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Marleen H. van der Veen

Marleen van der Veen

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2020 – today

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2024
[c7]
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  dblp key:
  - conf/irps/TierncALJVSBCBR24
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  - https://dblp.org/rec/conf/irps/TierncALJVSBCBR24
D. Tiernc, Antonio Arreghini, Alicja Lesniewska, Y. Jeong, Marleen H. van der Veen, J. Stiers, N. Bazzazian, Ivan Ciofi, Geert Van den Bosch, Maarten Rosmeulen:
Exploring the Reliability Limits for the Z-Pitch Scaling of Molybdenum Inter-Word Line Oxides in 3D NAND. IRPS 2024: 1-5
2022
[c6]
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  - conf/irps/PedreiraLZRVSCC22
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O. Varela Pedreira, Melina Lofrano, Houman Zahedmanesh, Philippe J. Roussel, Marleen H. van der Veen, Veerle Simons, Emmanuel Chery, Ivan Ciofi, Kris Croes:
Assessment of critical Co electromigration parameters. IRPS 2022: 8
2021
[c5]
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  - conf/irps/LesniewskaPLMVD21
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Alicja Lesniewska, Olalla Varela Pedreira, Melina Lofrano, Gayle Murdoch, Marleen H. van der Veen, Anish Dangol, Naoto Horiguchi, Zsolt Tökei, Kris Croes:
Reliability of a DME Ru Semidamascene scheme with 16 nm wide Airgaps. IRPS 2021: 1-6
2020
[c4]
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  - conf/irps/LesniewskaRTVVV20
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Alicja Lesniewska, Philippe J. Roussel, Davide Tierno, Victor Vega-Gonzalez, Marleen H. van der Veen, Patrick Verdonck, Nicolas Jourdan, Christopher J. Wilson, Zsolt Tökei, Kris Croes:
Dielectric Reliability Study of 21 nm Pitch Interconnects with Barrierless Ru Fill. IRPS 2020: 1-6
[c3]
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  - conf/irps/PedreiraSGGVLWT20
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Olalla Varela Pedreira, Michele Stucchi, Anshul Gupta, Victor Vega-Gonzalez, Marleen van der Veen, Stephane Lariviere, Christopher J. Wilson, Zsolt Tökei, Kristof Croes:
Metal reliability mechanisms in Ruthenium interconnects. IRPS 2020: 1-7

2010 – 2019

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2017
[c2]
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  - conf/essderc/AvasaralaGODCDV17
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Naga Sruti Avasarala, Bogdan Govoreanu, Karl Opsomer, Wouter Devulder, Sergiu Clima, Christophe Detavernier, Marleen van der Veen, Jan Van Houdt, Marc Henys, Ludovic Goux, Gouri Sankar Kar:
Doped GeSe materials for selector applications. ESSDERC 2017: 168-171
2014
[c1]
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  - conf/3dic/InouePVVHST14
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Fumihiro Inoue, Harold Philipsen, Marleen H. van der Veen, Kevin Vandersmissen, Stefaan Van Huylenbroeck, Herbert Struyf, Tetsu Tanaka:
Cu seeding using electroless deposition on Ru liner for high aspect ratio through-Si vias. 3DIC 2014: 1-4

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