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"Network-on-Chips for Future 3D Stacked Dies (Invited)."

Tiago Mück (2021)

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DOI: 10.1109/SLIP52707.2021.00020

access: closed

type: Conference or Workshop Paper

metadata version: 2022-01-21

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  - conf/slip/Muck21
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Tiago Mück:
Network-on-Chips for Future 3D Stacked Dies (Invited). SLIP 2021: 59

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