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"Through-Silicon-Via assignment for 3D ICs."

Jianchang Ao et al. (2011)

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DOI: 10.1109/ASICON.2011.6157194

access: closed

type: Conference or Workshop Paper

metadata version: 2018-08-30

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Jianchang Ao, Sheqin Dong, Song Chen, Satoshi Goto:
Through-Silicon-Via assignment for 3D ICs. ASICON 2011: 353-356

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