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Heegon Kim
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2020 – today
- 2025
- [j13]Jaewon Sa, Junhwan Ryu
, Heegon Kim:
ECTFormer: An efficient Conv-Transformer model design for image recognition. Pattern Recognit. 159: 111092 (2025) - 2024
- [c31]Eui-Dong Jeong
S-Witch: Switch Configuration Assistant with LLM and Prompt Engineering. NOMS 2024: 1-7 - [c30]Heegon Kim, Jae-Hyoung Yoo, James Won-Ki Hong:
AI-based Network Function Virtualization Orchestration. NOMS 2024: 1-5 - 2023
- [j12]Heegon Kim, Suhyun Park, Stanislav Lange, Doyoung Lee, DongNyeong Heo, Heeyoul Choi, Jae-Hyoung Yoo, James Won-Ki Hong:
Graph neural network-based virtual network function deployment optimization. Int. J. Netw. Manag. 33(1) (2023) - [j11]Donghoon Kim, Sunghwan Jeong, Byoungjun Kim, Seo-Jeong Kim, Heegon Kim, Sooho Jeong, Ga-Yun Yun, Kee-Yeun Kim
Automated Detection of Rice Bakanae Disease via Drone Imagery. Sensors 23(1): 32 (2023) - [c29]Minji Choi, Heegon Kim, Jae-Hyoung Yoo, James Won-Ki Hong:
Network Traffic Prediction and Auto-Scaling of SFC using Temporal Fusion Transformer. APNOMS 2023: 131-136 - 2022
- [j10]Junhwan Ryu
Multispectral interaction convolutional neural network for pedestrian detection. Comput. Vis. Image Underst. 223: 103554 (2022) - [c28]DongNyeong Heo, Doyoung Lee, Heegon Kim, Suhyun Park, Heeyoul Choi:
Reinforcement Learning of Graph Neural Networks for Service Function Chaining in Computer Network Management. APNOMS 2022: 1-6 - [c27]Namjin Seo, DongNyeong Heo, Jibum Hong, Heegon Kim, Jae-Hyoung Yoo, James Won-Ki Hong, Heeyoul Choi:
Updating VNF deployment with Scaling Actions using Reinforcement Algorithms. APNOMS 2022: 1-4 - [c26]Seo-Jeong Kim, Sunghwan Jeong, Heegon Kim, Sooho Jeong, Ga-Yun Yun, Keunho Park:
Detecting Ripeness of Strawberry and Coordinates of Strawberry Stalk using Deep Learning. ICUFN 2022: 454-458 - 2021
- [j9]Heegon Kim
Graph neural network-based virtual network function deployment optimization. Int. J. Netw. Manag. 31(6) (2021) - [j8]Stanislav Lange
A Network Intelligence Architecture for Efficient VNF Lifecycle Management. IEEE Trans. Netw. Serv. Manag. 18(2): 1476-1490 (2021) - 2020
- [c25]DongNyeong Heo, Stanislav Lange, Heegon Kim, Heeyoul Choi:
Graph Neural Network based Service Function Chaining for Automatic Network Control. APNOMS 2020: 7-12 - [c24]Heegon Kim, Suhyun Park, Stanislav Lange, Doyoung Lee, DongNyeong Heo, Heeyoul Choi, Jae-Hyoung Yoo, James Won-Ki Hong:
Graph Neural Network-based Virtual Network Function Management. APNOMS 2020: 13-18 - [c23]Suhyun Park, Heegon Kim, Jibum Hong, Stanislav Lange, Jae-Hyoung Yoo, James Won-Ki Hong:
Machine Learning-based Optimal VNF Deployment. APNOMS 2020: 67-72 - [c22]Heegon Kim, Suhyun Park, DongNyeong Heo, Stanislav Lange, Heeyoul Choi, Jae-Hyoung Yoo, James Won-Ki Hong:
Graph Neural Network-based Virtual Network Function Deployment Prediction. CNSM 2020: 1-7 - [i2]DongNyeong Heo, Stanislav Lange, Heegon Kim, Heeyoul Choi:
Graph Neural Network based Service Function Chaining for Automatic Network Control. CoRR abs/2009.05240 (2020) - [i1]DongNyeong Heo, Doyoung Lee, Heegon Kim, Suhyun Park, Heeyoul Choi:
Reinforcement Learning of Graph Neural Networks for Service Function Chaining. CoRR abs/2011.08406 (2020)
2010 – 2019
- 2019
- [c21]Seyeon Jeong, Heegon Kim, Jae-Hyoung Yoo, James Won-Ki Hong:
Machine Learning based Link State Aware Service Function Chaining. APNOMS 2019: 1-4 - [c20]Stanislav Lange, Heegon Kim, Seyeon Jeong, Heeyoul Choi, Jae-Hyung Yoo, James Won-Ki Hong:
Machine Learning-based Prediction of VNF Deployment Decisions in Dynamic Networks. APNOMS 2019: 1-6 - [c19]Stanislav Lange, Heegon Kim, Seyeon Jeong, Heeyoul Choi, Jae-Hyung Yoo, James Won-Ki Hong:
Predicting VNF Deployment Decisions under Dynamically Changing Network Conditions. CNSM 2019: 1-9 - [c18]Chaehyeon Lee, Heegon Kim, Sajan Maharjan, Kyungchan Ko, James Won-Ki Hong:
Blockchain Explorer based on RPC-based Monitoring System. IEEE ICBC 2019: 117-119 - [c17]Heegon Kim, Doyoung Lee, Seyeon Jeong, Heeyoul Choi, Jae-Hyung Yoo, James Won-Ki Hong:
Machine Learning-Based Method for Prediction of Virtual Network Function Resource Demands. NetSoft 2019: 405-413 - [c16]Heegon Kim, Seyeon Jeong, Doyoung Lee, Heeyoul Choi, Jae-Hyung Yoo, James Won-Ki Hong:
A Deep Learning Approach to VNF Resource Prediction using Correlation between VNFs. NetSoft 2019: 444-449 - 2018
- [j7]Yeseul Jeon
Design of an On-Silicon-Interposer Passive Equalizer for Next Generation High Bandwidth Memory With Data Rate Up To 8 Gb/s. IEEE Trans. Circuits Syst. I Regul. Pap. 65-I(7): 2293-2303 (2018) - 2017
- [j6]Sungju Lee, Heegon Kim, Jaewon Sa, Byungkwan Park, Yongwha Chung:
Real-time processing for intelligent-surveillance applications. IEICE Electron. Express 14(8): 20170227 (2017) - [j5]Jinseong Kim, Yeonwoo Chung, Younchang Choi, Jaewon Sa
Depth-Based Detection of Standing-Pigs in Moving Noise Environments. Sensors 17(12): 2757 (2017) - 2016
- [j4]Manho Lee
High-Frequency Temperature-Dependent Through-Silicon-Via (TSV) Model and High-Speed Channel Performance for 3-D ICs. IEEE Des. Test 33(2): 17-29 (2016) - 2015
- [c15]Hyunsuk Lee, Kyungjun Cho, Heegon Kim, Sumin Choi, Jaemin Lim, Joungho Kim:
Electrical performance of high bandwidth memory (HBM) interposer channel in terabyte/s bandwidth graphics module. 3DIC 2015: TS2.2.1-TS2.2.4 - [c14]Sumin Choi, Heegon Kim, Daniel H. Jung, Jonghoon J. Kim, Jaemin Lim, Hyunsuk Lee, Kyungjun Cho, Joungho Kim, Hyungsoo Kim, Yong-Ju Kim, Yunsaing Kim:
Crosstalk-included eye-diagram estimation for high-speed silicon, organic, and glass interposer channels on 2.5D/3D IC. 3DIC 2015: TS8.25.1-TS8.25.5 - [c13]Daniel H. Jung, Heegon Kim, Jonghoon J. Kim, Sukjin Kim, Joungho Kim, Hyun-Cheol Bae, Kwang-Seong Choi:
Modeling and analysis of defects in through silicon via channel for non-invasive fault isolation. 3DIC 2015: TS8.29.1-TS8.29.4 - [c12]Jonghoon J. Kim, Daniel H. Jung, Heegon Kim, Sunkyu Kong, Sumin Choi, Jaemin Lim, Joungho Kim:
TSV-based current probing structure using magnetic coupling in 2.5D and 3D IC. EMC Compo 2015: 212-215 - 2014
- [j3]Sungju Lee, Heegon Kim, Daihee Park, Yongwha Chung, Taikyeong T. Jeong:
CPU-GPU hybrid computing for feature extraction from video stream. IEICE Electron. Express 11(22): 20140932 (2014) - [c11]Daniel H. Jung, Heegon Kim, Jonghoon J. Kim, Sukjin Kim, Joungho Kim, Hyun-Cheol Bae, Kwang-Seong Choi:
Fault detection and isolation of multiple defects in through silicon via (TSV) channel. 3DIC 2014: 1-5 - [c10]Jonghoon J. Kim, Bumhee Bae, Sukjin Kim, Sunkyu Kong, Heegon Kim, Daniel H. Jung, Joungho Kim:
Magnetically-coupled current probing structure consisting of TSVs and RDLs in 2.5D and 3D ICs. 3DIC 2014: 1-6 - [c9]Youngwoo Kim, Jonghyun Cho, Kiyeong Kim, Heegon Kim, Joungho Kim, Srikrishna Sitaraman, Venky Sundaram, Rao R. Tummala:
Analysis and optimization of a power distribution network in 2.5D IC with glass interposer. 3DIC 2014: 1-4 - 2013
- [j2]Heegon Kim, Sungju Lee, Yongwha Chung, Sung Bum Pan:
Parallelizing H.264 and AES Collectively. KSII Trans. Internet Inf. Syst. 7(9): 2326-2337 (2013) - [c8]Daniel H. Jung, Jonghyun Cho, Heegon Kim, Jonghoon J. Kim, Hongseok Kim, Joungho Kim, Hyun-Cheol Bae, Kwang-Seong Choi:
Fault isolation of short defect in through silicon via (TSV) based 3D-IC. 3DIC 2013: 1-4 - [c7]Heegon Kim, Jonghyun Cho, Jonghoon J. Kim, Daniel H. Jung, Sumin Choi, Joungho Kim, Junho Lee, Kunwoo Park:
Eye-diagram simulation and analysis of a high-speed TSV-based channel. 3DIC 2013: 1-7 - [c6]Jonghoon J. Kim, Heegon Kim, Sukjin Kim, Bumhee Bae, Daniel H. Jung, Sunkyu Kong, Joungho Kim, Junho Lee, Kunwoo Park:
Non-contact wafer-level TSV connectivity test methodology using magnetic coupling. 3DIC 2013: 1-4 - [c5]Heegon Kim, Jonghyun Cho, Daniel H. Jung, Jonghoon J. Kim, Sumin Choi, Joungho Kim, Junho Lee, Kunwoo Park:
Design and measurement of a compact on-interposer passive equalizer for chip-to-chip high-speed differential signaling. EMC Compo 2013: 5-9 - [c4]Jonghoon J. Kim, Heegon Kim, Sukjin Kim, Bumhee Bae, Daniel H. Jung, Sunkyu Kong, Joungho Kim, Junho Lee, Kunwoo Park:
Design of contactless wafer-level TSV connectivity testing structure using capacitive coupling. EMC Compo 2013: 158-162 - [c3]Daniel H. Jung, Heegon Kim, Jonghoon J. Kim, Joungho Kim, Hyun-Cheol Bae, Kwang-Seong Choi:
Modeling and analysis of open defect in through silicon via (TSV) channel. EMC Compo 2013: 163-166 - [c2]Sungju Lee, Heegon Kim, Yongwha Chung:
Power-Time Tradeoff of Parallel Execution on Multi-core Platforms. MUSIC 2013: 157-163 - 2012
- [j1]Sungju Lee, Heegon Kim, Yongwha Chung, Daihee Park:
Energy Efficient Image/Video Data Transmission on Commercial Multi-Core Processors. Sensors 12(11): 14647-14670 (2012) - [c1]Heegon Kim, Sungju Lee, Yongwha Chung:
Overcoming Amdahl's Law by Distributing Workload Asymmetrically. ICHIT (2) 2012: 465-471
Coauthor Index
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