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"Placement of 3D ICs with Thermal and Interlayer Via Considerations."

Brent Goplen, Sachin S. Sapatnekar (2007)

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DOI: 10.1145/1278480.1278637

access: closed

type: Conference or Workshop Paper

metadata version: 2018-11-06

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  dblp key:
  - conf/dac/GoplenS07
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  - https://dblp.org/rec/conf/dac/GoplenS07
Brent Goplen, Sachin S. Sapatnekar:
Placement of 3D ICs with Thermal and Interlayer Via Considerations. DAC 2007: 626-631

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