
Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
< IC > R110 1-216-657-11 METAL CHIP 1.8K 0.5% 1/10W
R111 1-216-671-11 METAL CHIP 6.8K 0.5% 1/10W
IC101 8-759-471-19 IC TA2112FN(EL) R112 1-216-001-00 METAL CHIP 10 5% 1/10W
IC103 8-759-449-84 IC LA6539M-TE-L R113 1-216-001-00 METAL CHIP 10 5% 1/10W
IC104 8-759-701-36 IC NJM3403AM R114 1-216-001-00 METAL CHIP 10 5% 1/10W
IC105 8-759-082-61 IC TC4W53FU
IC106 8-759-471-18 IC BA6849FP-E2 R115 1-216-001-00 METAL CHIP 10 5% 1/10W
R118 1-216-295-91 SHORT 0
IC107 8-759-384-55 IC LA6527N R119 1-216-673-11 METAL CHIP 8.2K 0.5% 1/10W
IC109 8-759-338-78 IC BA10324AFV-E2 R120 1-216-295-91 SHORT 0
IC110 8-759-008-67 IC MC14066BF R121 1-216-673-11 METAL CHIP 8.2K 0.5% 1/10W
IC111 8-759-338-78 IC BA10324AFV-E2
IC112 8-759-505-70 IC L2726 R122 1-216-001-00 METAL CHIP 10 5% 1/10W
R123 1-216-663-11 METAL CHIP 3.3K 0.5% 1/10W
IC201 8-759-471-17 IC TC9449AF(BS,D,24A) R124 1-216-651-11 METAL CHIP 1K 0.5% 1/10W
IC202 8-759-710-79 IC NJM2107F R125 1-216-683-11 METAL CHIP 22K 0.5% 1/10W
IC203 8-759-082-57 IC TC7W04FU R126 1-216-683-11 METAL CHIP 22K 0.5% 1/10W
IC301 8-752-388-69 IC CXD1818R
IC302 8-759-578-85 IC MSM5416258B-35JDR1 R127 1-216-668-11 METAL CHIP 5.1K 0.5% 1/10W
R129 1-216-677-11 METAL CHIP 12K 0.5% 1/10W
IC303 8-759-522-95 IC HD6433032SSNM11F R130 1-216-659-11 METAL CHIP 2.2K 0.5% 1/10W
IC304 8-759-435-26 IC AT29C512-90JC-T R131 1-216-677-11 METAL CHIP 12K 0.5% 1/10W
IC305 8-759-497-15 IC BU6260AKV R132 1-216-675-11 METAL CHIP 10K 0.5% 1/10W
IC501 8-759-259-77 IC PQ20VZ5U
R133 1-216-677-11 METAL CHIP 12K 0.5% 1/10W
< COIL > R139 1-216-025-91 RES,CHIP 100 5% 1/10W
R140 1-216-033-00 METAL CHIP 220 5% 1/10W
L101 1-414-267-11 INDUCTOR 10uH R141 1-220-745-11 RES,CHIP 0.56 5% 1/2W
L200 1-414-235-22 INDUCTOR CHIP 0uH R142 1-216-675-11 METAL CHIP 10K 0.5% 1/10W
L201 1-414-235-22 INDUCTOR CHIP 0uH
L202 1-414-235-22 INDUCTOR CHIP 0uH R143 1-216-675-11 METAL CHIP 10K 0.5% 1/10W
L203 1-414-267-11 INDUCTOR 10uH R144 1-218-756-11 METAL CHIP 150K 0.50% 1/10W
R145 1-216-687-11 METAL CHIP 33K 0.5% 1/10W
L701 1-500-425-11 FERRITE 0uH R146 1-218-764-11 METAL CHIP 330K 0.50% 1/10W
L702 1-500-425-11 FERRITE 0uH R149 1-216-699-11 METAL CHIP 100K 0.5% 1/10W

< TRANSISTOR > R150 1-216-667-11 METAL CHIP 4.7K 0.5% 1/10W
R151 1-218-764-11 METAL CHIP 330K 0.50% 1/10W
Q101 8-729-101-07 TRANSISTOR 2SB798-DL R152 1-216-699-11 METAL CHIP 100K 0.5% 1/10W
Q102 8-729-107-30 TRANSISTOR 2SC3545-T42 R153 1-218-758-11 METAL CHIP 180K 0.50% 1/10W
Q103 8-729-027-39 TRANSISTOR DTA144TKA-T146 R155 1-216-679-11 METAL CHIP 15K 0.5% 1/10W
Q104 8-729-107-30 TRANSISTOR 2SC3545-T42
Q105 8-729-421-19 TRANSISTOR UN2213 R156 1-216-675-11 METAL CHIP 10K 0.5% 1/10W
R157 1-218-754-11 METAL CHIP 120K 0.50% 1/10W
Q106 8-729-421-19 TRANSISTOR UN2213 R158 1-216-677-11 METAL CHIP 12K 0.5% 1/10W
Q202 8-729-107-30 TRANSISTOR 2SC3545-T42 R161 1-216-675-11 METAL CHIP 10K 0.5% 1/10W
Q203 8-729-216-22 TRANSISTOR 2SA1162-G R163 1-216-675-11 METAL CHIP 10K 0.5% 1/10W
Q205 8-729-107-46 TRANSISTOR 2SC3624A-L15
Q206 8-729-107-46 TRANSISTOR 2SC3624A-L15 R164 1-216-675-11 METAL CHIP 10K 0.5% 1/10W
R166 1-220-149-11 REGISTER 2.2 10% 1/2W
Q207 8-729-421-19 TRANSISTOR UN2213 R167 1-220-149-11 REGISTER 2.2 10% 1/2W
Q701 8-729-421-22 TRANSISTOR UN2211 R168 1-216-675-11 METAL CHIP 10K 0.5% 1/10W
Q702 8-729-926-85 TRANSISTOR 2SB1424-T101-Q R169 1-216-663-11 METAL CHIP 3.3K 0.5% 1/10W

< RESISTOR > R171 1-216-295-91 SHORT 0

R174 1-216-295-91 SHORT 0
R100 1-216-625-11 METAL CHIP 82 0.5% 1/10W R180 1-216-295-91 SHORT 0
R101 1-216-610-11 METAL CHIP 20 0.50% 1/10W R181 1-216-675-11 METAL CHIP 10K 0.5% 1/10W
R102 1-216-610-11 METAL CHIP 20 0.50% 1/10W R182 1-216-667-11 METAL CHIP 4.7K 0.5% 1/10W
R103 1-216-651-11 METAL CHIP 1K 0.5% 1/10W
R104 1-216-687-11 METAL CHIP 33K 0.5% 1/10W R183 1-216-699-11 METAL CHIP 100K 0.5% 1/10W
R184 1-216-667-11 METAL CHIP 4.7K 0.5% 1/10W
R105 1-216-687-11 METAL CHIP 33K 0.5% 1/10W R186 1-216-121-91 RES,CHIP 1M 5% 1/10W
R106 1-216-699-11 METAL CHIP 100K 0.5% 1/10W R187 1-216-675-11 METAL CHIP 10K 0.5% 1/10W
R107 1-216-693-11 METAL CHIP 56K 0.5% 1/10W R188 1-216-675-11 METAL CHIP 10K 0.5% 1/10W
R108 1-216-001-00 METAL CHIP 10 5% 1/10W
R109 1-216-673-11 METAL CHIP 8.2K 0.5% 1/10W R189 1-216-073-00 METAL CHIP 10K 5% 1/10W
R191 1-216-073-00 METAL CHIP 10K 5% 1/10W

99
 MA-C30

Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
R192 1-216-669-11 METAL CHIP 5.6K 0.5% 1/10W R310 1-216-073-00 METAL CHIP 10K 5% 1/10W
R193 1-216-669-11 METAL CHIP 5.6K 0.5% 1/10W
R194 1-216-669-11 METAL CHIP 5.6K 0.5% 1/10W R311 1-216-033-00 METAL CHIP 220 5% 1/10W
R316 1-216-065-91 RES,CHIP 4.7K 5% 1/10W
R195 1-216-669-11 METAL CHIP 5.6K 0.5% 1/10W R318 1-216-025-91 RES,CHIP 100 5% 1/10W
R196 1-216-691-11 METAL CHIP 47K 0.5% 1/10W R319 1-216-025-91 RES,CHIP 100 5% 1/10W
R197 1-216-691-11 METAL CHIP 47K 0.5% 1/10W R320 1-216-025-91 RES,CHIP 100 5% 1/10W
R198 1-216-691-11 METAL CHIP 47K 0.5% 1/10W
R199 1-216-691-11 METAL CHIP 47K 0.5% 1/10W R321 1-216-025-91 RES,CHIP 100 5% 1/10W
R322 1-216-001-00 METAL CHIP 10 5% 1/10W
R200 1-216-009-91 RES,CHIP 22 5% 1/10W R323 1-216-001-00 METAL CHIP 10 5% 1/10W
R201 1-216-033-00 METAL CHIP 220 5% 1/10W R330 1-216-009-91 RES,CHIP 22 5% 1/10W
R203 1-216-675-11 METAL CHIP 10K 0.5% 1/10W R331 1-216-009-91 RES,CHIP 22 5% 1/10W
R204 1-216-691-11 METAL CHIP 47K 0.5% 1/10W
R205 1-216-675-11 METAL CHIP 10K 0.5% 1/10W R333 1-216-089-91 RES,CHIP 47K 5% 1/10W
R334 1-216-073-00 METAL CHIP 10K 5% 1/10W
R206 1-216-691-11 METAL CHIP 47K 0.5% 1/10W R335 1-216-089-91 RES,CHIP 47K 5% 1/10W
R207 1-216-687-11 METAL CHIP 33K 0.5% 1/10W R336 1-216-033-00 METAL CHIP 220 5% 1/10W
R208 1-216-699-11 METAL CHIP 100K 0.5% 1/10W R337 1-216-089-91 RES,CHIP 47K 5% 1/10W
R209 1-216-675-11 METAL CHIP 10K 0.5% 1/10W
R210 1-216-683-11 METAL CHIP 22K 0.5% 1/10W R338 1-216-113-00 METAL CHIP 470K 5% 1/10W
R340 1-216-033-00 METAL CHIP 220 5% 1/10W
R211 1-216-675-11 METAL CHIP 10K 0.5% 1/10W R341 1-216-033-00 METAL CHIP 220 5% 1/10W
R212 1-216-683-11 METAL CHIP 22K 0.5% 1/10W R342 1-216-033-00 METAL CHIP 220 5% 1/10W
R213 1-216-675-11 METAL CHIP 10K 0.5% 1/10W R343 1-216-113-00 METAL CHIP 470K 5% 1/10W
R214 1-216-675-11 METAL CHIP 10K 0.5% 1/10W
R215 1-216-663-11 METAL CHIP 3.3K 0.5% 1/10W R344 1-216-667-11 METAL CHIP 4.7K 0.5% 1/10W
R345 1-216-667-11 METAL CHIP 4.7K 0.5% 1/10W
R216 1-216-663-11 METAL CHIP 3.3K 0.5% 1/10W R346 1-216-089-91 RES,CHIP 47K 5% 1/10W
R217 1-216-033-00 METAL CHIP 220 5% 1/10W R347 1-216-667-11 METAL CHIP 4.7K 0.5% 1/10W
R218 1-216-675-11 METAL CHIP 10K 0.5% 1/10W R349 1-216-033-00 METAL CHIP 220 5% 1/10W
R219 1-216-683-11 METAL CHIP 22K 0.5% 1/10W
R221 1-216-295-91 SHORT 0 R350 1-216-033-00 METAL CHIP 220 5% 1/10W
R351 1-216-687-11 METAL CHIP 33K 0.5% 1/10W
R222 1-216-057-00 METAL CHIP 2.2K 5% 1/10W R352 1-216-627-11 METAL CHIP 100 0.5% 1/10W
R223 1-216-041-00 METAL CHIP 470 5% 1/10W R355 1-216-089-91 RES,CHIP 47K 5% 1/10W
R224 1-216-065-91 RES,CHIP 4.7K 5% 1/10W R356 1-216-089-91 RES,CHIP 47K 5% 1/10W
R226 1-216-057-00 METAL CHIP 2.2K 5% 1/10W
R227 1-216-041-00 METAL CHIP 470 5% 1/10W R358 1-216-049-91 RES,CHIP 1K 5% 1/10W
R359 1-216-049-91 RES,CHIP 1K 5% 1/10W
R228 1-216-065-91 RES,CHIP 4.7K 5% 1/10W R401 1-216-049-91 RES,CHIP 1K 5% 1/10W
R229 1-216-651-11 METAL CHIP 1K 0.5% 1/10W R502 1-216-295-91 SHORT 0
R230 1-216-651-11 METAL CHIP 1K 0.5% 1/10W R701 1-216-073-00 METAL CHIP 10K 5% 1/10W
R231 1-216-651-11 METAL CHIP 1K 0.5% 1/10W
R232 1-216-651-11 METAL CHIP 1K 0.5% 1/10W R702 1-220-262-11 RES,CHIP 680 5% 1/4W
R703 1-218-618-11 METAL CHIP 22 5% 1W
R234 1-216-665-11 METAL CHIP 3.9K 0.5% 1/10W R704 1-218-618-11 METAL CHIP 22 5% 1W
R235 1-216-665-11 METAL CHIP 3.9K 0.5% 1/10W R705 1-216-663-11 METAL CHIP 3.3K 0.5% 1/10W
R236 1-216-675-11 METAL CHIP 10K 0.5% 1/10W R706 1-216-651-11 METAL CHIP 1K 0.5% 1/10W
R237 1-216-677-11 METAL CHIP 12K 0.5% 1/10W
R238 1-216-089-91 RES,CHIP 47K 5% 1/10W < COMPOSITION CIRCUIT BLOCK >

R239 1-216-675-11 METAL CHIP 10K 0.5% 1/10W RB301 1-233-578-11 RES, CHIP NETWORK 47K
R240 1-216-675-11 METAL CHIP 10K 0.5% 1/10W RB302 1-233-576-11 RES, CHIP NETWORK 100
R241 1-216-687-11 METAL CHIP 33K 0.5% 1/10W RB303 1-236-908-11 RES, CHIP NETWORK 10K (3216)
R242 1-216-033-00 METAL CHIP 220 5% 1/10W RB304 1-236-908-11 RES, CHIP NETWORK 10K (3216)
R243 1-218-760-11 METAL CHIP 220K 0.50% 1/10W RB305 1-233-578-11 RES, CHIP NETWORK 47K

R244 1-216-695-11 METAL CHIP 68K 0.5% 1/10W RB306 1-233-578-11 RES, CHIP NETWORK 47K
R245 1-216-683-11 METAL CHIP 22K 0.5% 1/10W
R247 1-216-121-91 RES,CHIP 1M 5% 1/10W < VIBRATOR >
R249 1-216-667-11 METAL CHIP 4.7K 0.5% 1/10W
R250 1-216-663-11 METAL CHIP 3.3K 0.5% 1/10W X201 1-767-382-11 OSCILLATOR, CERAMIC (40MHz)
X301 1-767-382-11 OSCILLATOR, CERAMIC (40MHz)
R251 1-216-655-11 METAL CHIP 1.5K 0.5% 1/10W X302 1-579-834-11 VIBRATOR, CRYSTAL (33.86MHz)
R256 1-216-097-91 RES,CHIP 100K 5% 1/10W
R257 1-216-097-91 RES,CHIP 100K 5% 1/10W **************************************************************
R308 1-216-001-00 METAL CHIP 10 5% 1/10W

100
 MAIN
Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
* A-4724-461-A MAIN BOARD, COMPLETE < RESISTOR >
********************
R601 1-216-041-00 METAL CHIP 470 5% 1/10W
< CAPACITOR > R602 1-216-041-00 METAL CHIP 470 5% 1/10W
R603 1-216-073-00 METAL CHIP 10K 5% 1/10W
C601 1-163-038-91 CERAMIC CHIP 0.1uF 25V R604 1-216-085-00 METAL CHIP 33K 5% 1/10W
C602 1-163-038-91 CERAMIC CHIP 0.1uF 25V R605 1-216-073-00 METAL CHIP 10K 5% 1/10W
C603 1-163-001-11 CERAMIC CHIP 220PF 10% 50V
C604 1-163-038-91 CERAMIC CHIP 0.1uF 25V R606 1-216-073-00 METAL CHIP 10K 5% 1/10W
C605 1-163-101-00 CERAMIC CHIP 22PF 5% 50V R607 1-216-073-00 METAL CHIP 10K 5% 1/10W
R608 1-216-073-00 METAL CHIP 10K 5% 1/10W
C606 1-163-038-91 CERAMIC CHIP 0.1uF 25V R609 1-216-073-00 METAL CHIP 10K 5% 1/10W
C607 1-126-394-11 ELECT CHIP 10uF 20% 16V R610 1-216-073-00 METAL CHIP 10K 5% 1/10W
C608 1-163-038-91 CERAMIC CHIP 0.1uF 25V
C609 1-163-101-00 CERAMIC CHIP 22PF 5% 50V R611 1-216-073-00 METAL CHIP 10K 5% 1/10W
C610 1-163-038-91 CERAMIC CHIP 0.1uF 25V R612 1-216-073-00 METAL CHIP 10K 5% 1/10W
R613 1-216-073-00 METAL CHIP 10K 5% 1/10W
C611 1-163-038-91 CERAMIC CHIP 0.1uF 25V R614 1-216-073-00 METAL CHIP 10K 5% 1/10W
C612 1-126-396-11 ELECT CHIP 47uF 20% 16V R615 1-216-073-00 METAL CHIP 10K 5% 1/10W
C614 1-163-038-91 CERAMIC CHIP 0.1uF 25V
C615 1-163-038-91 CERAMIC CHIP 0.1uF 25V R616 1-216-073-00 METAL CHIP 10K 5% 1/10W
C616 1-164-222-11 CERAMIC CHIP 0.22uF 25V R617 1-216-073-00 METAL CHIP 10K 5% 1/10W
R618 1-216-033-00 METAL CHIP 220 5% 1/10W
C617 1-163-038-91 CERAMIC CHIP 0.1uF 25V R619 1-216-033-00 METAL CHIP 220 5% 1/10W
C618 1-126-394-11 ELECT CHIP 10uF 20% 16V R620 1-216-033-00 METAL CHIP 220 5% 1/10W
C619 1-163-038-91 CERAMIC CHIP 0.1uF 25V
C620 1-126-392-11 ELECT CHIP 100uF 20% 6.3V R621 1-216-073-00 METAL CHIP 10K 5% 1/10W
C621 1-126-396-11 ELECT CHIP 47uF 20% 16V R622 1-216-073-00 METAL CHIP 10K 5% 1/10W
R623 1-216-073-00 METAL CHIP 10K 5% 1/10W
C622 1-163-109-00 CERAMIC CHIP 47PF 5% 50V R624 1-216-073-00 METAL CHIP 10K 5% 1/10W
R625 1-216-073-00 METAL CHIP 10K 5% 1/10W
< CONNECTOR >
R626 1-216-073-00 METAL CHIP 10K 5% 1/10W
* CN601 1-568-951-11 PIN, CONNECTOR 2P R627 1-216-073-00 METAL CHIP 10K 5% 1/10W
CN602 1-770-640-11 CONNECTOR, FFC/FPC 9P R628 1-216-079-00 METAL CHIP 18K 5% 1/10W
CN603 1-770-643-11 CONNECTOR, FFC/FPC 12P R629 1-216-068-00 METAL CHIP 6.2K 5% 1/10W
CN604 1-506-468-11 PIN, CONNECTOR 3P R630 1-216-073-00 METAL CHIP 10K 5% 1/10W
* CN605 1-568-955-11 PIN, CONNECTOR 6P
R631 1-216-033-00 METAL CHIP 220 5% 1/10W
CN606 1-506-469-11 PIN, CONNECTOR 4P R632 1-218-603-91 METAL CHIP 1.2 5% 1W
* CN608 1-568-951-11 PIN, CONNECTOR 2P R633 1-218-603-91 METAL CHIP 1.2 5% 1W
CN609 1-506-469-11 PIN, CONNECTOR 4P R634 1-216-033-00 METAL CHIP 220 5% 1/10W
CN611 1-770-643-11 CONNECTOR, FFC/FPC 12P R635 1-216-057-00 METAL CHIP 2.2K 5% 1/10W
* CN612 1-770-416-11 PIN, CONNECTOR (PC BOARD) 54P
R636 1-216-025-91 RES,CHIP 100 5% 1/10W
< IC > R637 1-216-073-00 METAL CHIP 10K 5% 1/10W
R638 1-216-065-91 RES,CHIP 4.7K 5% 1/10W
IC601 8-759-040-83 IC BA6287F R639 1-216-033-00 METAL CHIP 220 5% 1/10W
IC602 8-759-569-86 IC uPD784031GC-8BT R640 1-216-073-00 METAL CHIP 10K 5% 1/10W
IC603 8-759-356-03 IC BA6780
IC604 8-759-926-80 IC SN74HC573BNS R641 1-216-073-00 METAL CHIP 10K 5% 1/10W
IC605 8-759-926-11 IC SN74HC138ANS
< COMPOSITION CIRCUIT BLOCK >
IC606 8-759-927-72 IC TL1591CP
IC607 8-759-587-80 IC SST29EE010-90-4C-NH-1.00 RB601 1-233-414-11 RES, CHIP NETWORK 4.7K (3216)
IC608 8-759-634-43 IC M51953BFP RB602 1-233-414-11 RES, CHIP NETWORK 4.7K (3216)
IC609 8-759-384-47 IC SYM53CF92A-64QFP RB603 1-236-908-11 RES, CHIP NETWORK 10K (3216)
IC610 8-759-497-29 IC uPD43256BGU-70LL-E2 RB604 1-236-908-11 RES, CHIP NETWORK 10K (3216)
RB605 1-236-908-11 RES, CHIP NETWORK 10K (3216)
< COIL >
RB606 1-236-908-11 RES, CHIP NETWORK 10K (3216)
L601 1-414-235-22 INDUCTOR CHIP 0uH RB607 1-236-908-11 RES, CHIP NETWORK 10K (3216)
L602 1-500-202-11 FERRITE 0uH
L603 1-500-202-11 FERRITE 0uH < SWITCH >

< TRANSISTOR > SW601 1-570-313-11 SWITCH, KEY BOARD

SW602 1-570-313-11 SWITCH, KEY BOARD
Q601 8-729-107-46 TRANSISTOR 2SC3624A-L15

101
 MAIN MOTOR P.JACK P.SW POWER
Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
< VIBRATOR > C923 1-104-666-11 ELECT 220uF 20% 25V

X601 1-760-225-11 VIBRATOR, CERAMIC < CONNECTOR >

X602 1-767-325-21 OSCILLATOR, CRYSTAL
CN905 1-564-321-00 PIN, CONNECTOR 2P
************************************************************** CN906 1-691-766-11 PLUG (MICRO CONNECTOR) 4P
CN907 1-691-766-21 PLUG (MICRO CONNECTOR) 4P
* 1-672-167-11 MOTOR BOARD * CN908 1-568-951-11 PIN, CONNECTOR 2P
*********** * CN909 1-568-951-11 PIN, CONNECTOR 2P

< CONNECTOR > < COMPOSITION CIRCUIT BLOCK >

CN61 1-506-469-11 PIN, CONNECTOR 4P CP901 1-537-771-21 TERMINAL BOARD, GROUND

************************************************************** < DIODE >

* 1-672-161-11 P.JACK BOARD D902 8-719-025-03 DIODE RBA-402-SL

************ D903 8-719-210-39 DIODE EC10QS-04
D904 8-719-210-39 DIODE EC10QS-04
< CONNECTOR > D905 8-719-210-33 DIODE EC10DS2
D906 8-719-210-33 DIODE EC10DS2
* CN451 1-564-506-11 PLUG, CONNECTOR 3P
D907 8-719-210-33 DIODE EC10DS2
< JACK > D908 8-719-210-33 DIODE EC10DS2

J451 1-770-719-11 JACK, PIN 2P < FUSE >

< COIL > ! F904 1-532-388-51 FUSE (2A/250V)

L451 1-414-235-22 INDUCTOR CHIP 0uH < FERRITE BEAD >

L452 1-414-235-22 INDUCTOR CHIP 0uH
L453 1-414-235-22 INDUCTOR CHIP 0uH FB901 1-410-397-21 FERRITE BEAD INDUCTOR
FB902 1-410-397-21 FERRITE BEAD INDUCTOR
**************************************************************
< FUSE HOLDER >
* 1-672-160-11 P.SW BOARD
********** FH903 1-533-293-11 FUSE HOLDER
FH904 1-533-293-11 FUSE HOLDER
< CAPACITOR >
< IC >
C901 1-113-920-11 CERAMIC 0.0022uF 20% 250V
IC901 8-759-442-83 IC MC34166D2TR4
< CONNECTOR > IC902 8-759-442-83 IC MC34166D2TR4
IC903 8-759-245-86 IC TA7912S
* CN901 1-568-226-11 PIN, CONNECTOR 2P
< COIL >
< SWITCH >
L901 1-415-951-11 INDUCTOR 220uH
S901 1-762-581-11 SWITCH, AC POWER PUSH (1 KEY)(U) L902 1-415-951-11 INDUCTOR 220uH

************************************************************** < RESISTOR >

* A-4724-442-A POWER BOARD, COMPLETE R901 1-216-073-00 METAL CHIP 10K 5% 1/10W
********************* R904 1-216-069-00 METAL CHIP 6.8K 5% 1/10W
R905 1-216-045-00 METAL CHIP 680 5% 1/10W
< CAPACITOR > R906 1-216-073-00 METAL CHIP 10K 5% 1/10W
R907 1-216-105-91 RES,CHIP 220K 5% 1/10W
C908 1-125-742-11 ELECT(BLOCK) 12000uF 20% 35V
C911 1-126-965-11 ELECT 22uF 20% 50V R910 1-216-073-00 METAL CHIP 10K 5% 1/10W
C912 1-163-125-00 CERAMIC CHIP 220PF 5% 50V R911 1-216-089-91 RES,CHIP 47K 5% 1/10W
C913 1-104-666-11 ELECT 220uF 20% 25V
C915 1-126-965-11 ELECT 22uF 20% 50V **************************************************************

C916 1-164-699-11 CERAMIC CHIP 0.0033uF 5% 50V

C917 1-104-666-11 ELECT 220uF 20% 25V
C920 1-126-941-11 ELECT 470uF 20% 25V
C921 1-126-941-11 ELECT 470uF 20% 25V
C922 1-126-951-11 ELECT 470uF 20% 35V
The components identified by Les composants identifiés par une
mark ! or dotted line with mark marque ! sont critiques pour la
! are critical for safety. sécurité.
Replace only with part number Ne les remplacer que par une
specified. piéce portant le numéro spécifié.

102
 SE-C7 SCSI IN SCSI OUT TABLE SENSOR
Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
* A-4724-441-A SE-C7 BOARD, COMPLETE < IC >
*********************
IC691 8-759-464-52 IC BH9598FP-YE2
1-790-251-11 WIRE (FLAT TYPE) (11 CORE)
< RESISTOR >
< CAPACITOR >
R691 1-216-073-00 METAL CHIP 10K 5% 1/10W
C2 1-115-467-11 CERAMIC CHIP 0.22uF 10% 10V
C3 1-162-962-11 CERAMIC CHIP 470PF 10% 50V **************************************************************
C4 1-115-156-11 CERAMIC CHIP 1uF 10V
C5 1-115-156-11 CERAMIC CHIP 1uF 10V * 1-672-168-11 TABLE SENSOR BOARD
******************
< IC >
< CONNECTOR >
IC1 8-759-702-02 IC NJM062M
* CN51 1-568-944-11 PIN, CONNECTOR 6P
< RESISTOR > CN52 1-506-481-11 PIN, CONNECTOR 2P

R1 1-218-732-11 METAL CHIP 47K 0.50% 1/16W < IC >

R2 1-218-732-11 METAL CHIP 47K 0.50% 1/16W
R3 1-218-714-11 METAL CHIP 8.2K 0.50% 1/16W IC51 8-749-924-18 IC PHOTO INTERRUPTER RPI-1391
R4 1-218-752-11 METAL CHIP 330K 0.50% 1/16W IC52 8-749-924-18 IC PHOTO INTERRUPTER RPI-1391
R5 1-218-732-11 METAL CHIP 47K 0.50% 1/16W IC53 8-749-924-18 IC PHOTO INTERRUPTER RPI-1391

R6 1-218-909-11 RES,CHIP 390K 0.50% 1/16W < RESISTOR >

R7 1-218-716-11 METAL CHIP 10K 0.50% 1/16W
R8 1-218-668-11 METAL CHIP 100 0.50% 1/16W R51 1-216-047-91 RES,CHIP 820 5% 1/10W
R9 1-219-570-11 RES,CHIP 10M 5% 1/16W R52 1-216-047-91 RES,CHIP 820 5% 1/10W
R10 1-219-570-11 RES,CHIP 10M 5% 1/16W R53 1-216-047-91 RES,CHIP 820 5% 1/10W

R11 1-218-738-11 METAL CHIP 82K 0.50% 1/16W **************************************************************

R12 1-218-728-11 METAL CHIP 33K 0.50% 1/16W
MISCELLANEOUS
< VIBRATOR > *************

X1 1-803-503-21 SENSOR, SHOCK 14 1-790-228-11 CORD (WITH CONNECTOR)

! 21 1-783-531-41 CORD, POWER
************************************************************** 110 1-790-229-11 WIRE (FLAT TYPE) (9 CORE)
111 1-790-230-11 WIRE (FLAT TYPE) (12 CORE)
* 1-672-364-11 SCSI IN BOARD 112 1-790-231-11 WIRE (FLAT TYPE) (12 CORE)
*************
259 8-729-926-31 PHOTO TRANSISTOR PT483F1
< CONNECTOR > 303 1-777-692-11 WIRE (FLAT TYPE) (11 CORE)
308 1-758-088-11 OPTICAL PICK-UP SPU-3212
CN681 1-785-592-11 PIN, CONNECTOR (PC BOARD) 50P 309 1-782-368-12 WIRE (FLAT TYPE) (16 CORE)
CN682 1-793-168-11 PIN, CONNECTOR (HALF PITCH)50P M61 X-4951-512-1 MOTOR ASSY (SPINDLE)

************************************************************** M62 X-4951-512-1 MOTOR ASSY (LOADING)

M101 A-4672-641-A SPINDLE ASSY (TABLE)
* 1-672-365-11 SCSI OUT BOARD * M102 X-4951-510-1 MOTOR, DC (SLED)
************** ! T901 1-433-542-11 TRANSFORMER, POWER

< CAPACITOR > **************************************************************

C691 1-163-038-91 CERAMIC CHIP 0.1uF 25V ACCESSORIES & PACKING MATERIALS
C692 1-126-402-11 ELECT CHIP 2.2uF 20% 50V *******************************

< CONNECTOR > 1-761-178-11 BOARD, SCSI

1-790-517-11 CORD, CONNECTION
CN691 1-785-592-11 PIN, CONNECTOR (PC BOARD) 50P 1-790-661-11 CORD, CONNECTION (SCSI)
CN694 1-793-168-11 PIN, CONNECTOR (HALF PITCH)50P 3-867-854-11 MANUAL, INSTRUCTION (ENGLISH)
3-866-765-11 MANUAL (CD-ROM), INSTRUCTION (ENGLISH)
< DIODE >
4-214-059-01 LABEL (DISC)
D691 8-719-210-39 DIODE EC10QS-04
**************************************************************
< FUSE >

F691 1-533-817-21 THERMISTOR The components identified by Les composants identifiés par une
mark ! or dotted line with mark marque ! sont critiques pour la
! are critical for safety. sécurité.
Replace only with part number Ne les remplacer que par une
specified. piéce portant le numéro spécifié.

103
CDJ-500

Ref. No. Part No. Description Remark

*************
HARDWARE LIST
*************

#1 7-685-646-79 SCREW +BVTP 3X8 TYPE2 N-S

#2 7-682-135-01 SCREW +P 2.5X6
#3 7-685-871-01 SCREW +BVTT 3X6 (S)
#4 7-685-104-14 SCREW +P 2X6 TYPE2 SLIT
#5 7-621-772-18 SCREW +B 2X4

#7 7-624-105-04 STOP RING 2.3, TYPE -E

#8 7-621-255-25 SCREW +P 2X4
#9 7-685-873-09 SCREW +BVTT 3X10 (S)
#10 7-685-875-09 SCREW +BVTT 3X14 (S)
#11 7-628-253-00 SCREW +PS 2X4

#12 7-628-254-15 SCREW +PS 2.6X6

#13 7-685-102-19 SCREW +P 2X4 NON-SLIT TYPE 2
#14 7-685-107-11 SCREW +P 2X12 TYPE2 NON-SLIT
#15 7-685-534-19 SCREW +BTP 2.6X8 TYPE2 N-S
#16 7-685-862-09 SCREW +BVTT 2.6X6 (S)

#17 7-685-546-19 SCREW +BTP 3X8 TYPE2 N-S

#18 7-685-532-19 SCREW +BTP 2.6X5 TYPE2 N-S

9-928-997-11 Sony Corporation 99H0923-1D

Home Audio Company Printed in Japan © 1999. 8
104 Published by Quality Assurance Dept.