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Cher Ming Tan
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- affiliation: Chang Gung University, Taoyuan City, Taiwan
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2020 – today
- 2023
- [c3]Peerapat Phetpadriew, Bharatha Kumar Thangarasu, Nagarajan Mahalingam, Zhenghao Lu, Cher Ming Tan, Kiat Seng Yeo:
Concurrent Multiband CMOS Low Noise Amplifier Design for Internet of Things Applications. ASICON 2023: 1-4 - 2022
- [j50]Vimal Kant Pandey
, Cher Ming Tan
Effect of resistor tolerance on the performance of resistor network - An application of the statistical design of experiment. Int. J. Circuit Theory Appl. 50(1): 175-182 (2022) - 2020
- [j49]Vivek Sangwan
Electromagnetic Induced Failure in GaN-HEMT High-Frequency Power Amplifier. IEEE Trans. Ind. Electron. 67(7): 5708-5716 (2020)
2010 – 2019
- 2018
- [j48]Preetpal Singh
Uncover the Degradation Science of Silicone Under the Combined Temperature and Humidity Conditions. IEEE Access 6: 1302-1311 (2018) - [c2]Nirdosh, Cher Ming Tan, Malay Ranjan Tripathy:
A miniaturized T-shaped MIMO antenna for X-band and Ku-band applications with enhanced radiation efficiency. WOCC 2018: 1-5 - 2016
- [j47]Asen Asenov, Ulf Schlichtmann, Cher Ming Tan, Hei Wong
Editorial. Microelectron. Reliab. 61: 1-2 (2016) - [j46]Marvin Chan, Cher Ming Tan
Non-destructive degradation study of copper wire bond for its temperature cycling reliability evaluation. Microelectron. Reliab. 61: 56-63 (2016) - [j45]Udit Narula
Copper induced synthesis of graphene using amorphous carbon. Microelectron. Reliab. 61: 87-90 (2016) - [j44]Preetpal Singh, Cher Ming Tan:
A review on the humidity reliability of high power white light LEDs. Microelectron. Reliab. 61: 129-139 (2016) - [j43]Preetpal Singh, Cher Ming Tan
Early degradation of high power packaged LEDs under humid conditions and its recovery - Myth of reliability rejuvenation. Microelectron. Reliab. 61: 145-153 (2016) - 2014
- [j42]Cher Ming Tan
Damage threshold determination and non-destructive identification of possible failure sites in PIN limiter. Microelectron. Reliab. 54(5): 960-964 (2014) - [j41]Asen Asenov, Ulf Schlichtmann
Special section reliability and variability of devices for circuits and systems. Microelectron. Reliab. 54(6-7): 1057 (2014) - [j40]Xiangchen Chen, Cher Ming Tan:
Modeling and analysis of gate-all-around silicon nanowire FET. Microelectron. Reliab. 54(6-7): 1103-1108 (2014) - [j39]Song Lan, Cher Ming Tan, Kevin Wu:
Methodology of reliability enhancement for high power LED driver. Microelectron. Reliab. 54(6-7): 1150-1159 (2014) - 2013
- [j38]Minh Duc Le, Cher Ming Tan
Optimal maintenance strategy of deteriorating system under imperfect maintenance and inspection using mixed inspection scheduling. Reliab. Eng. Syst. Saf. 113: 21-29 (2013) - [c1]Jiye Zhang, Lin Zhang, Yuanwei Dong, Hongyu Li, Cher Ming Tan, Guangrui Xia, Chuan Seng Tan
The dependency of TSV keep-out zone (KOZ) on Si crystal direction and liner material. 3DIC 2013: 1-5 - 2012
- [j37]Feifei He, Cher Ming Tan
Electromigration reliability of interconnections in RF low noise amplifier circuit. Microelectron. Reliab. 52(2): 446-454 (2012) - [j36]Asen Asenov, Ulf Schlichtmann
ICMAT 2011 - Reliability and variability of semiconductor devices and ICs. Microelectron. Reliab. 52(8): 1531 (2012) - [j35]Cher Ming Tan
Applications of finite element methods for reliability study of ULSI interconnections. Microelectron. Reliab. 52(8): 1539-1545 (2012) - [j34]Feifei He, Cher Ming Tan
Effect of IC layout on the reliability of CMOS amplifiers. Microelectron. Reliab. 52(8): 1575-1580 (2012) - [j33]Sihan Joseph Chen, Cher Ming Tan
Ensuring accuracy in optical and electrical measurement of ultra-bright LEDs during reliability test. Microelectron. Reliab. 52(8): 1632-1635 (2012) - [j32]Song Lan, Cher Ming Tan
Reliability study of LED driver - A case study of black box testing. Microelectron. Reliab. 52(9-10): 1940-1944 (2012) - [j31]Sihan Chen, Cher Ming Tan
Degradation behavior of high power light emitting diode under high frequency switching. Microelectron. Reliab. 52(9-10): 2168-2173 (2012) - 2010
- [b1]Cher Ming Tan:
Electromigration in ULSI Interconnections. International Series on Advances in Solid State Electronics and Technology, World Scientific 2010, ISBN 978-981-4273-32-9, pp. 1-312 - [j30]Feifei He, Cher Ming Tan
Circuit level interconnect reliability study using 3D circuit model. Microelectron. Reliab. 50(3): 376-390 (2010) - [j29]Feifei He, Cher Ming Tan
Modeling the effect of barrier thickness and low-k dielectric on circuit reliability using 3D model. Microelectron. Reliab. 50(9-11): 1327-1331 (2010) - [j28]C. M. Fu, Cher Ming Tan
Width dependence of the effectiveness of reservoir length in improving electromigration for Cu/Low-k interconnects. Microelectron. Reliab. 50(9-11): 1332-1335 (2010) - [j27]Yung Chuen Tan
Electromigration performance of Through Silicon Via (TSV) - A modeling approach. Microelectron. Reliab. 50(9-11): 1336-1340 (2010) - [j26]Yung Chuen Tan
Addressing the challenges in solder resistance measurement for electromigration test. Microelectron. Reliab. 50(9-11): 1352-1354 (2010) - [j25]Cher Ming Tan
Humidity study of a-Si PV cell. Microelectron. Reliab. 50(9-11): 1871-1874 (2010)
2000 – 2009
- 2009
- [j24]Jie Liao, Cher Ming Tan
Behavior of hot carrier generation in power SOI LDNMOS with shallow trench isolation (STI). Microelectron. Reliab. 49(9-11): 1038-1043 (2009) - [j23]Arijit Roy
Electromigration in width transition copper interconnect. Microelectron. Reliab. 49(9-11): 1086-1089 (2009) - [j22]Cher Ming Tan
Analysis of humidity effects on the degradation of high-power white LEDs. Microelectron. Reliab. 49(9-11): 1226-1230 (2009) - [j21]Cher Ming Tan
Reply to comments on "A framework to practical predictive maintenance modeling for multi-state systems". Reliab. Eng. Syst. Saf. 94(3): 781-782 (2009) - 2008
- [j20]Guangyu Huang, Cher Ming Tan
Reverse Breakdown Voltage Measurement for Power P+NN+ Rectifier. J. Electron. Test. 24(5): 473-479 (2008) - [j19]Cher Ming Tan, Nagarajan Raghavan
A framework to practical predictive maintenance modeling for multi-state systems. Reliab. Eng. Syst. Saf. 93(8): 1138-1150 (2008) - 2007
- [j18]Cher Ming Tan
An approach to statistical analysis of gate oxide breakdown mechanisms. Microelectron. Reliab. 47(9-11): 1336-1342 (2007) - [j17]Wei Li, Cher Ming Tan
Enhanced finite element modelling of Cu electromigration using ANSYS and matlab. Microelectron. Reliab. 47(9-11): 1497-1501 (2007) - [j16]Cher Ming Tan
Finite element modeling of capacitive coupling voltage contrast. Microelectron. Reliab. 47(9-11): 1555-1560 (2007) - [j15]Arijit Roy
Room temperature observation of point defect on gold surface using thermovoltage mapping. Microelectron. Reliab. 47(9-11): 1580-1584 (2007) - 2006
- [j14]Cher Ming Tan
Feasibility study of the application of voltage contrast to printed circuit board. Microelectron. Reliab. 46(5-6): 939-948 (2006) - [j13]Cher Ming Tan
Development of highly accelerated electromigration test. Microelectron. Reliab. 46(9-11): 1638-1642 (2006) - [j12]Arijit Roy
Experimental investigation on the impact of stress free temperature on the electromigration performance of copper dual damascene submicron interconnect. Microelectron. Reliab. 46(9-11): 1652-1656 (2006) - [j11]Guangyu Huang, Cher Ming Tan
Device level electrical-thermal-stress coupled-field modeling. Microelectron. Reliab. 46(9-11): 1823-1827 (2006) - 2005
- [j10]Cher Ming Tan
Determination of the dice forward I-V characteristics of a power diode from a packaged device and its applications. Microelectron. Reliab. 45(1): 179-184 (2005) - [j9]Arijit Roy
Effect of test condition and stress free temperature on the electromigration failure of Cu dual damascene submicron interconnect line-via test structures. Microelectron. Reliab. 45(9-11): 1443-1448 (2005) - [j8]Cher Ming Tan
Effect of vacuum break after the barrier layer deposition on the electromigration performance of aluminum based line interconnects. Microelectron. Reliab. 45(9-11): 1449-1454 (2005) - [j7]Cher Ming Tan
Non-destructive identification of open circuit in wiring on organic substrate with high wiring density covered with solder resist. Microelectron. Reliab. 45(9-11): 1572-1575 (2005) - [j6]Cher Ming Tan
Reliability screening through electrical testing for press-fit alternator power diode in automotive application. Microelectron. Reliab. 45(9-11): 1723-1727 (2005) - 2004
- [j5]Guan Zhang, Cher Ming Tan
Reliability Improvement in Al Metallization: A Combination of Statistical Prediction and Failure Analytical Methodology. Microelectron. Reliab. 44(9-11): 1843-1848 (2004) - 2003
- [j4]W. B. Yu, Jun Wei, Cher Ming Tan, S. S. Deng, M. L. Nai:
Influence Of Applied Load On Wafer Bonding In Vacuum. Int. J. Comput. Eng. Sci. 4(2): 351-354 (2003) - [j3]S. S. Deng, Jun Wei, Cher Ming Tan, M. L. Nai, W. B. Yu, H. Xie:
Low Temperature Silicon Wafer Bonding By Sol-Gel Processing. Int. J. Comput. Eng. Sci. 4(3): 655-658 (2003) - 2001
- [j2]Cher Ming Tan
A Reliability Statistics Perspective on the Pitfalls of Standard Wafer-Level Electromigration Accelerated Test (SWEAT). J. Electron. Test. 17(1): 63-68 (2001)
1990 – 1999
- 1999
- [j1]Cher Ming Tan
Using power diode models for circuit simulations-a comprehensive review. IEEE Trans. Ind. Electron. 46(3): 637-645 (1999)
Coauthor Index
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