A study of the effect of degradation of the aluminium metallization layer in the case of power semiconductor devices - S. Pietranico; Stéphane Lefebvre; S. Pommier; M. Berkani Bouaroudj; S. Bontemps (Microelectron. Reliab., 2011)

Characterisation of power modules ceramic substrates for reliability aspects - S. Pietranico; S. Pommier; Stéphane Lefebvre; Zoubir Khatir; S. Bontemps (Microelectron. Reliab., 2009)

Effects of metallization thickness of ceramic substrates on the reliability of power assemblies under high temperature cycling - Laurent Dupont; Zoubir Khatir; Stéphane Lefebvre; S. Bontemps (Microelectron. Reliab., 2006)