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"Thermal simulator of 3D-IC with modeling of anisotropic TSV conductance ..."

Hanhua Qian et al. (2013)

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DOI: 10.1109/ASPDAC.2013.6509643

access: closed

type: Conference or Workshop Paper

metadata version: 2025-05-31

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  - conf/aspdac/QianLCZY13
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Hanhua Qian, Hao Liang, Chip-Hong Chang, Wei Zhang, Hao Yu:
Thermal simulator of 3D-IC with modeling of anisotropic TSV conductance and microchannel entrance effects. ASP-DAC 2013: 485-490

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