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"IC thermal analyzer for versatile 3-D structures using multigrid ..."

Scott Ladenheim et al. (2016)

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DOI: 10.1145/2966986.2967045

access: closed

type: Conference or Workshop Paper

metadata version: 2018-11-06

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  - conf/iccad/LadenheimCMP16
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Scott Ladenheim, Yi-Chung Chen, Milan Mihajlovic, Vasilis F. Pavlidis:
IC thermal analyzer for versatile 3-D structures using multigrid preconditioned krylov methods. ICCAD 2016: 123

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