Influence of gold pick up on the hardness of copper free air ball. - Lee, Jae-sik; Mayer, Michael; Zhou, Norman Y.; Moon, J. T.; Persic, John (Microelectron. Reliab., 2011)

Effect of gas type and flow rate on Cu free air ball formation in thermosonic wire bonding. - Pequegnat, A.; Kim, H. J.; Mayer, M.; Zhou, Norman Y.; Persic, John; Moon, J. T. (Microelectron. Reliab., 2011)

Reduction of ultrasonic pad stress and aluminum splash in copper ball bonding. - Shah, Aashish; Rezvani, Alireza; Mayer, M.; Zhou, Norman Y.; Persic, John; Moon, J. T. (Microelectron. Reliab., 2011)

Measuring stress next to Au ball bond during high temperature aging. - Mayer, M.; Moon, J. T.; Persic, John (Microelectron. Reliab., 2009)