Nivesh Mangal Jeroen Missinne Gunther Roelkens Joris Van Campenhout Geert Van Steenberge Brad Snyder Expanded-Beam Through-Substrate Coupling Interface for Alignment Tolerant Packaging of Silicon Photonics. 1-3 2018 OFC https://ieeexplore.ieee.org/document/8385874 conf/ofc/2018 db/conf/ofc/ofc2018.html#MangalMRCSS18