Reliability of an Al2O3/SiO2MIM Capacitor for 180nm (3.3V) Technology. - Gambino, Jeff; Allman, Derryl D. J.; Hall, Gavin D. R.; Price, D.; Sheng, L.; Takada, R.; Kanuma, Y. (2019)

BEOL Process Development Using Fast Power Cycling on Test Structures. - Ring, Matt; Greve, Johan De; Cowell, Bill; Moore, Darren; Gambino, Jeff (2019)

Device reliability for CMOS image sensors with backside through-silicon vias. - Gambino, Jeff Peter; Soleimani, H.; Rahim, I.; Riebeek, B.; Sheng, L.; Hosey, G.; Truong, H.; Hall, Gavin D. R.; Jerome, R.; Price, D. (2018)

Copper interconnect technology for the 32 nm node and beyond. - Gambino, Jeff; Chen, Fen; He, John (2009)