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Plating

The document outlines various special processes related to electroplating, including cadmium plating, anodizing, and silver plating, detailing current systems and proposed new layouts for NADCAP compliance. It includes information on installation sequences, lab equipment requirements, and scrubber units for existing and new plants. The document serves as a comprehensive reference for the planning and implementation of these processes.

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sathishrajdme27
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36 views12 pages

Plating

The document outlines various special processes related to electroplating, including cadmium plating, anodizing, and silver plating, detailing current systems and proposed new layouts for NADCAP compliance. It includes information on installation sequences, lab equipment requirements, and scrubber units for existing and new plants. The document serves as a comprehensive reference for the planning and implementation of these processes.

Uploaded by

sathishrajdme27
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PPTX, PDF, TXT or read online on Scribd
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Special Process

1) CADMIUM PLATING PROCESS TANK CURRENT JAPL SEQUENCE

2) ANODIZING PROCESS TANK CURRENT JAPL SEQUENCE

3) PASSIVATION PROCESS TANK CURRENT JAPL SEQUENCE

4) PLATING RECTIFIER AND CHILLER INSTALLED SEQUENCE

5) ANODIZING TYPE I& TYPE II ALODINE 1200S NEW LAYOUT PLANNED FOR NADCAP

6) CADMIUM PLATING AND ZINC PLATING ELECTROPLATING NEW PROPOSED PLANT FOR NADCAP

7) SILVER PLATING COPPER PLATING NICKEL PLATING NEW PROPOSED PLANT FOR NADCAP

8) AUTO PLANT DETAIL STRUCTURE OF LINE I AND LINE II AND LINE III NEW PROPOSED PLANT

9).LAB EQUIPMENT REQUIRMENT AND AVAILABILITY NADCAP REQUIRMENT

10.NADCAP SEQUENCE PLANT INSTALLTION DETAILS REFERENCE

11.SCRUBBER UNIT OF EXITING AND NEW PROCESS PLANT DETAILS


SPECIAL PROCESS- PLATING
SUBJECT 1. ELECTROPLATING CADMIUM PLATING CURRENT JAPL SYSTEM

CADMIUM PLATING –PROCESSING SYSTEM


SPECIAL PROCESS- PLATING
SUBJECT 2. ELECTROPLATING ANODIZING TYPE-I CURRENT JAPL SYSTEM

ANODIZING-TYPE-I-PROCESSING SYSTEM
SPECIAL PROCESS - PLATING
SUBJECT 3. ELECTROPLATING SILVER PLATING, COPPER PLATING, NICKEL PLATING CURRENT JAPL SYSTEM

SILVER PLATING, COPPER PLATING, NICKEL PLATING


Special Process- PLATING

SUBJECT 4 RECTIFIER AND CHILLER INSTALLED CURRENT JAPL SYSTEM

RECTIFIER AND CHILLER


Special Process- PLATING

SUBJECT 5. ANODIZINGTYPE-I TYPE-II , ALODINE 1200S NEW PROCESS COMBINED PLANNED LAYOUT – PROCESS SEQUENCE(NADCAP)

ANODIZING TYPE-I TYPE-II ALODINE 1200SNEW PLANNED LAYOUT


Special Process- PLATING

SUBJECT 6. CADMIUM PLATING AND ZINC PLATING NEW PROCESS PLANNED LAYOUT –PROCESS SEQUENCE(NADCAP)

CADMIUM PLATING AND ZINC PLATING


Special Process- PLATING

SUBJECT 7. SILVER PLATING, COPPER PLATING, NICKEL PLATING NEW PLANNED LAYOUT –PROCESS SEQUENCE(NADCAP)

SILVER PLATING COPPER PLATING NICKEL PLATING


Special Process- PLATING

SUBJECT 8. AUTO PLANT DETAILED STRUCTURE DETAIL OF LINE I , LINE II, LINE III- NADCAP

AUTO PLANT DETAIL STRUCTURE (LINE-I,II,III)


Special Process- PLATING

SUBJECT 9.LAB EQUIPMENT REQUIRMENT AND AVAILABILITY NADCAP REQUIRMENT

LAB EQUIPMENT DETAILS


Special Process- PLATING

SUBJECT 10.NADCAP SEQUENCE PLANT INSTALLTION DETAILS REFERENCE

NADCAP PLANT INSTALLATION-SAMPLE REFERENCE


Special Process- PLATING

SUBJECT 11.SCRUBBER UNIT OF EXITING AND NEW PROCESS PLANT DETAILS

SCRUBBER UNIT FOR EXIST AND NEW PROCESS PLANT DETAIL

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