default search action

combined dblp search
author search
venue search
publication search

ask others

"Effects of Wiring Density and Pillar Structure on Chip Package Interaction ..."

Weishen Chu et al. (2020)

> Home

Details and statistics

DOI: 10.1109/IRPS45951.2020.9128333

access: closed

type: Conference or Workshop Paper

metadata version: 2020-07-30

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/irps/ChuSSH20
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/irps/ChuSSH20
Weishen Chu, Laura Spinella, Dwayne R. Shirley, Paul S. Ho:
Effects of Wiring Density and Pillar Structure on Chip Package Interaction for Advanced Cu Low-k Chips. IRPS 2020: 1-4

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.