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"Thermal and power delivery considerations of the 65k pixel 3-D integrated ..."

Krzysztof Kasinski (2017)

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DOI: 10.23919/MIXDES.2017.8005247

access: closed

type: Conference or Workshop Paper

metadata version: 2018-11-02

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Krzysztof Kasinski:
Thermal and power delivery considerations of the 65k pixel 3-D integrated radiation imaging module with through-silicon vias. MIXDES 2017: 435-439

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