Tree identification using a distributed K-mean clustering algorithm - Kuo-Tai Fan; Yu-Chang Tzeng; Y. F. Lin; Y. J. Su; Kun-Shan Chen (IEEE International Geoscience & Remote Sensing Symposium, IGARSS 2010, July 25-30, 2010, Honolulu, Hawaii, USA, Proceedings, 2010)

A Parallel Differential Box Counting Algorithm Applied to Hyperspectral Image Classifications - Yu-Chang Tzeng; Kuo-Tai Fan; Y. J. Su; Kun-Shan Chen (IEEE International Geoscience & Remote Sensing Symposium, IGARSS 2009, July 12-17, 2009, University of Cape Town, Cape Town, South Africa, Proceedings, 2009)

A study of post-etch wet clean on electrical and reliability performance of Cu/low k interconnections - C. F. Tsang; C. K. Chang; A. Krishnamoorthy; K. Y. Ee; Y. J. Su; H. Y. Li; W. H. Li; L. Y. Wong (Microelectron. Reliab., 2005)

Process improvement of 0.13mum Cu/Low K (Black Diamond\(^TM\)) dual damascene interconnection - H. Y. Li; Y. J. Su; C. F. Tsang; S. M. Sohan; V. N. Bliznetsov; L. Zhang (Microelectron. Reliab., 2005)

Impact of barrier deposition process on electrical and reliability performance of Cu/CVD low k SiOCH metallization - C. F. Tsang; C. Y. Li; A. Krishnamoorthy; Y. J. Su; H. Y. Li; L. Y. Wong; W. H. Li; L. J. Tang; K. Y. Ee (Microelectron. J., 2004)

Polymer residue chemical composition analysis and its effect on via contact resistance in dual damascene copper interconnects process integration - Y. S. Zheng; Q. Guo; Y. J. Su; P. D. Foo (Microelectron. J., 2003)

Study and improvement of electrical performance of 130 nm Cu/CVD low k SiOCH interconnect related to via etch process - C. F. Tsang; V. N. Bliznetsov; Y. J. Su (Microelectron. J., 2003)

Investigation of defect on copper bond pad surface in copper/low k process integration - Y. S. Zheng; Y. J. Su; B. Yu; P. D. Foo (Microelectron. Reliab., 2003)