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D. R. Frear

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2010 – 2019

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2012
[j2]
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J. W. Jang, L. Li, P. Bowles, R. Bonda, D. R. Frear:
High-lead flip chip bump cracking on the thin organic substrate in a module package. Microelectron. Reliab. 52(2): 455-460 (2012)

2000 – 2009

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2009
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S. M. Hayes, Nikhilesh Chawla, D. R. Frear:
Interfacial fracture toughness of Pb-free solders. Microelectron. Reliab. 49(3): 269-287 (2009)

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