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"Formation Mechanism of high Ni content (Cu, Ni)6Sn5 in Cu/Sn/Ni microbump ..."

Haiyang Yu, C. R. Kao (2022)

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DOI: 10.1109/ICTA56932.2022.9962977

access: closed

type: Conference or Workshop Paper

metadata version: 2023-11-16

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Haiyang Yu, C. R. Kao:
Formation Mechanism of high Ni content (Cu, Ni)6Sn5 in Cu/Sn/Ni microbump for solid state aging. ICTA 2022: 20-21

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