default search action
3DIC 2023: Cork, Ireland
- IEEE International 3D Systems Integration Conference, 3DIC 2023, Cork, Ireland, May 10-12, 2023. IEEE 2023, ISBN 979-8-3503-1137-2
- Po-Yao Chuang
, Francesco Lorenzelli
Effective and Efficient Test and Diagnosis Pattern Generation for Many Inter-Die Interconnects in Chiplet-Based Packages. 1-6 - Pouria Zaghari
Thermal Cycling and Fatigue Life Analysis of a Laterally Conducting GaN-based Power Package. 1-5 - Erik W. Masselink, Andrew Stark, Benjamin B. Yang, T. Robert Harris:
Review of Hybrid Integration Techniques for Integrating III-V Onta Silicon. 1-7 - Mariappan Murugesan, M. Sawa, E. Sone, Makoto Motoyoshi, Mitsumasa Koyanagi, Takafumi Fukushima
Copper Electrode Surface Features and Cu-SiO2Hybrid Bonding. 1-4 - Koutaro Hachiya:
Measurement Point Selection Algorithms for Testing Power TSVs. 1-4 - Jiayi Shen, Chang Liu, Tadaaki Hoshi, Atsushi Sinoda, Hisashi Kino, Tetsu Tanaka, Mariappan Murugesan, Mitsumasa Koyanagi, Takafumi Fukushima
Impact of Super-long-throw PVD on TSV Metallization and Die-to-Wafer 3D Integration Based on Via-last. 1-4 - Joshua A. Stevens, Tse-Han Pan, Prasanth Prabu Ravichandiran, Paul D. Franzon
Chiplet Set For Artificial Intelligence. 1-5 - Priyank Kashyap
Thermal Estimation for 3D-ICs Through Generative Networks. 1-4 - Nermeen Hossam, John Ferguson:
Fast, Accurate Assembly-Level Physical Verification of 3DIC Packages. 1-4 - Somnath Pal, Liang Ye
A Study on a Tether-Less Approach Towards Micro-Transfer-Printing of Large-Footprint Power Micro-Inductor Chiplets. 1-4 - Emre Can Durmaz, Carl Heine, Zhibo Cao, Jens Lehmann, Dietmar Kissinger, Matthias Wietstruck:
SiGe BiCMOS Technology with Embedded Microchannels based on Cu Pillar PCB Integration Enabling sub-THz Microfluidic Sensor Applications. 1-4 - Mohamed Naeim
Design Enablement of 3-Dies Stacked 3D-ICs Using Fine-Pitch Hybrid-Bonding and TSVs. 1-4
manage site settings
To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.
last updated on 2025-01-14 21:02 CET by the dblp team
all metadata released as open data under CC0 1.0 license
see also: Terms of Use | Privacy Policy | Imprint
dblp was originally created in 1993 at:
since 2018, dblp has been operated and maintained by:
the dblp computer science bibliography is funded and supported by: