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"0.61W/mm² resonant inductively coupled power transfer for 3D-ICs."

Sangwook Han, David D. Wentzloff (2012)

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DOI: 10.1109/CICC.2012.6330590

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-17

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Sangwook Han, David D. Wentzloff:
0.61W/mm² resonant inductively coupled power transfer for 3D-ICs. CICC 2012: 1-4

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