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"HyPlace-3D: A Hybrid Placement Approach for 3D ICs Using Space ..."

Jai-Ming Lin et al. (2023)

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DOI: 10.1109/ICCAD57390.2023.10323786

access: closed

type: Conference or Workshop Paper

metadata version: 2024-01-03

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  dblp key:
  - conf/iccad/LinLKL23
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Jai-Ming Lin, Yu-Chien Lin, Hsuan Kung, Wei-Yuan Lin:
HyPlace-3D: A Hybrid Placement Approach for 3D ICs Using Space Transformation Technique. ICCAD 2023: 1-8

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