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"Non-invasive pre-bond TSV test using ring oscillators and multiple voltage ..."

Sergej Deutsch, Krishnendu Chakrabarty (2013)

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DOI: 10.7873/DATE.2013.225

access: closed

type: Conference or Workshop Paper

metadata version: 2022-01-03

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  dblp key:
  - conf/date/DeutschC13
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  persistent URL:
  - https://dblp.org/rec/conf/date/DeutschC13
Sergej Deutsch, Krishnendu Chakrabarty:
Non-invasive pre-bond TSV test using ring oscillators and multiple voltage levels. DATE 2013: 1065-1070

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