Comparison of different flex materials in high density flip chip on flex applications. - Palm, Petteri; Määttänen, Jarmo; Maquillé, Yannick De; Picault, Alain; Vanfleteren, Jan; Vandecasteele, Björn (Microelectron. Reliab., 2003)

Reliability of 80 mum pitch flip chip attachment on flex. - Palm, Petteri; Määttänen, Jarmo; Tuominen, Aulis; Ristolainen, Eero (Microelectron. Reliab., 2001)