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"Testing Through Silicon Vias in Power Distribution Network of 3D-IC with ..."

Koutaro Hachiya, Atsushi Kurokawa (2020)

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DOI: 10.23919/DATE48585.2020.9116229

access: closed

type: Conference or Workshop Paper

metadata version: 2020-06-25

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Koutaro Hachiya, Atsushi Kurokawa:
Testing Through Silicon Vias in Power Distribution Network of 3D-IC with Manufacturing Variability Cancellation. DATE 2020: 290-293

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